Nokia 8310 Service manual

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8310
NHM-7

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GENERAL
-about Phoenix
When changing the phone mode with Phoenix, note that it is not possible to activate local mode directly from normal mode –
change to test mode first! In normal mode the phone works as it would be supplied by the normal phone battery. In local mode
the watchdog is disabled while in test mode only MCU-software is working without loading the PPM-file.
Using JBV-1 it is possible to change to local mode by suppling JBV-1 with +12VDC. If JBV-1 is supplied with +4VDC you have to
change the phone mode manually with Phoenix.
When using service jig MJS-46 take care not to supply more than +12VDC –the jig will surely be damaged!
-Component characteristics
Some components contain important data.
Several described steps are only practicable if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain
cases. Please pay attention to separate notes.
-Broken balls, µBGA
All replaceable µBGA-components must be renewed after removing. Reflow with hot air fan is not allowed!
Check soldering points, remove oxidated solderings (broken balls) carefully by enclosing few new solder before placing new
components.
µBGA must be soldered only with NMP approved µBGA-rework machines (e.g. Zevac/OK International).
Only use recommended Fluxtype and an appropriate amount of it.
-PCB handling & cleaning
To avoid damages of PCB and/or components through electrostatic discharging, handle the module in
ESD-suitable cases only. Always wear ESD-bracelets, which must be connected to earth bonding point.
Don´t make any loose wiring connections or do some other unqualified rework anywhere.
For cleaning use appropriate materials only, do not use scratching or rubbing tools.
Because of organic surface protection (OSP), cleaning must only be done with a lint-free cloth which may be moisten with DI-
water. IPA or other solvent like ethanol should only be used to clean gold pads for spring contacts without affecting the
surrounding copper layers.
-Realign after repair
Characteristics of replacement parts are different.
To prevent additional faults after repair (eg. low standby time, loosing network etc.) it is necessary
to retune phone values after repair.

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INTRODUCTION
IMPORTANT:
This document is intended for use by authorized NOKIA service centers only.
The purpose of this document is to provide some further service information for NOKIA 8310 phones.
It contains a lot of collected tips and hints to find failures and repair solutions easily.
It also will give support to the inexperienced technicians.
Saving process time and improving the repair quality is the aim of using this document.
We have built it up based on fault symptoms (listed in "Contents") followed by detailed description for further analysis.
It is to be used additionally to the service manual and other service information like Service Bulletins. For that reason it does
not contain any circuit descriptions or schematics.
All measurements are made using following equipment:
Nokia repair SW : Phoenix version 03.40.00
Data package : Version 4.0
Digital multimeter : Fluke 73
Oscilloscope : Hitachi V-1565; Fluke PM 3380A/B
Spectrum Analyzer : Advantest R3162 with an analogue probe
RF-Generator / : Rohde & Schwarz CMU 200
GSM Tester
While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by
the reader, NOKIA should be notified in writing, using following procedure:
Please state:
Title of the Document + Issue Number/Date of publication.
Page(s) and/or Figure(s) in error.
Please send to: Nokia GmbH
Service & Competence Center Europe
Meesmannstr.103
D-44807 Bochum / Germany
Email: [email protected]
Copyright © Nokia Mobile Phones.
This material, including documentation and any related computer programs, is protected by copyright, controlled by Nokia Mobile
Phones. All rights are reserved. Copying, including reproducing, modifying, storing, adapting or translating, any or all of this
material requires the prior written consent of Nokia Mobile Phones. This material also contains confidential information, which
may not be disclosed to others without the prior written consent of Nokia Mobile Phones.

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Contents
PREFACE 2
General 2
Introduction 3
CHAPTER 1 PHONE DOES NOT SWITCH ON 5
CHAPTER 2 PHONE SWITCHES ITSELF OFF 7
CHAPTER 3 FLASH UPDATE NOT POSSIBLE 8
CHAPTER 4 SIMCARD FAULTS 9
CHAPTER 5 AUDIO FAULTS 10
CHAPTER 6 CHARGING FAULTS 11
CHAPTER 7 USER INTERFACE FAULTS 12
CHAPTER 8 NO SERVICE 13
CHAPTER 9 RX DOES NOT WORK 16
CHANGE HISTORY 18

