Panasonic EB-G450 Quick start guide

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Order Number: MCUK971001G8
Technical Guide
G450 Personal Cellular Telephone Handheld por able
EB-G450
Car moun ki
EB-HF501Z
Easy fi car moun ki
EB-HF450Z
Dual charger
EB-CR500
Issue 1
Revision 0

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This Technical Guide is copyrigh and issued on he s ric unders anding ha i is no o be reproduced, copied, or
disclosed o any hird par y, ei her in whole or par , wi hou he prior wri en consen of Ma sushi a Communica ion
Indus rial UK L d.
Every care has been aken o ensure ha he con en s of his manual give an accura e represen a ion of he
equipmen . However, Ma sushi a Communica ion Indus rial UK L d. accep s no responsibili y for inaccuracies ha
may occur and reserves he righ o make changes o specifica ion or design wi hou prior no ice.
The informa ion con ained in his manual and all righ s in any designs disclosed herein, are and remain he
exclusive proper y of Ma sushi a Communica ion Indus rial UK L d.
O her pa en s apply o ma erial con ained in his publica ion:
BULL CP8 PATENTS
Commen s or correspondence concerning his manual should be addressed o:
Cus omer Suppor Depar men ,
Ma sushi a Communica ion Indus rial UK L d.,
Col hrop,
Tha cham,
Berkshire. RG19 4ZD.
ENGLAND
© 1997 Ma sushi a Communica ion Indus rial UK L d.
Issue 1 ii MCUK971001G8
Revision 0 Technical Guide

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MCUK971001G8 iii Issue 1
Technical Guide Revision 0
TABLE OF CONTENTS
1 INTRODUCTION
1.1 Purpose of his Guide ..............................................1-1
1.2 S ruc ure of he Guide ..............................................1-1
2 INTERFACES AND TEST POINTS
2.1 In roduc ion ...................................................2-1
2.2 In erfaces ....................................................2-1
2.3 Tes Poin s ...................................................2-4
3 RF OVERVIEW
3.1 In roduc ion ...................................................3-1
3.2 Func ional Descrip ion..............................................3-1
4 TRANSMITTER
4.1 In roduc ion ...................................................4-1
4.2 Func ional Descrip ion..............................................4-2
5 RECEIVER
5.1 In roduc ion ...................................................5-1
5.2 Func ional Descrip ion..............................................5-2
6 BASEBAND OVERVIEW
6.1 In roduc ion ...................................................6-1
6.2 Fuc ional Descrip ion ..............................................6-1
7 GEMINI
7.1 In roduc ion ...................................................7-1
7.2 Func ional Descrip ion..............................................7-1
8 VEGA
8.1 In roduc ion ...................................................8-1
8.2 Func ional Descrip ion..............................................8-1
9 POWER SUPPLIES
9.1 In roduc ion ...................................................9-1
9.2 Overview ....................................................9-1
9.3 Power-up ....................................................9-2
9.3.3 Power-down ...................................................9-3
9.4 Power Managemen ...............................................9-4
10 ACCESSORIES
10.1 Handsfree Uni - Circui Descrip ion ......................................10-1
10.2 Dual Charger .................................................10-4

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WARNINGS AND CAUTIONS
WARNING
The equipmen described in his manual con ains polarised capaci ors u ilising liquid elec roly e. These devices
are en irely safe provided ha nei her a shor -circui nor a reverse polari y connec ion is made across he
capaci or erminals. FAILURE TO OBSERVE THIS WARNING COULD RESULT IN DAMAGE TO THE
EQUIPMENT OR, AT WORST, POSSIBLE INJURY TO PERSONNEL RESULTING FROM ELECTRIC SHOCK
OR THE AFFECTED CAPACITOR EXPLODING. EXTREME CARE MUST BE EXERCISED AT ALL TIMES
WHEN HANDLING THESE DEVICES.
