Panasonic KX-TC2000SNB User manual

ORDERNO. KM40310268C3
Telephone Equipment
KX-TC2000SNB / KX-TC2000SNS
Cordless Phone
Black Version
Silver Version
(for Singapore)
SPECIFICATIONS
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2003 PanasonicCommunications Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
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Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50°F ~ 70° F(30°C~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700°F ± 50° F(370°C± 10°C).
Incase of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper(Sn+Ag+Cu), you canalsouse Tinand Copper(Sn+
Cu), orTin, Zinc, and Bismuth(Sn+Zn+Bi). Please check the manufac turer’s specific
instructions forthe melting points of theirproducts and anyprecautions forusing theirproduct
withothermaterials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
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1.2. How to recognize that Pb Free solder isused
1.2.1. Base Unit MainPCB
(Component View)
Note:
The location of the "PbF" marks is subject tochange without notice.
1.2.2. Handset PCB
(Component View)
Note:
The location of the "PbF" marks is subject tochange without notice.
2. FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on worktable.
4. Donot grasp ICor LSI pins with bare fingers.
3. CAUTION
Dangerof explosion if batteryis incorrectlyreplaced.
Replace onlywiththe same orequivalent type recommendedbythe manufacturer.
Dispose of usedbatteries according tothe manufacturer's Instructions.
4. BATTERY
4.1. Recharge
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4.2. Batteryinformation
5. BATTERY REPLACEMENT
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6. LOCATION OF CONTROLS
6.1. Base Unit
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6.2. Handset
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7. CONNECTION
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-USE ONLY WITHPanasonicAC ADAPTORPQLV16BXZ.
-The AC adaptor must remainconnected at all times.
(Itisnormal for the adaptor to feel warm during use.)
-Thisunitwill not function during apower failure. Ifyou want to
connect astandard telephone on the same line, use aT-adaptor.
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8. OPERATIONS
8.1. Making Calls
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8.2. Answering Calls
8.3. Storing Phone Numbers inMemory
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8.4. Storing aPhone Number inthe DIRECTButton
8.5. Dialing aStored Number
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8.6. Dialing the Stored Number inthe DIRECTButton
8.7. Flash Button
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9. DISASSEMBLY INSTRUCTIONS
ShowinFig. Procedure To remove. Remove.
1 1 LowerCabinet Screws (2.6 × 12)....................... (A) × 4
2 1, 2 MainP.C. Board
Screw(2.6 × 6).......................... (B) × 1
Screw(2.6 × 12).......................... (C) ×
1
Solder
MainP.C. Board.
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ShowinFig. Procedure To remove. Remove.
3 3 RearCabinet Batterycompartment cover.
43, 4 Screws (2.6 × 12)......................(D) × 2
5 3, 4, 5 Followthe procedure.
6 3, 4, 5, 6 MainP. C. Board Screw(2.6 × 12)........................(E) × 1
Tape and solder.
MainP. C. Board.
10. TROUBLESHOOTING GUIDE
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Cross Reference:
Check Power ()
Bell Reception ()
Check Battery Charge ()
Check Link ()
Check Handset Transmission ()
Check Handset Reception ()
10.1. Check Power
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Cross Reference:
Reset Circuit (Base Unit) ()
Power Supply Circuit ()
Note:
CPU: IC2
Cross Reference:
Charge Circuit ()
Note:
CPU: IC2
*: Eachmeasurement points are shownin CIRCUIT BOARD (Base Unit) () or CIRCUIT BOARD
(Handset) ()
10.2. Bell Reception
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Cross Reference:
Check Link ()
Telephone Line Interface ()
Note:
CPU: IC2
Cross Reference:
Check Link ()
*: Eachmeasurement points are shownin CIRCUIT BOARD (Base Unit) () or CIRCUIT BOARD
(Handset) ()
10.3. Check BatteryCharge
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Cross Reference:
Charge Circuit ()
Power Supply Circuit ()
Note:
CPU: IC2
Cross Reference:
Reset Circuit (Handset) ()
Note:
CPU: IC2
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*: Eachmeasurement points are shownin CIRCUIT BOARD (Base Unit) () or CIRCUIT BOARD
(Handset) ()
10.4. Check Link
**: Referto Adjustment ()
Note:
CPU: IC2
RFIC: IC1
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