Panasonic KX-TS100EXW User manual

ORDERNO. KM40201786C2
TelephoneEquipment
KX-TS100EXW
IntegratedTelephoneSystem
White Version
(forEurope)
SPECIFICATIONS

1. LOCATIONOFCONTROLS
2. CONNECTION
2

2.1. Connecting theHandset/TelephoneLineCord
Afterconnection, lift thehandsettocheck for adial tone.
-Use onlyaPanasonicHandset fortheKX-TS100EXW.
2.2. Connecting aCommunication Device
Ifyou connectacommunication device (computer, modem, fax, answering machine, etc.)tothe
telephoneline, you canconnectitthrough thisunitusing theDATAjack.
Afterconnecting thehandsetand telephonelinecord (see above), connectthecommunication
device telephonelinecord totheDATAjack.
3

-Make surethecommunication device isnotinuse beforeusing this
unit(making calls, storing phonenumbersinmemoryetc.)orthe
communication device maynotoperate properly.
3. OPERATIONS
3.1. Making Calls
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3.2. Answering Calls
5

4. SPECIALFEATURES
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4.1. RECALL Button
4.2. How toUse thePAUSE Button (ForAnalog PBXLine/Long
Distance Service Users)
4.3. How toUse thePAUSE Button (ForAnalog PBXLine/Long
Distance Service Users)
5. DISASSEMBLYINSTRUCTIONS
7

Ref. No. Procedure ShowninFig—. Toremove —. Remove —.
1 1 1 LowerCabinet Screws(2.6×12)............. (A)×5
21~2 2 PrintedCircuitBoard Remove theP.C.Board
6. HOWTO REPLACE FLATPACKAGEIC
6.1. Preparation
-SOLDER
SparkleSolder115A-1, 115B-1 orAlmitSolderKR-19, KR-19RMA
-Soldering iron
Recommendedpowerconsumption will bebetween30 Wto40 W.
TemperatureofCopperRod 662 ±50°F(350 ±10°C)
(Anexpertmayhandlebetween60 Wto80 Wiron, butbeginner
mightdamagefoil byoverheating.)
-Flux
HI115 Specificgravity0.863.
(Original fluxwill bereplaceddaily.)
6.2. Procedure
1. TemporaryfixFLATPACKAGEICbysoldering on twomarked2
pins.
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*Mostimportantmatterisaccuratesetting ofICtothecorresponding soldering foil.
2. Applyfluxforall pinsofFLATPACKAGEIC.
3. Solderemploying specifiedsoldertodirection ofarrow, as sliding
thesoldering iron.
6.3. Modification ProcedureofBridge
1. Re-solderslightlyon bridgedportion.
2. Removeremainedsolderalong pinsemploying soldering iron as
showninbelow figure.
7. CPU DATA
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8. TERMINALGUIDE OFTHE ICsTRANSISTORS AND
DIODES
9. ICBLOCK DIAGRAM
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10. OPTIONJUMPER TABLE
10.1. Dialing ModeSW
IC1
SWPosition
Pin14 LOWTonedialing
Pin14 High Pulse dialing 10 pps
10.2. FlashKey
Flashtime Option
98 ms J1
305 ms J2
600 ms J3 default
11. BLOCK DIAGRAM(IC2)
11

