Samsung Anycall SGH-N700 User manual

SGH-N700
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
SAMSUNG Anycall
CONTENTS
SAMSUNG Anycall

Samsung Electronics Co.,Ltd. January. 2005
PrintedinKorea.
Code No.: GH68-06532A
BASIC.
ⓒ
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.

SAMSUNG Proprietary-Contents may change without notice
1. SGH-N700 Specification
ThisDocumentcan notbe used withoutSamsung'sauthorization
1-1
GSM900
Phase1EGSM900 Phase2DCS1800 Phase1
Freq.Band[MHz]
Uplink/Downlink 890~915 935~960 880~915 925~960 1710~1785 1805~1880
ARFCNrange1~124 0~124 &975~1023 512~885
Tx/Rxspacing 45MHz45MHz95MHz
Mod.Bit rate/
Bit Period 270.833kbps 3.692us270.833kbps 3.692us270.833kbps 3.692us
TimeSlot
Period/FramePeriod 576.9us 4.615ms576.9us 4.615ms576.9us 4.615ms
Modulation 0.3GMSK0.3GMSK0.3GMSK
MS Power33dBm~13dBm33dBm~5dBm30dBm~0dBm
PowerClass 5pcl~15pcl5pcl~19pcl0pcl~15pcl
Sensitivity-102dBm-102dBm-100dBm
TDMAMux 8 8 8
Cell Radius35Km35Km2Km
1. GSMGeneralSpecification

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
Specification
1-2
TXPower
control levelGSM900
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
TXPower
control levelDCS1800
0 30±2 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2. GSMTXpower class

SAMSUNG Proprietary-Contents may change without notice
2. SGH-N700 Circuit Description
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-1
1. SGH-N700 RFCircuitDescription
1)RXPART
1.FEM(U402(SWITCHPLEXER+FILTER)) →Switching Tx,Rx pathforE`GSM900,and DCS1800 by logic controlling.
2.FEMControlLogic(U402)→TruthTable
VC1VC2
DCS/PCSTxModeLH
GSMTxModeHL
GSM/DCSRxModeL L
3.FILTER
ToconvertElectromagneticFieldWavetoAcousticWave and then pass thespecificfrequency band.
-GSMFILTER(U402(SWITCHPLEXER+FILTER)) →For filtering thefrequency band between 925 ~960 MHz
-DCS FILTER(U402(SWITCHPLEXER+FILTER)) →For filtering thefrequency band 1805 and 1880 MHz.
4.VC-TCXO (OSC401)
To generatethe13MHzreference clockto drivethelogic and RF.
Afteradditionalprocess,thereference clockappliestotheU900 RxIQdemodulatorand TxIQmodulator.
Theoscillator forRXIQdemodulatorand Txmodulatorare controlled by serialdatatoselectchanneland usefast lock
modeforGPRShigh class operation.
5.SI4205 (U404)
Thischipintegratestwo differential-inputLNAs.
TheGSMinputsupportstheE-GSM,DCSinputsupportstheDCS1800.TheLNA inputsarematchedtothe200 ohm
differentialoutputSAWfiltersthrough eternalLCmatching network.
Image-rejectmixerdownconvertstheRFsignal toa100 KHzintermediatefrequency(IF)withtheRFLOfromfrequency
synthesizer.TheRFLOfrequencyisbetween 1849.8~1879.9MHz.
TheMixeroutput isamplifiedwithananalog programmablegainamplifier(PGA),whichiscontrolled by AGAIN.
ThequadratureIFsignal isdigitizedwith high resolution A/Dconverts(ADC).
Also,thischip down-convertstheADCoutput to baseband withadigital100 KHzquadratureLOsignal.Digital
decimation and IIRfiltersperformchannelselection toremoveblocking and reference interface signals.
Afterchannelselection,thedigitaloutput is scaledwithadigitalPGA,whichiscontrolledwiththeDGAIN.DACsdrive
adifferentialanalog signalontotheRXIP,RXIN,RXQP,RXQN pinstointerface tostandardanalog-inputbaseband IC.