CAUTION
The equipmen described in his manual con ains elec ros a ic sensi ive devices (ESDs). Damage can occur o
hese devices if he appropria e handling procedure is no adhered o.
ESD Handling precautions
A working area where ESDs may be safely handled wi hou undue risk of damage from elec ros a ic discharge,
mus be available. The area mus be equipped as follows:
Working Surfaces - All working surfaces mus have a dissipa ive bench ma , SAFE for use wi h live equipmen ,
connec ed via a 1M2 resis or (usually buil in o he lead) o a common ground poin .
Wris S rap - A quick release skin con ac device wi h a flexible cord, which has a buil in safe y resis or of be ween
5k2 and 1M2 shall be used. The flexible cord mus be a ached o a dissipa ive ear h poin .
Con ainers - All con ainers and s orage mus be of he conduc ive ype.
Batteries
This equipmen may con ains an in ernal ba ery in addi ion o he ex ernal ba ery packs. These ba eries are re-
cyclable and should be disposed of in accordance wi h local legisla ion. They mus no be incinera ed, or disposed
of as ordinary rubbish.
Issue 1 iv MCUK971001G8
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1 INTRODUCTION
1.1 Pu pose of this Guide
This guide con ains echnical informa ion for he Panasonic G450 personal cellular elephone sys em opera ing on
he GSM ne work. Procedures for ins alling, opera ing and servicing (e.g. disassembly and es ing) he elephone
sys em are provided in he associa ed Service Manual.
1.2 St uctu e of the Guide
The guide is s ruc ured o provide service-engineering personnel wi h he following echnical informa ion on he
GSM mobile elephone:
1. In erface de ails and relevan es poin s.
2. Func ional descrip ion of each sec ion of he mobile elephone.
3. De ailed descrip ion of each sec ion of he mobile elephone.
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2 INTERFACES AND TEST POINTS
2.1 Int oduction
This sec ion provides de ails on connec ions be ween he RF and Baseband PCB and o her in erfaces on G450.
2.2 Inte faces
2.2.1 Baseband and RF
This de ails he 50way connec or be ween he RF and baseband PCB.
PIN Signal Direc ion Descrip ion
1 RX_AUDIO RF o Baseband Receive audio
2 TX_AUDIO Baseband o RF Transmi audio
3 A_GND Audio ground
4 LO_EN RF o Baseband RF iming signal
5 BUZZ RF o Baseband Buzzer driver
6 SERIAL_RX Baseband o RF Serial da a receive
7 SERIAL_TX RF o Baseband Serial da a ransmi
8 HF_ON RF o Baseband HF power con rol
9 nADP_DETECT Baseband o RF Da a adap or de ec
10 nHF_DETECT Baseband o RF Handsfree de ec
11 IGNITION Baseband o RF Igni ion
12 nRADIO_MUTE RF o Baseband Radio mu e
13 nLOGIC_POWER RF o Baseband Logic power
14 CHARGE_ON Baseband o RF Enable charging
15 EXT PWR Baseband o RF Ex ernal power
16 PA_LOW RF o Baseband RF con rol signal (indica ed low power ou pu from PA –
no used)
17 BAT_TEMP Baseband o RF Ba ery empera ure
18 VBATT Ba ery inpu
19 GND Ground
20 GND Ground
21 nON_HOOK Baseband o RF On hook
22 SIM_5V RF o Baseband SIM 5v power
