PIE Tergeo-EM User manual

1 Tergeo plasma cleaner operator’s manual
Revision: B3, Year 2020
Operator’s Manual
Tergeo plasma cleaner
PIE SCIENTIFIC LLC
Address:
3209 Whipple Road
Union City, CA, 94587, U.S.A.
Tel: [phone].
Email: [e-mail]

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Chapter 1 Legal notice:
This document is copyrighted with all rights reserved. Under the copyright laws, this document
may not be copied in whole or in part or reproduced in any other media without the express
written permission of PIE Scientific LLC. Permitted copies must carry the same proprietary and
copyright notices as were affixed to the original. This exception does not allow copies to be
made for others, whether or not sold, but all the material purchased may be sold, given or
loaned to another person. Under the law, copying includes translation into another language.
PIE Scientific, the PIE Scientific Logo, and Tergeo are registered trademarks of PIE Scientific
LLC.
Every effort has been made to ensure that the data given in this document is accurate. The
information, figures, tables, specifications and schematics contained herein are subject to
change without notice. PIE Scientific makes no warranty or representation, either expressed or
implied on this document. In no event will PIE Scientific be liable for any direct, indirect, special,
incidental or consequential damages resulting from any defects in its documentation.
Chapter 2 Safety compliance symbols used in this manual
This symbol is intended to alert the operator to the presence
of important operating and maintenance instructions.
This symbol is intended to alert the operator to the presence
of dangerous voltages within the product enclosure that may
be of sufficient magnitude to constitute a risk of electric shock.
This symbol is regarding the lifting and handling precautions
due to the weight of the equipment.

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Chapter 3 Table of contents
Operator’s Manual........................................................................................................................................ 1
Tergeo plasma cleaner.................................................................................................................................. 1
Chapter 1 Legal notice: ................................................................................................................................. 2
Chapter 2 Safety compliance symbols used in this manual.......................................................................... 2
Chapter 3 Table of contents.......................................................................................................................... 3
Chapter 4 List of figures ................................................................................................................................ 6
Chapter 5 Operation safety........................................................................................................................... 7
5.1 Intended use of the equipment .......................................................................................................... 7
5.2 Safety precautions .............................................................................................................................. 7
5.3 Electrical ratings.................................................................................................................................. 8
5.4 Environmental conditions ................................................................................................................... 9
5.5 IEC 61010-1:2010 electrical safety conformity certificate................................................................ 10
5.6 UL/CSA 61010-1 conformance certificate from TUV Rheinland. ...................................................... 11
5.7 UL Japan rf emission conformity certificate ..................................................................................... 12
Chapter 6 Introduction ............................................................................................................................... 13
6.1 Introduction to plasma ..................................................................................................................... 13
6.2 Introduction to system................................................................................................................ 13
6.3 Immersion/direct cleaning and remote/downstream cleaning ....................................................... 14
6.4 Pulsed operation mode..................................................................................................................... 15
6.5 Plasma sensor ................................................................................................................................... 16
Chapter 7 Installation.................................................................................................................................. 17
Step 1, preparation ................................................................................................................................. 17
Step 2, prepare the vacuum pump ......................................................................................................... 17
Step 3, set up the plasma cleaner........................................................................................................... 19

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Getting familiar with the system ........................................................................................................ 19
Assembly procedure ........................................................................................................................... 21
Getting started.................................................................................................................................... 23
Chapter 8 Operation ................................................................................................................................... 25
8.1 General guidance. ............................................................................................................................. 25
8.2 Sequence of operation...................................................................................................................... 25
8.3 Understand the main screen layout ................................................................................................. 26
8.4 Manual operation ............................................................................................................................. 27
8.4.1 Pumping down the chamber...................................................................................................... 27
8.4.2 Set the gas flow rate .................................................................................................................. 27
8.4.3 Set up the timer ......................................................................................................................... 27
8.4.4 Change the cleaning mode ........................................................................................................ 27
8.4.5 Set up the rf power supply......................................................................................................... 27
8.4.6 Stop the process manually......................................................................................................... 28
8.4.7 Vent the chamber. ..................................................................................................................... 28
8.5 Set up recipes in recipe library.......................................................................................................... 28
8.6 Run a cleaning recipe ........................................................................................................................ 30
8.6.1 Load a recipe to the main screen............................................................................................... 30
8.6.2 Turn on the vacuum pump......................................................................................................... 30
8.6.3 Execute the recipe ..................................................................................................................... 30
8.6.4 Execute a job sequence ............................................................................................................. 32
8.7 Tune the impedance ......................................................................................................................... 32
8.8 What to do after plasma cleaning finishes. ...................................................................................... 32
8.9 How to reduce the pumping down time and achieve better vacuum level? ................................... 33
8.10 How to reduce the venting time? ................................................................................................... 34

