Panasonic KX-MB262CX User manual

© 2007 Panasonic Communications Co., Ltd. All© 2007 Panasonic Communications Co., Ltd. All
ORDER NO.KMF0711125CE.ORDER NO.KMF0711125CE.
Multi-Function printerMulti-Function printer
KX-MB262CXKX-MB262CX
KX-MB772CXKX-MB772CX
(for Asia and Middle Near East)(for Asia and Middle Near East)

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
TT
ABLE OF ABLE OF
CONTENTSCONTENTS
PP
AA
GG
EE
PP
AA
GG
EE
11
SafeSafe
ty Pty P
recaurecau
tiontion
--------------------------------------------------------------------------------------------------
33
1.1.1.1.
FOR FOR
SERVICE SERVICE
TECHNICIANSTECHNICIANS
----------------------------------
-------3-------3
1.2.1.2.
AC AC
CAUTIONCAUTION
----------------------------------
------------------------------------
------------3------------3
1.3.1.3.
PERSPERS
ONAL SAFETONAL SAFET
Y Y
PRECPREC
AUTIAUTI
ONSONS
--------
----------
--------
-4-4
1.4.1.4.
SERVICE SERVICE
PRECAUTIONSPRECAUTIONS
--------------------------------
--------------4--------------4
22
WaWa
rnirni
ngng
--------------------------------------
--------------------------------------
----------------------------------------
--------
55
2.1.2.1.
ABOUABOU
T LEAD FREE SOT LEAD FREE SO
LDER (PLDER (P
bF: Pb free)bF: Pb free)
--------
-5-5
2.2.2.2.
Discarding Discarding
of Pof P
. C. . C.
BoardBoard
----------------------------------
---------------6---------------6
2.3.2.3.
INSULAINSULA
TION RESISTTION RESIST
ANCE TEST------------------ANCE TEST------------------
--6--6
2.4.2.4.
BABA
TTERY TTERY
CAUTIONCAUTION
----------------------------------
------------------------------------
---6---6
2.5.2.5.
LASELASE
R BEAM ANR BEAM AN
D FUSER UD FUSER U
NIT SECNIT SEC
TIONTION
--------
--6--6
33
SpecSpec
ificatificat
ionsions
----------------------------------
--------------------------------------
------------------------------------
77
44
GeneGene
ral/Iral/I
ntrodntrod
uctiouctio
nn
------------------------------------------------------------------------------------------
88
4.1.4.1.
OPTIONAL OPTIONAL
ACCESSORIEACCESSORIE
SS
--------------------------------
------------8------------8
55
FeFe
atat
urur
eses
--------------------------------------
--------------------------------------
----------------------------------------
--------
99
5.1.5.1.
General General
Features-----------Features-----------
------------------------------------
--------------9--------------9
5.2.5.2.
HARDWHARDW
ARE REQUIREMARE REQUIREM
ENTS FOR MULENTS FOR MUL
TI-TI-
FUNCTION FUNCTION
SOFTWARSOFTWAR
E----------------------E----------------------
-----------9-----------9
66
TT
echniechni
cal cal
DescrDescr
iptioiptio
nsns
--------------------------------------------------------------------------------
1010
6.1.6.1.
CONNECTIOCONNECTIO
N N
DIAGRAM-----------------------DIAGRAM-----------------------
------------
1010
6.2.6.2.
GENERAL GENERAL
BLOCK BLOCK
DIAGRAM-------------DIAGRAM-------------
----------------------
1111
6.3.6.3.
MAIN MAIN
BOARD BOARD
SECTION---------------SECTION---------------
--------------------------------
1313
6.4.6.4.
NCU NCU
SECTION (KX-MB772CX SECTION (KX-MB772CX
ONLONL
Y)Y)
------------------------
2525
6.5.6.5.
ITS (IntegrITS (Integr
ated telephone ated telephone
System) System)
andand
MONITOR MONITOR
SECTION SECTION
(KX-MB772CX (KX-MB772CX
ONLONL
Y)Y)
--------
2626
6.6.6.6.
CIS CIS
CONCON
TROL TROL
SECTSECT
IONION
----------
----------
--------
----------
----------
--------
--
2727
6.7.6.7.
MOTOR MOTOR
DRIVE DRIVE
SECTION----------SECTION----------
------------------------------------
--
2828
6.8.6.8.
TIMING CHARTIMING CHAR
T AND WAT AND WA
VE FORM OFVE FORM OF
SCANNER SCANNER
MOTORSMOTORS
----------------------------------
------------------------------------
3232
6.9.6.9.
FAN FAN
MOTOR MOTOR
SECTION-----------------------------SECTION-----------------------------
------
3535
6.10.6.10.
SOLENOID SOLENOID
DRIVER DRIVER
SECTIONSECTION
----------------------------
----------------
3737
6.11.6.11.
LSU LSU
(Laser (Laser
Scanning Scanning
Unit) Unit)
SECTIONSECTION
----------------------------
3838
6.12.6.12.
SENSSENS
ORS AND SWITORS AND SWIT
CHES SECCHES SEC
TIONTION
--------
----------
----
4040
6.13.6.13.
OPERAOPERA
TION TION
BOARD BOARD
SECTION-------------------SECTION-------------------
----
4848
6.14.6.14.
LCD LCD
SECTION-----------------SECTION-----------------
----------------------------------
--------------------
4949
6.15.6.15.
HVPS (High HVPS (High
VoltVolt
age Power Supplyage Power Supply
))
SECTION-------SECTION-------
--------------------------------------
--------------------------------------
------------
5050
6.16.6.16.
HEAHEA
T LAMP T LAMP
CONTROL CONTROL
CIRCUIT-------CIRCUIT-------
------------------------
5252
6.17.6.17.
Main Main
Board Board
Section----------------------Section----------------------
--------------------------------
5757
6.18.6.18.
POWEPOWE
R SUPPLR SUPPL
Y BOARD SECTIY BOARD SECTI
ONON
----------
----------
----60----60
6.19.6.19.
Mechanical Mechanical
Operation----------------------Operation----------------------
--------------------------
6161
77
Location of Location of
Controls anControls an
d Compod Compo
nentsnents
------------------------------------
6363
7.1.7.1.
OVERVIEW-----------------OVERVIEW-----------------
--------------------------------------
------------------------
6363
7.2.7.2.
CONTROL CONTROL
PP
ANEL----------------------------ANEL----------------------------
----------------------
6464
88
InstInst
allatiallati
on on
InstrInstr
uctiucti
onsons
------------------------------------------------------------------------------
6565
8.1.8.1.
INSTINST
ALLAALLA
TIONTION
--------------------------------
----------------------------------
--------------------
6565
8.2.8.2.
CONNECTIONCONNECTION
S---------------------------S---------------------------
------------------------------
7676
99
OperOper
ation Instation Inst
ructiructi
onsons
--------------------------------------------------------------------------------
7878
9.1. 9.1.
YOUR LOGYOUR LOG
O (KX-MBO (KX-MB
772CX only)--------772CX only)--------
--------
-----78-----78
1010
TT
est Moest Mo
dede
----------------------------------
--------------------------------------
----------------------------------------
----
8080
10.1.10.1.
TEST TEST
FUNCTIONS-----------------------FUNCTIONS-----------------------
------------------------------
8080
1111
ServiServi
ce Mce M
odeode
------------------------------------
