Panasonic TH-37PG9W User manual

©2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TH-37PG9W
TH-42PG9W
GP9D Chassis
Progressive Wide Hospitality Plasma Display
Specifications
Power Source 220-240 V
A
C, 50/60Hz
Power Consumption
Power on 250 W (37 inch) 280 W (42 inch)
Stand-b
y
condition Save OFF 0.8 W, Save ON 0.6 W (37 inch) Save OFF 0.8 W, Save ON 0.6 W (42 inch)
Power off condition 0.2 W (37 inch) 0.2 W (42 inch)
Plasma Displa
y
panel Drive method:
A
C type 37-inch, Drive method:
A
C type 42-inch,
16:9 aspect ratio (37 inch) 16:9 aspect ratio (42 inch)
Contrast Ratio Ma
x
10000:1
Screen size 818 mm (W) × 461 mm (H) × 939 mm (diagonal) (37 inch)
920 mm (W) × 518 mm (H) × 1,056 mm (diagonal) (42 inch)
(No. of pixels) 408,960 (852 (W) × 480(H))
[2,556 × 480 dots]
Operating condition
Temperature 0 °C - 40 °C
Humidit
y
20% - 80%
Applicabl
e
signals
Scanning format 525 (480) / 60i 60p, 625 (575)
/
50i 50p, 750 (720)
/
60p 50p, 1125 (1080) / 60i 50i 24p 25p
30p 24sF.... SMPTE274M, 1250 (1080) / 50i
PC signals VG
A
SVGA, XGA, SXGA, UXGA..... (compressed)
Horizontal scanning frequency 15 - 110 kHz
Vertical scanning frequency 48 - 120 Hz
Connection terminals
COMPONENT Y/G(BNC)
PB/B(BNC),PR/R(BNC)
AUDIO IN (RCA PIN JACK × 2)
Y
or G with
/
syn
c
1.0 Vp-p (75-ohm)
0.7 Vp-p (75-ohm)
0.5 Vrms
PC (HIGH-DENSIT
Y
Mini-D-SUB 15PIN)
Y
or G with
/
syn
c
1.0 Vp-p (75-ohm)
Y
or G without / syn
c
0.7 Vp-p (75-ohm)
B
/
PB
/
CB:0.7 Vp-p (75-ohm)
ORDER NO. ITD0609073CE

1 Applicable signals 4
2 Safety Precautions 5
2.1. General Guidelines 5
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 6
4 About lead free solder (PbF) 7
5 Service Hint 8
6 Disassembly 9
6.1. Removal of the Back Cover 9
6.2. Removal of the HA-Board 9
6.3. Removal of the Slot Block 9
6.4. Removal of the J-Board 10
6.5. Removal of the HX-Board 10
6.6. Removal of the DA-Board 11
6.7. Removal of the P-Board 11
6.8. Removal of the D-Board 11
6.9. Removal of the Speaker (L, R) 11
6.10. Removal of the SU-Board and the SD-Board 12
6.11. Removal of the SC-Board 12
6.12. Removal of the SS-Board 13
6.13. Removal of the C1, C2-Board 13
6.14. Removal of the S-Board 14
6.15. Removal of the GK-Board 14
6.16. Removal of the K-Board 14
6.17. Removal of the Control Panel, the Power SW and the
Door 15
6.18. Removal of the Front Glass 15
6.19. Removal of the Escutcheon 16
6.20. Removal of the Plasma Panel 18
7 Location of Lead Wiring 20
7.1. Location of Lead Wiring (1) 20
7.2. Location of Lead wiring (2) 21
7.3. Location of Lead wiring (3) 22
7.4. Location of Lead Wiring (4) 23
8 Adjustment Procedure 24
8.1. Driver Set-up 24
8.2. Initialization Pulse Adjust 25
8.3. P.C.B. (Printed Circuit Board) exchange 25
8.4. Adjustment Volume Location 26
8.5. Test Point Location 27
9 Service mode 28
9.1. CAT (computer Aided Test) mode 28
9.2. IIC mode structure (following items value is sample data.)
31
10 Adjustment 32
10.1. RGB white balance adjustment 32
10.2. HD white balance adjustment 34
10.3. Power control adjustment 36
11 Troubleshooting guide 37
11.1. Self Check 37
11.2. No Power 39
11.3. No Picture 39
11.4. Local screen failure 40
12 Option Setting 41
R
/
PR
/
CR:0.7 Vp-p (75-ohm)
HD
/
VD:1.0 - 5.0 Vp-p (high impedance)
VBS (use HD port) with
/
picture 1.0 Vp-p (high impedance)
without
/
picture 0.3 Vp-p (high impedance)
A
UDIO IN (M3 JACK) 0.5 Vrms
SERIAL EXTERNAL CONTROL TERMINAL (D-SUB 9PIN) RS-232C COMPATIBLE
Accessories Supplied
Fixing bands TMME187 × 2
Dimensions (
W
×H×D) 917 mm × 644 mm × 95 mm 1,020 mm ×705 mm × 95 mm
(109 mm when including protruding portion of slots)
(37 inch)
(109 mm when including protruding portion of slots)
(42 inch)
Mass (weight) approx. 26.0 kg net (37 inch) approx. 30.0 kg net (42 inch)
Sound
Speaker 120 mm × 60 mm × 2 pcs, 8-ohm
A
udio output 20W〔10W + 10W〕（10％THD）
Notes:
· Design and specifications are subject to change without notice. Mass and dimensions shown are approximate.
CONTENTS
Page Page
2
TH-37PG9W / TH-42PG9W

