Panasonic KX-T7636 User manual

ORDERNO. KMS0308803C1
F19
Digital ProprietaryTelephone
KX-T7636 / KX-T7636-B
White version
Black version
(for U.S.A.)
2003 PanasonicCommunicationsCo., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
IMPORTANT INFORMATIONABOUT LEAD FREE, (PbF),

SOLDERING
Ifleadfree solderwas usedinthe manufacture of this productthe printedcircuitboards will be
markedPbF.
Standardleaded, (Pb), soldercanbe usedas usual on boards without the PbF mark.
Whenthis mark does appearplease readand followthe special instructions describedinthis
manual on the use of PbF and howitmight be permissible to use Pbsolderduring service and
repairwork.
1. ABOUTLEADFREE SOLDER(PbF:Pbfree)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthatcontains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made from Tin, (Sn), Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggestusing the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solderhas amelting pointthat is50° ~70° F, (30° ~40°C)
higherthanPbsolder. Please use asoldering iron with
temperaturecontrol and adjust itto700° ±20° F, (370° ±10°C). In
case ofusing high temperaturesoldering iron, please becareful
nottoheat too long.
-PbF solderwill tend tosplashifitisheatedmuchhigherthanits
melting point, approximately1100°F, (600°C).
-Ifyou must use Pbsolderon aPCB manufacturedusing PbF
solder, removeas muchoftheoriginal PbF solderas possibleand
besurethat anyremaining ismeltedprior toapplying thePb
solder.
-Whenapplying PbF soldertodoublelayeredboards, please check
thecomponentsidefor excess whichmayflowontotheopposite
side(See figure, below).

1.1. SUGGESTEDPbF SOLDER
There are several types of PbF solderavailable commercially. While this productis
manufacturedusing Tin, Silver, and Copper, (Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn
+Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufacturer’s specific instructions forthe melting points of theirproducts
and anyprecautions forusing theirproductwith othermaterials.
The following leadfree (PbF) solderwire gauges are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. HOWTO RECOGNIZE THATPbFREE SOLDERIS USED
PbF is stampedto showthatPbfree solderis used. (See the figure below.)
2. FORSERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Covertheplasticparts boxes withaluminum foil.
2. Ground thesoldering irons.
3. Use aconductivemat on theworktable.
4. DonottouchICor LSI pinswithbarefingers.
3. SPECIFICATIONS
Station Loop Limit: 90 ohms
Calling Method: 2 pairwire
Jacks: HandsetJack, TELJack, HeadsetJack
Dimensions: LowAngle:265 (D)mm [Operate]×208 (W)mm ×128 (H)mm
(10 7/16”×8 3/16”×5 1/32”)
High Angle:212 (D)mm [Operate]×208 (W)mm ×202 (H)mm
(8 11/32”×8 3/16”×7 15/16”)
213 (D)mm [Base](8 3/8”)
Weight: 1.13kg(39.86 oz.)
Design and specifications are subjectto change without notice.

4. LOCATIONOF CONTROLS

5. CONNECTION
Caution:
Consultyour dealerfor moredetailsaboutXDP.
6. DISASSEMBLY INSTRUCTIONS

1. Remove 9 Screws (A).
2. Remove the Bottom Cabinet.
3. Remove the P. C. Boardfrom the Top Cabinet.
7. HOWTO REPLACE AFLATPACKAGE IC
7.1. PREPARATION
-PbF (:Pbfree) Solder
-Soldering Iron

TipTemperatureof700°F±20°F(370°C±10°C)
Note:Werecommend a30 to40 Watt soldering iron. Anexpert
maybeabletouse a60 to80 Watt iron wheresomeonewithless
experience couldoverheat and damagethePCB foil.
-Flux
RecommendedFlux:SpecificGravity0.82.
TypeRMA(lowerresidue, non-cleaning type)
Note:See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
7.2. PROCEDURE
1. Tack theflat pack ICtothePCB bytemporarilysoldering two
diagonallyopposite pinsinthecorrect positionson thePCB.
Be certaineachpinis locatedoverthe correctpadon the PCB.
2. Applyfluxtoall ofthepinson theIC.
3. Being careful tonotunsolderthetack points, slidethesoldering
iron along thetipsofthepinswhilefeeding enough soldertothe
tipsothat itflowsunderthepinsas theyareheated.

