Nxp semiconductors Frdm33664bevb User manual

FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication

network high-speed transceiver IC

Rev. 1.0 — 22 June 2018 User guide

1 FRDM33664BEVB

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

User guide Rev. 1.0 — 22 June 2018

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2 Important notice

NXP provides the enclosed product(s) under the following conditions:

This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR

EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a

printed circuit board to make it easier to access inputs, outputs, and supply terminals.

This evaluation board may be used with any development system or other source of

I/O signals by simply connecting it to the host MCU or computer board via off-the-

shelf cables. This evaluation board is not a Reference Design and is not intended to

represent a final design recommendation for any particular application. Final device in

an application will be heavily dependent on proper printed circuit board layout and heat

sinking design as well as attention to supply filtering, transient suppression, and I/O

signal quality.

The goods provided may not be complete in terms of required design, marketing, and

or manufacturing related protective considerations, including product safety measures

typically found in the end product incorporating the goods. Due to the open construction

of the product, it is the user’s responsibility to take any and all appropriate precautions

with regard to electrostatic discharge. In order to minimize risks associated with the

customers applications, adequate design and operating safeguards must be provided

by the customer to minimize inherent or procedural hazards. For any safety concerns,

contact NXP sales and technical support services.

Should this evaluation kit not meet the specifications indicated in the kit, it may be

returned within 30 days from the date of delivery and will be replaced by a new kit.

NXP reserves the right to make changes without further notice to any products herein.

NXP makes no warranty, representation or guarantee regarding the suitability of its

products for any particular purpose, nor does NXP assume any liability arising out of the

application or use of any product or circuit, and specifically disclaims any and all liability,

including without limitation consequential or incidental damages. “Typical” parameters

can and do vary in different applications and actual performance may vary over time.

All operating parameters, including “Typical”, must be validated for each customer

application by customer’s technical experts.

NXP does not convey any license under its patent rights nor the rights of others. NXP

products are not designed, intended, or authorized for use as components in systems

intended for surgical implant into the body, or other applications intended to support or

sustain life, or for any other application in which the failure of the NXP product could

create a situation where personal injury or death may occur.

Should the Buyer purchase or use NXP products for any such unintended or

unauthorized application, the Buyer shall indemnify and hold NXP and its officers,

employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,

damages, and expenses, and reasonable attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or

unauthorized use, even if such claim alleges NXP was negligent regarding the design

or manufacture of the part. NXP and the NXP logo are trademarks of NXP B.V. All other

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

User guide Rev. 1.0 — 22 June 2018

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3 Getting started

The NXP analog product development boards provide an easy-to-use platform for

evaluating NXP products. The boards support a range of analog, mixed-signal and

power solutions. They incorporate monolithic integrated circuits and system-in-package

devices that use proven high-volume technology. NXP products offer longer battery life, a

smaller form factor, reduced component counts, lower cost and improved performance in

powering state-of-the-art systems.

The tool summary page for is located at http://www.nxp.com/FRDM33664BEVB. The

overview tab provides an overview of the device, product features, a description of the

kit contents, a list of (and links to) supported devices, list of (and links to) any related

products and a Get Started section.

The Get Started section provides links to everything needed to start using the

device and contains the most relevant, current information applicable to the

FRDM33771BTPLEVB.

•Go to http://www.nxp.com/FRDM33664BEVB.

•On the Overview tab, locate the Jump To navigation feature on the left side of the

window.

•Select the Get Started link.

•Review each entry in the Get Started section and download an entry by clicking on the

title.

