Panasonic KX-TCD455GM User manual

ORDERNO. KM40306110C2
Telephone Equipment
KX-TCD455GM / KX-A145EXM
Digital Cordless Phone
MetalicGrayVersion
(for Germany)
SPECIFICATIONS
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2003 PanasonicCommunications Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin(Sn), Silver(Ag), and Copper(Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50°F ~70°F (30°C~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700°F ± 20°F (370°C± 10°C). In
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case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See the figure below).
1.1. Suggested PbF Solder
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper
(Sn+Ag+Cu), you canalsouse Tinand Copper(Sn+Cu) orTin, Zinc, and Bismuth(Sn+Zn+Bi).
Please check the manufac
turer’s specific instructions forthe melting points of theirproducts and anyprecautions for
using theirproduct withother
materials.
The following leadfree (PbF) solderwire sizes are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. How to recognize that Pb Free solder isused
1.2.1. Base Unit PCB
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(Component View)
(FlowSolderSide View)
Note:
The location of the “PbF“ mark is subject tochange without notice.
1.2.2. Handset PCB
(Component View)
(FlowSolderSide View)
Note:
The location of the “PbF“ mark is subject tochange without notice.
1.2.3. ChargerUnit PCB
Note:
The location of the “PbF“ mark is subject tochange without notice.
2. FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
3. CAUTION
Dangerof explosion if batteryis incorrectlyreplaced. Replace onlywiththe same orequivalent
type recommendencedbythe manufacturer.
Dispose of usedbatteries according tothe manufacture’s Instructions.
4. BATTERY
4.1. BatteryInstallation
Please ensure the batteries are insertedas shown. part shouldbe insertedfirst.
Close the coveras indicatedbythe arrow.
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-When you replace the batteries, part shouldbe removed first.
4.2. BatteryCharge
At the time of shipment, the batteries are not charged. To charge, place the handset on the base
unit.
Please charge the batteries forabout 7 hours before initial use. During charging, the battery
icon is as shownbelow.
The handset whichpoweris off will be turnedon automaticallywhenit is placedon the base
unit.
Innormal use, the handset and the base unit shouldbe poweredon at all times.
Note forService:
The batterystrengthmaynot be indicatedcorrectlyif the batteryis disconnectedand connected
again, evenafterit is fullycharged.
Inthat case, byrecharging the batteryas mentionedabove, you will get a correct indication of
the batterystrength.
4.3. BatteryLife
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