RF SOLUTIONS PB-03F User manual

DS-BLE-PB03F-1
BLE-PB03F
PB-03F User Manual
Version: V1.0.0
PB-03F User Manual

BLE-PB03F
DS-BLE-PB03F-1
Content
1. Product Overview.......................................................................................... 3
1.1. Characteristic.................................................................................... 4
2. Main parameters.......................................................................................... 4
2.1. Static electricity requirements............................................................ 5
2.2. Electrical characteristics.................................................................... 5
2.3. BLE RF performance........................................................................... 5
2.4. Power consumption............................................................................ 6
3. Appearance dimensions................................................................................. 7
4. Pin definition................................................................................................ 8
5. Schematic................................................................................................... 10
6. Antenna parameters.................................................................................... 11
6.1. Test conditions for the antenna........................................................... 11
6.2. Antenna S parameter......................................................................... 12
6.3. Antenna Gain and Efficiency................................................................ 12
6.4. Antenna field type diagram.................................................................. 13
7. Design guidance........................................................................................... 14
7.1. Module application circuit................................................................... 14
7.2. Antenna layout requirements.............................................................. 15
7.3. Power supply..................................................................................... 16
7.4. GPIO................................................................................................ 17
8. Flow welding curve diagram........................................................................... 18
9. Product related models................................................................................ 19
10. Product packaging information.................................................................... 20

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1. Product Overview
PB-03F is a BLE module, the core processor chip PHY6252(SSOP24) of this module is
a BLE SoC with high integration and low power consumption, which is specially designed
for various applications such as IoT, mobile devices, wearable electronic devices and
smart homes.
PHY6252(SSOP24) chip has industry-leading low power consumption performance and
RF performance, it supports BLE 5.2.The chip built in 64 KB SRAM, 256KB flash, 96
KB ROM,256bit efuse. The chip supports a variety of low-power working states and can
meet the power consumption requirements of various application scenarios. RF output
power can be adjusted to achieve the best balance among communication distance,
communication rate and power consumption.
PB-03F module provide rich peripheral interfaces, including
UART,PWM,ADC,I2C,SPI,PDM,DMA and up to 19 IOs.
PB-03F module has many unique hardware security mechanisms. Hardware encryption
accelerator supports AES algorithm.
PB-03F module supports BLE with low power consumption: BLE 5.2 and BLE mesh.
Bluetooth rate support:125Kbps, 500Kbps,1Mbps, 2Mbps.Support broadcast
expansion, multi-broadcast, channel selection.
Figure 1 Main chip architecture diagram

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1.1. Characteristic
• Support BLE5.2, rate support:125Kbps, 500Kbps, 1Mbps, 2Mbps
• Own 64 KB SRAM，256KB flash, 96 KB ROM，256bit efuse
• Support UART/GPIO/ADC/PWM/I2C/SPI/PDM/DMA interface
• Adopt SMD-22 package
• Support multiple sleep modes, deep sleep current is less than 1uA
• Support for serial local upgrade and remote Firmware upgrade (FOTA)
• Universal AT instructions can be used easy and quickly
• Support for secondary development, with an integrated Windows development
environment
2. Main parameters
Table 1 Description of the main parameters

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2.1. Static electricity requirements
PB-03F is an electrostatic sensitive device, and special precautions must be taken
when handling it.
Figure 2 ESD anti-static diagram
2.2. Electrical characteristics
Table 2 Electrical characteristics table
2.3. BLE RF performance
Table 3 BLE RF performance table

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2.4. Power consumption
The following power consumption data are based on a 3.3V power supply, ambient
temperature of 25°C and measured using an internal regulator.
• All measurements were completed without the SAW filter at the antenna
interface.
• All emission data were measured based on the TX_Burst_Test&RX_Burst_Test
mode
Table 4 Power consumption table

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3. Appearance dimensions
Figure 3 Appearance diagram pictures is for reference only, subject to physical objects)
Figure 4 Module size diagram

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4. Pin definition
PB-03F has a total of 22 interfaces. As shown in below pin diagram, the pin function
definition table is the interface definition.
Figure 5 Schematic diagram of module pins (back view)

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Table 6 Pin function definition table

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5. Schematic
Figure 6 Module schematic

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6. Antenna parameters
6.1. Test conditions for the antenna

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6.2. Antenna S parameter
Figure 8 Antenna S parameters
6.3. Antenna Gain and Efficiency
Table 7 Antenna Gain and efficiency

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6.4. Antenna field type diagram
Figure 9 Antenna field type diagram

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7. Design guidance
7.1. Module application circuit
Figure 10 Application circuit diagram
Note:
• Because the PB-03M does not have the reset pin, we can achieve the reduction by
power off, we can restore the module with a PMOS to achieve the reduction of
power off.
• TX&RX serial port line, 2 resistors are reserved, In series in the line. The 3.3V
voltage used to prevent the serial port affects the reset of the module.

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7.2. Antenna layout requirements
• The installation position on the motherboard suggests the following 2 ways:
Scheme 1: Put the module on the edge of the motherboard, and the antenna area out
of the motherboard edge.
Scheme 2: Put the module on the edge of the motherboard, and empty an area along
the antenna position.
• To meet the performance of the on-board antenna, metal parts are not placed
around the antenna, away from the high-frequency device.
Figure 11 Schematic diagram of the antenna layout

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7.3. Power supply
• Recommended 3.3V voltage, peak current over 200mA.
• Power supply is recommend to use LDO; If the DC-DC is used, the ripple is
recommended to be controlled within 30mV.
• The DC-DC power supply circuit proposes to reserve the dynamic response
capacitance to optimize the output ripple with large load changes.
• 3.3V power interface it is recommended to add ESD devices.
Figure 12 The DC-D C antihypertensive circuit diagram

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7.4. GPIO
• Some IO ports are lead outside the module, if using, a proposed resistance of 10-
100 ohms on the IO port. This suppresses the overshoot and enables smoother
levels on both sides, helping for both EMI and ESD.
• The up and down of the special IO port should refer to the use instructions of the
specification, which will affect the start-up configuration of the module.
• The IO port of the module is 3.3V, if the main control does not match the IO port
level of the module, the level conversion circuit should be increased.
• If the IO port is directly connected to the peripheral interface, or terminals such
as pin header, it is recommended to reserve ESD devices at the IO port line near
the terminal.
Figure 13 Level convert circuit

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8. Flow welding curve diagram
Figure 14 Flow welding diagram

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9. Product related models
Table 8 Product related model list

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10. Product packaging information
PB-03F module was packaged in a tape, 800pcs/reel. As shown in the below image:
Figure 15 Package and packing diagram