•After reviewing the Overview tab, visit the other product related tabs for additional

information:

– Documentation: download current documentation

– Software & Tools: download current hardware and software tools

– Buy/Parametrics: purchase the product and view the product parametrics

After downloading files, review each file, including the user guide which includes setup

instructions. If applicable, the Bill of Materials (BOM), suporting schematics, and layout

are available via NXP DocStore. [4]

3.1 Kit contents/packing list

The kit contents include:

•Assembled and tested evaluation board/module in anti-static bag

•Quick-start guide

•Four connectors to be mounted on the MCU board

3.2 Required equipment and software

To use this kit, you need:

•5.0 V power supply, 50 mA capability

•3.3 V power supply, 50 mA capability (optional: Depends if the application requires

3.3 V logic threshold)

•NXP Microcontroller Development Platform (optional)

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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4 Getting to know the hardware

4.1 Board overview

The FRDM33664BEVB is a hardware tool for evaluation and development and is ideal

for rapid prototyping of an Isolated Network High Speed Transceiver. It can be used

to evaluate the features of the MC33664ATL1EG device. The EVB allows the user to

connect SPI signals from the MCU to the device SPI_TX and be able to create bit pulses

transmission to the bus through the transformer. The messages received by the device

can be converted bit by bit and transferred to the MCU by SPI.

4.2 Board features

The board features are as follows:

•MC33664ATL1EG Isolated Communication Transceiver in a 16-pin SOICN package

•SPI interface

•LED indicators

•Fault detection report

•Isolated Communication by transformers with connector

4.3 Block diagram

LED INDICATOR

EN/FLT

POWER SUPPLY

CONNECTOR

VCC5/VIO/GND

ISOLATED NETWORK

HIGH SPEED

TRANSCEIVER

MC33664TL

16-PIN SOICN

RDTX_P

FAULT FAULT_IN

TRANSFORMER

SPI

CONNECTOR

SIGNAL

TRANSCEIVER

PHYSICAL

LAYER

CONNECTOR

RDTX_N

SPI_TX

SPI_RX

aaa-030301

Figure 1. Block diagram

4.3.1 Device features

This evaluation board features the following product:

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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Table 1. Device features

Device Description Features

MC33664ATL1EG The MC33664ATL1EG is

an Isolated Communication

Network High Speed

Transceiver IC intended to

provide a simple method

for isolated high speed

differential communication.

•2.0 Mbps isolated network communication rate

•Dual SPI architecture for message confirmation

•Robust conducted and radiated immunity with wake-up

•3.3 V and 5.0 V compatible logic thresholds

•Low sleep mode current with automatic bus wake-up

•Ultra-low radiated emissions

4.4 Board description

The FRDM33664BEVB allows the user to exercise all the functions of the

MC33664ATL1EG.

Figure 2. Board description

Table 2. Board description

Name Description

LED EN Indicates when EN pin is set to high level (VIO) by MCU

LED FAULT Indicates when Fault pin is set to high level (VIO) by MCU

Transformer Bus Isolator Transformer

TPL BUS

Connector The two bus cables must be placed inside the connector

Fault Connector The fault cable to report the error to the MCU must be placed inside the

connector

MC33664ATL1EG Isolated Network High Speed Transceiver

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

User guide Rev. 1.0 — 22 June 2018

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The modes of operation followed by MC33664ATL1EG for the VIO and EN pins are

shown in Table 3.

Table 3. Modes of operation

Device mode EN pin VIO pin LED EN Comment

Normal 1 1 On The MC33664 operates as a full transceiver. MCU messages

transmitted on the SPI_TX emerge on the SPI_RX for the MCU to read.

Sleep 0 1 Off In Sleep mode, the transceiver activates the INTB pin when a valid

wake-up sequence is detected. The INTB pin remains low until the

rising edge of the EN pin places the device in Normal mode.

Reset x 0 Off The RDTX± outputs are in high impedance and the device is not able to

transmit, receive, or report bus wake-up events.

4.5 Test-point definitions

Figure 3. Test points

The following test points provide access to various signals to and from the board.

Table 4. Test points

Test-point name Signal name Description

RTDX_P RDTX+

RDTX_N RDTX–

Measures the isolated pulse communication sent to

the device

GND_SIGNAL GND Ground reference of the device

VCC VCC5 5 V Input supply

VCCIO VIO digital 3.3 V / 5.0 V power to the IC

4.6 Connectors

Figure 4 shows the location of connectors on the board. Table 4, Table 5, and Table 6 list

the pinouts for each connector.

