Panasonic TY-FB9TU User manual

1 Safety Precautions 3
1.1. General Guidelines 3
© 2006 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TY-FB9TU
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4
3 About lead free solder (PbF) 5
U/V Tuner Board with MATE I/F Board
Specification
Channel Capability-181 VHF-12: UHF-56: Cable-125
Connection Terminals
AV INPUT VIDEO (RCA PIN JACK TYPE) 1.0 Vp-p (75 W)
S VIDEO (Mini DIN 4-pin) Y: 1.0 Vp-p (75 W), C: 0.286 Vp-p (75 W)
AUDIO L-R (RCA PIN JACK TYPE) 0.5 Vrms
AV OUTPUT Video (RCA PIN JACK TYPE) 1.0 Vp-p (75 W)
*Cannot output UHF/VHF signals.
AUDIO L-R (M3 JACK TYPE) 0.5 Vrms
Digital interface port
(MATE) RJ-11C
Remote Control Model No. N2QAFB000003
Mass (weight) approx. 160 g (5.6 oz) (including batteries)
Operating range approx. 7 m (23 feet) directly in front of the unit
CONTENTS
Page Page
ORDER NO.ITD0604018CE
D10 Canada: B07

4 Installation 6
5 Antenna connection 7
6 Connection of external equipment 8
7 Circuit Board Layout 9
7.1. HMB-Board 9
8 Block and Schematic Diagram 11
8.1. Schematic Diagram Notes 11
8.2. HMB-Board Block Diagram 12
8.3. HMB-Board (1 of 4) Schematic Diagram 13
8.4. HMB-Board (2 of 4) Schematic Diagram 14
8.5. HMB-Board (3 of 4) Schematic Diagram 15
8.6. HMB-Board (4 of 4) Schematic Diagram 16
9 Replacement Parts List 17
9.1. Replacement Parts List Notes 17
9.2. Electrical Replacement Parts List 18
9.3. Mechanical Replacement Parts List 22
9.4. Parts Location (1) 23
9.5. Parts Location (2) 24
2
TY-FB9TU

1 Safety Precautions
1.1. General Guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.1.1. Leakage Current Cold Check
1.Unplug the AC cord and connect a jumper between the two prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between the jumpered AC plug and each exposed metallic cabinet part on
the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the
chassis, the reading should be between 1MWand 5.2MW.
When the exposed metal does not have a return path to the chassis, the reading must be .
Figure 1
1.1.2. Leakage Current Hot Check (See Figure 1.)
1.Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2.Connect a 1.5kW, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a
good earth ground such as a water pipe, as shown in Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the above measurements.
6.The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may
be used to make the hot checks, leakage current must not exceed 1/2 milliamp. In case a measurement is outside of the limits
specified, there is a possibility of a shock hazard, and the equipment should be repaired and rechecked before it is returned to
the customer.
3
TY-FB9TU

2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
4
TY-FB9TU

3 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol stamped on the back of PCB.
Caution
·
· ·
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
· ·
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
5
TY-FB9TU