Panasonic KX-T7665NE User manual

ORDERNO. KMS0306778C2
Digital ProprietaryTelephone
KX-T7665NE / KX-T7665NE-B
White version
Black version
(for Europe)
2003 PanasonicCommunications Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF),
SOLDERING
If leadfree solderwas usedinthe manufacture of this product the printedcircuit boards will be
markedPbF.
Standardleaded, (Pb), soldercanbe usedas usual on boards without the PbF mark.
Whenthis mark does appearplease readand followthe special instructions describedinthis
manual on the use of PbF and howit might be permissible touse Pbsolderduring service and
repairwork.
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1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin, (Sn), Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50° ~ 70° F, (30° ~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700° ± 20° F, (370° ± 10°C). In
case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F, (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See figure, below).
1.1. SUGGESTEDPbF SOLDER
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper, (Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+
Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufacturer’s specific instructions forthe melting points of theirproducts
and anyprecautions forusing theirproduct withothermaterials.
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The following leadfree (PbF) solderwire gauges are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. HOWTO RECOGNIZE THATPb FREE SOLDERISUSED
PbF is stampedtoshowthat Pbfree solderis used. (See the figure below.)
2. FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
3. SPECIFICATIONS
Station Loop
Limit: 90 ohms
Calling Method: 2 pairwire
Jacks: Handset Jack, TELJack
Dimensions: Low
Angle:
High
Angle:
213 (D)mm × 177 (W)mm × 107 (H)mm
201 (D)mm × 177 (W)mm × 127 (H)mm
Weight: 0.7 kg
Design and specifications are subject tochange without notice.
4. LOCATION OF CONTROLS
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5. CONNECTION
Caution:
The availabilityof D-XDPfunction depends on the software version
of the connected Business Telephone System.
Consultyour dealer for more detailsabout D-XDP.
6. DISASSEMBLY INSTRUCTIONS
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1. Remove the Stand.
2. Remove 5 Screws (A).
3. Remove the Cabinet Cover.
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4. Remove the Connectorfromthe MainBoard.
5. Remove 2 Screws (A).
6. Remove the MainBoardand the LCD fromthe
Cabinet Body.
7. HOW TO REPLACE A FLAT PACKAGE IC
7.1. PREPARATION
-PbF (: Pb free) Solder
-Soldering Iron
TipTemperature of 700°F ± 20°F (370°C± 10°C)
Note: We recommend a30 to 40 Watt soldering iron. Anexpert
maybe ableto use a60 to 80 Watt iron where someone with less
experience couldoverheat and damage the PCB foil.
-Flux
Recommended Flux: SpecificGravity0.82.
Type RMA(lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
7.2. PROCEDURE
1. Tack the flat pack ICto the PCB bytemporarilysoldering two
diagonallyopposite pins inthe correct positions on the PCB.
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Be certaineachpinis locatedoverthe correct padon the PCB.
2. Applyflux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins whilefeeding enough solder to the
tipso that itflowsunder the pins as theyare heated.
7.3. REMOVING SOLDERFROMBETWEENPINS
1. Add asmall amount of solder to the bridged pins.
2. With ahot iron, use asweeping motion along the flat part of the
pinto draw the solder from between the adjacent pads.
8. TROUBLESHOOTING GUIDE
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8.1. NO OPERATION
Note:
Referto(1)~(4) of WAVEFORM () forwaveform.
8.2. LCD DOES NOTOPERATE
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Note:
Referto(5) of WAVEFORM () forwaveform.
8.3. HANDSET DOES NOTWORK
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