----------------------------------
------------------------------------
8484
11.1.11.1.
PROGRAMPROGRAM
MING MING
AND AND
LISTSLISTS
--------------------------------
----------------
8484
11.211.2
..
USER MODUSER MOD
E (The list below is an examE (The list below is an exam
ple ofple of
the SYSTEM SETthe SYSTEM SET
UP LIST the unit prints out.)---UP LIST the unit prints out.)---
8888
11.3.11.3.
SERVICE MSERVICE M
ODE SETTINGS ODE SETTINGS
(Example of a(Example of a
printed out printed out
list)list)
8989
1212
TrTr
oubloubl
eshooeshoo
ting Guideting Guide
------------------------------------------------------------------------------
9393
12.1.12.1.
USER RECUSER REC
OVEROVER
ABLE ERRABLE ERR
ORSORS
--------
----------
--------
----------
9393
12.2.12.2.
REMOTE REMOTE
PROGRAMPROGRAM
MING (KXMING (KX
-MB772CX-MB772CX
ONLONL
Y)Y)
--------------------------------------
--------------------------------------
--------------------------------
9595
12.3.12.3.
TROUBLESHTROUBLESH
OOTING OOTING
DETDET
AILSAILS
--------------------------------
------
102102
12.4.12.4.
DOCUMEDOCUME
NT JAMS (AUNT JAMS (AU
TO DOCTO DOC
UMENTUMENT
FEEDER) (KX-MB772CX ONLFEEDER) (KX-MB772CX ONL
Y)Y)
--------------------------------
------
177177
12.5.12.5.
RECORDING RECORDING
PP
APER APER
JAMJAM
------------------------------
-----------179-----------179
1313
Service FixtuService Fixtu
re & re &
ToTo
olsols
----------------------------------------------------------------------------
187187
1414
Disassembly Disassembly
and Assemand Assem
bly Instructbly Instruct
ionsions
--------------------------
188188
14.1.14.1.
ADF ADF
SECTIONSECTION
--------------------------------
----------------------------------
---------189---------189
14.2.14.2.
REMOVE REMOVE
ADF ADF
SECTION SECTION
(1)(1)
------------------------------
---------190---------190
14.3.14.3.
REMOVE REMOVE
ADF ADF
SECTION SECTION
------------------------------
------------191------------191
14.4.14.4.
REMOVE REMOVE
TOP TOP
COVER COVER
SECTION---------------SECTION---------------
----
192192
14.5.14.5.
REMOVE REMOVE
SCANNER SCANNER
GLASS GLASS
SECTION---------SECTION---------
193193
14.6.14.6.
REMREM
OVE OPERAOVE OPERA
TION PTION P
ANEL SECTANEL SECT
IONION
--------
--194--194
14.7.14.7.
LEFT LEFT
SIDE SIDE
SECTIONSECTION
----------------------------------
----------------195----------------195
14.8.14.8.
REMOREMO
VE VE
MAIMAI
N N
BOARBOAR
DD
----------
----------
----------
--------
----------
-----195-----195
14.9.14.9.
REMOVE REMOVE
GEAR GEAR
CHASSIS CHASSIS
SECTION------------SECTION------------
196196
14.10.14.10.
REMOVE REMOVE
PAPA
PER FEPER FE
ED ROED RO
LLERLLER
-----------------197-----------------197
14.114.1
1.1.
RIGHT RIGHT
SIDE SIDE
SECTIONSECTION
----------------------------------
--------------197--------------197
14.12.14.12.
REMOVE REMOVE
RIGHT SRIGHT S
IDE COVEIDE COVE
R SECTIOR SECTIO
N------N------
198198
14.1314.13
..
LOWELOWE
R SIDE CABINER SIDE CABINE
T SECTIONT SECTION
----------
----------
-----199-----199
14.1414.14
..
REMREM
OVE RIGHT CASSOVE RIGHT CASS
ETTE GUIDEETTE GUIDE
----------
--------
---200---200
14.15.14.15.
REMOVE REMOVE
PICK PICK
UP UP
BOARDBOARD
------------------------------
----------200----------200
14.16.14.16.
REMOVE HIGREMOVE HIG
H VOLH VOL
TT
AGE POWER AGE POWER
BOARD---BOARD---
201201
14.17.14.17.
REMOVE REMOVE
PICK PICK
UP RUP R
OLLER OLLER
UNIT----------------UNIT----------------
202202
14.18.14.18.
REMOVE REMOVE
LOW LOW
VOLVOL
TATA
GE PGE P
OWER OWER
BOARDBOARD
------
203203
14.19.14.19.
REMOVE REMOVE
FUSER FUSER
UNIT----------UNIT----------
----------------------------------
--------
204204
14.20.14.20.
Installation Installation
Position Position
of Tof T
he Lead------------he Lead------------
--------205--------205
1515
MaiMai
ntente
nacnac
ee
------------------------------------
--------------------------------------
------------------------------------
211211
15.1.15.1.
MAINTENAMAINTENA
NCE ITEMS ANCE ITEMS A
ND COMPOND COMPO
NENTNENT
LOCALOCA
TIONSTIONS
------------------------------------
------------------------------------
------------------
2121
11
15.2.15.2.
MAINTENANCMAINTENANC
E---------------E---------------
----------------------------------
---------213---------213
15.3.15.3.
PRINTING PRINTING
OPERAOPERA
TION TION
PRINCIPLEPRINCIPLE
-------------218-------------218
15.4.15.4.
TERMINAL TERMINAL
GUIDE GUIDE
OF THE OF THE
ICsICs
TRANSISTOTRANSISTO
RS AND RS AND
DIODES---------DIODES---------
-------------223-------------223
15.5.15.5.
HOW TO RHOW TO R
EPLAEPLA
CE THE FLACE THE FLA
T PAT PA
CKAGCKAG
E ICE IC
--
225225
15.6.15.6.
MAIN MAIN
BOARD BOARD
SECTIONSECTION
--------------------------------
-------------227-------------227
15.7.15.7.
TEST TEST
CHART-------CHART-------
------------------------------------
----------------------------------
----
229229
1616
SchemSchem
atic Datic D
iagraiagra
mm
--------------------------------------------------------------------------------------
231231
16.1.16.1.
For For
Schematic Schematic
Diagram-----------------------------Diagram-----------------------------
----
231231
16.2.16.2.
KX-MB262CX KX-MB262CX
MAIN MAIN
BOARD------------------------232BOARD------------------------232
16.3.16.3.
KX-MB772CX KX-MB772CX
MAIN MAIN
BOARD------------------------242BOARD------------------------242
16.4.16.4.
OPERAOPERA
TION TION
BOARDBOARD
----------------------------
--------------------------------
------
252252
16.5.16.5.
SENSOR SENSOR
BOARDBOARD
----------------------------------
----------------------------------
--------
253253
1717
PrinPrin
ted Circted Circ
uit Boauit Boa
rdrd
----------------------------------------------------------------------------------
255255
17.1.17.1.
MAIN MAIN
BOARDBOARD
----------------------------------
----------------------------------
---------255---------255
17.2.17.2.
OPERAOPERA
TION TION
BOARDBOARD
----------------------------
--------------------------------
------
257257
17.3.17.3.
SENSOR SENSOR
BOARDBOARD
----------------------------------
----------------------------------
--------
259259
1818
Exploded View Exploded View
and Replacement and Replacement
Parts ListParts List
--------------------
262262
18.1.18.1.
CABINETCABINET
, MECHANICAL AND ELECTR, MECHANICAL AND ELECTR
ICALICAL
PP
ARTS ARTS
LOCALOCA
TION-----------------------TION-----------------------
--------------262--------------262
18.2.18.2.
REPLACEMENREPLACEMEN
T T
PAPA
RTS RTS
LISTLIST
----------------------------------
----------
275275

