Renesas ISL81802EVAL3Z User manual

ISL81802EVAL3Z
Evaluation Board
R16UH0004EU0100 Rev.1.00 Page 1 of 19
Sep.15.20
User Manual
The ISL81802EVAL3Z 4-phase evaluation board (shown in Figure 4) features the ISL81802, a 80V high-voltage
dual synchronous buck controller that offers external soft-start, independent enable functions, and integrates
UV/OV/OC/OT protection. A programmable switching frequency ranging from 100kHz to 1MHz helps optimize
inductor size while the strong gate driver delivers up to 40A for the buck output.
Key Features
• Wide input range: 18V to 80V
• High light-load efficiency in pulse skipping DEM operation
• Programmable soft-start
• Optional DEM/PWM operation
• Optional CC/HICCUP OCP protection
• Supports pre-bias output with soft-start
• PGOOD indicator
• OVP, OTP, and UVP protection
• Back biased from output to improve efficiency
The ISL81802EVAL3Z 4-phase evaluation board is designed for high current applications. The current rating of
the ISL81802EVAL3Z is limited by the FETs and inductor selected. The ISL81802EVAL3Z electrical ratings are
shown in Ta ble 1.
Ordering Information
Related Literature
For a full list of related documents, visit our website:
•ISL81802 device page
Table 1. Electrical Rating
Parameter Rating
Input Voltage 18V to 80V
Switching Frequency 200kHz
Output Voltage 12V
Output Current 40A
OCP Set Point Minimum 44A at ambient room temperature
Part Number Description
ISL81802EVAL3Z High Voltage Dual Buck Controller Evaluation Board

ISL81802EVAL3Z
R16UH0004EU0100 Rev.1.00 Page 2 of 19
Sep.15.20
Figure 1. ISL81802EVAL3Z Block Diagram
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ISL81802EVAL3Z 1. Functional Description
R16UH0004EU0100 Rev.1.00 Page 3 of 19
Sep.15.20
1. Functional Description
The ISL81802EVAL3Z is the same test board used by Renesas application engineers and IC designers to
evaluate the performance of the ISL81802 HTSSOP IC. The board provides an easy and complete evaluation of
all the IC and board functions.
As shown in Figure 2, 18V to 80V VIN is supplied to J1/J13 (+) and J2/J14 (-). The regulated 12V output on
J4/J10 (+) and J5/J11 (-) can supply up to 40A to the load. Because of the high power efficiency, the evaluation
board can run at 40A continuously without airflow at room temperature ambient conditions.
Test points TP1 through TP36 provide easy access to the IC pin and external signal injection terminals.
As shown in Tab le 2 , connectors J6 and J8 provide a selection of either Forced PWM mode (shorting Pin 1 and
Pin 2) or DEM mode (shorting Pin 2 and Pin 3). Connectors J7 and J12 provide a selection of either constant
current limit (shorting Pin 1 and Pin 2) or HICCUP OCP (shorting Pin 2 and Pin 3). Connectors J3 and J9 provide
an option to disable the converter by shorting its Pin 1 and Pin 2.
1.1 Recommended Testing Equipment
The following materials are recommended for testing:
• 0V to 80V power supply with at least 40A source current capability
• Electronic loads capable of sinking current up to 50A
• Digital Multimeters (DMMs)
• 100MHz quad-trace oscilloscope
1.2 Operating Range
The input voltage range is from 18V to 80V for an output voltage of 12V. If the output voltage is set to a lower
value, the minimum VIN can be reset to a lower value by changing both the ratio of R1and R5, and the ratio of R58
and R63. The minimum EN threshold that VIN can be set to is 4.5V.
The rated load current is 40A with the OCP point set at minimum 44A at ambient room temperature conditions.
The operating temperature range of this board is -40°C to +85°C.
Note: Airflow is needed for higher temperature ambient conditions.
1.3 Quick Test Guide
1. Jumper J6 provides the option to select PWM or DEM. Jumper J7 provides the option to select constant current
limit or HICCUP. See Table 2 for the operating options. Ensure that the circuit is correctly connected to the
supply and electronic loads before applying any power. See Figure 2 for proper setup.
Table 2. Operating Options
Jumper Position Function
3, 9 EN-GND Disable output
EN Floating Enable output
6, 8 Pin 1-2 PWM
Pin 2-3 DEM
7, 12 Pin 1-2 Constant current limit
Pin 2-3 HICCUP

