Neoway M660 User manual

M660
GPRS Module
User Manual
Shenzhen Neoway Technology Co.,Ltd.
Enjoy your wireless life

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Copyright
Copyright © 2008 Neoway Technology
All rights reserved.
is a trade mark of Shenzhen NeowayTechnology Co., Ltd.
Notice
This document is intended for the customer engineers.
This document is subject to change without any notice.
No responsibility is assumed by Neoway Technology for the use of this document.
Neoway Technology always provides the best supports.
For pricing, ordering information and delivery please contact:
[e-mail]
For any technical support requests please contact:
[e-mail]
For further information please visit:
http://www.neoway.com.cn

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Contents
1. Introduction................................................................................................................................6
2. General Description...................................................................................................................6
3. Simplified Block Diagram.........................................................................................................6
4. Key Features...............................................................................................................................7
5. Product Specifications ...............................................................................................................8
5.1 Variants .................................................................................................................................8
5.2 Dimension & Package...........................................................................................................8
5.3 Pin Description......................................................................................................................9
5.4 PCB foot print.....................................................................................................................10
6. Application Interface...............................................................................................................11
6.1 Power Supply Requirements...............................................................................................11
6.1.1 Power Supply Basic Design Rules........................................................................11
6.1.2 Extended Design Rules for Power Supply............................................................13
6.2 ON/OFF Procedure.............................................................................................................15
6.2.1 Turning on the module..........................................................................................16
6.2.2 Turning off the module.........................................................................................16
6.2.3 RESET ..................................................................................................................17
6.2.4 VCCIO..................................................................................................................17
6.3 UART..................................................................................................................................18
6.3.1 Basic Descriptions of UART.................................................................................18
6.3.2 Level Translators for UART..................................................................................18
6.4 Sleep mode..........................................................................................................................20
6.4.1 DTR.......................................................................................................................20
6.4.2 RING.....................................................................................................................21
6.5 SIM interface ......................................................................................................................21
6.6 Running LED Indicator.......................................................................................................23
6.7 Audio Interface ...................................................................................................................24
6.8 Antenna Interface................................................................................................................26
7. Mounting the Module onto theApplication Board...............................................................28
8. Package .....................................................................................................................................29

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9. Terms and Abbreviations.........................................................................................................29

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Document History
Revision History
Version
Remarks
Date Issue
V3.0
Modified Version
2013-9
V3.1
Change receive sensitivity index
2013-10
V3.2
Change 24pin definition
2013-11

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1. Introduction
This document describes the hardware features of M660, and guides for the relevant
application design.
2. General Description
With the ultra-compact design, M660 is intended to be used in a wide range of applications,
including industrial and consumer devices. M660 is a GSM/GPRS module with EDGE of
downlink. It features with voice, SMS, and data services.
3. Simplified Block Diagram
Figure 1 M660 Block Diagram

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4. Key Features
Table1 M660 Key Features
Feature
Implementation
Frequency Bands
850/900/1800/1900 MHz Quad-band
Compliant with GSM/GPRS Phase2/2+
Sensitivity
< -107dBm
Transmit Power
850/900 Class4(2W)
1800/1900 Class1(1W)
AT
GSM07.07
Extended AT commands
Audio CODEC
FR、EFR、HR、AMR
SMS
TEXT/PDU
Point-to-point / cell broadcast
DATA
GPRS:Class 12
Supplementary Service
Call forwarding（CFB, CFNA, CFU）
Call waiting & Call hold
Multiparty call
USSD
CPU
ARM7-EJ@260MHz, 32Mbits SRAM, 16~32Mbits Nor Flash
Open Resources
16Mbits RAM, 0.3~16Mbits Flash
Interfaces
UART, SIM
Operational Temperature
-40℃～+85℃
Operating Voltage
3.5V～4.3V（typical 3.9V）
Peak Current
Max 1.8A
Power Consumption
< 2mA @DRX5 (Sleep mode)

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5. Product Specifications
5.1 Variants
Variants
Frequencies
Packages
M660-QUAD-AA0/A00
850/900/1800/1900MHz Quad-band
28 Pin LCC
5.2 Dimension & Package
Physical Characteristics
Dimensions
22mm*18.4mm*2.7mm (Length*Width*Thickness)
Weight
2.2 g
Package
28 Pin LCC
Figure 2 M660 Sketch