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
11
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1.1.
Before servicing, unplug Before servicing, unplug
the AC power cord to prevthe AC power cord to prev
ent an electric shockent an electric shock
..
2.2.
When replacing parts, use only the manufacWhen replacing parts, use only the manufac
turer's recommturer's recomm
ended components.ended components.
3.3.
Check the condition oCheck the condition o
f the power cord. Replace if wf the power cord. Replace if w
ear or damage is evidentear or damage is evident
..
4.4.
After servicing, be sure to restorAfter servicing, be sure to restor
e the lead dress, insulation barriers, insulation papers, shields, etc.e the lead dress, insulation barriers, insulation papers, shields, etc.
5.5.
Before returning the serviced equipment to the customerBefore returning the serviced equipment to the customer
, be sure to perform the following insulation resistance test to prevent, be sure to perform the following insulation resistance test to prevent
the customer from being exposed the customer from being exposed
to shock hazards.to shock hazards.
11
..
11
..
FF
OO
R SR S
EE
RR
VV
II
CC
E TE T
EE
CC
HH
NN
II
CC
II
AA
NN
SS
••
Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can vent fires, injury or electric shock, which can
be caused by improper repair work.be caused by improper repair work.
1.1.
When repair services arWhen repair services ar
e provided, neither the products nor their parts or membee provided, neither the products nor their parts or membe
rs shall be remodeled.rs shall be remodeled.
2.2.
If a lead wire assembly is supplied as a repair part, the lead wire assembly sIf a lead wire assembly is supplied as a repair part, the lead wire assembly s
hall be replaced.hall be replaced.
3.3.
FASFAS
TON terminals TON terminals
shall be plugged straight in and unplugged strashall be plugged straight in and unplugged stra
ight out.ight out.
••
ICs and LSIs ICs and LSIs
are vulnerable to are vulnerable to
static electricitystatic electricity
..
When repairing, the following precautions will help prevent When repairing, the following precautions will help prevent
recurring malfunctions.recurring malfunctions.
1.1.
Cover the plasCover the plas
tic part's boxtic part's box
es with alumes with alum
inum foil.inum foil.
2.2.
GrouGrou
nd the soldend the solde
ring ironring iron
s.s.
3.3.
Use a coUse a co
nductive mat nductive mat
on the workton the workt
able.able.
4.4.
Do not touch tDo not touch t
he IC or LSI he IC or LSI
pins with bare fpins with bare f
ingers.ingers.
11
..
22
..
AA
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CC
AA
UU
TT
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For safetyFor safety
, before closing the lower , before closing the lower
cabinet, please make sure of the following precautions.cabinet, please make sure of the following precautions.
1.1.
The earth lead is The earth lead is
fixed with the fixed with the
screwscrew
..
2.2.
The AC cThe AC c
onnector is connector is c
onnected properlyonnected properly
..

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
1.1.
3.3.
PEPE
RSRS
OO
NANA
L SL S
AFAF
ETET
Y PY P
RR
ECEC
AA
UTUT
II
ONON
SS
1.1.
3.3.
11
..
MOMO
VV
ININ
G SG S
ECEC
TITI
ONON
S OS O
F TF T
HH
E UE U
NINI
TT
Be careful not to Be careful not to
let your hair, clothes, fingers, accessorieslet your hair, clothes, fingers, accessories
, etc., become caught in any moving sections of the , etc., become caught in any moving sections of the
unit.unit.
The moving sections of the unit are the The moving sections of the unit are the
rollers and a gear. There is a separation roller and a rollers and a gear. There is a separation roller and a
document feed roller which are rotateddocument feed roller which are rotated
by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unitby the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unit
is operating.is operating.
1.3.2.1.3.2.
LIVE ELECTRICAL SECTIONSLIVE ELECTRICAL SECTIONS
All the electrical sections All the electrical sections
of the unit supplied with AC powof the unit supplied with AC pow
er by the AC power corer by the AC power cor
d are live.d are live.
Never disassemble the unit for service with the AC power supply plugged in.Never disassemble the unit for service with the AC power supply plugged in.
CAUTION:CAUTION:
AC voltage is supplied to the primary side of the power supply unit. AC voltage is supplied to the primary side of the power supply unit.
Therefore, always unplug the AC power cord before disas-Therefore, always unplug the AC power cord before disas-
sembling for service.sembling for service.
11
..
44
..
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EE
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II
CC
E PRE PR
EE
CC
AA
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1.41.4
.1..1.
PREPRE
CAUCAU
TIOTIO
NS TNS T
O PRO PR
EVEEVE
NT NT
DAMDAM
AGE AGE
FROFRO
M SM S
TT
AA
TIC TIC
ELEELE
CTRCTR
ICIICI
TYTY
Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change theirElectrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their
electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.
Never touch the electrical sections such as the power supply unit, Never touch the electrical sections such as the power supply unit,
etc.etc.

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
22
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2.2.
1.1.
ABAB
OUOU
T LT L
EAEA
D FD F
RERE
E SE S
OLOL
DEDE
R (R (
PbPb
F: F:
Pb Pb
frfr
eeee
))
Note:Note:
In the information below, Pb, the symbol for lead in the periodic table of In the information below, Pb, the symbol for lead in the periodic table of
elements, will refer to standard solder or solder that con-elements, will refer to standard solder or solder that con-
tains lead.tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repairThis model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of work we suggest using the same type of
solder although, with some precautions, standard Pb solder can also be used.solder although, with some precautions, standard Pb solder can also be used.
CautionCaution
••
PbF solder has PbF solder has
a melting point that a melting point that
is 50is 50
°°
~ 70~ 70
°°
F, (30F, (30
°°
~ 40~ 40
°°
C) higher than Pb solder. Please use a soldering iron C) higher than Pb solder. Please use a soldering iron
with tempera-with tempera-
ture control and adjust it to 700ture control and adjust it to 700
°°
± 20± 20
°°
F, (370F, (370
°°
± 10± 10
°°
C). In case of using high temperature soldering iron, please be careful not toC). In case of using high temperature soldering iron, please be careful not to
heat too long.heat too long.
••
PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1
100100
°°
F, (600F, (600
°°
C).C).
••
If you must use Pb solder on a PCB maIf you must use Pb solder on a PCB ma
nufactured using PbF soldernufactured using PbF solder
, remove as much of the original PbF solder as poss, remove as much of the original PbF solder as poss
ible andible and
be sure that any remaining is be sure that any remaining is
melted prior to applying the Pb melted prior to applying the Pb
solder.solder.
••
When applying PbF solder to double layered boards, please check the componWhen applying PbF solder to double layered boards, please check the compon
ent side for excess which may flow onto theent side for excess which may flow onto the
opposite side (See figure, below).opposite side (See figure, below).
22
.1.1
..
11
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There are several types of There are several types of
PbF solder available commerciallyPbF solder available commercially
. While . While
this product is manufactured using Tin, Silver, and Copper,this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use (Sn+Ag+Cu), you can also use
Tin and Copper, (Sn+Cu), or Tin, Zinc, and Tin and Copper, (Sn+Cu), or Tin, Zinc, and
Bismuth, (Sn+Zn+Bi). Please check the manufac-Bismuth, (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their turer’s specific instructions for the melting points of their
products and any precautions for using their product with otherproducts and any precautions for using their product with other
materials.materials.
The following lead free The following lead free
(PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.(PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