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PIN Signal Direc ion Descrip ion
23 SIM_RESET RF o Baseband SIM rese line
24 SIM_IO Bidirec ional SIM inpu /ou pu line
25 SIM_CLK RF o Baseband SIM clock line
26 VCXO_CNTL RF o Baseband VCXO con rol line (13 bi D/A)
27 IFLOSEL Baseband o RF RF iming signal
28 RF_GND RF o Baseband Ground
29 PA_RAMP RF o Baseband Power con rol ramp
30 nQ_RX Baseband o RF Downlink nQ
31 Q_RX Baseband o RF Dwonlink Q
32 nQ_TX RF o Baseband Uplink nQ
33 Q_TX RF o Baseband Uplink Q
34 nI_TX Baseband o RF Downlink nI
35 I_RX Baseband o RF Downlink I
36 nI_TX RF o Baseband Uplink nI
37 I_TX RF o Baseband Uplink I
38 GND Ground
39 STAY_ALIVE RF o Baseband Keep power on af er igni ion swi ched off
40 RXON2 RF o Baseband Timed signal
41 RXON1 RF o Baseband Timed signal
42 BCAL RF o Baseband Timed signal (calibra ion – also used by VEGA)
43 TXON1 RF o Baseband Timed signal
44 PAON RF o Baseband Timed signal
45 TSP_AGCSEL RF o Baseband AGC selec for imed serial por
46 TSP_PPLSEL RF o Baseband PLL selec for imed serial por
47 TSP_DO RF o Baseband GEMINI imed serial por da a ou
48 TSP_CLK RF o Baseband GEMINI imed serial por clock
49 VBAT Ba ery vol age
50 13MHz_SYS_CLK Baseband o RF 13MHz VCXO ou pu
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2.2.2 Ex ernal In erface
G450 has 2 ex ernal connec ors, a mul iway connec or for use wi h a handsfree and da a and addi ional con ac s
for he charging he ba ery pack while in he desk op charger. Bo h in refaces are elec rically and mechanically
compa eble wi h G450.
Hands ree and data connector (J001)
PIN Signal Direc ion
(from HH) Descrip ion
1 GND Power supply and digi al signal ground
2 TX_AUDIO Inpu TX audio
3 AUDIO_GND Audio signal ground
4 nHF_ON Ou pu Handsfree con ol signal
(Lo=ON, Hi-Zo=OFF)
5 nADP_SENSE Inpu Da a adap or selec signal
6 SERIAL_UP Inpu UART up (9600, 33.8kbps)
7 SERIAL_DOWN Ou pu UART down (9600, 33.8kbps)
8 EXT_PWR Inpu Power for charging
9 GND Digi al signal power supply ground
10 RX_AUDIO Ou pu RX audio signal (analogue)
11 nRADIO_MUTE Ou pu Radio mu e
(Lo=mu e, Hi-Zo=No mu ed)
12 nHF_SENSE Inpu Handsfree selec signal
(Lo=Handsfree mode)
13 nFLASH_WE /
PERF_PWR_ENBL Ou pu Flash wri e enable and enable ex ernal peripheral
(Lo=Enable flash wri e)
14 IGNITION Inpu Condi ion of igni ion
(Lo=off, Hi=on)
15 nLOGIC_PWR Ou pu Handheld s a e
(Lo=off, Hi=on)
16 PERF_PWR /
PA_ON Ou pu Power amplefier con rol signal and ex ernal peripheral
power supply
Charge Contacts
PIN Signal Descrip ion
20 EXT_PWR Power for charging
21 GND Ground
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Battery Contacts
PIN Signal Descrip ion
T TEMP Ba ery empera ure sense
+ BATT + Ba ery posi ive
- BATT - Ba ery nega ive
SIM Inter ace
PIN SIGNAL
1 GND
25V
3 No connec ed
4 Rese
5 Serial inpu /ou pu
6 Clock
7 No connec ed
8 No connec ed
2.3 Test Points
2.3.1 Baseband
TP No. Signal
2 GND
3 nRESET
5 nBSCAN (U4 pin 92)
6 SSDX (U8 pin 18)
7 SSRST (U8 pin 17)