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5.3 Pin Description
Table2 M660 pin definition
M660
Pin
Signal
I/O
Function
Note
1
VSIM
PWR
SIM supply voltage
1.8/3.0V compatible.
2
SIM_CLK
DO
SIM clock
3
SIM_DATA
DIO
SIM data
5KΩ internal pull-up
4
GND
PWR
GND
5
SIM_RST
DO
SIM reset
Prompted by module
6
MICP
AI
MIC+
Vi ≤ 200mVpp
7
MICN
AI
MIC-
Vi ≤ 200mVpp
8
EAR-L
AO
Earpiece output L
Signal Ended Output. Can drive
a 16Ω/32Ω earpiece directly.
9
EAR-R
AO
Earpiece output R
Signal Ended Output. Can drive
a 16Ω/32Ω earpiece directly.
10
DTR
DI
Data Terminal Ready
Can be used to control sleep
mode.
11
GND
PWR
GND
12
RING
DO
Output for RING indicator
Can be used to indicate an
incoming voice call or SMS.
13
VCCIO
PWR
2.8V power output
Can be used to power the level
translators. Imax=5mA
14
Reserved
Reserved
15
Reserved
Reserved
16
URXD1
DI
Serial data input of module
V.24: TXD
17
UTXD1
DO
Serial data output of module
V.24: RXD
18
GND
PWR
GND
19
RESET
DI
Reset input
Active low > 60mS
20
BACK_LIGHT
DO
Status LED
2.8V/4mA output
Can drive a LED directly
21
ON/OFF
DI
Switch the module on/off
Low level pulse triggered
22
ANT
I/O
Antenna interface
A 50ohm antenna expected
23
GND
PWR
GND
24
Reserved
Reserved
25
GND
PWR
GND
26
VBAT
PWR
Main power supply
3.5V~4.3V (typical 3.9V)
27
VBAT
PWR
Main power supply
28
GND
PWR
GND

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5.4 PCB foot print
Recommended foot print:
Figure 3 Recommended foot print of M660 (all dimensions in millimeters)
Note：
Every other pitch not specified is 2.0mm.
The circle on the top-right with a 1.3mm radius, defines a keep-out region, under which any
copper or wire is inhibited, due to the RF test point here needs to be surrounded by restricted
area filled with air.
There may be some masks on the bottom of the module PCB, created by hollowing the solder
resist layer, causing reveal of copper. To avoid short circuits, it is recommended to cover the
application PCB with a silkscreen block at the area under the module, but excluding soldering
area.

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6. Application Interface
6.1 Power Supply Requirements
Table3 Power Supply and ON/OFF Control
Signal
I/O
Function
Note
VCCIO
PWR
2.8V power output
Can be used to power the level
translators. Imax=5mA
RESET
DI
Reset input
Active low > 60mS.
ON/OFF
DI
Switch the module on/off
Low level pulse triggered.
VBAT
PWR
Main Power Supply
3.5V~4.3V(typical 3.9V)
6.1.1 Power Supply Basic Design Rules
VBAT is the main power supply for internal base band and radio PA of the module, in a range of
3.5V-4.3V. A 3.9V voltage is preferable.
The performance of power supply issued, is a critical path to module’s performance and stability.
The GSM bursts can cause current peaks up to 1.8A, therefore large bypass capacitors are expected
to reduce voltage drops during the bursts. The biggest current occurs when the received signal is
very low. It’s very important to ensure that the voltage of supply rail never drops below 3.5V
while any burst occurs.
Figure 4 shows how the GSM bursts and voltage drops.
Figure 5 shows how the capacitor helps to improve peak current performance.

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Figure 4 Burst Caused Current Peaks and Voltage Drops
Figure 5 Test Circuit and Peak Current
Results may vary depending on the ESR of capacitors, and the impedance of power source.
A low ESR 1000uF aluminum capacitor for C1 can be selected. As an alternative, a 470uF
tantalum capacitor is also suited. In case of Li-Ion cell battery used, 220uF or even 100uF
tantalum capacitor may be applicable because of the battery’s low internal impedance and the
ability to provide high transient current.
Use a low impedance power source, and keep the resistance of the power supply lines as low as
possible.

