Philips TDA1552Q User manual

DATA SHEET
Product specification
File under Integrated Circuits, IC01 July 1994
INTEGRATED CIRCUITS
TDA1552Q
2 x 22 W BTL stereo car radio
power amplifier

July 1994 2
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
GENERAL DESCRIPTION
The TDA1552Q is an integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package.
The circuit contains 2 x 22 W amplifiers in Bridge Tied Load (BTL) configuration. The device is primarily developed for
car radio applications.
Features
•Requires very few external components
•High output power
•Low offset voltage at outputs
•Fixed gain
•Good ripple rejection
•Mute/stand-by switch
•Load dump protection
•AC and DC short-circuit-safe to ground and VP
•Thermally protected
•Reverse polarity safe
•Capability to handle high energy on outputs (VP= 0 V)
•Protected against electrostatic discharge
•No switch-on/switch-off plop
•Low thermal resistance
•Flexible leads.
QUICK REFERENCE DATA
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141R); SOT 141-6; 1996 July 23.
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating VP6.0 14.4 18.0 V
non-operating VP−−30 V
load dump protected VP−−45 V
Repetitive peak output
current IORM −−4A
Total quiescent current Itot −80 160 mA
Stand-by current Isb −0.1 100 µA
Switch-on current Isw −−60 µA
Input impedance |ZI| 506075kΩ
Junction temperature Tj−−150 °C
Stereo application
Output power RL= 4 Ω; THD = 10% Po20 22 −W
Supply voltage ripple
rejection RS= 0 Ω
f = 100 Hz to 10 kHz RR 48 −−dB
DC output offset voltage |∆VO|−−150 mV
Channel separation α40 −−dB
Channel unbalance |∆Gv|−−1dB

July 1994 3
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
Fig.1 Block diagram.
handbook, full pagewidth
mute/stand-by
MLB952
output 1A
Vref
x1
VA
stand-by
switch
VP
mute
switch
stand-by
reference
voltage
310
VP1 VP2
18 kΩ
2
kΩ
18 kΩ
15 kΩ
15 kΩ
2
kΩ
18 kΩ
2
kΩ
18 kΩ
2
kΩ
60
kΩ
60
kΩ
mute switch
VA
Cm
power stage
mute switch
VA
Cm
power stage
4
6
11
12
mute switch
VA
Cm
power stage
mute switch
VA
Cm
power stage
9
7
Vref
258
ground (signal)
GND1 GND2
power ground (substrate)
output 2B
output 2A
not connected
output 1B
input 1
input 2 13
1
TDA1552Q

July 1994 4
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
PINNING
FUNCTIONAL DESCRIPTION
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.
The gain of each amplifier is fixed at 26 dB. A special feature of this device is:
Mute/stand-by switch
•low stand-by current (< 100 µA)
•low mute/stand-by switching current (low cost supply switch)
•mute facility.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1 IP1 input 1 8 GND2 power ground 2 (substrate)
2 GND ground (signal) 9 OUT2B output 2B
3V
P1 positive supply voltage 1 10 VP2 positive supply voltage 2
4 OUT1A output 1A 11 M/SS mute/stand-by switch
5 GND1 power ground 1 (substrate) 12 n.c. not connected
6 OUT1B output 1B 13 IP2 input 2
7 OUT2A output 2A
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage
operating VP−18 V
non-operating VP−30 V
load dump protected during 50 ms;
tr≥ 2.5 ms VP−45 V
Non-repetitive peak output current IOSM −6A
Repetitive peak output current IORM −4A
Storage temperature range Tstg −55 +150 °C
Junction temperature Tj−150 °C
AC and DC short-circuit-safe voltage VPSC −18 V
Energy handling capability at outputs VP= 0 V −200 mJ
Reverse polarity VPR −6V
Total power dissipation see Fig.2 Ptot −60 W

July 1994 5
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
Fig.2 Power derating curve.