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8.11 How to set the right gas flow rate for hydrogen gas. ..................................................................... 34
8.12 How to create extremely weak oxygen plasma for some critical biopolymer processing
applications ............................................................................................................................................. 34
8.13 How to improve the gas purity for some critical applications........................................................ 35
8.14 How to use plasma emission sensor reading as the end-point indicator for oxygen plasma ashing
process .................................................................................................................................................... 35
8.14 Process uniformity in the chamber................................................................................................. 36
Chapter 9 System settings .......................................................................................................................... 37
Chapter 10 Service and troubleshooting .................................................................................................... 40
10.1. The vacuum in the chamber gets worse and worse over time. How to improve the vacuum level?
................................................................................................................................................................ 40
10.2 Fail to start touchscreen user interface. ......................................................................................... 40
10.3 Plasma fails to ignite. ...................................................................................................................... 41
10.4 Auto impedance tuning fails ........................................................................................................... 41
10.5 Recipe execution stuck in the pumping down state....................................................................... 42
10.6 Gas flow rate can’t reaching the set value...................................................................................... 42
10.7 Flow controller oscillate at the set point. ....................................................................................... 42
10.8 How to check the leak rate on the gas delivery system ................................................................. 42
10.9 Replace the quartz chamber........................................................................................................... 43
10.10 Why pure oxygen plasma emission intensity is so low compared with argon and nitrogen plasma?
How to set up a recipe for oxygen plasma?............................................................................................ 43
10.11 Why sample chamber may be bright when remote plasma source is activated?........................ 43
10.12 Why plasma intensity gradually increase or decrease during cleaning? ...................................... 43
10.13 If the plasma is too weak to be detected by the plasma sensor (value is below 2), how to let the
timer start counting down and run a recipe? ......................................................................................... 44
10.14 Clean and replace the front cap o-ring ......................................................................................... 44
10.15 Why the plasma intensity value doesn’t change when it reaches a value of 800 or 1000?......... 45

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10.16 What to do if the plasma intensity sensor fails. ........................................................................... 45
10.17 What to do if the pressure readings stays at atmospheric pressure? .......................................... 45
10.18 How to use the plasma cleaner if the pressure sensor fails? ....................................................... 45
10.19 How to replace the pressure sensor if the filament burned out? ................................................ 46
Chapter 4 List of figures
Figure 1, Tergeo series plasma cleaner....................................................................................................... 13
Figure 2, immersion mode plasma cleaning ............................................................................................... 14
Figure 3, downstream/remote plasma cleaning mode .............................................................................. 15
Figure 4, pulsed operation mode............................................................................................................... 15
Figure 5, Front view of Tergeo plasma cleaner........................................................................................... 19
Figure 6, sample chamber assembly........................................................................................................... 19
Figure 7, Front cap for sample chamber..................................................................................................... 20
Figure 8, backside of the Tergeo plasma cleaner ....................................................................................... 20
Figure 9, Touch screen user interface......................................................................................................... 24
Figure 10, main screen of the user interface .............................................................................................. 26
Figure 11, rf power control ......................................................................................................................... 28
Figure 12, Recipe library ............................................................................................................................. 29
Figure 13, edit recipe window, left: the recipe can be edited by the user. Right: the recipe has been
locked to prevent unintended modification............................................................................................... 29
Figure 14, Job sequence.............................................................................................................................. 32
Figure 15, system setting screen ................................................................................................................ 37
Figure 16, How to change the fuse ............................................................................................................. 40
Figure 17, How to replace the pressure sensor. ......................................................................................... 46