12. CIRCUITOPERATIONS
Note:Thecircuitdiagram may bemodifiedatanytimewiththedevelopmentofnewtechnology.
12.1. TelephoneLineInterface
WhenthehookswitchSW1isON(off-hook), thecircuitisclosed, and currentissuppliedtothe
base ofQ2viathediodebridgeD1and Q2isOnQ1isON(OFF-HOOKcondition).
12.2. ToneDial Circuit
Function:
Thetonedialing circuitconsistsofaDTMF(Dual ToneMulti Frequency)signal generator
(outputtedfrom Pin11 oftheIC1)for tonedialing, and alsoacircuitfor outputting thesignal to
line.
TheDTMFcircuitidentifies inputsfrom the12 keys (1,2,3,4,5,6,7,8,9,0, and #)bymeansofa
total ofsevenfrequencies, thatisfour lowfrequencies (Lowgroup)and three high frequencies
(High group).
CircuitDescription:
Whenadial key ispressed, aDTMFsignal isoutputfrom Pin11 ofIC1as ananalog synthetic
wave.
Thesignal flowtothelineisas follows.
Pin11 ofIC1R37 Q9Q3Q1Tel Line.
TheDTMFsignal issenttothelineviathefollowing path. Q9and Q3isanamplifierwhichisused
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tooutputthesignal toline.
Shownbelowisthesignal flowusedtooutputtheDTMFsignal from thehandsetas amonitor
tonewhenadial key ispressed.
Pin11 ofIC1R48 C33 Q7C18 HandsetSpeaker.
Thesignal combination and frequency corresponding toeachdial key isshownon nextpage.
ToneFrequencies
High Group
LowGroup H1 H2 H3
L1 1 2 3
L2 4 5 6
L3 7 8 9
L4 0 #
LowGroup Frequencies High Group
Frequencies
L1 697 Hz±1.5% H1 1209 Hz±
1.5%
L2 770 Hz±1.5% H2 1336 Hz±
1.5%
L3 852 Hz±1.5% H3 1477 Hz±
1.5%
L4 941 Hz±1.5% ----- -----
12.3. RingerCircuit
CircuitOperation:
Thebell signal passes through C1(R1)supplying powertopin1ofIC2.
Thering signal isoutputfrom Pin5ofIC2, and itsvolumeisadjustedin3steps(H-L-OFF)by
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SW3thenimpressedon theceramicsound generator, and soisgenerated.
Outputfrequency iscontrolledbyR2and C3following belowformula.
12.4. PowerCircuitand Redial Back-up Circuit
Function:
Thissetispoweredfrom theline. WhenitisanOFF-HOOKstatus, Tel LineD1Q1R14
pin17 ofIC1(tobecomethepowersupplyfor IC1speechnetwork).
Thevoltagefrom thelineisturnedintoaconstantvoltagebyD6and thensuppliedtotheIC1and
sending and receiving circuitoftheset.
AtON-HOOKstatusthevoltagefrom thelineviaR40, R5isturnedintoaconstantvoltagebyD8,
and thenbecomepowersupplyfor IC1(Pin17), and theredial Back-up will bedone.
12.5. Sending Circuit(Tx)
Whenaperson talkthrough theHandset, thevoice analog signal flowfrom the
micC20 R33 Q9R38 C23 Q3Q1D1Tel line.
*Q9and Q3isanamplifierfor thevoice signal.
12.6. Receiving Circuit(Rx)
Receiving signal from thelinego through
D1Q1R15 Q4R19 C16 Q6C17 R26 Q7C18 VR1Handset
speaker.
*Q4and Q6isamplifierfor theReceiving signal.
13. TROUBLESHOOTING GUIDE
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13.1. Service Hints
SYMPTOM CURE
NoToneDialing. Check IC1, Q3, Q9, R37, R38, R34 and R35.
Dead. Check IC1, Q2and Q1.
Rings, no dial toneor tonedial. Check Q1, Q2, D1.
Norings. Check C1, R1, R3and IC2.
13.2. ProblemsWiththeHandset
13.3. ToneDialing Problems
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13.4. ProblemsWithRinger
