Panasonic KX-T7665NE User manual

ORDERNO. KMS0306778C2
Digital ProprietaryTelephone
KX-T7665NE / KX-T7665NE-B
White version
Black version
(for Europe)
2003 PanasonicCommunications Co., Ltd. All rights reserved.
Unauthorized copying and distribution isaviolation of law.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF),
SOLDERING
If leadfree solderwas usedinthe manufacture of this product the printedcircuit boards will be
markedPbF.
Standardleaded, (Pb), soldercanbe usedas usual on boards without the PbF mark.
Whenthis mark does appearplease readand followthe special instructions describedinthis
manual on the use of PbF and howit might be permissible touse Pbsolderduring service and
repairwork.
1

1. ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
Inthe information below, Pb, the symbol forleadinthe periodic table of elements, will referto
standardsolderorsolderthat contains lead.
We will use PbF solderwhendiscussing the leadfree solderusedinourmanufacturing process
whichis made fromTin, (Sn), Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufacturedusing leadfree solderwill have PbF stampedon
the PCB. Forservice and repairwork we suggest using the same type of solderalthough, with
some precautions, standardPbsoldercanalsobe used.
Caution
-PbF solder has amelting point that is50° ~ 70° F, (30° ~ 40°C)
higher than Pb solder. Please use asoldering iron with
temperature control and adjust itto 700° ± 20° F, (370° ± 10°C). In
case of using high temperature soldering iron, please be careful
not to heat too long.
-PbF solder will tend to splash ifitisheated much higher than its
melting point, approximately1100°F, (600°C).
-Ifyou must use Pb solder on aPCB manufactured using PbF
solder, remove as much of the original PbF solder as possibleand
be sure that anyremaining ismelted prior to applying the Pb
solder.
-When applying PbF solder to doublelayered boards, please check
the component side for excess which mayflow onto the opposite
side (See figure, below).
1.1. SUGGESTEDPbF SOLDER
There are several types of PbF solderavailable commercially. While this product is
manufacturedusing Tin, Silver, and Copper, (Sn+Ag+Cu), you canalsouse Tinand Copper, (Sn+
Cu), orTin, Zinc, and Bismuth, (Sn+Zn+Bi).
Please check the manufacturer’s specific instructions forthe melting points of theirproducts
and anyprecautions forusing theirproduct withothermaterials.
2

The following leadfree (PbF) solderwire gauges are recommendedforservice of this product:
0.3mm, 0.6mm and 1.0mm.
1.2. HOWTO RECOGNIZE THATPb FREE SOLDERISUSED
PbF is stampedtoshowthat Pbfree solderis used. (See the figure below.)
2. FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable tostatic electricity.
Whenrepairing, the following precautions will helpprevent recurring malfunctions.
1. Cover the plasticparts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use aconductive mat on the worktable.
4. Donot touch ICor LSI pins with bare fingers.
3. SPECIFICATIONS
Station Loop
Limit: 90 ohms
Calling Method: 2 pairwire
Jacks: Handset Jack, TELJack
Dimensions: Low
Angle:
High
Angle:
213 (D)mm × 177 (W)mm × 107 (H)mm
201 (D)mm × 177 (W)mm × 127 (H)mm
Weight: 0.7 kg
Design and specifications are subject tochange without notice.
4. LOCATION OF CONTROLS
3

4

5. CONNECTION
Caution:
The availabilityof D-XDPfunction depends on the software version
of the connected Business Telephone System.
Consultyour dealer for more detailsabout D-XDP.
6. DISASSEMBLY INSTRUCTIONS
5

1. Remove the Stand.
2. Remove 5 Screws (A).
3. Remove the Cabinet Cover.
6

4. Remove the Connectorfromthe MainBoard.
5. Remove 2 Screws (A).
6. Remove the MainBoardand the LCD fromthe
Cabinet Body.
7. HOW TO REPLACE A FLAT PACKAGE IC
7.1. PREPARATION
-PbF (: Pb free) Solder
-Soldering Iron
TipTemperature of 700°F ± 20°F (370°C± 10°C)
Note: We recommend a30 to 40 Watt soldering iron. Anexpert
maybe ableto use a60 to 80 Watt iron where someone with less
experience couldoverheat and damage the PCB foil.
-Flux
Recommended Flux: SpecificGravity0.82.
Type RMA(lower residue, non-cleaning type)
Note: See ABOUT LEAD FREE SOLDER (PbF: Pb free) ().
7.2. PROCEDURE
1. Tack the flat pack ICto the PCB bytemporarilysoldering two
diagonallyopposite pins inthe correct positions on the PCB.
7

Be certaineachpinis locatedoverthe correct padon the PCB.
2. Applyflux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering
iron along the tips of the pins whilefeeding enough solder to the
tipso that itflowsunder the pins as theyare heated.
7.3. REMOVING SOLDERFROMBETWEENPINS
1. Add asmall amount of solder to the bridged pins.
2. With ahot iron, use asweeping motion along the flat part of the
pinto draw the solder from between the adjacent pads.
8. TROUBLESHOOTING GUIDE
8