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CHAPTER 1 PHONE DOES NOT SWITCH ON
Phone does not switch on
Try to make SW-update,
continue with section
"Flash update not possible" if
not ok
check if
current consumption
is around 15mA
(in Servicejig supplied with
4VDC)
check VBATT
4VDC at both sides of Z260-
Z265
Check X101, also check
resistance of Z260-Z265
(0 Ohm)
check 32.768kHz
at C209/210
change B200,
also check C209/210.
Probably D200 faulty
check that
PWRONX decreases to 0V if
powerswitch is pressed
check that
VIO, VCORE, VANA, VFLASH1
and VR3 rise to their intended
values
check 13MHz reference clock at
R420
Check PURX 1.8VDC at J402
check / change
S300, R301
check lines for shorts to ground
or interruption, change UPP if
necessary
Check / change
G660, N600
OK
OK
OK
OK
OK
nOK
nOK
nOK
nOK
nOK
Check if
current consumption
is higher than
1 Ampere
Usually N700 faulty
(remove L703 to ensure)
yes
yes
no
no
UEM D200 faulty in all
probability
Try to flash the phone.
If SW-update does not work,
continue with chapter
"Flash update not possible"
nOK

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PHONE DOES NOT SWITCH ON
X101
-check mechanical appearance of battery connector. Change part if it is bent, soiled or corroded.
S300
-check mechanical appearance of powerswitch, change if necessary.
-check voltage at S300, 3.8VDC in case that switch is not pressed. If voltage is not measureable or too low especially check
R301 and C312.
-if switch is pressed, voltage at S300 must decrease to 0V. Change switch if necessary.
B200
-check DC-voltages at C209 and C210, normally 0.5VDC. If voltages are not ok check C209/210 for shorts to ground. It also
is possible that UEM D200 is defect.
-if DC-voltages are ok but no 32.768kHz signal is measurable at C209/210 change the crystal B200.
Note that this signal must be always measurable if battery voltage is higher than 3.1VDC, even if phone is switched off! In
this case amplitude of 32.768kHz is a bit lower (700mVpp at C209, 550mVpp at C210).
D200
-at this time it is not useful to change this part. IMEI and Simlockdata must be reconstructed in case that UEM has been
changed. This is not possible up to now, but it is planned to make this possible in the future.
D450
-in case that phone does not switch on while current consumption stays on 15mA (in Service jig supplied with 4VDC) this
indicates that Flash D450 probably is empty. Try to make SW-update. If any failuremessage appears during flashing, try
SW-update a second time. It also can be necessary to change D450. Note that in this case you have to rewrite IMEI, Simlock
data and Product code, furthermore you have to run all RX/TX-tunings and energy management calibration!
G660
-check voltage at C662, 2.8VDC
-check signal of 26MHz reference oscillator at C660:
With the voltage of 2.8VDC at C662 the oscillator
must be able to work on a frequency around 26MHz, else
you have to change G660.
N700
-in case you suppose a defect poweramplifier N700 to be responsible for the fault, first of all check the current consumption
of the phone. If current rises to more than 1 Ampere directly after connecting the phone to the servicebattery, remove
coil L703 and check current consumption again. If current is ok now you have to change poweramplifier N700 with help of
µBGA soldering machine and LGA rework kit LRK-1.

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CHAPTER 2 PHONE SWITCHES OFF ITSELF
If this fault appears ensure that switching-off symptom is not the result of a too old phone software-version. SW-version
should be 4.04 or newer!
Also check that symptom is not caused by an insufficient charged battery. In case of doubt retest the phone with a new or
well charged battery. If this does not solve the problem, check the following:
-check mechanical appearance of battery connector X101. Change part if spring contacts are bent, soiled or corroded.
-check amplitude and frequency of 32.768kHz sleepclock-signal at J404, 1.9Vpp:
-check amplitude and frequency of 13MHz system clock at R420, 320mVpp:
-try to calibrate TX-powerlevels. It is possible that poweramplifier N700 is defect so that the phone switches off if you try
to tune the upper powerlevels because of too high current consumption.
-check solderings and resistance of R102 (100kΩ). It has been observed that solderings of this part were responsible for this
fault in some cases, especially if phone switches off or resets after some minutes to some hours.
In case that phone switches off itself repeatly after 30 seconds, this could be the result of a changed Flash D450 or UEM D200.
Because of the data mismatch between both parts the watchdog will not be reset and the phone switches off itself.