8 SSCLK (U8 pin 20)
9 SSDR (U8 pin 19)
13 TXON1
14 RXON2
15 RXON1
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TP No. Signal
16 BCAL
17 TDI (U8 pin 63)
18 TDO (U8 pin 62)
20 TCK (U8 pin 64)
21 TMS (U8 pin 61)
22 nHF_ON
23 IGNITION
24 nLOGIC_PWR
25 nADP_SENSE
26 BAT_TEMP
27 SERIAL_IN
28 BUZZ
29 nHF_SENSE
30 nON_HOOK
31 IFLOSEL
32 LO_EN
33 PAON
34 PLL_SD
35 PLL_CLK
36 IFAGCEN
37 PLL_STRB
38 AFC
39 PARAMP
40 UQX
41 UQ
42 UI
43 UIX
44 DI
45 DIX
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TP No. Signal
46 DQ
47 DQX
48 SIM_5V
49 SIM_RST
50 SIM_IO
51 SIM_CLK
53 13MHz_SYS_CLK
54 nRADIO_MUTE
55 SERIAL_OUT
59 EXTINT
60 TX_AUDIO
61 RX_AUDIO
62 PA_LOW
63 DSPINT (U4 pin 94)
64 3V0
65 3V0
66 VDD
68 KEYBD 6
69 PWR_KEY (KEYBD 5)
70 KEYBD 7
71 KEYBD 8
72 KEYBD 9
73 KEYBD 1
74 KEYBD 0
75 KEYBD 2
76 KEYBD 3
77 KEYBD 4
78 Q2c(swi ched backligh LEDs)
86 CHARGE_ON
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TP No. Signal
92 VBATT
93 VDD
94 EXT_PWR
101 LCD (J401 pin 6)
102 TDO_BSCAN (U4 pin 63)
103 Speaker pos. (J404 pin 1)
104 Speaker neg. (J404 pin 2)
105 Mic. neg. (J403 pin 2)
106 Mic. pos. (J403 pin 1)
107 Q8 pin 6 (swi ched charge LED)
108 Q8 pin 4 (swi ched ring LED)
2.3.2 RF
TP No. Signal
1 RX_AUDIO
2 TX_AUDIO
4 LO_EN
5 BUZZ
6 SERIAL_OUT
7 SERIAL_IN
8 nHF_ON
9 nADP_SENSE
10 nHF_SENSE
11 IGNITION
12 nRADIO_MUTE
13 nLOGIC_PWR
14 CHARGE_ON
15 EXT_PWR
17 BAT_TEMP
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TP No. Signal
21 nON_HOOK
22 5V
26 AFC
27 IFLOSEL
29 PARAMP
30 DQX
31 DQ
32 UQX
33 UQ
34 DIX
35 DI
36 UIX
37 UI
39 RF_EN
44 PAON
45 IFAGCEN
46 PLL_STRB
47 PLL_SD
48 PLL_CLK
49 VBAT
50 13MHz_SYS_CLK
100 2nd VCO (be ween R328 and
C239)
114 nPAON
143 PXON1
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3 RF OVERVIEW
3.1 Int oduction
All he RF circui ry is con ained on one PCB. The RF PCB has six layers made from FR4 ma erial. Top and bo om
layer racks are gold-pla ed o preven oxidisa ion and enable be er soldering. The board hickness is 1.0 mm
(+0.0, -0.1mm).
The majori y of he componen s are on one side of he PCB leaving as much as possible of he opposi e side o be
a comple e a ground plane, his is used o provide RF shielding.
The RF board is connec ed o he baseband digi al board via a 50 way dual in line connec or.
A me allised plas ic chassis is used o separa e he RF and he Logic PCB’s. The chassis has no holes o her han
he one for he in erface connec or. The con inuous chassis design is impor an for EMC purposes. When he
chassis is sandwiched be ween he RF and he Logic PCB’s he ground plane of he RF board oge her wi h he
chassis forms an effec ive shielded enclosure, which preven s spurious emissions. The chassis has been designed
o provide smaller walled sec ions, which are used o isola e sensi ive areas from areas wi h high level RF signals.
3.2 Functional Desc iption
The major building blocks for he RF design are he ransmi (Tx) and receive (Rx) IC’s, RF-IF dual PLL and he
an enna subsys em.