KX-MB262CX/KX-MB772CX
2.
2.
D
is
ca
rd
i
ng
of
P
.
C
.
B
oa
rd
When discarding P
. C. Board,
delete all
personal information such as telephone
directory and caller list o
r scrap P
. C. Board.
2.
3.
IN
SU
LA
TI
ON
RE
SI
ST
AN
CE
TE
ST
1.
Unplug the power cord an
d short the two prongs of the plug w
ith a jumper wire.
2.
Tur
n on the power swi
tch.
3.
Measure the resistanc
e value with an ohmmeter between the jumpered AC plug and each exposed met
al cabinet part
(screw heads, control shafts, bottom frame, etc.).
Note: Some exposed parts may be
isolated from the
chassis by design. These will
read infinity.
4.
If the measurement is outside the specified limits
, there is a possibility of a shock hazard.
2
.
4
.
B
A
T
T
E
R
Y
C
A
U
T
I
O
N
CAUTION
Danger of explosion if the battery is replaced incorrectly. Replace only with the same or equivalent type recommended by the
manufacturer
. Discard used batteries according
to following caution:
Disposal of lithium batteries should be
performed by permitted, professional disposal firms knowledgeable in
state government
federal and local
hazardous materials and hazardous waste transportation and
disposal requirements.
A battery continues to have no tr
ansportation limitations
as long as it is separated to prev
ent short circuits
and packed in strong
packaging.
Commercial firms that dispose of any quantity of
lithium cells should have a
mechanism in place to account for their
ultimate dis-
position. This is a good
practice for all types of commercial or industrial waste.
Recommend Type Number:
CR2354 (BAT300) Manufactured by MATSUSHITA
2.5.
LASER BEAM AND FUSER UNIT SECTION
•
The printer of this unit utilizes a laser. Use of controls or adjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.
•
The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleaning the lower glass.

KX-MB262CX/KX-MB772CX
3
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KX-MB772CX only
* Transmission speed depends upon the contents of the pages, resolution, telephone line conditions and capability of the other
party’s machine.
** Transmission speed is based upon the ITU-T No. 1 Test Chart. (Refer to
ITU-T No.1 TEST CHART
(P.229).) If the capability of
the other party's machine is inferior to your unit,
the transmission time may be longer.
Note:
•
Design and s
pecifications are
subject to ch
ange without notice.
•
The pictures and illustrations in these instructions m
ay vary slightly from the actual product.
Applicable Lines:
Multi-Function printer
Document Size:
KX-MB262CX
: Max. 216 mm in width, Max. 297 mm in
length
KX-MB772CX
: Max. 216 mm in with, Max. 600
mm in length
Effective Scanning Width:
208 mm
Effective Printing Width:
Letter/ Legal: 208 mm
A4: 202 mm
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:
C
o
p
y
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s
o
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:
Up to 600
×
600 dpi (Scanner Glass)
Scanning resolution:
Up to 600
×
1200 dpi (Optical)
Up to 9600
×
9600 dpi (Interpolated)
Photo resolution:
64-level
Scanner Type:
Color C
ontact
Image S
ensor
Printer Type:
Laser printer
Operating Environment:
10
°
C—32.5
°
C, 20—70% RH (Relative Humidity)
Dimensions (H
×
W
×
D):
KX-MB262CX
: Approx. height 255mm x width 420 mm x depth
445 m
KX-MB772CX
: Approx. height 305mm x width 420 mm x depth
445 m
Mass (Weight):
KX-MB262CX: Approx. 12kg
KX-MB772CX: Approx. 13kg
Power Consumption:
Standby: Approx. 6.5 W
Preheat: Approx. 65 W
Copy: Approx. 320 W
Maximum: Approx
. 950 W (When the
fuser lamp turns on)
Power Supply:
220 - 240 V AC, 50/60 Hz
Memory Capacity (for operation and
storing memory):
32 MB
Laser diode properties:
Laser output: Max. 5 mW
Wave length: 760 nm—810 nm
Emission duration: Continuous
Print Speed:
18 ppm (page per minute)
Printing Resolution:
600
×
600 dpi
Applicable Lines:
Public Switched Telephone Network
Transmission Time*:
Approx.
4 s/page (ECM
-MMR Mem
ory transmiss
ion)**
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F
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:
Horizontal:
8 pels/mm
Vertical:
3.85 lines/mm STANDARD
7.7 lines/mm
FINE/PHOT
O
15.4 lines/mm SUPER FINE
Data Compression System:
Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR)
Modem Speed:
33,600 / 31,200 / 28,800 / 26,400 / 24,000 / 21,600 / 19,200 / 16,800 / 14,400 / 12,000 /
9,600 / 7,200 / 4,800
/ 2,400 bps; Automatic Fallback
Fax Memory Capacity:
2 MB in total
Approx. 170 pages of
memory recep
tion
Approx. 150 pages of
memory transm
ission
(Based on the ITU-T
No. 1 Test Chart in standard resolution.)
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:
Up to 600 x 300
dpi (Auto document feeder)