13 Conduct Views 43
13.1. P-Board (37inch) 43
13.2. P-Board (42inch) 46
13.3. HA-Board 49
13.4. HX-Board 50
13.5. GK, K and S-Board 51
13.6. J-Board 52
13.7. DA-Board 54
13.8. D-Board 56
13.9. C1-Board (37inch) 58
13.10. C1-Board (42inch) 59
13.11. C2-Board (37inch) 60
13.12. C2-Board (42inch) 61
13.13. SC-Board 62
13.14. SU-Board (37inch) 65
13.15. SU-Board (42inch) 66
13.16. SD-Board (37inch) 67
13.17. SD-Board (42inch) 68
13.18. SS-Board 69
14 Block and Schematic Diagram 71
14.1. Schematic Diagram Notes 71
14.2. Main Block Diagram 72
14.3. P-Board Block Diagram (37inch) 73
14.4. P-Board (1 of 6) Schematic Diagram (37inch) 74
14.5. P-Board (2 of 6) Schematic Diagram (37inch) 75
14.6. P-Board (3 of 6) Schematic Diagram (37inch) 76
14.7. P-Board (4 of 6) Schematic Diagram (37inch) 77
14.8. P-Board (5 of 6) Schematic Diagram (37inch) 78
14.9. P-Board (6 of 6) Schematic Diagram (37inch) 79
14.10. P-Board Block Diagram (42inch) 80
14.11. P-Board (1 of 6) Schematic Diagram (42inch) 81
14.12. P-Board (2 of 6) Schematic Diagram (42inch) 82
14.13. P-Board (3 of 6) Schematic Diagram (42inch) 83
14.14. P-Board (4 of 6) Schematic Diagram (42inch) 84
14.15. P-Board (5 of 6) Schematic Diagram (42inch) 85
14.16. P-Board (6 of 6) Schematic Diagram (42inch) 86
14.17. HA-Board Block and Schematic Diagram 87
14.18. HX-Board Block and Schematic Diagram 88
14.19. GK and K-Board Block and Schematic Diagram 89
14.20. J-Board (1 of 2) Block Diagram 90
14.21. J-Board (2 of 2) Block Diagram 91
14.22. J-Board (1 of 5) Schematic Diagram 92
14.23. J-Board (2 of 5) Schematic Diagram 93
14.24. J-Board (3 of 5) Schematic Diagram 94
14.25. J-Board (4 of 5) Schematic Diagram 95
14.26. J-Board (5 of 5) Schematic Diagram 96
14.27. DA-Board (1 of 2) Block Diagram 97
14.28. DA-Board (2 of 2) Block Diagram 98
14.29. DA-Board (1 of 6) Schematic Diagram 99
14.30. DA-Board (2 of 6) Schematic Diagram 100
14.31. DA-Board (3 of 6) Schematic Diagram 101
14.32. DA-Board (4 of 6) Schematic Diagram 102
14.33. DA-Board (5 of 6) Schematic Diagram 103
14.34. DA-Board (6 of 6) Schematic Diagram 104
14.35. D-Board Block Diagram 105
14.36. D-Board (1 of 6) Schematic Diagram 106
14.37. D-Board (2 of 6) Schematic Diagram 107
14.38. D-Board (3 of 6) Schematic Diagram 108
14.39. D-Board (4 of 6) Schematic Diagram 109
14.40. D-Board (5 of 6) Schematic Diagram 110
14.41. D-Board (6 of 6) Schematic Diagram 111
14.42. C1 and C2-Board Block Diagram 112
14.43. C1-Board (1 of 2) Schematic Diagram (37inch) 113
14.44. C1-Board (2 of 2) Schematic Diagram (37inch) 114
14.45. C1-Board (1 of 2) Schematic Diagram (42inch) 115
14.46. C1-Board (2 of 2) Schematic Diagram (42inch) 116
14.47. C2-Board (1 of 2) Schematic Diagram (37inch) 117
14.48. C2-Board (2 of 2) Schematic Diagram (37inch) 118
14.49. C2-Board (1 of 2) Schematic Diagram (42inch) 119
14.50. C2-Board (2 of 2) Schematic Diagram (42inch) 120
14.51. SC, SU and SD-Board Block Diagram 121
14.52. SC-Board (1 of 2) Schematic Diagram 122
14.53. SC-Board (2 of 2) Schematic Diagram 123
14.54. SU-Board Schematic Diagram (37inch) 124
14.55. SU-Board Schematic Diagram (42inch) 125
14.56. SD-Board Schematic Diagram (37inch) 126
14.57. SD-Board Schematic Diagram (42inch) 127
14.58. SS and S-Board Block Diagram 128
14.59. SS and S-Board Schematic Diagram 129
15 Parts Location 131
15.1. Exploded View 131
15.2. Cable relation 132
15.3. Packing summary 133
16 Mechanical Replacement Parts List 135
17 Replacement Parts List 136
17.1. Replacement Parts List Notes 136
17.2. TH-37PG9W Electrical Replacement Parts List 137
17.3. TH-42PG9W Electrical Replacement Parts List 158
18 Schematic Diagram for printing with A4 179
3
TH-37PG9W / TH-42PG9W