Figure 1: RF Block Diagram 450-0301
3.2.1 Func ional Descrip ion of he PLL’s
The G450 design employs wo fixed IF LO’s - 201MHz for Rx and 246MHz for Tx. They are genera ed a 402MHz
and 496MHz using he IF par of he PLL IC. The IF VCO used is a discre e design and he VCO uning frequency
is selec able be ween 402MHz and 492MHz by means of swi ching he frequency de ermining induc ors,
L302+L303, by IFLOSEL con rol line.
The RF LO is genera ed by he PLL formed by he RF par of he PLL IC MB15F02 and an ex ernal modular VCO.
The use of a modular VCO improves he design repea ibili y.
3.2.2 An enna
The an enna is a fixed helical ype. A whip an enna may be connec ed o he RF pa h and provides be er gain and
minimises he head effec s on he an enna.
The I/O connec or incorpora es a mechanical RF swi ch which rou es he RF signal o he I/O connec or for
handsfree opera ion and es purposes.
3.2.3 Transmi and Receive
The ransmi and receive pa hs of G450 are covered in heir own specific chap ers la er in his manual.
MCUK971001G8 Sec ion 3 Issue 1
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RF OVERVIEW
Rx 201MHz
(1136.2 - 1160.8)MHz
(935.2 - 959.8)MHz
IF VCO
RF VCO
Tx
(890.2 - 914.8)MHz
2nd LO
Rx /Tx
swi ch
I, Q modula ion inpu s
from baseband
2
2
402MHz for Rx
492MHz for Tx
I, Q ou pu s o baseband
zero IF

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4 TRANSMITTER
4.1 Int oduction
This sec ion provides a echnical descrip ion of he ransmi er circui of he RF circui . A circui diagram of he
whole sys em is provided in Sec ion 8 of he Service Mnaual.
4.1.1 Uplink Frequecies
CHANNEL
NUMBERS UPLINK FREQUENCIES (MHz)
1-5
6-10
11-15
16-20
21-25
890.200
891.200
892.200
893.200
894.200
890.400
891.400
892.400
893.400
894.400
890.600
891.600
892.600
893.600
894.600
890.800
891.800
892.800
893.800
894.800
891.000
892.000
893.000
894.000
895.000
26-30
31-35
36-40
41-45
46-50
895.200
896.200
897.200
898.200
899.200
895.400
896.400
897.400
898.400
899.400
895.600
896.600
897.600
898.600
899.600
895.800
896.800
897.800
898.800
899.800
896.000
897.000
898.000
899.000
900.000
51-55
56-60
61-65
66-70
71-75
900.200
901.200
902.200
903.200
904.200
900.400
901.400
902.400
903.400
904.400
900.600
901.600
902.600
903.600
904.600
900.800
901.800
902.800
903.800
904.800
901.000
902.000
903.000
904.000
905.000
76-80
81-85
86-90
91-95
96-100
905.200
906.200
907.200
908.200
909.200
905.400
906.400
907.400
908.400
909.400
905.600
906.600
907.600
908.600
909.600
905.800
906.800
907.800
908.800
909.800
906.000
907.000
908.000
909.000
910.000
101-105
106-110
111-115
116-120
121-124
910.200
911.200
912.200
913.200
914.200
910.400
911.400
912.400
913.400
914.400
910.600
911.600
912.600
913.600
914.600
910.800
911.800
912.800
913.800
914.800
911.000
912.000
913.000
914.000
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4.2 Functional Desc iption
The main building block in he Tx line-up is he ransmi er IC U103 which provides a Class 4 (2Wa s) ransmi er.
Figure 1: Transmi er IC U103 450-0401
The RF mixer is used o genera e he GSM carrier, which is hen modula ed by he baseband I-Q signals in he
quadra ure modula or. The ou pu from he quadra ure modula or is buffered and is ou pu differen ially a abou -
8dBm.