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
CircuitDescription
2-2
2)TXPART
Baseband IQsignalfedinto offsetPLL,thisfunction isincludedinsideofU404 chip.
SI4205 chip generatesmodulatorsignalwhich powerlevel isabout1.5dBmand fedintoPowerAmplifier(U403).
ThePAoutputpowerand power ramping arewell controlled by AutoPowerControlcircuit.WeuseoffsetPLL below
Modulation Spectrum
200kHzoffset
30 kHzbandwidth
GSM-35dBc
DCS-35dBc
400kHzoffset
30 kHzbandwidth
GSM-66dBc
DCS-65dBc
600kHz~1.8MHzoffset
30 kHzbandwidth
GSM-75dBc
DCS-68dBc
2. Baseband CircuitdescriptionofSGH-N700
1)CSP2200B1
1.Power Management
Sevenlow-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimal
systemperformance and long batterylife.AprogrammableLDO provides supportfor1.8V,3.0VSIMs,while a
self-resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,suchastwo
LEDdriversand twocall-alertdrivers,aidinreducing both boardarea and systemcomplexity.Afour-wireserial interface
unit(SIU)providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor full controlofthe
CSP2200B1and enables systemdesignerstomaximize bothstandby and talktimes.Error reporting isprovided via an
interruptsignaland statusregister.Supervisoryfunctions.including aresetgenerator,aninputvoltagemonitor,and a
thermalmonitor,supportreliablesystemdesign.Thesefunctionsworktogethertoensurepropersystembehaviorduring
start-up orinthe eventofafault condition(lowmicroprocessorvoltage,insufficientbatteryenergy,orexcessivedie
temperature).
2.BatteryChargeManagement
Abatterychargemanagementblock,incorporating aninternalPMOSswitch,and an 8-bit ADC,providesfast,efficient
charging ofsingle-cell Li-Ion battery.Usedinconjunction witha current-limited voltagesource,thisblocksafely
conditionsnear-deadcellsand providestheoption ofhaving fast-charge and top-off controlledinternally orby thesystem's
microprocessor.
3.BacklightLED Driver
ThebacklightLEDdriverisalow-side,programmable currentsource designedtocontrol thebrightness ofthekeyboard
illumination.LED1_DRViscontrolled viaLED1_[0:2]and can beprogrammedtosink from15mAto 60mAin 7.5mA
steps.LED2_DRViscontrolled viaLED2_[0:2]and can beprogrammedtosink from5mAto 40mAin 5mAsteps.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-3
BothLEDdriversare capableofsinking theirmaximumoutputcurrentataworst-casemaximumoutputvoltageof0.6V.
Forefficientuse,theLEDsisconnected betweenthebatteryand theLED_DRVoutput.
4.VibratorMotorDriver
Thevibratormotordriverisaindependentvoltageregulatorto driveasmall dcmotorthatsilentlyalertstheuserofan
incoming call.Thedriverisa3.0Vconstantsource whilesinking up to 180mAand controlledbyenablesignalofmain
chip.Forefficientuse and safety,thevibratormotorshould be connected betweentheregulatoroutputand theground.
2).LCD
LCDisconsisted ofmainLCD(B/WSTNLCD).ChipselectsignalsofEMIpart inthetrident,LCD_CS,canenable
mainLCD.VDD_EL signalenablesEL ofmainLCD.Insleepmode,EL areturned off.
ThesetwosignalsarefromIOpartoftheDSP inthetrident.RSTsignalfromCSP2200B1initiatestheinitialprocess of
theLCD.
8-bit datalines(D(0)~D(7)) transfersdata and commandstoLCD.Data and commandsuseA(2)signal.If this signal is
high,InputstoLCDare commands.If it islow,InputstoLCDaredata.
ThesignalswhichinformtheinputoroutputstatetoLCD,arerequired.But this systemisnotnecessaryfor readenable
signal.CP_WENsignal isonly usedtowritedataorcommandstoLCD.
Powersignalforoperating LCDdriverisVCCD.
3).JTAGConnector
TridenthastwoJTAG portswhichareforARMcore and DSP core(DSP16000).Sothis systemhastwo portconnector
fortheseports.Pins'initialsforARMcore are'CP_' and pins'initialsforDSP core are'DSP_'.
CP_TDIand DSP_TDIsignalareusedforinputofdata.CP_TDO and DSP_TDO signalsareusedfortheoutputofthe
data.CP_TCKand DSP_TCKsignalsareusedforclock becauseJTAG communication isasynchronous.CP_TMSand
DSP_TMSsignalsaretestmodesignals.Thedifference betweentheseistheRESET_INTsignalwhichisforARMcore
RESET.
4).Keypad
Thisisconsisted ofkeyinterface pinsinthetrident,KEY_ROW[0~4]and KEY_COL[0~4].Thesesignalscomposethe
matrix.Result ofmatrixinformsthekeystatusto keyinterface inthetrident.Somepinsare connectedto varistor for
ESDprotection.And poweron/off keyis seperatedfromthematrix.
So poweron/off signal isconnectedwithCSP2200 toenableCSP2200.