1 Applicable signals
4
TH-37PG9W / TH-42PG9W

2.1.1. Leakage Current Cold Check
1. Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2. Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screw heads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1MΩand 5.2MΩ.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
2.1.2. Leakage Current Hot Check (See
Figure 1.)
1. Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6. The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
5
TH-37PG9W / TH-42PG9W

3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
6
TH-37PG9W / TH-42PG9W

4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
7
TH-37PG9W / TH-42PG9W

5 Service Hint
Note:
· The remote control transmitter is not included with this set.
· Execute by the following remote control transmitter when repairing.
product number : EUR7636070R
Board Name Function
DA Digital Signal Processor, Micon
D Format Converter, Plasma AI Processor
Sub-Field Processor
J Slot Interface (Audio / Video / Sync input
Switch),
SYNC processor, Sound processor,
SS Sustain drive
SC Scan drive
SU Scan out (Upper)
SD Scan out (Lower)
C1 Data Drive (Right)
C2 Data Drive (Left)
SP Speaker
S Power switch
K Remote receiver, LED_G,R
GK Key switch
P Power supply
HX PC / RS-232C_Input terminal
HA BNC Component Video
Note:
· Extension cable kit Slot Board is supplied as service fixtures and tools.
(Parts No. TZCS07040)
8
TH-37PG9W / TH-42PG9W

6 Disassembly
· To disassemble P.C.B., wait for 1 minute after power was
off for discharge from electrolysis capacitors.
· and marks indicate screw positions.
6.1. Removal of the Back Cover
1. Remove the screws (×6 ,×6 , ×14 ,×8 ) and then
remove the Back Cover.
6.2. Removal of the HA-Board
1. Remove the 4 screws(D) and then remove the HA Terminal
Block.
2. Remove the 4 screws(E).
3. Remove the 2 screws(F) and then remove the HA-Board.
6.3. Removal of the Slot Block
1. Disconnect the couplers (J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15).
2. Remove the 4 screws and then remove the Slot Block.
9
TH-37PG9W / TH-42PG9W

6.4. Removal of the J-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. The slot block is turned inside out.
3. Remove the 6 screws and then remove the Slot cover.
4. Remove the 6 screws, release the coupler(J14) from HX-
Board and then remove the J-Board.
6.5. Removal of the HX-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Remove the J-Board.
(Reference to Removal of the J-Board)
3. Remove the 2 screws and then remove the Slot Case.
4. Remove the 4 Hexagonal-Head screws and the 1 screw
and then remove the HX-Board.
10
TH-37PG9W / TH-42PG9W