The RF LO is ob ained from he same VCO ha supplies he Rx LO. Therefore, he Tx IF frequency is 45MHz
grea er han he Rx IF frequency. The IF LO is genera ed by he same discre e VCO as he Rx IF VCO offse by
90MHz. The VCO frequency is divided by wo by an on-chip divider o genera e he required 246MHz.
The ou pu from Tx IC is fil ered before and af er he PA driver U106. The amoun of fil ering provided ensures ha
he Tx spurii and he Tx noise in he Rx band are wi hin GSM limi s wi h sufficien margins.
The PA amplifies he ou pu from he PA driver o any required level up o PL5 (33dBm) a he an enna. The power
level can be con rolled as required in Phase II GSM in 2dB s eps from 33dBm o 9dBm. To achieve he accuracy
and ime mask requiremen s for he ou pu power, a closed loop power con rol design has been implemen ed. In
his me hod, a por ion of he ou pu power is coupled in o a de ec or. This sample is hen compared wi h a ramp
waveform whose rising and falling edges are precisely shaped o ensure ha he frequency splash due o he fas
urn on and off of he PA remains in specifica ions. The level of he ramp waveform de ermines ou pu power level
ha needs o be ransmi ed.
The ou pu from he PA is fil ered hrough a discre e low-pass fil er o ensure ha here is sufficien margin in he
rejec ion of he second and hird Tx harmonics as he duplexer rejec ion is no sufficien .
For a ypical ou pu power of 33dBm a he an enna, assuming a ypical loss of 1.5dB be ween he PA ou pu and
he an enna. The PA has an efficiency minimum of 40%.
Issue 1 Sec ion 4 MCUK971001G8
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4.2.1 Signal Levels
The signal levels hrough he ransmi er IC are given below.
Figure 2: Typical Losses 450-0402
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TRANSMITTER
L1 (Balun) FL101 U106 FL102 U104 (PA) Coupler LPF FL103
-0.9dB -2.5dB +21.5dB -2.5dB +26.8dB -0.3dB -0.3dB -0.9dB
-15
-10
-5
0
5
10
15
20
25
30
35

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5 RECEIVER
5.1 Int oduction
This sec ion provides a echnical descrip ion of he receiver sec ion of he RF circui . A circui diagram of he whole
sys em is provided in Sec ion 8 of he Service Manual.
5.1.1 Downlink Frequencies
CHANNEL
NUMBERS DOWNLINK FREQUENCIES (MHz)
1-5
6-10
11-15
16-20
21-25
935.200
936.200
937.200
938.200
939.200
935.400
936.400
937.400
938.400
939.400
935.600
936.600
937.600
938.600
939.600
935.800
936.800
937.800
938.800
939.800
936.000
937.000
938.000
939.000
940.000
26-30
31-35
36-40
41-45
46-50
940.200
941.200
942.200
943.200
944.200
940.400
941.400
942.400
943.400
944.400
940.600
941.600
942.600
943.600
944.600
940.800
941.800
942.800
943.800
944.800
941.000
942.000
943.000
944.000
945.000
51-55
56-60
61-65
66-70
71-75
945.200
946.200
947.200
948.200
949.200
945.400
946.400
947.400
948.400
949.400
945.600
946.600
947.600
948.600
949.600
945.800
946.800
947.800
948.800
949.800
946.000
947.000
948.000
949.000
950.000
76-80
81-85
86-90
91-95
96-100
950.200
951.200
952.200
953.200
954.200
950.400
951.400
952.400
953.400
954.400
950.600
951.600
952.600
953.600
954.600
950.800
951.800
952.800
953.800
954.800
951.000
952.000
953.000
954.000
955.000
101-105
106-110
111-115
116-120
121-124
955.200
956.200
957.200
958.200
959.200
955.400
956.400
957.400
958.400
959.400
955.600
956.600
957.600
958.600
959.600
955.800
956.800
957.800
958.800
959.800
956.000
957.000
958.000
959.000
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5.2 Functional Desc iption
The main building block for he receiver is he IC U201. The receiver is a double superhe ype wi h he firs IF a
201MHz. This is hen conver ed down o zero IF.