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Chapter 5 Operation safety
5.1 Intended use of the equipment
Tergeo series plasma equipment are designed to generate low pressure plasma using non-toxic
gases. The ions and neutral radicals generated inside the plasma source can then be used to
etch or remove a thin layer of materials from the surface of the samples placed inside the
plasma chamber. It can be used to change surface energy of the samples, ash organic materials,
remove oxide from metal surface, etch silicon, silicon nitride and silicon oxide materials.
Equipment should be placed on a stable table far away from heat source and flammable
materials. Any unintended usage outside the scope of this manual can results in damage of the
equipment or cause harm to the operator. PIE Scientific LLC is not liable for damage or personal
injury for any unintended usage of equipment.
5.2 Safety precautions
The user should read through the following safety precautions before operating the plasma
cleaner.
1) If the chamber is filled with high concentration oxygen, please do not use hydrocarbon
oil pump to pump down the plasma chamber. Hydrocarbon oil pump can be used to
pump oxygen mixture with oxygen concentration level lower than 25%. To pump highly
concentrated oxygen, inert PFPE pump oil such as Krytox or Fomblin should be used
instead. The oil-free dry pump is also compatible with concentrated oxygen.
2) If combustible gasses are used in the system, explosion-proof vacuum pump must be
used. The exhaust gas should not be vented directly to the lab space.
3) No toxic gas is allowed at the input port. If toxic gasses will be generated inside the
plasma chamber using gases such as CF4, SF4 or NF3, the pump exhaust gasses can not
be vented directly into the lab space. Toxic exhaust gas must be handled according to
appropriate safety guideline.
4) If toxic gas can be generated inside the plasma chamber, please enable the purging step
in the recipe setting to flush the chamber clean before opening the plasma chamber.
5) Maximum pressure at the gas inlet port is 15 psi. Recommended gas inlet pressure
during operation should not exceed 10 psi. For explosive gasses such as hydrogen,
suggested gas inlet pressure should be about 5 psi.
6) If hydrogen gas is connected to the plasma system, always close the output valve on the
hydrogen compressed gas bottle if the hydrogen gas will not be used within the next
hour. Also keep the front door of the plasma chamber open so that the hydrogen gas
will not be confined inside the small plasma chamber even if there is a leak in the MFC.

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7) If potentially dangerous gas will be used to generate plasma, please check the leak rate
of the gas delivery system following the procedure in section 10.6.
8) Tergeo series plasma system is an electrical equipment. To avoid electric shock, please
follow all standard electrical safety precautions.
9) Tergeo plasma system is grounded through the input power cord. The input power cord
must have the line, the neutral and the ground cables. The power cord can only be
inserted to a grounded outlet.
10) Do not use power cord that doesn’t meet the electrical ratings specified in Section 5.3.
11) RF high voltage exists inside the equipment enclosure. Do not open the equipment
cover when the rf output is on.
12) Do not plug a vacuum pump that uses more than 7 amps of current into the pump
power plug on the back of the Tergeo plasma equipment. There is no fuse protection for
the vacuum pump power control circuit inside the plasma machine. The connected
vacuum pump or the facility power supply must have over current protection capability
in case of electrical short event inside the vacuum pump.
13) Do not overtight the front door of the vacuum chamber. The front door will seal
automatically during pumping down even if it feels loose.
14) Do not open the front door if the chamber is still under the vacuum.
15) Equipment can be heavier than 40lbs. Two persons are required to lift the equipment to
avoid back injury or dropping the equipment to the ground and causing personal injury.
16) The power switch is located at the back of the machine. Please make sure the power
switch can be easily accessed by the users. Do not position the system that the user
can’t access the power switch. User should be able to deenergize the equipment easily.
17) The cooling fan and the venting holes for the cooling air flow are both located at the
back of the plasma machine. Do not block the entrance of the fan and the venting holes
on the back of the machine. The distance between the plasma machine and the wall
should be larger than one foot.
5.3 Electrical ratings
1) Input power for plasma machine: 100V-230V AC, 50~60Hz, maximum power: 300Watt,
connector type: IEC 320 C13.
2) Fuse for the plasma machine: Size: IEC 5X20mm; Type: Slow blown; Current: 3 amp for
220~230V AC; 5 amp for 100~110VAC.
3) The input AC voltage and frequency for the vacuum pump power inlet port must meet the
requirements of the vacuum pump connected to the Tergeo plasma system.
4) Vacuum pump power inlet port on the plasma machine: Type: IEC 320 C13, Rating: 10A, 250VAC.