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
CircuitDescription
2-4
5)IFconnetor
It is18-pinconnector,and separatedintotwo parts.Oneisapowersupply partformainsystem.And theotheris
designedto useSDS,DEBUG,DLC-DETECT,JIG_ON,TA,VF,and GND.Theyconnectedto powersupplyIC,
microprocessorand signalprocessor IC.
6)Audio
AOUTAP,AOUTAN fromCSP2200 isconnectedtothespeakervia analog switch.MICINand MICOUTare connected
tothemainMIC.
YMU759 isaLSI forportabletelephonethat iscapableofplaying high qualitymusicby utilizing FMsynthesizerand
ADPCMdecorderthatareincludedinthisdevice.
Asasynthesis,YMU759 isequipped 16 voiceswith different tones.Since thedevice iscapableofsimultaneously
generating up tosynchronouswiththeplay oftheFMsynthesizer,various sampled voicescan beusedas sound effects.
Since theplay dataofYMU759 areinterpretedatanytimethrough FIFO,thelength ofthedata(playing period)isnot
limited,sothedevice canflexiblysupportapplication suchasincoming call melody musicdistribution service.The
hardwaresequencerbuilt inthisdevice allowsplaying ofthe complexmusicwithoutgiving excessiveloadtotheCPUof
theportabletelephones.Moreover,theregistersoftheFMsynthesizercan beoperated directlyfor real timesound
generation,allowing,forexample,utilization ofvarious sound effectswhen using thegamesoftwareinstalledinthe
portabletelephone.
YMU759 includesaspeakeramplifierwith high rippleremovalratewhosemaximumoutput is550mW(SPVDD=3.6V).
Thedevice isalsoequippedwithconventionalfunction including avibartorand a circuit forcontrolling LEDs synchornous
withmusic.
7)Memory
This systemusesAMD'smemory,S71JL064HA0BAW110.
It isconsisted of64Mbitsflashmemoryand 16MbitsPSRAM.Ithas16 bit dataline,D[0~15]whichisconnectedto
trident,LCDorCSP2200.Ithas22 bit address lines,A[0~21].Theyare alsoconnected.CP_CSROMENsignal,chip
selectsignal inthetrident,enableflashmemories.They use2.8 volt supply voltage,VCCD.
During wrting process,CP_WENislowand it enableswriting process toflashmemoryand PSRAM.During reading
process,CP_OENislowand it output information whichislocatedat the address fromthetrident intheflashmemory or
PSRAMto datalines.Eachchipselectsignalsinthetridentselectflashmemory orPSRAM.Reading orwriting
procedureisprocessedafterCP_WENorCP_OENisenabled.MemoriesuseRST.A[0]signalenableslowerbyteof
PSRAMand UPPER_BYTE signalenableshigherbyteofPSRAM.

SAMSUNG Proprietary-Contents may change without notice
CircuitDescription
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-5
8)Trident
Trident isconsisted ofARMcore and DSP core.Ithas20K*16bitsRAM144K*16bitsROMintheDSP.Ithas
4K*32bitsROMand 2K*32bitsRAMintheARMcore.DSP isconsisted oftimer,onebit input/outputunit(BIO),JTAG,
EMIand HDS(HardwareDevelopmentSystem).ARMcoreisconsisted ofEMI,PIC(ProgrammableInterruptController),
reset/power/clock unit,DMAcontroller,TIC(TestInterface Controller),peripheralbridge,PPI,SSI(SynchronousSerial
Interface),ACCs(Asynchronouscommunicationscontrollers),timer,ADC,RTC(Real-TimeClock)and keyboardinterface.
DSP_AB[0~8],address linesofDSP core and DSP_DB[0~15],datalinesofDSP core are connectedtoCSP2200.A[0~20],
address linesofARMcore and D[0~15],datalinesofARMcore are connectedtomemory,LCDand YMU762.
ICP(InterprocessorCommunication Port)controlsthe communication betweenARMcore and DSP core.
CSROMEN,CSRAMENand CS1NtoCS4NintheARMcore are connectedtoeachmemory.WENand OENcontrol the
process ofmemory.ExternalIRQ(InterruptReQuest)signalsfromeach units,suchas,YMU,Ear-jack,Ear-mic and
CSP1093,needthe compatibleprocess.
SomePPIpinshasmany specialfunctions.CP_KB[0~9] receivethestatusfromkeyFPCB and areusedforthe
communicationsusing datalink cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
And UP_CS/SCLK/SDI,controlsignalsforCSP2200 areoutputtedthrough PPIpins.Ithas signalportfor
charging(CHG_DET),SIM_RESET and FLIP_SNSwithwhichweknowsopen.closedstatusof folder.Ithas JTAG control
pins(TDI/TDO/TCK) forARMcore and DSP core.Itrecieves13MHz clockinCKIpinfromexternalTCXO and receives
32.768KHz clockfromX1RTC.ADC(Analog toDigitalConvertor) partreceivesthestatusoftemperature,batterytype and
battery voltage.And controlsignals(DSP_INT,DSP_IOand DSP_RWN) forDSP core areused.ItenablesmainLCD with
DSP IPpins.
8)X-TAL(13MHz)
This systemusesthe13MHzTCXO.AFCcontrolsignalformCSP1093 controlsfrequencyfrom13MHzx-tal.Thisclock
isfedtoCSP1093,Trident,YMU759 and Silabsolution.