The Rx IC con ains he following s ages:
1 LNA
2 RF mixer
3 Gain con rolled 5-s age IF amplifier
4 I,Q quadra ure down conver er
5 Baseband Op Amps for fur her amplifica ion and some fil ering of he baseband I,Q signals
Figure 1: Receiver IC U201 450-0501
RF inpu o he receiver is ei her via he an enna or via he I/O connec or for es purposes and handsfree
opera ion. The inpu signal from he an enna or he I/O connec or is fed in o he LNA hrough he ANT – Rx pa h of
he ceramic duplexer (FL103). The duplexer provides a low-pass fil er func ion for he Tx signals be ween i s Tx
and ANT por s and an addi ional no ch in he Rx band o minimise he Tx noise wi hin he Rx band. The response
be ween he ANT and Rx por s is a bandpass fil er response providing he roofing fil er func ion for he Rx fron
end.
The LNA gain can be con rolled via a hree-wire bus be ween a ypical value of 17dB and approxima ely -3dB. The
LNA gain reduc ion is required for opera ion under s rong signal condi ions where inpu power levels are grea er
han abou -40dBm.
The ou pu from he LNA goes hrough a differen ial BP SAW fil er and is fed in o he 1s down-conver er mixer
differen ially. The LO for he mixer is genera ed by a PLL (U305) employing a modular VCO (U303). The ou pu
from he VCO is buffered by an RF MMIC amplifier (U306). The LO frequency range is 1136.2 o 1160.8MHz.
The IF ou pu a 201MHz from he mixer is fil ered by he differen ial IF SAW fil er (FL202) before i is fed in o he
gain-con rolled IF amplifiers. The use of differen ial fil ers elimina es he need for baluns and provides some cos
and space advan age.
The IF amplifier is a five s age cascaded sec ion. The gain is con rollable by a hree-wire bus from -10 o +70dB in
2dB s eps. This func ion is used for AGC purposes.
The ou pu from IF amplifiers is fed in o wo quadra ure mixers where i is conver ed down o i s baseband . The IF
LO is genera ed a 402MHz by an ex ernal discre e VCO. An on-chip divider on he Rx IC divides his by wo and
also produces wo ou pu s in quadra ure o genera e he baseband I and Q signals. The ou pu s from he mixers
are connec ed o ex ernal pins hrough a pair of buffers. Two on-chip Op Amps provided are used o amplify he AC
signal from he mixers o mee he overall signal budge requiremen s.
The DC level a he ou pu of he Op Amps is 0.95V and a resis ive DC adder is used o increase his DC levels o
1.425V as required by he baseband IC Vega.
The coupling be ween RF ou pu and he baseband inpu has been designed as DC coupling in order o minimise
he urn-on ime of he Rx IC for he purpose of curren op imisa ion.
Issue 1 Sec ion 5 MCUK971001G8
Revision 0 5 - 2 Technical Guide
RECEIVER

http://cxema.ru
5.2.1 Signal Levels
The signal levels hrough he receiver IC are given below.
Figure 2: Nominal and Wors Case Signal Levels 450-0502
-102.0 -105.2 -90.2 -94.2 -89.2 -98.2 Wors case (dBm)
-102.0 -104.7 -87.7 -90.9 -82.9 -91.9 Normal case (dBm)
MCUK971001G8 Sec ion 5 Issue 1
Technical Guide 5 - 3 Revision 0
RECEIVER
-110
-105
-100
-95
-90
-85
-80
Duplexer LNA RF Fil er 1s Mixer IF Fil er IF Amp.
Nominal
Wors Case
-3.2 +15 -4.0 +5.0 -9.0
-2.7 +17 -3.2 +8.0 -9.0
Wors case
Normal case