6.6. Removal of the DA-Board
1. Disconnect the couplers(DA1, DA3, DA5, DA6).
2. Remove the Flexible Cable from the coupler(DA2).
3. Remove the 4 screws and then remove the DA-Board.
Note:
A re-setup of the destination is performed by MS mode
after DA-Board exchange.
6.7. Removal of the P-Board
1. Disconnect the couplers(P2, P5, P9, P10, P11, P12, P23,
P25)
2. Remove the 6 screws and then remove the P-Board.
6.8. Removal of the D-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Disconnect the couplers(D5, D20, D25)
3. Remove the Flexible Cable from the couplers (D3, D31,
D32).
4. Remove the 4 screws and then remove the D-Board.
6.9. Removal of the Speaker (L, R)
6.9.1. Removal of the Speaker (L)
1. Disconnect the coupler (J8).
2. Remove the 2 screws ( ) and then remove the Plate.
3. Remove the 4 screws ( ) and then remove the Speaker (L).
11
TH-37PG9W / TH-42PG9W

6.9.2. Removal of the Speaker (R)
1. Disconnect the coupler (J7).
2. Remove the 2 screws ( ) and then remove the Plate.
3. Remove the 4 screws ( ) and then remove the Speaker (R).
6.10. Removal of the SU-Board and
the SD-Board
1. Remove the each 2 screws.
2. Remove the Flexible Cable from the couplers(SU1, SU2,
SU3).
3. Remove the Flexible Cable from the couplers(SD1, SD2,
SD3).
4. Disconnect the couplers(SU45, SD46).
5. Slide the SU-Board and the SD-Board to the left, remove
the SU-Board and the SD-Board from the couplers(SC41,
SC42).
6.11. Removal of the SC-Board
1. Slide the SU-Board and the SD-Board to the left.
(Reference to Removal of the SU-Board and the SD-Board)
2. Disconnect the couplers(SC2, SC20, SC23).
3. Remove the 6 screws and then remove the SC-Board.
12
TH-37PG9W / TH-42PG9W

6.12. Removal of the SS-Board
1. Disconnect the couplers(SS11, SS12, SS23, SS34).
2. Remove the Flexible Cable from the couplers(SS41, SS42,
SS43, SS44)
3. Remove the 6 screws and then remove the SS-Board.
6.13. Removal of the C1, C2-Board
1. Remove the Slot Block.
(Reference to Removal of the Slot Block)
2. Remove the each 6 screws and then remove the Stand
Blocks.
6.13.1. Removal of the C1-Board
1. Disconnect the couplers(C11, C12).
2. Remove the 6 screws and then remove the Flexible Cable
from the couplers(CB1, CB2, CB3).
3. Remove the 3 screws and then remove the C1-Board.
6.13.2. Removal of the C2-Board
1. Disconnect the coupler(C21, C22).
2. Remove the 8 screws and then remove the Flexible Cable
from the couplers(CB4, CB5 CB6, CB7).
3. Remove the 4 screws and then remove the C2-Board.
13
TH-37PG9W / TH-42PG9W

6.14. Removal of the S-Board
1. Disconnect the coupler(SS34).
2. Remove the 2 screws(A) and then remove the S-Board
Block.
3. Disconnect the coupler(S1).
4. Remove the 2 screw(B) and then remove the S-Board.
6.15. Removal of the GK-Board
1. Remove the 2 screws(C) and then remove the Plate(A).
2. Remove the 2 screws(D).
3. Disconnect the coupler(GK3) and then remove the GK-
Board.
6.16. Removal of the K-Board
1. Remove the 2 screws.
2. Disconnect the coupler(K1) and then remove the K-Board.
14
TH-37PG9W / TH-42PG9W

6.17. Removal of the Control Panel,
the Power SW and the Door
1. Remove the S-Board Block.
(Remove to the Removal of the S-Board)
2. Remove the K-Board.
(Remove to the Removal of the K-Board)
3. Remove the GK-Board.
(Remove to the Removal of the GK-Board)
4. Remove the 5 screws(E) and then remove the Plate(B).
5. Remove the 2 screws(F) and then remove the Control
Panel.
6. Remove the 1 screw(G) and then remove the Spring.
7. Remove the 3 hooks and then remove the Door.
8. Remove the 4 hooks and then remove the Power SW.
6.18. Removal of the Front Glass
1. Disconnect the couplers(J2, J7, J8, J15, SS34).
2. Remove the 10 screws.
3. Pull the bottom of the Plasma Panel forward (arrow1).
4. Slide the Plasma Panel and then remove the Plasma Panel
(arrow2).
5. Remove the 5 screws (E) and then remove the Plate (B).
6. Remove the each screws and then remove the Glass Fixed
Plate (A, B, C, D).
7. Remove the Front Glass.
15
TH-37PG9W / TH-42PG9W