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5) Vacuum pump power outlet port on the plasma machine: For North America and Japan, type:
NEMA 5-15; Rating: 15A, 125VAC. For regions that use 220V to 230VAC, Type: IEC 320 C13,
Rating: 10A, 250VAC.
6) The maximum current for the vacuum pump connected to the pump power outlet should be
less than 7 amps.
7) Compatible power cord for both the plasma system and the vacuum pump: For countries and
regions use 100~110VAC, voltage rating on the power cord must be higher than 110VAC, current
rating should be equal or higher than 10 amps; For countries and regions uses 220~230VAC,
voltage ratings on the power cord should be higher than 230VAC, current rating should be equal
or higher than 10amps.
5.4 Environmental conditions
1. The recommended condition for operation: temperature range is 0-30C, humidity: 10% -
70% RH.
2. The recommended conditions for transportation and storage: temperature range is -20-
60C, humidity: 10% - 90% RH.
RF high voltage exists within controller and plasma source
enclosure. Please do not open the enclosure whenever RF
output is ON.
Read this manual carefully before operating the plasma
cleaner for the first time. Failure to follow the safety
precautions may result in serious damage to the system or
may cause personal injury. PIE Scientific LLC is not liable
and will not honor the warranty if the applicable safety
precautions are ignored by the users.
The equipment and the vacuum pump could weight more than
40 lbs. Two persons are required to lift the equipment to avoid
back injury or dropping the equipment to the ground and
causing personal injury.

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5.5 IEC 61010-1:2010 electrical safety conformity certificate

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5.6 UL/CSA 61010-1 conformance certificate from TUV Rheinland.

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5.7 UL Japan rf emission conformity certificate

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Chapter 6 Introduction
6.1 Introduction to plasma
Plasma is an ionized gas phase substance that consists of ions, electrons, neutral atoms and
molecules that maintain charge neutrality. To ignite a plasma, free moving electrons will be
accelerated by an external radio frequency wave and acquire enough energy to ionize the process
gasses. If the pressure is too high (higher than 1 Torr), the mean free path of electrons will be too
short for electrons to accumulate enough energy to ionize the process gasses. If pressure is lower
than 1 mTorr, mean free path may become so long that energetic electrons might be lost on
electrodes or chamber wall before they can ionize process gas molecules. Optimal chamber
pressure for plasma processing is around 50~300mTorr. For oxygen gas, optimal pressure range is
70~150mTorr.
6.2 Introduction to system
Tergeo plasma system consists of the following components: a sample chamber, a remote plasma
source, a rf power supply, rf electrodes, rf antennas, a gas delivery system, plasma sensors, system
control electronics and a touch screen user interface.
Figure 1, Tergeo series plasma cleaner.
The sample chamber is composed of a high purity quartz tube, a front cap with view port for Tergeo and
Tergeo-plus, a back flange. The front cap for Tergeo-EM plasma cleaner has been modified to accept
TEM rod from major TEM vendors. There are two different chamber sizes available. The quartz chamber
in basic Tergeo and Tergeo-EM plasma cleaner has an inner diameter of 110mm. The inner diameter of
the quartz tube in Tergeo-plus plasma cleaner is 160mm. The depth of the sample chamber is 280mm.
RF power supply has two options, 75watt or 150watt. Some models may be equipped with automatic
impedance matching capability if the option is purchased.
Up to three mass flow controller (MFC) regulated gas delivery ports are available. The number of gas
input port may vary depending on purchasing options. The range of the MFC is 0~100 sccm. If the