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The power source should be able to output an average current greater than 1A.
Some small capacitors, with values of 0.1uF, 100pF, 33pF, placed close to the module’s power
pin, are very helpful to suppress high frequency disturbances.
The voltage range of power supply must never be exceeded. Over-voltage can even destroy the
module permanently.
Ensure the trace for VBAT to be wide enough, in order to pass the current peaks without
significant voltage drops. The width of 2mm is preferable.
6.1.2 Extended Design Rules for Power Supply
6.1.2.1 Power Control
A controlled power supply is preferable if used in harsh conditions. RESET pin may be not
functioning under strong disturbance. The output enable pin of LDO or DC/DC chipset could be
used for emergency power control of the module, as shown in Figure 6.
Figure 6 Using LDO’s enable pin for emergency power control
The alternative way is to use a P-MOSFET to control the module’s power, as shown in Figure 7. The
GPRS_EN signal is routed to host GPIO, controlling the ON/OFF of the P-MOSFET. The host can
cut off and then switch on the power supply in case of abnormal conditions, such as no response
from the module or the disconnection of GPRS.

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Figure 7 Using PMOS for power control
Q2 is for eliminating the need for a high enough voltage level of the host GPIO. In case that the
GPIO can output a high voltage greater than VDD3V9 - |VGS(th)|, where VGS(th) is the Gate Threshold
Voltage, Q2 is not needed.
Reference components:
Q1: IRML6401
Q2: MMBT3904
C4: 470uF tantalum capacitor rated at 6.3V; or 1000uF aluminum capacitor.
It’s strongly recommended to place a TVS diode on VBAT to ground, in order to absorb the power
surges subjected. The SMAJ5.0A from Vishay can be as a choice.
6.1.2.2 Power Separating
As described in section 6.1.1, the GSM device works in burst mode generating voltage drops on
power supply. And furthermore this results in a 217Hz TDD noise through power (One of the way
generating noise. Another way is through RF radiation). Analog parts, especially the audio circuits,
are subjected to this noise, known as a “buzz noise” in GSM systems. To prevent other parts from
being affected, it’s better to use separated power supplies. The module shall be supplied by an
independent power, like a DC/DC or LDO.
The inductor used in Reference Design (b), should be a power inductor and have a very low

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resistance. The value of 10uH, with average current ability>1.2A and low DC resistance, is
recommended.
Figure 8 Using separated power supply for module
Never use a diode to make the drop voltage between a higher input and module power. It will
obviously decrease the module performances, or result in unexpected restarts, due to the forward
voltage of diode will vary greatly in different temperature and current.
6.1.2.3 EMC Considerations for Power Supply
Place transient overvoltage protection components like TVS diode on power supply, to absorb the
power surges. SMAJ5.0A could be a choice.
6.1.2.4 Power-on Sequence
Prior to turning on the module, turn on the host MCU and finish the UART initialization. Otherwise
conflictions may occur during initialization, due to unstable conditions.
6.2 ON/OFF Procedure
ON/OFF is a low level pulse active input, used to turn on or off the module.

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Figure 9 Turning on /off the module using ON/OFF
6.2.1 Turning on the module
While the module is off, drive the ON/OFF pin to ground for at least 600mS (800mS is
recommended) and then release, the module will start. An unsolicited message will be sent to host
through AT port (“+EIND: 1”), indicating the powering up of the module and the AT commands can
respond.
It’s recommended to drive the ON/OFF to low before applying the VBAT to module. 300mS
(400mS is recommended) later from the VBAT applied, release the ON/OFF. Therefore the module
starts up. The simplest way to power on the module, is to directly tie the ON/OFF to ground, issuing
to an auto-power-on feature.
After the module is operating, keep ON/OFF being high level.
6.2.2 Turning off the module
While the module is on, drive the ON/OFF pin to ground for at least 500mS and then release, the
module will try to detach to network and normally 1 second later it will shut down. Another
approach to turn off the module is with AT command.
Figure 10 shows a reference circuits for ON/OFF control with inverted control logic.