8.1. NO OPERATION
Note:
Referto(1)~(4) of WAVEFORM () forwaveform.
8.2. LCD DOES NOTOPERATE
9

Note:
Referto(5) of WAVEFORM () forwaveform.
8.3. HANDSET DOES NOTWORK
Receive
Send
10

Note:
Referto(6)~(7) of WAVEFORM () forwaveform.
8.4. SPEAKER-PHONETROUBLE
Receive
Send
11

Note:
Referto(6)~(7) of WAVEFORM () forwaveform.
8.5. DXDP-DPT DOES NOTWORK
Note:
Referto(8) of WAVEFORM () forwaveform.
9. BLOCK DIAGRAM
10. CIRCUIT OPERATIONS
10.1. KEY INPUTCONTROLCIRCUIT
The keydata is underthe matrix control by20 to23(KEYOUT) and 28 to35(KEYIN) of IC6.
The keyinformation outputtedfromKEYOUTis inputtedintoKEYIN, whenthe keyis pressed.
12

10.2. LCD CONTROLCIRCUIT
The LCD data is output frompins 52 to58 of IC6.
LCD contrast adjustment is performedbythe circuit composedof R603 and R604.
The contrast is determinedonlybythe voltage level betweenpin2 and pin3 of CN5. Higher
potential makes the contrast high.
13

LCD Contrast Control
CONTRAST IC6 Pin59 IC6 Pin19
HIGH L L
MIDDLE Z L
LOW Z Z
14

10.3. LEDCIRCUIT
The lighting of the LED is controlledbypin14 to18 (Row) and pin8 to13 (Colum) of IC2.
The LED lights up ina dynamic lighting system.
The dutyratiois 1/8 (ON time 1.5ms).
15

10.4. RESET CIRCUIT
Reset Signal is outputtedfromIC7 and inputtedintoIC2, IC3 and IC6 at the connection of TEL
cord.
16

10.5. POWERSUPPLY CIRCUIT
This circuit converts the voltage suppliedfromPBX intothe powersupplyvoltage of +3.3V by
IC1 (Switching RegulatorIC).
Q22 and Q23 control the powersupplycircuit as belowtoturnIC1 on inlowconsumption
current at starting up.
-Input Voltage approx. 26V or less Q23 OFF Q22 ONIC1-pin
3HIC1OFF
-Input Voltage approx. 26V or more Q23 ONQ22 OFF IC1ON
17

10.6. DATACOMMUNICATION
Function
The data communication circuit serves the following functions:
Information exchangerbetweenPBX and proprietarytelephone, keyinput information as well as
data forthe LED control, LCD control, voice data, etc. This information is continuously
exchangedat all times.
Circuit Operation
The data receivedfromPBX is inputtedtothe comparator(pin36) built inIC2 through Pulse
Trans T1. The thresholdvoltage of the comparatoris determinedbyR101 to103 and inputtedto
pin37 and 35 of IC2.
The data toPBX is outputtedfrompin38 and 39 of IC2, drives T1 byTransistorQ1 and
transmitted.
18

10.7. DXDPCOMMUNICATION
Function
This circuit performs the same communication as DXDP-compatible DPTand PBX
communication connectedwithDXDP port.
Circuit Operation
The data toSlave DPTis outputtedfrompin33 and 34 of IC2 and sent byTransistorQ2 and Q3.
The data fromSlave DPTis inputtedtothe comparator(pin31) built inIC2.
The thresholdvoltage of the comparatoris determinedbyR112 to114 and inputtedtopin30
and 32 of IC2.
Also, the supplying powertoSlave DPTis controlledbya constant current circuit of Q16 as
below.
-IC2-pin28 as H:Constant current circuitON
-IC2-pin28 as L:Constant current circuitOFF
-IC2-pin29 as H:40mAFeeding (Slave DPT usually)
-IC2-pin29 as L:20mAFeeding (Slave DPT at starting up only)
19

10.8. ANALOG CIRCUIT
This circuit performs the setting of the call path/vol. adjustment ineachcall mode byIC4.
The audiogainof eachcall is determinedbydownloaddata fromPBX.
-IC2sends each audiodata to IC3byPCMinterface.
-IC2receives each audiodata from IC3byPCMinterface.
1. Handset Call
Transmitting signal isinputted from handset microphone and
amplified byIC4built-inAmp A/Dconversion Gain
adjustment byIC4inputted to IC3and IC2inPCMdata then
sent to PBX.
Receiving signal isinputted from PBXIC2 IC3 D/A
conversion after the input to IC4inPCMdata Gainadjustment
byDSP of IC4 Pin26 of IC4 outputted from Q51 to handset.
2. Speakerphone Call
The speakerphone mode can onlyprovide aone-way
communication path.
IC3compares transmitting signal and receiving signal during
speakerphone mode, then provide aone-waycommunication path.
Transmitting signal isinputted from SP phone mic. and amplified
byIC4built-inAmp A/Dconversion inputted to IC3inPCM
20