ISL81802EVAL3Z 1. Functional Description
R16UH0004EU0100 Rev.1.00 Page 4 of 19
Sep.15.20
2. Turn on the power supply.
3. Adjust the input voltage (VIN) within the specified range and observe the output voltage. The output voltage
variation should be within 3%.
4. Adjust the load current within the specified range and observe the output voltage. The output voltage variation
should be within 3%.
5. Use an oscilloscope to observe output voltage ripple and phase node ringing. For accurate measurement, see
Figure 3 for proper test setup.
Figure 2. Proper Test Setup
Figure 3. Proper Probe Setup to Measure Output Ripple and Phase Node Ringing
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ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 5 of 19
Sep.15.20
2. PCB Layout Guidelines
Careful attention to Printed Circuit Board (PCB) layout requirements is necessary for successful implementation
of an ISL81802 based DC/DC converter. The ISL81802 switches at a high frequency; therefore, the switching
times are short. At these switching frequencies, even the shortest trace has significant impedance and the peak
gate drive current rises significantly in an extremely short time. The transition speed of the current from one
device to another causes voltage spikes across the interconnecting impedances and parasitic circuit elements.
These voltage spikes can degrade efficiency, generate EMI, and increase device voltage stress and ringing.
Careful component selection and proper PCB layout minimizes the magnitude of these voltage spikes.
The following are critical components
when using the ISL81802 DC/DC converter:
• Controller
• Switching power components
• Small-signal components
The switching power components are the most critical to the layout because they switch a large amount of energy
that tend to generate a large amount of noise. The critical small-signal components are those connected to
sensitive nodes or those supplying critical bias currents. A multilayer PCB is recommended.
Complete the following steps to optimize the PCB layout.
1. Place the input capacitors, FETs, inductor, and output capacitor first. Isolate these power components on
dedicated areas of the board with their ground terminals adjacent to one another. Place the input and output
high frequency decoupling ceramic capacitors close to the MOSFETs.
2. If signal components and the IC are placed separately from the power train, Renesas recommends using full
ground planes in the internal layers with shared SGND and PGND to simplify the layout design. Otherwise,
use separate ground planes for the power ground and the small signal ground. Connect the SGND and PGND
together close to the IC. Note: DO NOT connect them together anywhere else.
3. Keep the loop formed by the input capacitor, the top FET, and the bottom FET as small as possible.
4. Ensure the current paths from the input capacitor to the FETs, the power inductor, and the output capacitor are
as short as possible with maximum allowable trace widths.
5. Place the PWM controller IC close to the lower FETs. The low-side FETs gate drive connections should be
short and wide. Place the IC over a quiet ground area. Avoid switching ground loop currents in this area.
6. Place the VDD bypass capacitor close to the VDD pin of the IC and connect its ground end to the PGND pin.
Connect the PGND pin to the ground plane by a via.
Note: DO NOT connect the PGND pin directly to the SGND EPAD.
7. Place the gate drive components (BOOT diodes and BOOT capacitors) together near the controller IC.
8. Place the output capacitors as close to the load as possible. To avoid inductance and resistances, use short,
wide copper regions to connect output capacitors to load.
9. Use copper filled polygons or wide, short traces to connect the junction of the upper FET, lower FET, and output
inductor. Keep the PHASE nodes connection to the IC short. Note: DO NOT unnecessarily oversize the copper
islands for the PHASE nodes. Because the phase nodes are subjected to extreme dv/dt voltages, the stray
capacitor formed between these islands and the surrounding circuitry tends to couple switching noise.
10. Route all high-speed switching nodes away from the control circuitry.
11. Create a separate small analog ground plane near the IC. Connect the SGND pin to this plane. Connect all small
signal grounding paths including feedback resistors, current monitoring resistors and capacitors, soft-starting
capacitors, loop compensation capacitors and resistors, and EN pull-down resistors to this SGND plane.
12. Use a pair of traces with minimum loop for the input or output current sensing connection.
13. Ensure the feedback connection to the output capacitor is short and direct.