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Figure 10 Reference circuit for ON/OFF control
Reference Components:
Q1: MMBT3904, or to use digital transistor with bias resistors built in, like DTC123/114
The combination of R3 and R4, should limit the high voltage of ON/OFF less than 3.0V.
Note:
If the host itself is not initialized before turning on the module, some abnormal conditions on
IO or UART may affect the power on procedure.
The better way to rescue the module from abnormal condition, is to apply a power OFF-ON
procedure, rather than using the ON/OFF control signal. In fact ON/OFF signal is
software-dependent.
6.2.3 RESET
Pull the RESET signal to low level for at least 60mS to reset the module. A pull-up resistor is
internally included. Reset pin can be left open if not used.
6.2.4 VCCIO
VCCIO is provided to power the level translators, with a 2.8V / 5mA output.
VCCIO can also be used to monitor the on/off state of module. It outputs 2.8V high level while the
module is on, and low level while the module is off.

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6.3 UART
6.3.1 Basic Descriptions of UART
Table4 UART
Signal
I/O
Function
Note
URXD1
DI
Serial input of module
UTXD1
DO
Serial output of module
DTR
DI
Signal for controlling sleep mode
RING
DO
Ringing output
UART1 is forAT commands, data sending/receiving, firmware updating, etc.
As a DCE device, the module is connected to DTE as shown in Figure 11.
Supported baud rates are 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400bps, and the
default is 115200.
Figure 11 Connection between DCE (module) and DTE
The UART of M660 works at 2.8V CMOS logic level. The voltages for input high level should not
exceed 3.0V.
6.3.2 Level Translators for UART
If the UART is interfacing with a MCU that has 3.3V logic levels, resistors should be connected in
series with the signals.

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Figure 12 Interfacing with 3.3V logic levels of MCU
If the UART is interfacing with a MCU that has 5V logic levels, general level translators are
required, for both inputs and outputs.As shown in Figure 13.
Figure 13 Interfacing with 5V logic levels of MCU
Reference components:
R2: 2K-10K. The higher rate the UART works at, the smaller value used
R3: 4.7K-10K. The higher rate the UART works at, the smaller value used
Q1: MMBT3904 or MMBT2222. High-speed transistors preferred.
Used for 5V logic -> 2.8V logic:
While this circuit used between MCU TXD and module URXD1, the INPUT signal is connected to
MCU TXD, and OUTPUT connected to module URXD1. VCC_IN powered from 5V and
VCC_OUT powered from 2.8V (module’s VCCIO can be used). This applies to DTR control as
well.
Used for 2.8V logic -> 5V logic:
It can be used between module UTXD1 and MCU RXD as well, with INPUT connected to module
UTXD1, and OUTPUT connected to MCU RXD. VCC_IN powered from 2.8V (module’s VCCIO)
and VCC_OUT powered from 5V. This applies to RING signal as well.

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Note:
Avoid sparks and glitches on UART signals while the module is in a turning on procedure.
Avoid sending any data to UART during the beginning of 2 seconds after the module being turned
on.
6.4 Sleep mode
6.4.1 DTR
Generally DTR is used for sleep mode control. For details, see AT commands manual. Based on the
setting of the selected mode, pulling DTR low will bring the module into relevant power saving
mode. Working in this mode, the power consumption is around 2mA, depending on the DRX setting
of network.
In sleep mode, the module can also respond to the incoming call, SMS, and GPRS data. The host
MCU can also control the module to exit sleep mode by controlling DTR.
The controlling of sleep mode:
1) Keep DTR high in normal working mode. Activate the sleep mode by using the AT command
AT+ENPWRSAVE=1.
2) Pull DTR low, the module will enter sleep mode, but only after process and pending data
finished.
3) UART is not available in sleep mode.
4) In sleep mode, the module can be woken up by the events of incoming voice call, received data,
or SMS. Meanwhile the module will send out the unsolicited messages by the interface of RING
or UART.
Upon receipt of the unsolicited messages, the host MCU should pull DTR high firstly, otherwise
the module will resume sleep mode shortly. And then the host MCU can process the voice call,
received data, or SMS. After processing is finished, pull DTR low again to put the module into
sleep mode.