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pressure sensor is integrated, the user should set a flow rate that provides a pressure between
30~300mTorr for plasma processing. Plasma intensity sensor can constantly monitor the emission
intensity of the plasma. Plasma intensity is a unit-less relative measurement providing users with real-
time feedback.
6.3 Immersion/direct cleaning and remote/downstream cleaning
Plasma consists of electrons, ions, neutral atoms, molecules, and reactive neutral radical species. In
immersion plasma cleaning mode, plasma is generated inside the sample chamber. Samples are subject
to chemical reactions with radical species and energetic ion bombardment. Immersion mode plasma
treatment is mainly used for high-speed plasma etching and surface activation.
Figure 2, immersion mode plasma cleaning
If remote plasma source option is purchased, Tergeo series plasma cleaner can also carry out
downstream mode plasma cleaning. In this mode, plasma is generated in a remote plasma source
attached to the sample chamber. Plasma is mostly confined within the remote plasma source. There
is no ion bombardment to the sample in the downstream cleaning mode. Reactive species
generated in the plasma source will diffuse into the downstream sample chamber and carry out
chemical etching to the surface contaminant on the sample surface. Downstream plasma cleaning is
a gentle plasma cleaning method for delicate samples such as optics with a thin antireflective
coating, gate oxide, graphene, DLC (diamond-like-carbon), carbon fiber or TEM carbon grid

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Figure 3, downstream/remote plasma cleaning mode
6.4 Pulsed operation mode
If the pulsed operation option is purchased, the duty ratio of the rf power supply can be changed.
Full duty ratio is 255 (e.g. continuous operation). Duty ratio can vary from 2 to 255. Pulse
frequency is 480Hz. Low duty ratio pulsed mode can further reduce the average plasma power and
change discharge chemistry. If pressure is too high or rf power is too low, plasma may fail to ignite
in pulsed operation mode. If plasma fails to ignite, please increase rf power and reduce the pressure
to around 30~150mTorr for immersion mode and 75~100mTorr for remote mode.
Figure 4, pulsed operation mode.
If the pressure in the downstream sample chamber is too low,
plasma from the remote plasma source may diffuse into the sample
chamber. Then user should increase the gas flow rate/pressure so
that remote plasma will die out sooner.

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6.5 Plasma sensor
Tergeo plasma system has integrated an advanced plasma emission intensity sensor. It can measure the
plasma emission intensity in real time. The maximum value of the plasma intensity sensor is around 750
to 850. Plasma emission intensity can vary a lot for different process gasses. The plasma emission
intensity for electronegative oxygen gas is usually very low. The plasma emission intensity for argon gas
is usually very high. For the plasma sensor to measure low-intensity oxygen plasma emission accurately,
the gain of the sensor has been adjusted to a relatively high value. As a result, the plasma emission
intensity value for argon process gas may easily saturate to a maximum value around 750 to 850. If the
plasma intensity sensor reading saturates, it may not change even after the user reduces the rf power.

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Chapter 7 Installation
Step 1, preparation
1. Unpack the Tergeo plasma system.
a. Use a screwdriver to bend the metal clip on the top cover of the wooden shipping box.
Bend all the metal clips straight. Lift the top cover from the wooden box.
b. Take out the accessories on the top of the plasma machine. Count the accessories and
compared them with the packing list. If any parts are missing, contact PIE Scientific LLC.
c. Take out the packing foams on the side to release the Tergeo plasma system.
d. Two persons are required to lift and carry the Tergeo plasma system and the vacuum
pump.
2. Read through all the safety precautions in Chapter 5. Applicable safety precautions must be
followed. Select the right power cables and power cords that meet the electrical ratings of the
system and the vacuum pump.
Step 2, prepare the vacuum pump
Before operating the rotary vane vacuum pump, please make sure the oil has been filled in the
tank. The oil level must be within the min and max levels indicated on the oil window. Please
check the oil level on a weekly basis and add oil if necessary. If the rotary vane vacuum pump
has been prepared with PFPE pump oil (Fomblin or Krytox), please continue to use PFPE pump
oil. Hydrocarbon and PFPE oil won’t mix in the pump. Please make sure the exhaust port is not
blocked before turning on the pumpp power.
It’s always better to choose the pump equipped with an inlet solenoid valve or at least a flipper
valve. If there is no such valve between the pump and the plasma cleaner, pump oil or pump
debris may backstream into the vacuum hose or the plasma cleaner when the pump is turned
off. Inlet valve can also prevent rapid venting of the plasma chamber when the pump is turned
off.
The equipment and the vacuum pump could weight more than
40 lbs. Two persons are required to lift the equipment to avoid
back injury or dropping the equipment to the ground and
causing personal injury.

