Panasonic KX-TS100EXW User manual

ORDERNO. KM40201786C2
TelephoneEquipment
KX-TS100EXW
IntegratedTelephoneSystem
White Version
(forEurope)
SPECIFICATIONS

1. LOCATIONOFCONTROLS
2. CONNECTION
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2.1. Connecting theHandset/TelephoneLineCord
Afterconnection, lift thehandsettocheck for adial tone.
-Use onlyaPanasonicHandset fortheKX-TS100EXW.
2.2. Connecting aCommunication Device
Ifyou connectacommunication device (computer, modem, fax, answering machine, etc.)tothe
telephoneline, you canconnectitthrough thisunitusing theDATAjack.
Afterconnecting thehandsetand telephonelinecord (see above), connectthecommunication
device telephonelinecord totheDATAjack.
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-Make surethecommunication device isnotinuse beforeusing this
unit(making calls, storing phonenumbersinmemoryetc.)orthe
communication device maynotoperate properly.
3. OPERATIONS
3.1. Making Calls
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3.2. Answering Calls
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4. SPECIALFEATURES
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4.1. RECALL Button
4.2. How toUse thePAUSE Button (ForAnalog PBXLine/Long
Distance Service Users)
4.3. How toUse thePAUSE Button (ForAnalog PBXLine/Long
Distance Service Users)
5. DISASSEMBLYINSTRUCTIONS
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Ref. No. Procedure ShowninFig—. Toremove —. Remove —.
1 1 1 LowerCabinet Screws(2.6×12)............. (A)×5
21~2 2 PrintedCircuitBoard Remove theP.C.Board
6. HOWTO REPLACE FLATPACKAGEIC
6.1. Preparation
-SOLDER
SparkleSolder115A-1, 115B-1 orAlmitSolderKR-19, KR-19RMA
-Soldering iron
Recommendedpowerconsumption will bebetween30 Wto40 W.
TemperatureofCopperRod 662 ±50°F(350 ±10°C)
(Anexpertmayhandlebetween60 Wto80 Wiron, butbeginner
mightdamagefoil byoverheating.)
-Flux
HI115 Specificgravity0.863.
(Original fluxwill bereplaceddaily.)
6.2. Procedure
1. TemporaryfixFLATPACKAGEICbysoldering on twomarked2
pins.
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*Mostimportantmatterisaccuratesetting ofICtothecorresponding soldering foil.
2. Applyfluxforall pinsofFLATPACKAGEIC.
3. Solderemploying specifiedsoldertodirection ofarrow, as sliding
thesoldering iron.
6.3. Modification ProcedureofBridge
1. Re-solderslightlyon bridgedportion.
2. Removeremainedsolderalong pinsemploying soldering iron as
showninbelow figure.
7. CPU DATA
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8. TERMINALGUIDE OFTHE ICsTRANSISTORS AND
DIODES
9. ICBLOCK DIAGRAM
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