KX-MB262CX/KX-MB772CX
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a
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s
KX-F
A
T92A/
KX-F
AT9
2E
Repla
cemen
t
toner
cartri
dge
1
toner
cartri
dge
K
X
-
F
A
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9
3
A
/
K
X
-
F
A
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9
3
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KX-MB262CX/KX-MB772CX
Description of Pin Distribution (IC300) SOC (System On
Chip)
P
I
N
N
O
.
P
i
n
N
a
m
e
I
/
O
P
O
W
E
R
S
U
P
P
L
Y
V
O
L
T
A
G
E
E
X
P
L
A
N
A
T
I
O
N
A02
LEDONB
O
3.3V
SCANNER INTERFACE
A03
NCCDON
O
3.3V
SCANNER INTERFACE
A04
AFEMCLK
O
3.3V
SCANNER INTERFACE
A05
NCCDCP
O
3.3V
NOT USED
A06
CCDCLK
O
3.3V
NOT USED
A07
PIO29
O
3.3V
OPERATION P
ANEL INTERFACE
A08
PIO57
O
3.3V
CARRIAGE MOTOR INTERFACE
A09
PIO53
O
3.3V
CARRIAGE/ADF MOTOR INTERFACE
A10
PIO50
O
3.3V
CARRIAGE/ADF MOTOR INTERFACE
A11
PIO46
O
3.3V
FAN1 CONTROL
A12
PIO42
O
3.3V
DC MOTOR INTERF
ACE
A13
NFRCE
O
3.3V
FLASH MEMORY CHIP SELECT
A14
FRMD0
I/O
3.3V
FLASH MEMORY DA
TA BUS 0
A15
FRMD3
I/O
3.3V
FLASH MEMORY DA
TA BUS 3
A16
FRMD7
I/O
3.3V
FLASH MEMORY DA
TA BUS 7
A17
FRMA3
O
3.3V
FLASH MEMORY ADDRESS BUS 3
A18
FRMA6
O
3.3V
FLASH MEMORY ADDRESS BUS 6
A19
FRMA10
O
3.3V
FLASH MEMORY ADDRESS BUS 10
A20
THRMAVDD
-
3.3V
POWER SUPPLY
A21
FRMA11
O
3.3V
FLASH MEMORY ADDRESS BUS 11
A22
FRMA15
O
3.3V
FLASH MEMORY ADDRESS BUS 15
A23
FRMA17
O
3.3V
FLASH MEMORY ADDRESS BUS 17
A24
FRMA20
O
3.3V
FLASH MEMORY ADDRESS BUS 20
A25
FRMA22
O
3.3V
FLASH MEMORY ADDRESS BUS 22
AA01
SDMD8
I/O
3.3V
SDRAM DAT
A BUS 8
AA02
SDMD9
I/O
3.3V
SDRAM DAT
A BUS 9
AA03
SDMA7
O
3.3V
SDRAM ADDRESS BUS 7
AA04
SDMA6
O
3.3V
SDRAM ADDRESS BUS 6
AA23
VDD1.2
-
1.2V
POWER SUPPLY
AA24
AFERST
O
3.3V
NCU INTERFACE
AA25
RING
I
3.3V
NCU INTERFACE
AA26
EXTINT
I
3.3V
NCU INTERFACE
AB01
SDMD10
I/O
3.3V
SDRAM DAT
A BUS 10
AB02
SDMD1
1
I/O
3.3V
SDRAM DAT
A BUS 11
AB03
SDMA5
O
3.3V
SDRAM ADDRESS BUS 5
AB04
VDD1.2
-
1.2V
POWER SUPPLY
AB23
VSS
-
GND
GND
AB24
BTXD
O
3.3V
NCU INTERFACE
AB25
BRXD
I
3.3V
NCU INTERFACE
AB26
AFECLK
O
3.3V
NCU INTERFACE
AC01
SDMD12
I/O
3.3V
SDRAM DAT
A BUS 12
AC02
SDMD13
I/O
3.3V
SDRAM DAT
A BUS 13
AC03
SDMA4
O
3.3V
SDRAM ADDRESS BUS 4
AC04
VSS
-
GND
GND
AC05
VSS
-
GND
GND
AC06
VDD1.2
-
1.2V
POWER SUPPLY
AC07
TXD0
O
3.3V
ETHERNET INTERFACE
AC08
TX_ER
O
3.3V
ETHERNET INTERFACE
AC09
RXD1
I
3.3V
ETHERNET INTERFACE
AC10
VDD3.3
-
3.3V
POWER SUPPLY
AC11
TEST
I
3.3V
NOT USED
AC12
USBREXT
I
3.3V
USB INTERFACE
AC13
VDD1.2
-
1.2V
POWER SUPPLY
AC14
VDD3.3
-
3.3V
POWER SUPPLY
AC15
USBXIN
I
3.3V
CRYSTAL(12M
Hz) INPUT
AC16
LSI_SCAN_ENABLE
I
3.3V
NOT USED
AC17
VDD1.2
-
1.2V
POWER SUPPLY
AC18
NWDTRST
O
3.3V
WA
TCH DOG TIMER RESET OUTPUT
AC19
LSI_TN
I
3.3V
NOT USED
AC20
PSCIO2
I
3.3V
INPUT PORT (FANDET1)
AC21
PSCIO6
O
3.3V
NOT USED
AC22
VDD1.2
-
1.2V
POWER SUPPLY
AC23
VSS
-
GND
GND

KX-MB262CX/KX-MB772CX
AC26
BSPCLK
I/O
3.3V
NCU INTERFACE
AD01
SDMD14
I/O
3.3V
SDRAM DAT
A BUS 14
AD02
SDMD15
I/O
3.3V
SDRAM DAT
A BUS 15
AD03
VSS
-
GND
GND
AD04
NBATRST
I
3.3V
BATTERY RESET INPUT
AD05
VDD2RTC
-
1.2V
POWER SUPPLY
AD06
CRS
I
3.3V
ETHERNET INTERFACE
AD07
TXD1
O
3.3V
ETHERNET INTERFACE
AD08
RX_DV
I
3.3V
ETHERNET INTERFACE
AD09
RXD2
I
3.3V
ETHERNET INTERFACE
AD10
RX_ER
I
3.3V
ETHERNET INTERFACE
AD11
CLKSEL
I
3.3V
NOT USED
AD12
USBVSSA33_BIAS
-
GND
GND
AD13
USBVSSA33
-
GND
GND
AD14
USBVDDA12_SQ
-
1.2V
POWER SUPPLY
AD15
USBVSSA12
-
GND
GND
AD16
LSI_TRSTN
I
3.3V
NOT USED
AD17
LSI_TDO
O
3.3V
NOT USED
AD18
NRST
I
3.3V
SYSTEM RESET INPUT
AD19
HTRCTL
O
3.3V
HEATER CONTROL
AD20
PSCIO3
I
3.3V
INPUT PORT (POUT)
AD21
PSCIO7
O
3.3V
NOT USED
AD22
PSCIO15
I
3.3V
INPUT PORT (RPS)
AD23
NC
-
-
NOT USED
AD24
VSS
-
GND
GND
AD25
ASPCLK
I/O
3.3V
NCU INTERFACE
AD26
ARXD
I
3.3V
NCU INTERFACE
AE01
SDLDM1
O
3.3V
SDRAM DQML1
AE02
VSS
-
GND
GND
AE03
SYSPLLVSS1
-
GND
GND
AE04
RTCCLKOUT
O
3.3V
CRYSTAL(32.768KHz) OUTPUT
AE05
RTCPWRDWN
I
3.3V
RTC POWER DOWN
AE06
TX_CLKI
I
3.3V
ETHERNET INTERFACE
AE07
TXD2
O
3.3V
ETHERNET INTERFACE
AE08
RX_CLKI
I
3.3V
ETHERNET INTERFACE
AE09
RXD3
I
3.3V
ETHERNET INTERFACE
AE10
MDC
O
3.3V
ETHERNET INTERFACE
AE11
NC
-
-
NOT USED
AE12
USBID
O
3.3V
NOT USED
AE13
USBDM
I/O
3.3V
USB INTERFACE
AE14
USBVSSA12_SQ
-
GND
GND
AE15
USBVDDA12PLL
-
1.2V
POWER SUPPLY
AE16
USBVDDA12
-
1.2V
POWER SUPPLY
AE17
LSI_TDI
I
3.3V
NOT USED
AE18
LSI_PROCMON
O
3.3V
NOT USED
AE19
LSI_IDDT
I
3.3V
NOT USED
AE20
PSCIO1
I
3.3V
INPUT PORT (PICK)
AE21
PSCIO5
O
3.3V
NOT USED
AE22
PSCIO13
I
3.3V
INPUT PORT (TNR)
AE23
MDMCLKOUT
O
3.3V
CRYSTAL(24
.576MHz) OUTPUT
AE24
MDMPLLVDD
-
3.3V
POWER SUPPLY
AE25
VSS
-
GND
GND
AE26
ABITCLK
I/O
3.3V
NCU INTERFACE
AF02
SYSPLLVDD1
-
3.3V
POWER SUPPLY
AF03
VDD3.3OSC
-
3.3V
POWER SUPPLY
AF04
RTCCLKIN
I
3.3V
CRYSTAL(32.7
68KHz) INPUT
AF05
COL
I
3.3V
ETHERNET INTERFACE
AF06
TX_EN
O
3.3V
ETHERNET INTERFACE
AF07
TXD3
O
3.3V
ETHERNET INTERFACE
AF08
RXD0
I
3.3V
ETHERNET INTERFACE
AF09
MDIO
I/O
3.3V
ETHERNET INTERFACE
AF10
MGTINT
I
3.3V
ETHERNET INTERFACE
AF11
USBVBUS
O
3.3V
USB INTERFACE
AF12
USBVDDA33_BIAS
-
3.3V
POWER SUPPLY
AF13
USBDP
I/O
3.3V
USB INTERFACE
P
I
N
N
O
.
P
i
n
N
a
m
e
I
/
O
P
O
W
E
R
S
U
P
P
L
Y
V
O
L
T
A
G
E
E
X
P
L
A
N
A
T
I
O
N