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Plasma cleaner should be placed on a secure table space, connect the inlet port of the vacuum
pump to the pumping port of the plasma cleaner using stainless steel bellow or rubber hose.
The pumping port on the plasma cleaner is a standard NW25 flange. The pump must be set in
the mode that it can automatically start when the power plug is connected.
Please do not use oil pump with hydrocarbon oil to pump
concentrated oxygen. To pump high purity oxygen gas, oil
pump with inert PFPE pump oil or dry pump should be used.
Do not mix up the pump inlet port and the gas exhaust port on the
vacuum pump! If the plasma cleaner is connected to the exhaust port
on the vacuum pump, the pressure in the vacuum hose will rise to a
very high pressure. The high pressure will damage the pump valve in
the plasma cleaner and cause the vacuum leak issue. The pumping
port on the plasma cleaner should be connected to the inlet port on
the vacuum pump!!
Do not run rotary vane vacuum pump without adding sufficient
pump oil. If oil level is too high, oil can be carried out by exhaust
gas. Check the oil level weekly to make sure there is enough oil in
the oil pump. Do not mix PFPE oil with hydrocarbon oil.
Please make sure the pump exhaust port is not blocked or
closed before turning on pump power.
Do not let hydrogen gas exhaust enter the lab space. It must be
connected to a dedicated exhaust line. Contact lab safety
manager on how to handle hydrogen exhaust gas safely.

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Step 3, set up the plasma cleaner
Getting familiar with the system
Sample chamber
with cap and view
port
Front cap
locking groove
Pumping port
Opening for
pressure sensor
O-ring
Figure 5, Front view of Tergeo plasma cleaner
Figure 6, sample chamber assembly
The front surface of the o-ring should be free of dust particles.
Otherwise, it will create vacuum leak. Wipe the front surface of the o-
ring and the glass door regularly with lint-free wipes. If the o-ring has
been taken out of the o-ring grooves, then please reapply the vacuum
grease on the o-ring and inside the o-ring groove.
Quartz sample shelf.
The front edge of the
sample shelf should
align with the front
edge of the round
quartz chamber
When the system is shipped to the
customer site, the chamber might
be under partial vacuum. Do not
try to open the front door when
the system is still under the
vacuum. Once the chamber is fully
vented to the atmospheric
pressure, rotate the front door in
the counter clockwise (CCW)
direction and pull it out.

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Locking pin
Figure 7, Front cap for sample chamber. Two locking pins will mate with two locking
slots on the door. Rotate t
he from cap in CW direction to lock the door. Rotate the
front cap in CCW direc
tion to unlock the door.
Power switch
Fuse box
AC power entry,
connects to
utility AC
NW25 pumping
port
Figure 8, backside of the Tergeo plasma cleaner
Pump power outlet.
Connects to pump
Pump power
inlet, connects to
utility power.
Venting port with an
optional dust particle filter
Process gas input
If the untreated room air is directly used to vent the chamber or to be
used as the process gas on MFCs to generate the plasma, the dust
particles in the room air may land on the sealing surface inside the vent
valve or the MFCs. Dust will create the vacuum leak issue. Please use
treated clean air (CDA) or nitrogen to vent the chamber. If treated
clean air line or nitrogen line is not available, please contact PIE
Scientific LLC to buy a room air dust particle filter.
RS232 communi-
cation port