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Figure 4. Connectors

Table 5. Connector J5 description

Pin Name Description

1 J5_1 TPL bus – Receive/transmit input negative

2 J5_2 TPL bus – Receive/transmit input positive

3 J5_3 FAULT_RTN

4 J5_4 FAULT_IN

Table 6. Connector J1 description

Pin Name Description

1 J1_1 No connection

2 J1_2 No connection

3 J1_3 No connection

4 J1_4 No connection

5 J1_5 No connection

6 J1_6 Connected to jumpers J15, J16, J23

7 J1_7 No connection

8 J1_8 Connected to jumpers J14, J17, J22

9 J1_9 Connected to jumpers J31_1

10 J1_10 Connected to jumpers J13, J18, J21

11 J1_11 Connected to jumper J25_2

12 J1_12 Connected to jumper J26_2

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Pin Name Description

13 J1_13 Connected to jumper J20_1

14 J1_14 Connected to jumper J12

15 J1_15 Connected to jumper J24_2

16 J1_16 No connection

Table 7. Connector J2 description

Pin Name Description

1 J2_1 No connection

2 J2_2 No connection

3 J2_3 No connection

4 J2_4 No connection

5 J2_5 No connection

6 J2_6 Connected to jumper J31_3

7 J2_7 No connection

8 J2_8 Connected to jumper J19_2

9 J2_9 No connection

10 J2_10 Connected to jumper J28_3

11 J2_11 No connection

12 J2_12 Connected to jumper J11_3

13 J2_13 Connected to jumper J49_3

14 J2_14 Connected to jumper J49_1

15 J2_15 No connection

16 J2_16 No connection

Table 8. Connector J9 description

Pin Name Description

1 J9_1 No connection

2 J9_2 No connection

3 J9_3 No connection

4 J9_4 No connection

5 J9_5 Connected to jumper J31_1

6 J9_6 No connection

7 J9_7 Connected to jumper J11_1

8 J9_8 Connected to jumper J32_1

9 J9_9 Connected to jumper J29_3

10 J9_10 Connected to jumper J29_1

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Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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Pin Name Description

11 J9_11 Connected to jumper J48_3

12 J9_12 Connected to jumper J48_1

13 J9_13 Connected to jumper J48_3

14 J9_14 Connected to jumper J

15 J9_15 No connection

16 J9_16 No connection

Table 9. Connector J10 description

Pin Name Description

1 J10_1 No connection

2 J10_2 No connection

3 J10_3 Connected to jumper J20_3

4 J10_4 No connection

5 J10_5 No connection

6 J10_6 Connected to jumper J30_3

7 J10_7 Connected to jumper J27_3

8 J10_8 No connection

9 J10_9 No connection

10 J10_10 Connected to jumper J33

11 J10_11 No connection

12 J10_12 No connection

4.7 Compatible NXP MCU development platforms

FRDM33664BEVB is compatible with multiple NXP MCU development platforms:

•FRDM-KL25Z (default)

•FRDM-KE06Z

•FRDM-KL43Z

•FRDM-KV31F

•FRDM-KW40Z

•FRDM-KEAZ128

Please find MCU development platform ordering, instruction, and other information on

nxp.com.

Table 10. Jumper setting to work with FRDM-KL25Z (default)

Jumper Setting Description

J11 1-2 SCLK_RX

J12 1-2 CSB_TX

J13 open —

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Jumper Setting Description

J14 open —

J15 1-2 FAULT

J16 open —

J17 open —

J18 open —

J19 2-3 DATA_TX

J20 open —

J21 open —

J22 1-2 INTB

J23 open —

J24 open —

J25 open —

J26 open —

J27 1-2 SCLK_TX

J28 1-2 DATA_RX

J29 1-2 VCC

J30 1-2 EN

J31 1-2 CSB_RX

J32 1-2 VCCIO

J33 open —

J48 1-2 GND

J49 1-2 GND

Table 11. Jumper Setting to Work with FRDM-KE06Z

Jumper Setting Description

J11 2-3 SCLK_RX

J12 open —

J13 open —

J14 open —

J15 open —

J16 open —

J17 1-2 SCLK_TX

J18 open —

J19 2-3 DATA_RX

J20 open —

J21 1-2 FAULT

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Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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Jumper Setting Description