KX-MB262CX/KX-MB772CX
AF16
USBXOUT
I
3.3V
CRYSTAL(12M
Hz) OUTPUT
AF17
LSI_TMS
I
3.3V
NOT USED
AF18
LSI_TCK
I
3.3V
NOT USED
AF19
LSI_CW_TAP
I
3.3V
NOT USED
AF20
PSCIO0
I
3.3V
INPUT PORT (REGIST)
AF21
PSCIO4
O
3.3V
NOT USED
AF22
PSCIO12
I
3.3V
INPUT PORT (POUT)
AF23
PSCIO14
I
3.3V
INPUT PORT (DOCU)
AF24
MDMCLKIN
I
3.3V
CRYSTAL(24.
576MHz) INPUT
AF25
MDMPLL
VSS
-
GND
GND
B
0
1
A
F
E
A
D
C
0
I
3
.
3
V
N
O
T
U
S
E
D
B
0
2
V
S
S
-
G
N
D
G
N
D
B
0
3
L
E
D
O
N
G
O
3
.
3
V
S
C
A
N
N
E
R
I
N
T
E
R
F
A
C
E
B
0
4
A
F
E
R
S
M
P
O
3
.
3
V
N
O
T
U
S
E
D
B
0
5
A
F
E
V
S
M
P
O
3
.
3
V
S
C
A
N
N
E
R
I
N
T
E
R
F
A
C
E
B
0
6
N
C
C
D
R
S
O
3
.
3
V
S
C
A
N
N
E
R
I
N
T
E
R
F
A
C
E
B
0
7
P
I
O
3
0
I
/
O
3
.
3
V
O
P
E
R
A
T
I
O
N
P
A
N
E
L
I
N
T
E
R
F
A
C
E
B
0
8
M
M
P
W
R
O
3
.
3
V
N
O
T
U
S
E
D
B
0
9
P
I
O
5
4
O
3
.
3
V
C
A
R
R
I
A
G
E
/
A
D
F
M
O
T
O
R
I
N
T
E
R
F
A
C
E
B
1
0
P
I
O
5
1
O
3
.
3
V
C
A
R
R
I
A
G
E
/
A
D
F
M
O
T
O
R
I
N
T
E
R
F
A
C
E
B
1
1
P
I
O
4
7
O
3
.
3
V
N
O
T
U
S
E
D
B
1
2
P
I
O
4
3
O
3
.
3
V
D
C
M
O
T
O
R
I
N
T
E
R
F
A
C
E
B
1
3
N
F
R
O
E
O
3
.
3
V
F
L
A
S
H
M
E
M
O
R
Y
C
H
I
P
O
U
T
P
U
T
E
N
A
B
L
E
B
1
4
F
R
M
D
1
I
/
O
3
.
3
V
F
L
A
S
H
M
E
M
O
R
Y
D
A
T
A
B
U
S
1
B
1
5
F
R
M
D
4
I
/
O
3
.
3
V
F
L
A
S
H
M
E
M
O
R
Y
D
A
T
A
B
U
S
4
B
1
6
F
R
M
A
0
O
3
.
3
V
F
L
A
S
H
M
E
M
O
R
Y
A
D
D
R
E
S
S
B
U
S
0
B
1
7
F
R
M
A
4
O
3
.
3
V
F
L
A
S
H
M
E
M
O
R
Y
A
D
D
R
E
S
S
B
U
S
4
B
1
8
F
R
M
A
7
O
3
.
3
V
F
L
A
S
H
M
E
M
O
R
Y
A
D
D
R
E
S
S
B
U
S
7
B
1
9
T
H
R
M
A
V
S
S
-
G
N
D
G
N
D
B
2
0
T
O
N
E
O
3
.
3
V
A
N
A
L
O
G
(
T
O
N
E
)
O
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H
I
G
H
V
O
L
T
A
G
E
U
N
I
T
I
N
T
E
R
F
A
C
E
J
2
6
P
I
O
4
O
3
.
3
V
H
I
G
H
V
O
L
T
A
G
E
U
N
I
T
I
N
T
E
R
F
A
C
E
K
0
1
V
S
S
-
G
N
D
G
N
D
K
0
2
S
D
C
L
K
2
O
3
.
3
V
S
D
R
A
M
C
L
O
C
K
2
K
0
3
V
S
S
-
G
N
D
G
N
D
K
0
4
V
D
D
3
.
3
-
3
.
3
V
P
O
W
E
R
S
U
P
P
L
Y
K
2
3
V
D
D
1
.
2
-
1
.
2
V
P
O
W
E
R
S
U
P
P
L
Y
P
I
N
N
O
.
P
i
n
N
a
m
e
I
/
O
P
O
W
E
R
S
U
P
P
L
Y
V
O
L
T
A
G
E
E
X
P
L
A
N
A
T
I
O
N

