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V850ES/IE2
32-bit Single-Chip Microcontrollers
Hardware
Printed in Japan
User’s Manual
μ
PD70F3713
μ
PD70F3714
Document No. U17716EJ2V0UD00 (2nd edition)
Date Published February 2008 N
2005
User’s Manual U17716EJ2V0UD
2
[MEMO]
User’s Manual U17716EJ2V0UD 3
1
2
3
4
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between V
IL
(MAX) and V
IH
(MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between V
IL
(MAX) and
V
IH
(MIN).
HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to V
DD
or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
NOTES FOR CMOS DEVICES
5
6
User’s Manual U17716EJ2V0UD
4
The information in this document is current as of January, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics
(as defined above).
•
•
•
•
•
•
M8E 02. 11-1
User’s Manual U17716EJ2V0UD 5
PREFACE
Readers This manual is intended for users who wish to understand the functions of the
V850ES/IE2 to design application systems using the V850ES/IE2.
Purpose This manual is intended to give users an understanding of the hardware functions.
Organization The V850ES/IE2 User’s Manual is divided into two parts: Hardware (this manual) and
Architecture (V850ES Architecture User’s Manual). The organization of each manual
is as follows:
Hardware Architecture
•Pin functions •Data type
•CPU function •Register set
•On-chip peripheral functions •Instruction format and instruction set
•Flash memory programming •Interrupts and exceptions
•Electrical specifications •Pipeline operation
How to Read This Manual It is assumed that the readers of this manual have general knowledge in the fields of
electrical engineering, logic circuits, and microcontrollers.
•To understand the overall functions of the V850ES/IE2
→Read this manual according to the CONTENTS.
•To find the details of a register where the name is known
→See APPENDIX B REGISTER INDEX.
•How to interpret the register format
→For a bit whose bit number is enclosed in angle brackets < >, its bit name is
defined as a reserved word in the device file.
•To understand the details of an instruction function
→Refer to the V850ES Architecture User’s Manual.
•To know the electrical specifications of the V850ES/IE2
→See CHAPTER 19 ELECTRICAL SPECIFICATIONS.
The “yyy bit of the xxx register” is described as the “xxx.yyy bit” in this manual. Note
with caution that if “xxx.yyy” is described as is in a program, however, the
compiler/assembler cannot recognize it correctly.
The mark <R> shows major revised points. The revised points can be easily searched
by copying an “<R>” in the PDF file and specifying it in the "Find what:" field.
User’s Manual U17716EJ2V0UD
6
Conventions Data significance: Higher digits on the left and lower digits on the right
Active low representation: xxx (overscore over pin or signal name)
Memory map address: Higher addresses on the top and lower addresses on
the bottom
Note: Footnote for item marked with Note in the text
Caution: Information requiring particular attention
Remark: Supplementary information
Numeric representation: Binary ... xxxx or xxxxB
Decimal ... xxxx
Hexadecimal ... xxxxH
Prefix indicating power of 2
(address space, memory
capacity): K (kilo): 210 = 1,024
M (mega): 220 = 1,0242
G (giga): 230 = 1,0243
Data type: Word ... 32 bits
Halfword ... 16 bits
Byte ... 8 bits
User’s Manual U17716EJ2V0UD 7
Related Documents The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents related to V850ES/IE2
Document Name Document No.
V850ES Architecture User’s Manual U15943E
V850ES/IE2 Hardware User’s Manual This manual
Documents related to development tools (user’s manuals)
Document Name Document No.
QB-V850ESIX2 (in-circuit emulator) U17909E
QB-MINI2 (On-Chip Debug Emulator with Programming Function) U18371E
Operation U17293E
C Language U17291E
Assembly Language U17292E
CA850 (Ver. 3.00) (C compiler package)
Link Directive U17294E
PM+ (Ver. 6.30) (Project manager) U18416E
ID850QB (Ver. 3.40) (Integrated debugger) Operation U18604E
TW850 (Ver. 2.00) (Performance analysis tuning tool) U17241E
Basics U13430E
Installation U17419E
Technical U13431E
RX850 (Ver. 3.20) (Real-time OS)
Task Debugger U17420E
Basics U18165E
Installation U17421E
Technical U13772E
RX850 Pro (Ver. 3.21) (Real-time OS)
Task Debugger U17422E
AZ850 (Ver. 3.30) (System performance analyzer) U17423E
PG-FP4 Flash Memory Programmer U15260E
PG-FP5 Flash Memory Programmer U18865E