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 6 of 19
Sep.15.20
2.1 ISL81802EVAL3Z Evaluation Board
Figure 4. ISL81802EVAL3Z Evaluation Board, Top View

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 7 of 19
Sep.15.20
Figure 5. ISL81802EVAL3Z Evaluation Board, Bottom View

ISL81802EVAL3Z 2. PCB Layout Guidelines R16UH0004EU0100 Rev.1.00 Page 8 of 19 Sep.15.20
2.2 ISL81802EVAL3Z Circuit Schematics
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ISL81802EVAL3Z 2. PCB Layout Guidelines R16UH0004EU0100 Rev.1.00 Page 9 of 19 Sep.15.20
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ISL81802EVAL3Z 2. PCB Layout Guidelines R16UH0004EU0100 Rev.1.00 Page 10 of 19 Sep.15.20
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BLK2

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 11 of 19
Sep.15.20
2.3 Bill of Materials
Qty Reference Designator Description Manufacturer Manufacturer Part
1 PWB-PCB, ISL81802EVAL3Z, REVB, ROHS Multilayer PCB
Technology
ISL81802EVAL3ZREVBPCB
4 C1, C2, C65, C70 CAP, RADIAL, 12.5x26.5, 220μF, 100V, 20%,
ALUM.ELEC., 5mm, ROHS
United Chemi-Con EKZN101ELL221MK25S
16 C3, C4, C5, C6, C42, C43, C44,
C45, C55, C84, C85, C90, C91,
C93, C96, C98
CAP-AEC-Q200, SMD, 1210, 4.7μF, 100V,
10%, X7S, ROHS
TDK CGA6M3X7S2A475K200AB
4 C7, C60, C9, C77 CAP, SMD, 0603, 1000pF, 50V, 10%, X7R,
ROHS
TDK C1608X7R1H102K080AE
4 C8, C41, C80, C94 CAP, SMD, 0603, 0.1µF, 100V, 10%, X7R,
ROHS
Vishay GRJ188R72A104KE11D
2 C11, C82 CAP, SMD, 0603, 10µF, 16V, X5R, 10%,
ROHS
Murata GRM188R61C106KAALJ
2 C12, C88 CAP, SMD, 0603, 100pF, 50V, X7R, 10%,
ROHS
Kemet C0603C101K5RACTU
2 C15, C81 CAP, SMD, 0603, 220pF, 50V, 10%, X7R,
ROHS
Murata GRM188R71H221KA01D
4 C16, C39, C68, C87 CAP, SMD, 0603, 0.47µF, 25V, 10%, X7R,
ROHS
Murata GRM188R71E474KA12D
2 C17, C18 CAP, SMD, 0603, 0.022µF, 50V, X7R, ROHS Tdk CGJ3E2X7R1E223K080AA
16 C18, C19, C20, C23, C34, C35,
C36, C37, C54, C61, C64, C66,
C73, C86, C92, C97
CAP, SMD, 1210, 22µF, 25V, X7R, ROHS Murata GRM32ER71E226KE15L
4 C21, C38, C71, C79 CAP-OSCON, SMD, 10mm, 1000μF, 16V,
20%, 12mΩ, ROHS
Panasonic 16SVPF1000M
2 C22, C62 CAP, SMD, 0603, 0.047µF 25V X7R, ROHS Kemet C0603C473K3RACTU
4 C24, C26, C56, C58 CAP, SMD, 0805, 10µF, 16V, 10%, X7S,
ROHS
Murata GRM21BC71C106KE11L
2 C28, C74 CAP, SMD, 0603, 820pF, 50V, 10%, X7R,
ROHS
Kemet C0603C821K5RACTU
10 C47, C48, C49, C50, C59, C63,
C83, C89, C27, C69
CAP, SMD, 0603, 0.01µF, 100V, 5%, X7R,
ROHS
Kemet C0603C103J1RACTU
2 C46, C95 CAP, SMD, 0603, 10pF, 50V, 10%, C0G,
ROHS
Kemet C0603C100K5GACTU
0 C13, C14, C25, C33, C51, C52,
C53, C57, C67, C72, C75, C76
CAP, SMD, 0603, DNP-PLACE HOLDER,
ROHS
6 D1, D3, D4, D5, D6, D7 DIODE-RECTIFIER, SMD, 2P, S0D-123FL,
100V, 1A, ROHS
ON Semiconductor MBR1H100SFT3G
8 J1, J2, J4, J5, J10, J11, J13, J14 HDWARE, TERMINAL, M4 METRIC
SCREW, TH, 4P, SNAP-FIT, ROHS
Keystone 7795
2 J3, J9 CONN-HEADER, 1x2, BRKAWY 1x36,
2.54mm, ROHS
Berg/FCI 68000-236HLF
4 J6, J7, J8, J12 CONN-HEADER, 1x3, BREAKAWY 1x36,
2.54mm, ROHS
Berg/FCI 68000-236HLF
4 L1, L2, L3, L4 COIL-PWR INDUCTOR, SMD, 6.8μH, 20%,
15A, 4.1mΩ, ROHS
Wurth 74439370068
2 U1, U2 80V DUAL-BUCK PWM
CONTROLLER, 38P, HTSSOP, ROHS
Renesas Electronics
America
ISL81802FVEZ
8 Q1, Q4, Q6, Q8, Q10, Q11, Q12,
Q14
TRANSISTOR-MOS, N-CHANNEL, SMD,
8P, PPK SO-8, 100V, 80A, ROHS
Infineon BSC070N10NS5ATMA1