July 1994 6
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
DC CHARACTERISTICS
VP= 14.4 V; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply
Supply voltage range note 1 VP6.0 14.4 18.0 V
Total quiescent current Itot −80 160 mA
DC output voltage note 2 VO−6.9 −V
DC output offset voltage |∆VO|−−150 mV
Mute/stand-by switch
Switch-on voltage level VON 8.5 −−V
Mute condition Vmute 3.3 −6.4 V
Output signal in mute VI= 1 V (max);
position f = 1 kHz VO−−2mV
DC output offset voltage
(between pins 4 to 6 and 7 to 9) |∆VO|−−150 mV
Stand-by condition Vsb 0−2V
DC current in VII < 0.5 V Isb −−100 µA
stand-by condition 0.5 V ≤VII < 2 V Isb −−500 µA
Switch-on current Isw −25 60 µA
Supply current short-circuit
to GND
note 3 IP−5.5 −mA

July 1994 7
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
AC CHARACTERISTICS
VP= 14.4 V; RL= 4 Ω; f = 1 kHz; Tamb = 25 °C; measurements taken using Fig.3; unless otherwise specified
Notes to the characteristics
1. The circuit is DC adjusted at VP= 6 V to 18 V and AC operating at VP= 8.5 V to 18 V.
2. At 18 V < VP< 30 V the DC output voltage ≤VP/2.
3. Conditions:
a) V11 = 0 V
b) short-circuit to GND
c) switch V11 to MUTE or ON condition (rise time ≥10 µs).
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 Ω(maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of RS(VI= 0 V).
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Output power THD = 0.5% Po15 17 −W
THD = 10% Po20 22 −W
Output power at VP= 13.2 V THD = 0.5% Po−12 −W
THD = 10% Po−17 - W
Total harmonic distortion Po= 1 W THD −0.1 −%
Power bandwidth THD = 0.5%
Po= −1 dB
w.r.t. 15 W Bw- 20 to −Hz
15000
Low frequency roll-off note 4
−1 dB fL−25 −Hz
High frequency roll-off −1 dB fH20 −−kHz
Closed loop voltage gain Gv25 26 27 dB
Supply voltage ripple rejection notes 5, 6 RR 42 −−dB
ON notes 5, 7 RR 48 −−dB
mute notes 5, 6, 7 RR 48 −−dB
stand-by notes 5, 6, 7 RR 80 −−dB
Input impedance |Zi| 506075kΩ
Noise output voltage
(RMS value)
ON RS= 0 Ω; note 8 Vno(rms) - 70 120 µV
ON RS= 10 kΩ; note 8 Vno(rms) −100 −µV
mute notes 8, 9 Vno(rms) −60 −µA
Channel separation α40 −−dB
Channel unbalance |∆Gv|- −1dB

July 1994 8
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
APPLICATION INFORMATION
Fig.3 Application circuit diagram.
handbook, full pagewidth
MLB951
100
nF
mute/stand-by switch
12 11 3 10
220 nF 14
6
220 nF 13 9
7
58
V
P
TDA1552Q
2200
µF
14.4 V
not connected
R = 4 Ω
L
R = 4 Ω
L
60
kΩ
60
kΩ
reference
voltage
2
ground (signal)
input 2
input 1
power ground (substrate)

July 1994 9
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
PACKAGE OUTLINE
UNIT A e1 A2bpcD
(1) E(1) Z(1)
deD
hLL 3m
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm 17.0
15.5 4.6 4.2 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 3.4
v
0.8
12.2
11.8 1.7
e2
5.08 2.4
1.6
Eh
62.00
1.45
2.1
1.8
3.4
3.1 4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25
w
0.03
x
D
L
E
A
c
A2
m
L3
Q
wM
bp
1
d
D
Ze2
e
e
xh
113
j
E
h
non-concave
view B: mounting base side
92-11-17
95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) SOT141-6
vM
B

July 1994 10
Philips Semiconductors Product specification
2 x 22 W BTL stereo car radio power
amplifier TDA1552Q
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Thistextgivesavery briefinsightto acomplextechnology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.