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
CircuitDescription
2-6

SAMSUNG Proprietary-Contents may change without notice
3. SGH-N700 ExplodedViews and Parts List
3-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
1.CellularphoneExplodedView-1
QIF01
QMP01
QMO01
QSP01
QLC01
QME01
QMI01
QCR05
QKP01
QFR01
QMW02
QAN02
QAN05
QRE01
QRF01
QBA21
QCR04

SAMSUNG Proprietary-Contents may change without notice
ExplodedViewsand PartsList
3-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
2.CellularphonePartslist
Location
NO.DescriptionSEC CODE Remark
QMW02 PMO-MAINWINDOWGH72-13316A
QFR01 MEC-FRONTCOVER GH75-04537A
QIF01 PMO-IFCOVER GH72-16745A
QKP01 MEC-KEYPADASSYGH75-04539A
QSP01 SPEAKER 3001-001576
QMO01 MOTORGH31-00047A
QMP01 MIANPBAGH92-01986A
QLC01 LCDGH07-00623A
QME01 UNITMETALDOMEGH59-01456A
QMI01 MICROPHONEASSYGH30-00125A
QCR05 SCREW6001-001478
QAN05 MEC-INTENARUBBER GH75-05620A
QRE01 REARCOVER GH75-04538A
QCR04 SCREW-MACHINE6001-001479
QRF01 MPR-R/FCOVER GH74-08243A
QBA21 BATTERY-820MAHGH43-01599A
QAN02 INTENNAGH42-00444A

SAMSUNG Proprietary-Contents may change without notice
ExplodedViewsand PartsList
3-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
3.TestJig(GH80-00865A)
3-1.RFTestCable
(GH39-00182A)3-2.TestCable (GH39-00127A)3-3.SerialCable
3-4.PowerSupplyCable3-5.DATACABLE
(GH39-00143B)3-6.TA
(GH44-00284A)

SAMSUNG Proprietary-Contents may change without notice
ExplodedViewsand PartsList
3-4
ThisDocumentcan notbe used withoutSamsung'sauthorization

SAMSUNG Proprietary-Contents may change without notice
4. SGH-N700 ElectricalParts List
4-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODE Design LOC
0403-001387 ZD629
0403-001427 ZD628
0403-001511 ZD301
0404-001172 D501
0406-001150 ZD501
0406-001150 ZD502
0501-000481 Q301
0504-001113 Q102
0601-001094 LED601
0601-001094 LED602
0601-001094 LED605
0601-001094 LED606
0601-001094 LED607
0601-001094 LED608
0601-001094 LED631
0601-001094 LED632
0601-001094 LED633
0601-001094 LED634
0601-001094 LED635
0601-001094 LED636
0601-001956 LED610
0801-000796 U102
1001-001261 U501
1003-001395 U302
1109-001309 U202
1201-002177 U403
1203-001917 U601
1203-003109 U107
1203-003304 U101
1204-001811 U502
1205-002433 U404
1209-001219 U203
1405-001082 ZD601
1405-001082 ZD602
1405-001082 ZD603
1405-001082 ZD604
1405-001082 ZD605
1405-001082 ZD606
1405-001082 ZD607
SEC CODE Design LOC
1405-001082 ZD608
1405-001082 ZD609
1405-001082 ZD610
1405-001082 ZD611
1405-001082 ZD612
1405-001082 ZD613
1405-001082 ZD614
1405-001082 ZD615
1405-001082 ZD616
1405-001082 ZD617
1405-001082 ZD618
1405-001082 ZD619
1405-001082 ZD620
1405-001082 ZD621
1405-001082 ZD622
1405-001082 ZD623
1405-001082 ZD624
2007-000138 R103
2007-000138 R113
2007-000138 R424
2007-000140 R515
2007-000140 R516
2007-000140 R617
2007-000140 R618
2007-000140 R619
2007-000140 R620
2007-000140 R621
2007-000140 R622
2007-000140 R623
2007-000140 R624
2007-000140 R625
2007-000140 R627
2007-000140 R628
2007-000140 R629
2007-000141 R420
2007-000148 R109
2007-000148 R110
2007-000148 R202
2007-000148 R214

