Contents
AboutThis Document.........................................................................................................1
1 Introduction toM590........................................................................................................1
1.1 Overview.....................................................................................................................................1
1.2 BlockDiagram............................................................................................................................1
1.3 Specifications..............................................................................................................................2
2 Pin Description and PCBFootPrint..............................................................................3
2.1 Specificationsand Encapsulation................................................................................................3
2.2 PinDefinition..............................................................................................................................4
2.3 PCB FootPrint............................................................................................................................6
3 Interface Design.................................................................................................................7
3.1 PowerSupplyand Switch Interfaces...........................................................................................7
3.1.1 Design Requirements.........................................................................................................7
3.1.2 VDD_EXT.......................................................................................................................10
3.1.3 Power-On/OffControland Procedure..............................................................................10
3.1.4 RESET .............................................................................................................................13
3.2 UART........................................................................................................................................13
3.3 DTRand RING.........................................................................................................................15
3.3.1 DTRPin...........................................................................................................................15
3.3.2 RING SignalIndicator.....................................................................................................16
3.4 SIMCard Interface....................................................................................................................16
3.5 Running LEDIndicator.............................................................................................................18
3.6 RFInterface...............................................................................................................................19
3.6.1 RFDesign and PCBLayout.............................................................................................19
3.6.2 Recommended RFConnection.........................................................................................21
4ElectricFeatures and Reliability .....................................................................................22
4.1 Electric Feature.........................................................................................................................22
4.2 Temperature...............................................................................................................................22
4.3 Current......................................................................................................................................23
4.4 ESDProtection..........................................................................................................................23
5 RFFeatures.......................................................................................................................25
5.1 WorkBand................................................................................................................................25
5.2 Transmitting PowerandReceiving Sensitivity.........................................................................25
5.2.1 Transmitting Power..........................................................................................................25
5.2.2 Receiving Sensitivity.......................................................................................................26
6 Mountingthe Module ontothe Application Board..................................................27
7 Package..............................................................................................................................27
8 Abbreviations...................................................................................................................28