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CHAPTER 3 FLASH UPDATE NOT POSSIBLE
D200
-because of the missing possibility to rewrite phonedata after changing UEM D200 you should not change this part
D400
-if it was necessary to change UPP D400 you have to make SW-update after reworking this part. Otherwise the phone will
not switch on!
D450
-change Flash D450 in case that prommer box messages “wrong manufacor/ devive ID”. Note that after changing D450 you
have to flash the phone, rewrite IMEI, Simlock data and Product code. Furthermore you have to run all RX/TX-tunings and
energy management calibration!
Flash update not possible
check that
signals which are necessary
for a working baseband
(voltages, sleepclock,
referenceclock, PURX)
are ok
check that
FBUS_TXO-line rise
to 2.8VDC after start
flashing
check pulse on
BSI-line (J101) after
start flashing
check components in
BSI-line
check R102. Probably
UEM D200 faulty
continue with section
"Phone does not switch on"
check voltage at
J411 (1.8VDC)
change UPP D400
nOK
OK
nOK
OK
nOK
OK
nOK
If failuremessage from prommer
is "wrong manufactor/ device ID"
update prommerbox or change
Flash D450
OK
nOK
FBUS TX0
FBUS RX0
MBUS

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CHAPTER 4 SIMCARD-FAULTS
Display message
"Insert SIM card"
Check / change R388, D200 or D400.
If this does not solve the problem
PCB is faulty in all probability
Check SIM lines for
shorts to GND
Check / change EMI-filter
R388, C203 and C389
Check at
SIM reader pin 1-4
if pulsed to
1.8V/3Vpp
Check SIM card if dirty, check
mechanical appearance of SIM reader
and SIM cover, change parts if
necessary
ok
nok
nok
ok
X386
In case that phone messages “Insert SIM card” on LCD, first of all check mechanical appearance of SIM card reader X386. If
contact springs are bent, soiled or corroded you have to change the sim reader.
R388/D200/D400
If mechanical appearance of SIM reader seems to be ok but fault persists, check with an oscilloscope if SIM lines at SIM reader
pin 1-4 are pulse to 1.8Vpp / 3Vpp as shown in the chart below. Signals are slightly different between pin 1-4 but the
amplitude always is 1.8Vpp / 3Vpp.
In case that the above mentioned signal is not measurable at one or more simlines, check SIM lines for shorts to ground.
Resistance of simdata-and VSimline normally is > 200kΩ, resistance of SIM reset-and SIM clock line normally is ~ 4.5MΩ.
If resistance of any line is not ok check parts the SIM lines consists of (R388, C203, C389).
In case that resistance of all lines is ok but fault persists, EMI-filter R388 may have internal interruption. Change part and retest
the phone. It also is possible that UEM D200 or UPP D400 are responsible for this fault. Due to the missing possibility to
rewrite phonedata after changing UEM D200 you should not change this part.
VSIM (1)
SIMReset (2)
SIMCLK (3)
GND (6)
n.c. (5)
SIMData (4)

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CHAPTER 5 AUDIO-FAULTS
In case of any audiofault in the phone, the best way to define the fault is to make a call with the defect phone to a proper
working one. In case that you can hear the speech of the proper working phone in the defect one but the other way round the
speech of the defect phone is not audible in the proper working phone you know that the internal microphones signalpath is
responsible for the fault.
Of course you can use the same procedure to check the external audiopathes XMIC and XEAR.
I009 bottomconnector
-check mechanical appearance of bottomconnector I009 in case that internal microphone does not work, external audiopath
seems to be interrupted or headset is not recognized. Retest phone with new connector in case of doubt.
Also ensure that contact pads for connector on PCB are clean.
I005 speaker
-check mechanical appearance of speaker. Change part if spring contacts are bent or soiled. Resistance of speaker normally
is 30Ω. Also ensure that contact pads on PCB are clean.
C151/C155
-check resistance of the double capacitors, which normally is > 20MΩ. Both parts have tendencies to leak and often are
responsible for missing uplink audio (C151 in case of internal -, C155 in case of external audio faults).
D200
-due to the missing possibility of rewriting IMEI and Simlock data after changing UEM D200 it is not useful to change
this part at the moment.
check/change R152,
C166/168.
Probably D200 faulty
check MicBias
2.1VDC
at R152 on active
micro
int. micro faulty
internal audio
does not work
int. speaker faulty ext. micro faulty
ext. speaker faulty
check XEAR-lines for shorts to
GND and interruption.
Probably D200 faulty
check MIC1N/P for shorts to GND
and interruption, especially check
C151! Probably D200 faulty
check speaker lines for shorts
to GND and interruption.
Probably D200 faulty
check XMIC-lines for shorts to
GND and interruption, especially
check C155! Probably D200 faulty
external audio
does not work
Audio-Faults
change microphone,
retest phone
change speaker,
retest phone
change headset/
bottomconnector,
retest phone change headset/
bottomconnector,
retest phone
check MicBias
2.7VDC
at R166 on active
micro
check/change R166, C165.
Probably D200 faulty
nOK
nOK
OK
nOK nOK
nOK
nOK
OK