KX-MB262CX/KX-MB772CX
K
2
6
P
I
O
3
9
O
3
.
3
V
N
O
T
U
S
E
D
L
0
1
S
D
M
D
2
4
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
2
4
L
0
2
S
D
M
D
2
5
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
2
5
L
0
3
S
D
M
A
1
O
3
.
3
V
S
D
R
A
M
A
D
D
R
E
S
S
B
U
S
1
L
0
4
S
D
M
A
Ç
O
O
3
.
3
V
S
D
R
A
M
A
D
D
R
E
S
S
B
U
S
0
L
1
1
V
S
S
-
G
N
D
G
N
D
L
1
2
V
S
S
-
G
N
D
G
N
D
L
1
3
V
S
S
-
G
N
D
G
N
D
L
1
4
V
S
S
-
G
N
D
G
N
D
L
1
5
V
S
S
-
G
N
D
G
N
D
L
1
6
V
S
S
-
G
N
D
G
N
D
L
2
3
P
I
O
3
7
I
3
.
3
V
I
N
P
U
T
P
O
R
T
(
R
I
N
G
)
L
2
4
P
I
O
3
8
O
3
.
3
V
N
O
T
U
S
E
D
L
2
5
P
I
O
3
6
O
3
.
3
V
N
O
T
U
S
E
D
L
2
6
P
I
O
3
5
O
3
.
3
V
N
O
T
U
S
E
D
M
0
1
S
D
M
D
2
6
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
2
6
M
0
2
S
D
M
D
2
7
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
2
7
M
0
3
S
D
M
A
1
0
O
3
.
3
V
S
D
R
A
M
A
D
D
R
E
S
S
B
U
S
1
0
M
0
4
S
D
B
A
1
O
3
.
3
V
S
D
R
A
M
B
A
N
K
A
D
D
R
E
S
S
1
M
1
1
V
S
S
-
G
N
D
G
N
D
M
1
2
V
S
S
-
G
N
D
G
N
D
M
1
3
V
S
S
-
G
N
D
G
N
D
M
1
4
V
S
S
-
G
N
D
G
N
D
M
1
5
V
S
S
-
G
N
D
G
N
D
M
1
6
V
S
S
-
G
N
D
G
N
D
M
2
3
P
I
O
3
3
O
3
.
3
V
N
O
T
U
S
E
D
M
2
4
P
I
O
3
4
O
3
.
3
V
N
O
T
U
S
E
D
M
2
5
P
I
O
2
6
O
3
.
3
V
N
O
T
U
S
E
D
M
2
6
P
I
O
2
5
O
3
.
3
V
O
U
T
P
U
T
P
O
R
T
(
C
N
G
M
U
T
E
)
N
0
1
S
D
M
D
2
8
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
2
8
N
0
2
S
D
M
D
2
9
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
2
9
N
0
3
S
D
B
A
0
O
3
.
3
V
S
D
R
A
M
B
A
N
K
A
D
D
R
E
S
S
0
N
0
4
V
D
D
1
.
2
-
1
.
2
V
P
O
W
E
R
S
U
P
P
L
Y
N
1
1
V
S
S
-
G
N
D
G
N
D
N
1
2
V
S
S
-
G
N
D
G
N
D
N
1
3
V
S
S
-
G
N
D
G
N
D
N
1
4
V
S
S
-
G
N
D
G
N
D
N
1
5
V
S
S
-
G
N
D
G
N
D
N
1
6
V
S
S
-
G
N
D
G
N
D
N
2
3
V
D
D
3
.
3
-
3
.
3
V
P
O
W
E
R
S
U
P
P
L
Y
N
2
4
P
I
O
2
3
O
3
.
3
V
N
O
T
U
S
E
D
N
2
5
P
I
O
2
2
O
3
.
3
V
N
O
T
U
S
E
D
N
2
6
P
I
O
2
0
O
3
.
3
V
N
O
T
U
S
E
D
P
0
1
S
D
M
D
3
0
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
3
0
P
0
2
S
D
M
D
3
1
I
/
O
3
.
3
V
S
D
R
A
M
D
A
T
A
B
U
S
3
1
P
0
3
N
S
D
C
S
O
3
.
3
V
S
D
R
A
M
C
H
I
P
S
E
L
E
C
T
1
P
0
4
V
D
D
3
.
3
-
3
.
3
V
P
O
W
E
R
S
U
P
P
L
Y
P
1
1
V
S
S
-
G
N
D
G
N
D
P
1
2
V
S
S
-
G
N
D
G
N
D
P
1
3
V
S
S
-
G
N
D
G
N
D
P
1
4
V
S
S
-
G
N
D
G
N
D
P
1
5
V
S
S
-
G
N
D
G
N
D
P
1
6
V
S
S
-
G
N
D
G
N
D
P
2
3
V
D
D
1
.
2
-
1
.
2
V
P
O
W
E
R
S
U
P
P
L
Y
P
2
4
P
I
O
1
6
O
3
.
3
V
N
O
T
U
S
E
D
P
2
5
P
I
O
1
7
O
3
.
3
V
N
O
T
U
S
E
D
P
2
6
P
I
O
1
8
I
3
.
3
V
H
I
G
H
V
O
L
T
A
G
E
U
N
I
T
I
N
T
E
R
F
A
C
E
R
0
1
S
D
U
D
M
1
O
3
.
3
V
S
D
R
A
M
D
Q
M
U
1
R
0
2
S
D
L
D
M
0
O
3
.
3
V
S
D
R
A
M
D
Q
M
L
0
R
0
3
B
Z
V
D
D
3
3
-
3
.
3
V
P
O
W
E
R
S
U
P
P
L
Y
R
0
4
B
Z
R
S
T
3
3
-
3
.
3
V
P
O
W
E
R
S
U
P
P
L
Y
R
1
1
V
S
S
-
G
N
D
G
N
D
R
1
2
V
S
S
-
G
N
D
G
N
D
R
1
3
V
S
S
-
G
N
D
G
N
D
R
1
4
V
S
S
-
G
N
D
G
N
D
P
I
N
N
O
.
P
i
n
N
a
m
e
I
/
O
P
O
W
E
R
S
U
P
P
L
Y
V
O
L
T
A
G
E
E
X
P
L
A
N
A
T
I
O
N

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
6.6.
1212
.9.9
.2.2
..
DrDr
um um
DeDe
tete
ctct
ioio
nn

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
6.6.
1313
..
OPOP
ERER
AA
TITI
ON BON B
OAOA
RD SRD S
ECEC
TITI
ONON
The unit consists of a LCD (Liquid crystal display), KEYs and LEDs (light-emitting diodes). They are controlled by the Gate ArrayThe unit consists of a LCD (Liquid crystal display), KEYs and LEDs (light-emitting diodes). They are controlled by the Gate Array
(IC1) on Operation board and IC300 on (IC1) on Operation board and IC300 on
Main board.Main board.
The key matrix table is shown below.The key matrix table is shown below.
1.1.
Key MatrixKey Matrix
a.a.
HarHar
d Scd Sc
anan
*LED7 should be set to KSL4. *LED7 should be set to KSL4.
"8 x 5" key matrix is executed by hardw"8 x 5" key matrix is executed by hardw
are scanning.are scanning.
2.2.
LEDLED
••
AUTO ANAUTO AN
SWER LED ON/OSWER LED ON/O
FF port---LED6 (IC1-FF port---LED6 (IC1-
2pin)2pin)
••
FAX FAX
MODE LED OMODE LED O
N/OFF port---XLEDN/OFF port---XLED
8 (IC1-5pin)8 (IC1-5pin)
••
COPY MODCOPY MOD
E LED ON/OFF E LED ON/OFF
port---LED5 (IC1-41pin)port---LED5 (IC1-41pin)
••
SCAN MODSCAN MOD
E LED ON/OFF E LED ON/OFF
port---LED2 (IC1-36pin)port---LED2 (IC1-36pin)
KK
II
NN
00
KK
II
NN
11
KK
II
NN
22
KK
II
NN
33
KK
II
NN
44
KK
II
NN
55
KK
II
NN
66
KK
II
NN
77
KK
SS
LL
00
AA
UU
TT
O O
AA
NN
SS
WW
EE
RR
SS
11
SS
33
MM
OO
NN
II
TT
OO
RR
↓↓
**
##
--
KK
SS
LL
1 F1 F
AA
XX
SS
22
ZZ
OO
OO
MM
FF
LL
AA
SS
HH
←←
77
00
SS
TT
AA
RR
TT
KK
SS
LL
22
CC
OO
PP
YY
CC
OO
LL
LL
AA
TT
EE
RR
EE
DD
II
AA
LL
SS
EE
TT
44
99
66
KK
SS
LL
33
CC
OO
NN
TT
RR
AA
SS
TT
N N
ii
n n
11
MM
EE
NN
UU
↑↑
22
55
SS
TT
OO
PP
KSL4KSL4
(LED7)(LED7)
SS
CC
AA
NN
RR
EE
SS
OO
LL
UU
TT
II
OO
NN
LL
OO
WW
EE
RR
CC
AA
LL
LL
EE
R R
II
DD
→→
11
88
33
CN2CN2
CN511CN511
IC300IC300
ASICASIC
LCD MODULELCD MODULE
CN1CN1
8x58x5
KEYSKEYS
MATRIXMATRIX
(Hard)(Hard)
LEDLED
MM
AA
II
N N
BB
OO
AA
RR
D D
OO
PP
EE
RR
AA
TT
II
OO
N N
BB
OO
AA
RR
DD
GATE ARRAY ICGATE ARRAY IC
IC1IC1

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
66
..
11
44
..
LL
CC
D SD S
EE
CC
TT
II
OO
NN
The Gate Array (IC1) works only for writing the The Gate Array (IC1) works only for writing the
ASCII code from the data bus (D4~D7). V0 is supplied for ASCII code from the data bus (D4~D7). V0 is supplied for
the LCD drive.the LCD drive.
R118 and R117 are density control resistors.R118 and R117 are density control resistors.
ConsequentlyConsequently
, in this unit, , in this unit,
the timing (positive clock) is generated by the LCD interface circuitry in the timing (positive clock) is generated by the LCD interface circuitry in
the gate array (IC1).the gate array (IC1).