J22 open —

J23 1-2 CSB_TX

J24 open —

J25 open —

J26 2-3 DATA_TX

J27 open —

J28 open —

J29 1-2 VCC

J30 2-3 EN

J31 2-3 CSB_RX

J32 1-2 VCCIO

J33 1-2 INTB

J48 1-2 GND

J49 1-2 GND

Table 12. Jumper Setting to Work with FRDM-KL43Z

Jumper Setting Description

J11 2-3 SCLK_RX

J12 open —

J13 open —

J14 1-2 FAULT

J15 open —

J16 open —

J17 open —

J18 open —

J19 2-3 DATA_RX

J20 open —

J21 open —

J22 open —

J23 1-2 CSB_TX

J24 2-3 SCLK_TX

J25 2-3 DATA_TX

J26 open —

J27 open —

J28 open —

J29 1-2 VCC

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Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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Jumper Setting Description

J30 2-3 EN

J31 2-3 CSB_RX

J32 1-2 VCCIO

J33 1-2 INTB

J48 1-2 GND

J49 1-2 GND

Table 13. Jumper Setting to Work with FRDM-KV31F

Jumper Setting Description

J11 2-3 SCLK_RX

J12 open —

J13 open —

J14 1-2 FAULT

J15 open —

J16 open —

J17 open —

J18 open —

J19 open —

J20 1-2 DATA_TX

J21 open —

J22 open —

J23 1-2 CSB_TX

J24 1-2 CSB_RX

J25 1-2 SCLK_TX

J26 open —

J27 open —

J28 2-3 DATA_RX

J29 1-2 VCC

J30 2-3 EN

J31 open —

J32 1-2 VCCIO

J33 1-2 INTB

J48 1-2 GND

J49 1-2 GND

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Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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Table 14. Jumper Setting to Work with FRDM-KW40Z

Jumper Setting Description

J11 2-3 SCLK_RX

J12 open —

J13 open —

J14 1-2 FAULT

J15 open —

J16 1-2 DATA_TX

J17 open —

J18 1-2 CSB_TX

J19 2-3 DATA_RX

J20 open —

J21 open —

J22 open —

J23 open —

J24 open —

J25 open —

J26 1-2 SCLK_TX

J27 open —

J28 open —

J29 1-2 VCC

J30 2-3 EN

J31 2-3 CSB_RX

J32 1-2 VCCIO

J33 1-2 INTB

J48 1-2 GND

J49 1-2 GND

Table 15. Jumper Setting to Work with FRDM-KEAZ128

Jumper Setting Description

J11 2-3 SCLK_RX

J12 open —

J13 1-2 SCLK_TX

J14 1-2 FAULT

J15 open —

J16 open —

J17 open —

J18 open —

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Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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Jumper Setting Description

J19 2-3 DATA_RX

J20 open —

J21 open —

J22 open —

J23 1-2 CSB_TX

J24 open —

J25 open —

J26 2-3 DATA_TX

J27 open —

J28 open —

J29 2-3 VCC

J30 2-3 EN

J31 2-3 CSB_RX

J32 2-3 VCCIO

J33 1-2 INTB

J48 2-3 GND

J49 2-3 GND

5 Configuring the hardware

The FRDM33664BEVB can be configured as a shield board connected to selected

Freedom boards or it can be used in a stand-alone configuration (without a Freedom

board).

5.1 Freedom board configuration

The layout of the connectors allow MCU development boards mentioned in Section 4.7

to be mounted directly to the FRDM33664BEVB. See Figure 5. When both boards

are connected together, the SPI connector is directly connected with the MCU SPI

pins. The routing of SPI signals through the Arduino™ connectors depends on the

specific Freedom board being used. In this configuration, power is supplied to the

FRDM33664BEVB through a USB cable connected between the Freedom board and a

PC. No external power supply is required.

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Figure 5. FRDM33664BEVB mounted to a FRDM-KL25Z

The board must be modified to be compatible with each specific Freedom board. This

modification is described in Section 4.7.

5.2 Standalone configuration

When the board is used in standalone mode, the SPI signals must be manually

connected to connectors J1, J2 and J9 on the board.