Check R1, C1, IC2, R3, C37, R2, C3, C2.
13.5. How toCheck theIC1(Scanning tothekey)
14. CABINETAND ELECTRICALPARTSLOCATION
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15. ACCESSORIES AND PACKING MATERIALS
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16. REPLACEMENTPARTSLIST
Note:
1. RTL (Retention TimeLimited)
Themarking (RTL)indicates that theRetention Timeislimitedfor
thisitem.
Afterthediscontinuation ofthisassemblyinproduction, theitem
will continuetobeavailableforaspecificperiod oftime. The
retention period ofavailabilitydependson thetypeofassembly
and thelawsgoverning parts and product retention.
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Attheend ofthisperiod, theassemblywill no longerbeavailable.
2. Importantsafetynotice
Components identifiedbythemarkindicates special
characteristics importantforsafety. Whenreplacing anyofthese
components, onlyuse specifiedmanufacture'sparts.
3. TheSmarkmeansthepartisoneofsomeidentical parts. Forthat
reason, itmaybedifferentfromtheinstalledpart.
4. RESISTORS&CAPACITORS
Unless otherwise specified;
All resistorsareinohms( )K=1000 , M=1000k
All capacitorsareinMICRO FARADS( F)P= F
*Type&WattageofResistor
16.1. Base Unit
16.1.1. CABINETAND ELECTRICALPARTS
Ref. No. PartNo. PartName& Description Remarks
1PQKM10508W1 UPPER CABINET S
2PQYF10527Y1 LOWER CABINET S
3PQBH10036Z1 HOOK BUTTON S
4PQBX10350Z1 21 KEYBUTTON S
5L0DDFD000002 RINGER
6PQGD10163Z TELCARD
7PQGV10040Z TELCARD COVER
8PQHR10875Z LED LENS
9PQSX10189Z RUBBER SWITCH, 3KEY
10 PQKE10070Z3 H/SHOLDER S
11 PQSX10186X RUBBER SWITCH, 20 KEY
12 PQGT15159Z NAMELABEL
16.1.2. MAINP.C.BOARD PARTS
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Ref. No. PartNo. PartName& Description Remarks
PCB1 PQWPTS100EXW MAIN P.C BOARD ASS'Y(RTL)
(ICS)
IC1 C1CA00000250 IC
IC2 PQVILS1240A IC
(TRANSISTORS)
Q1 2SA1625 TRANSISTOR(SI) S
Q2 PQVT2N6517CA TRANSISTOR(SI) S
Q3 2SC2120 TRANSISTOR(SI) S
Q4 2SD1819A TRANSISTOR(SI)
Q5 2SD1819A TRANSISTOR(SI)
Q6 2SD1819A TRANSISTOR(SI)
Q7 2SD1819A TRANSISTOR(SI)
Q8 PQVTFB1A4M TRANSISTOR(SI) S
Q9 2SD1819A TRANSISTOR(SI)
Q10 UN5113 TRANSISTOR(SI) S
Q11 2SD1819A TRANSISTOR(SI)
Q13 2SD1819A TRANSISTOR(SI)
Q14 2SD1819A TRANSISTOR(SI)
Q15 2SA1626 TRANSISTOR(SI) S
Q16 2SD1819A TRANSISTOR(SI)
Q18 2SD1819A TRANSISTOR(SI)
Q19 2SD1819A TRANSISTOR(SI)
(DIODES)
D1 PQVDS1YB60F1 DIODE(SI) S
D2 1SS119 DIODE(SI) S
D5 MA4180 DIODE(SI)
D6 PQVDHZS3A1 DIODE(SI) S
D7 1SS119 DIODE(SI) S
D8 MA4056 DIODE(SI)
D9 1SS119 DIODE(SI) S
D10 1SS119 DIODE(SI) S
D11 1SS119 DIODE(SI) S
(LED)
LED1 PQVDSML210LT LED
(CONNECTORS)
JJ101 PQJJ1T020Z JACK
JJ102 PQJJ1T020Z JACK
JJ103 PQJJ1T030Z JACK
(SWITCHES)
SW1 PQSH2B105Z HOOK SWITCH
SW3 PQSS3A17W SLIDESWITCH
SW25 PQSS3A17W SLIDESWITCH
(VARIABLERESISTORS)
VR1 PQNVZ6TLTB13 VARIABLERESISTOR S
VR2 EVNDXAA03B55 VARIABLERESISTOR
(OTHERS)
SA1 PQVDDSS301L VARISTOR S
X1 PQVBZTA3.58M CRYSTALOSCILLATOR
(RESISTORS)
R1 ERDS1VJ152 1.5k
R2 ERJ3GEYJ223 22k
R3 ERJ3GEYJ331 330
R4 ERJ3GEYJ103 10k
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