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 12 of 19
Sep.15.20
0 Q2, Q3, Q5, Q7, Q9, Q13, Q15,
Q16
DO NOT POPULATE OR PURCHASE
2 R1, R58 RES SMD 430kΩ1% 1/4W 1206 Panasonic ERJ-8ENF4303V
2 R2, R91 RES SMD 487kΩ1% 1/10W 0603 Yageo RC0603FR-07487KL
2 R3, R84 RES SMD 20Ω1% 1/10W 0603 Yageo RC0603FR-0720RL
8 R6, R73, R10, R25, R81, R94,
R29, R62
RES SMD 1Ω1% 1/10W 0603 Panasonic ERJ-3RQF1R0V
2 R7, R99 RES SMD 5.1Ω1% 1/10W 0603 Yageo RC0603FR-075R1L
2 R8, R90 RES SMD 20kΩ1% 1/10W 0603 Yageo RC0603FR-0720KL
4 R11, R80, R18, R93 RES SMD 5.1kΩ1% 1/10W 0603 Yageo RC0603FR-075K1L
2 R12, R98 RES SMD 34.8kΩ1% 1/10W 0603 Yageo RC0603FR-0734K8L
4 R14, R22, R76, R87 RES SMD 0.004Ω3W 2512 WIDE Susumu KRL6432E-M-R004-F-T1
4 R16, R21, R65, R79 RES SMD 3.3Ω1% 1/10W 0603 Yageo RC0603FR-073R3L
2 R19, R86 RES SMD 169kΩ1% 1/10W 0603 Venkel CR0603-10W-1693FT
2 R20, R64 RES SMD 2.7kΩ1% 1/10W 0603 Yageo RC0603FR-072K7L
4 R23, R27, R57, R77 RES SMD 100kΩ1% 1/10W 0603 Yageo RC0603FR-07100KL
2 R26, R71 RES SMD 22kΩ1% 1/10W 0603 Yageo RC0603FR-0722KL
4 R30, R32, R70, R101 RES SMD 39kΩ1% 1/10W 0603 Yageo RC0603FR-0739KL
4 R31, R33, R59, R75 RES SMD 39kΩ1% 1/10W 0603 Yageo RC0603FR-0739KL
8 R38, R39, R40, R67, R74, R97,
R5, R63
RES SMD 51kΩ1% 1/10W 0603 Yageo RC0603FR-0751KL
7 R41, R96, R52, R53, R54, R60,
R102
RES SMD 0Ω1% 1/10W 0603 Yageo RC0603FR-070RL
0 R42, R43, R46, R47, R56, R61,
R95, R100, R15, R17, R69, R78,
R34, R35, R44, R45, R48, R49,
R50, R51, R55, R66, R68, R72,
R82, R83, R85, R88, R89, R92,
RT2, RT3, RT4, RT5
RES, SMD, 0603, DNP-PLACE HOLDER,
ROHS
26 TP1, TP2, TP3, TP5, TP7, TP9,
TP10, TP13, TP14, TP15, TP18,
TP22, TP23, TP24, TP25, TP26,
TP27, TP28, TP29, TP30, TP31,
TP32, TP33, TP34, TP35, TP36
CONN-COMPACT TEST PT, VERTICAL,
WHT, ROHS
Keystone 5007
4 J6, J7, J8, J12 CONN-JUMPER, SHORTING, 2PIN, BLACK,
GOLD, ROHS
Sullins SPC02SYAN
6 Six corners SCREW, 4-40x1/4in, PHILLIPS, PANHEAD,
STAINLESS, ROHS
Keystone 2204
6 Six corners STANDOFF, 4-40x3/4in, F/F, HEX,
ALUMINUM, 0.25 OD, ROHS
Keystone 7795
Qty Reference Designator Description Manufacturer Manufacturer Part