Table 16. Standalone configuration table

Signal Pin

FAULT J1 − 6

INTB J1 − 8

SCLK_TX J1 − 9

CSB_TX J1 − 14

DATA_TX J2 − 8

SCLK_RX J9 − 7

CSB_RX J9 − 5

DATA_RX J2 − 19

EN J2 − 18

Power supply connections to the FRDM33664BEVB are:

•VCC (5.0 V ): J9 − 10

•VCCIO (3.3 V or 5.0 V depending on the required communication signal levels): J9 − 8

•GND: J9 − 12, J9 − 14, J2 − 14

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

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6 References

[1] Product summary page — nxp.com/MC33664

[2] Product summary page — nxp.com/MC33771

[3] Product summary page — nxp.com/MC33772

[4] NXP DocStore — docstore.nxp.com

7 Revision history

Revision history

Rev Date Description

1.0 20180622 Initial release

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8 Legal information

8.1 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

8.2 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the removal or replacement

of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

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Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Safety of high-voltage evaluation products — The non-insulated high

voltages that are present when operating this product, constitute a risk of

electric shock, personal injury, death and/or ignition of fire. This product is

intended for evaluation purposes only. It shall be operated in a designated

test area by personnel that is qualified according to local requirements

and labor laws to work with non-insulated mains voltages and high-voltage

circuits. The product does not comply with IEC 60950 based national or

regional safety standards. NXP Semiconductors does not accept any liability

for damages incurred due to inappropriate use of this product or related to

non-insulated high voltages. Any use of this product is at customer’s own

risk and liability. The customer shall fully indemnify and hold harmless NXP

Semiconductors from any liability, damages and claims resulting from the

use of the product.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

8.3 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

NXP Semiconductors FRDM33664BEVB

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Tables

Tab. 1. Device features ................................................. 5

Tab. 2. Board description .............................................. 5

Tab. 3. Modes of operation ........................................... 6

Tab. 4. Test points .........................................................6

Tab. 5. Connector J5 description .................................. 7

Tab. 6. Connector J1 description .................................. 7

Tab. 7. Connector J2 description .................................. 8

Tab. 8. Connector J9 description .................................. 8

Tab. 9. Connector J10 description ................................ 9

Tab. 10. Jumper setting to work with FRDM-KL25Z

(default) ............................................................. 9

Tab. 11. Jumper Setting to Work with FRDM-KE06Z .... 10

Tab. 12. Jumper Setting to Work with FRDM-KL43Z .....11

Tab. 13. Jumper Setting to Work with FRDM-KV31F .... 12

Tab. 14. Jumper Setting to Work with FRDM-KW40Z ....13

Tab. 15. Jumper Setting to Work with FRDM-

KEAZ128 ......................................................... 13

Tab. 16. Standalone configuration table ........................15

Figures

Fig. 1. Block diagram ................................................... 4

Fig. 2. Board description .............................................. 5

Fig. 3. Test points .........................................................6

Fig. 4. Connectors ........................................................ 7

Fig. 5. FRDM33664BEVB mounted to a FRDM-

KL25Z ..............................................................15

NXP Semiconductors FRDM33664BEVB

Featuring the MC33664ATL1EG isolated communication network high-speed transceiver IC

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: [email protected]

Date of release: 22 June 2018

Document identifier: FRDM33664BEVBUG

Contents

1 FRDM33664BEVB ................................................ 1

2 Important notice .................................................. 2

3 Getting started .................................................... 3

3.1 Kit contents/packing list ..................................... 3

3.2 Required equipment and software .....................3

4 Getting to know the hardware ........................... 4

4.1 Board overview ..................................................4

4.2 Board features ................................................... 4

4.3 Block diagram ....................................................4

4.3.1 Device features ..................................................4

4.4 Board description ...............................................5

4.5 Test-point definitions ..........................................6

4.6 Connectors .........................................................6

4.7 Compatible NXP MCU development

platforms ............................................................ 9

5 Configuring the hardware ................................ 14

5.1 Freedom board configuration ...........................14

5.2 Standalone configuration ................................. 15

6 References ......................................................... 16

7 Revision history ................................................ 16

8 Legal information .............................................. 17

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