· TH-42PG9W
Removed number of screws: 25
· TH-37PG9W
Removed number of screws: 23
Note: when Front Glass is exchanged
· Each Front Glass Sponge must be stuck along the
edge of Fixed Angle.
Note
· The sponges are parts which cannot be recycled.
Please use the new article when you exchange the
Front Glass.
6.19. Removal of the Escutcheon
1. Disconnect the couplers(J2, J7, J8, J15, SS34).
2. Remove the 10 screws.
3. Lift up the bottom of the Plasma Panel in the direction of the
arrow1 and pull the Plasma Panel in the direction of the
arrow2 and then remove the Plasma Panel.
4. Remove the S-Board Block.
(Remove to the Removal of the S-Board)
5. Remove the K-Board.
(Remove to the Removal of the K-Board)
6. Remove the GK-Board.
(Remove to the Removal of the GK-Board)
7. Remove the 5 screws(E) and then remove the Plate(B).
8. Remove the 2 screws(F) and then remove the Control
Panel.
16
TH-37PG9W / TH-42PG9W

9. Remove the 1 screw(G) and then remove the Spring.
10. Remove the 3 hooks and then remove the Door.
11. Remove the 4 hooks and then remove the Power SW.
12. Remove the each screws and then remove the Glass Fixed
Plate (A, B, C, D).
· TH-42PG9W
Removed number of screws: 25
· TH-37PG9W
Removed number of screws: 23
Note: when Front Glass is removed
· Each Front Glass Sponge must be stuck along the
edge of Fixed Angle.
Note
· The sponges are parts which cannot be recycled.
Please use the new article when you exchange the
Front Glass.
13. Remove the each 1 screw and then remove the Plate(L, R).
14. Remove the each 4 screws and then remove the Speaker
(L, R).
15. Remove the Escutcheon.
17
TH-37PG9W / TH-42PG9W

6.20. Removal of the Plasma Panel
· The C1,C2 module is connected with the plasma panel
for the repair.
1. Remove the each 6 screws and then remove the Stand
Blocks.
2. Disconnect the couplers(J1, J2, J3, J4, J5, J6, J7, J8, J10,
J15).
3. Remove the 4 screws and then remove the Slot Block.
4. Remove the Flexible Cable from the couplers(DA2).
5. Remove the 4 screws and then remove the D-Board Block.
6. Disconnect the couplers(P2, P9, P11, P12, P23, P25).
7. Remove the 6 screws and then remove the P-Board.
8. Disconnect the coupler(D20).
9. Remove the Flexible Cable from the couplers(C11, C21).
10. Remove the 4 screws and then remove the D-Board.
11. Remove the SU-Board and the SD-Board.
(Reference to Removal of the SU-Board and the SD-Board)
12. Remove the 6 screws and then remove the SC-Board.
18
TH-37PG9W / TH-42PG9W

13. Disconnect the couplers(SS23, SS34).
14. Remove the Flexible Cable from the couplers(SS41, SS42,
SS43, SS44).
15. Remove the 6 screws and then remove the SS-Board.
16. Remove the Flexible Cable from the couplers(C12, C22).
17. Remove the 3 screws and then remove the C1-Board.
18. Remove the 3 screws(H) and then remove the AC Inlet
Block.
19. Remove the 2 screws(J) and then remove the plate(C).
20. Remove the 6 Spacers and Spacer Rings from the Plasma
Panel.
Caution
· Please confirm the installation place of Spacer and
Spacer Ring when you exchange the Plasma Panel,
and install Spacer and Spacer Ring in an original
installation place after exchanging the Plasma
Panel.
21. Lift up the bottom of the Plasma Panel in the direction of the
arrow1 and pull the Plasma Panel in the direction of the
arrow2 and then remove the Plasma Panel.
19
TH-37PG9W / TH-42PG9W

7 Location of Lead Wiring
7.1. Location of Lead Wiring (1)
The lead wiring is dressed as shown in figure.
20
TH-37PG9W / TH-42PG9W