7.3. REMOVING SOLDERFROMBETWEENPINS
1. Add asmall amountofsoldertothebridgedpins.
2. Withahotiron, use asweeping motion along theflat partofthe
pintodrawthesolderfrom betweentheadjacentpads.
8. TROUBLESHOOTINGGUIDE
8.1. NO OPERATION

Note:
Referto (1)~(5)of WAVEFORM () forwaveform.
8.2. LCD DOES NOTOPERATE

Note:
Referto (6)of WAVEFORM () forwaveform.
8.3. HANDSETDOES NOTWORK
Receive
Send

Note:
Referto (7)~(8)of WAVEFORM () forwaveform.
8.4. HEADSETDOES NOTWORK
Receive
Send
Note:

Referto (7)~(8)of WAVEFORM () forwaveform.
8.5. SPEAKER-PHONE TROUBLE
Receive
Send
Note:
Referto (7)~(8)of WAVEFORM () forwaveform.
8.6. DXDP-DPTDOES NOTWORK

Note:
Referto (9)of WAVEFORM () forwaveform.
8.7. OPTIONDOES NOTWORK
9. BLOCK DIAGRAM
10. CIRCUITOPERATIONS
10.1. KEY INPUTCONTROLCIRCUIT
The keydata is underthe matrix control by19 to 23, 25, 44, 45(KEYOUT)and 28 to 35(KEYIN)of
IC3.
The keyinformation outputtedfrom KEYOUTis inputtedinto KEYIN, whenthe keyis pressed.

10.2. LCD CIRCUIT
LCD data are outputtedfrom pin57, 58, 59,10 and 12 of IC3 to LCD module.
IC8 is aninverterfora charge pump circuitwhichoutputs the voltage necessaryforLCD
driving.
-4.5V from -1.2V generatedat IC8as areference to+3.3V ofthe
powersupplyvoltageispressurizedfour times intheLCD module
and usedas LCD driving voltage(approx. 18V).
LCD contrastis setbyelectronic volume inthe LCD module.
The type of the LCD module is distinguishedbypin62 of IC3.

Pin62 of IC3
L KX-T7636 24 digits *6 lines
H KX-T7630/KX-
T7633 24 digits *3 lines
The lighting of the backlight is controlledbyQ1.
-IC3-pin56 H Q1-ON BacklightON
-IC3-pin56 L Q1-OFF BacklightOFF

10.3. LEDCIRCUIT
The lighting of the LED is controlledbypin19 to 28 (Row)and pin11 to 16 (Colum) of IC5.
The LED lights up ina dynamic lighting system.
The dutyratiois 1/8 (ON time 1.5ms).
OnlyD107 of LED forCO7 lights up ina static lighting system.
-IC5-pin55 H:CO7GreenON
-IC5-pin55 L:CO7GreenOFF
-IC5-pin56 H:CO7RedON
-IC5-pin56 L:CO7RedOFF

10.4. RESETCIRCUIT
ResetSignal is outputtedfrom IC1 and inputtedinto IC3 and IC5 atthe connection of TELcord.

10.5. POWERSUPPLY CIRCUIT
This circuitconverts the voltage suppliedfrom PBXinto the powersupplyvoltage of +3.3Vby
IC6 (Switching RegulatorIC).
IC10 controls the powersupplycircuitas belowto turnIC6 on inlowconsumption current at
starting up.
-InputVoltageapprox. 30V or less IC10-pin1LIC6OFF
-InputVoltageapprox. 30V or moreIC10-pin1HiZ IC6ON

10.6. DATACOMMUNICATION
Function
The data communication circuitserves the following functions:
Information exchangerbetweenPBXand proprietarytelephone, keyinput information as well as
data forthe LED control, LCD control, voice data, etc. This information is continuously
exchangedatall times.
CircuitOperation
The data receivedfrom PBXis inputtedto the comparator(pin68)builtinIC5 through Pulse
Trans T1. The thresholdvoltage of the comparatoris determinedbyR62 to 64 and inputtedto
pin67 and 29.
The data to PBXis outputtedfrom pin70 and 71 of IC5, drives T1 byTransistorQ2 and
transmitted.

10.7. DXDP COMMUNICATION
Function
This circuitperforms the same communication as DXDP-compatible DPTand PBX
communication connectedwith DXDPport.
CircuitOperation
The data to Slave DPTis outputtedfrom pin63 and 64 of IC5 and sent byTransistorQ8 and Q9.
The data from Slave DPTis inputtedto the comparator(pin61)builtinIC5.
The thresholdvoltage of the comparatoris determinedbyR65 to 67 and inputtedto pin60 and
62.
Also, the supplying powerto Slave DPTis controlledbya constant current circuitof Q15 as
below.
-IC5-pin58 as H:ConstantcurrentcircuitON
-IC5-pin58 as L:ConstantcurrentcircuitOFF
-IC5-pin57 as H:40mAFeeding (SlaveDPTusually)
-IC5-pin57 as L:10mAFeeding (SlaveDPTat starting up only)