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
6.16.1
5.5.
HVPHVP
S (HiS (Hi
gh Vgh V
oltolt
age Page P
oweowe
r Supr Sup
plyply
) SEC) SEC
TIOTIO
NN
6.6.
1515
.1.1
..
HVHV
PS PS
SPSP
ECEC
IFIF
ICIC
AA
TITI
ONON
As for the developing voltaAs for the developing volta
ge, the DC voltage and Age, the DC voltage and A
C voltage are overlapped aC voltage are overlapped a
nd output from an output terminnd output from an output termin
al.al.
There is one terminal for transcription output and + and - are switched to be output.There is one terminal for transcription output and + and - are switched to be output.
6.16.1
5.25.2
..
CHGCHG
-BI-BI
AS AS
(Ch(Ch
argarg
e Be B
IASIAS
)/GR)/GR
ID/ ID/
UNIUNI
TT
When IC300 turns on the transistor Q506, CHG REM becomes “L”, and Charge BIAS (200When IC300 turns on the transistor Q506, CHG REM becomes “L”, and Charge BIAS (200
µµ
A) is A) is
output from output from
CHG OUTPUTCHG OUTPUT
..
GRID BIAS is generated by the current flowing in GRID BIAS is generated by the current flowing in
the GRID circuit via charge wire and GRID.the GRID circuit via charge wire and GRID.
CC
hh
aa
rr
gg
e e
((
CC
HH
GG
))
GG
rr
ii
dd
DD
ee
vv
ee
ll
oo
pp
ii
nn
g g
DD
CC
DD
ee
vv
ee
ll
oo
pp
ii
nn
g g
AA
CC
TT
rr
aa
nn
ss
ff
ee
r r
((
TT
RR
AA
) )
--
TT
rr
aa
nn
ss
ff
ee
r r
((
TT
RR
AA
) )
++
OuOu
tptp
ut ut
ChCh
arar
acac
tete
riri
stst
icic
ss
CoCo
nsns
tata
nt nt
cucu
rrrr
enen
tt
CoCo
nsns
tata
nt nt
vovo
ltlt
agag
ee
CoCo
nsns
tata
nt nt
vovo
ltlt
agag
ee
CoCo
nsns
tata
nt nt
vovo
ltlt
agag
ee
CoCo
nsns
tata
nt nt
cucu
rrrr
enen
tt
(Variable)(Variable)
Constant voltageConstant voltage
NN
oo
mm
ii
nn
aa
l l
OO
uu
tt
pp
uu
t t
VV
oo
ll
tt
aa
gg
ee
44
..
33
55
KK
VV
44
77
55
±±
11
00
VV
22
33
00
VV
±±
11
55
VV
(50~300V)(50~300V)
PWM20%PWM20%
300M300M
ΩΩ
/220pF/220pF
330V±15Vp-p330V±15Vp-p
34KHz34KHz
100M100M
ΩΩ
(-1.48KV)(-1.48KV)
785V±100V785V±100V
NominNomin
al Output Cal Output C
urrenturrent
200±1200±1
55
µµ
AA
(19.4M(19.4M
ΩΩ
))
200200
µµ
AA
0.730.73
µµ
AA
----------
-14.8-14.8
µµ
A±1A±1
µµ
AA
(0(0
µµ
A~25A~25
µµ
A)A)
PWM 35%PWM 35%
1000M1000M
ΩΩ
(0.8(0.8
µµ
A)A)
LL
oo
aa
d d
RR
aa
nn
gg
ee
11
88
..
11
MM
ΩΩ
~20.6M~20.6M
ΩΩ
--
--
--
--
--
11
00
00
MM
ΩΩ
~2000M~2000M
ΩΩ
--
--
--
--
--
33
33
..
88
MM
ΩΩ
~284M~284M
ΩΩ
10M10M
ΩΩ
~1000M~1000M
ΩΩ
Constant CurrentConstant Current
RangeRange
44
..
11
~~
44
..
66
KK
VV
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
00
..
55
KK
V V
~ ~
--
44
..
22
KK
VV
--
--
--
--
--

KX-MB262CX/KX-MB772CXKX-MB262CX/KX-MB772CX
6.6.
1515
.3.3
..
DEDE
V V
DC DC
BIBI
AS AS
UNUN
ITIT
When CHG REM is “L”, 5.425kHz PWM (Pulse Width Modulation) is input from IC300 to DEV CLK through Q504, developingWhen CHG REM is “L”, 5.425kHz PWM (Pulse Width Modulation) is input from IC300 to DEV CLK through Q504, developing
voltage corresponding to the DUTY of PWM signal voltage corresponding to the DUTY of PWM signal
is output from DEV OUTPUTis output from DEV OUTPUT
. Also DUTY is adjusted by . Also DUTY is adjusted by
the utilization of thethe utilization of the
developing unit and developing unit and
environmental temperature.environmental temperature.
6.6.
1515
.4.4
..
DEDE
V V
AC AC
BIBI
AS AS
UNUN
ITIT
330 Vp-p 34 kHz wave of developing AC voltage is output from DEV OUTPUT. This voltage is overlapped with developing DC330 Vp-p 34 kHz wave of developing AC voltage is output from DEV OUTPUT. This voltage is overlapped with developing DC
voltage and output as AC voltage that includes the voltage and output as AC voltage that includes the
development DC voltage.development DC voltage.
6.15.6.15.
5.5.
TRA (+) TRA (+)
BIAS (TBIAS (T
ransrans
fer (+fer (+
) BIAS)/) BIAS)/
TRA (-) TRA (-)
BIAS (TBIAS (T
ransrans
fer (-) Bfer (-) B
IAS) UNIAS) UN
ITIT
When CHG REM is “L” and TRA CLK is “open”, Charge BIAS (200When CHG REM is “L” and TRA CLK is “open”, Charge BIAS (200
µµ
A) A)
is output is output
from CHG from CHG
OUTPUTOUTPUT
, ,
and and
at at
the the
same timesame time
Transfer (+) BIAS (785V) is output from TRA OUTPUT. When 5.086kHz PWM (Pulse Width Modulation) signal is input to TRATransfer (+) BIAS (785V) is output from TRA OUTPUT. When 5.086kHz PWM (Pulse Width Modulation) signal is input to TRA
CLK through transistor Q501, Transfer (-) CURRENT BIAS corresponding to CLK through transistor Q501, Transfer (-) CURRENT BIAS corresponding to
PWM signal is output PWM signal is output
from TRA OUTPUTfrom TRA OUTPUT
..

KX-MB262CX/KX-MB772CX
6.
16
.
HE
A
T LA
MP C
ON
TR
OL C
IR
CU
IT
The temperature of the fixing part of the
Fuser Unit is converted to a voltage by THERMISTOR and input to IC300-D19pin. The
heat lamp is turned on/off by the
HTRCTL signal (IC300-AD19pin) through the photo triac (PC2) and the
triac (SCR51). And two
thermostats are set on the AC line as the
safety devices.
1.
Control at Printing
a.
After the printing signal is rec
eived, turn ON the heater
.
b.
After that, turn ON the motor at the Primary S
table T
emperature (170
°
C).
c.
After that, control at the S
econdary S
table temperature (195
°
C/200
°
C), and feed papers.

KX-MB262CX/KX-MB772CX