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 13 of 19
Sep.15.20
2.4 Board Layout
Figure 9. Silkscreen Top
Figure 10. Top Layer

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 14 of 19
Sep.15.20
Figure 11. Second Layer (Solid Ground)
Figure 12. Third Layer

ISL81802EVAL3Z 2. PCB Layout Guidelines
R16UH0004EU0100 Rev.1.00 Page 15 of 19
Sep.15.20
Figure 13. Bottom Layer
Figure 14. Silkscreen Bottom

ISL81802EVAL3Z 3. Typical Performance Curves
R16UH0004EU0100 Rev.1.00 Page 16 of 19
Sep.15.20
3. Typical Performance Curves
VIN = 48V, TA= 25°C, unless otherwise noted.
Figure 15. Load Current Sharing, VIN = 48V, CCM Figure 16. Output Voltage Ripple, VIN = 48V, IOUT = 40A,
CCM
Figure 17. Inductor Current IL1, IL2, IL3, IL4, VIN = 18V,
IOUT = 40A
Figure 18. Inductor Current IL1, IL2, IL3, IL4, VIN = 48V,
IOUT = 40A
Figure 19. Inductor Current IL1, IL2, IL3, IL4, VIN = 80V,
IOUT = 40A
Figure 20. Load Transient, VIN = 18V, IOUT = 0A to 40A,
2.5A/µs, CCM
0
2
4
6
8
10
12
14
0102030
40
Inductor Currents (A)
Total Load Current (A)
I_L1 I_L2
I_L3 I_L4
4µs/Div
VOUT 200mV/Div
4µs/Div
IL1 10A/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
4µs/Div
IL1 10A/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
4µs/Div
IL1 10A/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
VOUT 500mV/Div
2ms/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div

ISL81802EVAL3Z 3. Typical Performance Curves
R16UH0004EU0100 Rev.1.00 Page 17 of 19
Sep.15.20
Figure 21. Load Transient, VIN = 48V, IOUT = 0A to 40A,
2.5A/µs, CCM
Figure 22. Load Transient, VIN = 80V, IOUT = 0A to 40A,
2.5A/µs, CCM
Figure 23. Start-Up Waveform, VIN = 18V, IOUT = 40A, CCM Figure 24. Start-Up Waveform, VIN = 48V, IOUT = 40A, CCM
Figure 25. Start-Up Waveform, VIN = 80V, IOUT = 40A, CCM Figure 26. Phase1, Phase2, Phase3, Phase4, VIN = 18V,
IOUT = 40A, CCM
VIN = 48V, TA= 25°C, unless otherwise noted. (Continued)
2ms/Div
VOUT 500mV/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
2ms/Div
VOUT 500mV/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
10ms/Div
VOUT 5V/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
10ms/Div
VOUT 5V/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
10ms/Div
VOUT 5V/Div
IL2 10A/Div
IL3 10A/Div
IL4 10A/Div
2µs/Div
Phase1 20V/Div
Phase2 20V/Div
Phase3 20V/Div
Phase4 20V/Div

ISL81802EVAL3Z 3. Typical Performance Curves
R16UH0004EU0100 Rev.1.00 Page 18 of 19
Sep.15.20
Figure 27. Phase1, Phase2, Phase3, Phase4, VIN = 48V,
IOUT = 40A, CCM
Figure 28. Phase1, Phase2, Phase3, Phase4, VIN = 80V,
IOUT = 40A, CCM
VIN = 48V, TA= 25°C, unless otherwise noted. (Continued)
2µs/Div
Phase1 50V/Div
Phase2 50V/Div
Phase3 50V/Div
Phase4 50V/Div
2µs/Div
Phase1
Phase2
Phase3
Phase4
50V/Div
50V/Div
50V/Div
50V/Div

ISL81802EVAL3Z 4. Revision History
R16UH0004EU0100 Rev.1.00 Page 19 of 19
Sep.15.20
4. Revision History
Rev. Date Description
1.00 Sep.15.20 Initial release

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(Rev.1.0 Mar 2020)
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