Panasonic KX-TG2226B User manual

ORDERNO. KM40305083C1
F12
TelephoneEquipment
KX-TG2226B / KX-TG2226S/ KX-TG2226W/ KX-TGA226B /
KX-TGA226S/ KX-TGA226W
2.4GHzDigital Cordless Answering System
Black Version
SilverVersion
White Version
(forU.S.A.)
SPECIFICATIONS
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2003 PanasonicCommunicationsCo., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
1. ABOUTLEADFREE SOLDER (PbF:Pbfree)
Note:
Intheinformation below, Pb, thesymbol for leadintheperiodictableofelements, will referto
standard solderor solderthatcontainslead.
Wewill use PbF solderwhendiscussing theleadfree solderusedinour manufacturing process
whichismadefrom Tin(Sn), Silver(Ag), and Copper(Cu).
Thismodel, and otherslike it, manufacturedusing leadfree solderwill have PbF stampedon the
PCB. For service and repairworkwesuggestusing thesametypeofsolderalthough, withsome
precautions, standard Pbsoldercanalsobeused.
Caution
-PbF solderhas amelting pointthat is50°F~70°F(30°C~40°C)
higherthanPbsolder. Please use asoldering iron with
temperaturecontrol and adjust itto700°F±20°F(370°C±10°C). In
case ofusing high temperaturesoldering iron, please becareful
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nottoheat too long.
-PbF solderwill tend tosplashifitisheatedmuchhigherthanits
melting point, approximately1100°F, (600°C).
-Ifyou must use Pbsolderon aPCB manufacturedusing PbF
solder, removeas muchoftheoriginal PbF solderas possibleand
besurethat anyremaining ismeltedpriortoapplying thePb
solder.
-Whenapplying PbF soldertodoublelayeredboards, please check
thecomponentsideforexcess whichmayflow ontotheopposite
side(See figure, below).
1.1. SuggestedPbF Solder
Thereareseveral types ofPbF solderavailablecommercially. Whilethisproductismanufactured
using Tin, Silver, and Copper,
(Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check themanufac
turer’sspecificinstructionsfor themelting pointsoftheirproductsand anyprecautionsfor
using theirproductwithother
materials.
Thefollowing leadfree (PbF)solderwiresizes arerecommendedfor service ofthisproduct:
0.3mm, 0.6mm and 1.0mm.
1.2. How torecognizethat PbFree solderisused
1.2.1. Base Unit
1.2.1.1. Main
(ComponentView)
1.2.1.2. Operation
(ComponentView)
(FlowSolderSideView)
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Note:
Thelocationsofthe“PbF“markaresubjecttochangewithoutnotice.
1.2.2. Handset
(ComponentView)
Note:
Thelocationsofthe“PbF“markaresubjecttochangewithoutnotice.
2. FORSERVICE TECHNICIANS
ICsand LSIsarevulnerabletostaticelectricity.
Whenrepairing, thefollowing precautionswill helppreventrecurring malfunctions.
1. Covertheplasticparts boxes withaluminumfoil.
2. Ground thesoldering irons.
3. Use aconductivemat on theworktable.
4. DonottouchICorLSI pinswithbarefingers.
3. CAUTION
Dangerofexplosion ifbatteryisincorrectlyreplaced. Replace onlywiththesameor equivalent
typerecommendencedbythemanufacturer.
Dispose ofusedbatteries according tothemanufacture’sInstructions.
4. BATTERY
4.1. Installing theBatteryintheHandset
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4.2. BatteryCharge
4.3. BatteryRecharge
Notefor Service:
Thebatterystrengthmay notbeindicatedcorrectlyifthebatteryisdisconnectedand connected
again, evenafteritisfullycharged.
Inthatcase, byrecharging thebatteryas mentionedabove, you will getacorrectindication of
thebatterystrength.
4.4. BatteryStrength
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4.5. BatteryReplacement
4.6. Batteryinformation
5. LOCATIONOFCONTROLS
5.1. Base Unit
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5.2. Handset
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6. DISPLAY
6.1. Troubleshooting
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