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODE Design LOC
2007-000148 R423
2007-000148 R510
2007-000148 R512
2007-000157 R207
2007-000157 R609
2007-000157 R610
2007-000162 R111
2007-000162 R112
2007-000162 R114
2007-000162 R201
2007-000162 R206
2007-000162 R501
2007-000162 R511
2007-000162 R513
2007-000164 R504
2007-000171 R102
2007-000171 R104
2007-000171 R105
2007-000171 R106
2007-000171 R108
2007-000171 R210
2007-000171 R213
2007-000171 R302
2007-000171 R425
2007-000171 R426
2007-000171 R509
2007-000171 R518
2007-000171 R519
2007-000171 R521
2007-000690 R301
2007-000775 R505
2007-000775 R506
2007-001119 R517
2007-001217 R601
2007-001217 R602
2007-001217 R605
2007-001217 R606
2007-001217 R607
2007-001217 R608
SEC CODE Design LOC
2007-001217 R631
2007-001217 R632
2007-001217 R633
2007-001217 R634
2007-001217 R635
2007-001217 R636
2007-001292 R502
2007-001292 R503
2007-001319 R101
2007-001325 R507
2007-002797 R421
2007-003001 R422
2007-003025 R630
2007-007100 R205
2007-007138 R402
2007-007142 R208
2007-007308 R211
2007-007308 R212
2007-008117 R107
2203-000189 C310
2203-000189 C311
2203-000189 C312
2203-000189 C313
2203-000189 C314
2203-000233 C110
2203-000233 C401
2203-000233 C402
2203-000233 C423
2203-000233 C429
2203-000233 C430
2203-000233 C431
2203-000233 C440
2203-000233 C502
2203-000233 C503
2203-000233 C505
2203-000233 C508
2203-000254 C118
2203-000254 C201
2203-000254 C202

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODE Design LOC
2203-000254 C203
2203-000254 C204
2203-000254 C205
2203-000254 C206
2203-000254 C207
2203-000254 C208
2203-000254 C212
2203-000254 C418
2203-000254 C419
2203-000254 C438
2203-000254 C441
2203-000254 C442
2203-000254 C443
2203-000254 C449
2203-000278 C530
2203-000425 C410
2203-000425 C439
2203-000438 C512
2203-000628 C220
2203-000628 C221
2203-000628 C407
2203-000628 C435
2203-000654 C504
2203-000679 C211
2203-000812 C107
2203-000812 C108
2203-000812 C109
2203-000812 C436
2203-000870 C450
2203-000885 C303
2203-000995 C434
2203-001072 C101
2203-001072 C102
2203-001072 C114
2203-001072 C215
2203-001072 C216
2203-001383 C412
2203-001405 C507
2203-001598 C111
SEC CODE Design LOC
2203-001598 C112
2203-001598 C116
2203-001652 C113
2203-005061 C103
2203-005061 C106
2203-005061 C117
2203-005061 C119
2203-005061 C124
2203-005061 C213
2203-005061 C214
2203-005061 C217
2203-005061 C218
2203-005061 C222
2203-005061 C223
2203-005061 C422
2203-005061 C506
2203-005061 C510
2203-005061 C513
2203-005061 C532
2203-005065 C302
2203-005065 C305
2203-005065 C306
2203-005065 C307
2203-005065 C523
2203-005065 C609
2203-005065 C610
2203-005288 C408
2203-005288 C409
2203-005288 C411
2203-005288 C413
2203-005480 C219
2203-005482 C304
2203-005482 C501
2203-005496 C209
2203-005496 C210
2203-005509 C515
2203-005509 C521
2203-006093 C115
2203-006093 C120

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-4
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODE Design LOC
2203-006093 C315
2203-006257 C121
2203-006257 C122
2203-006324 C104
2203-006324 C105
2404-001086 C511
2404-001239 C602
2404-001268 C123
2404-001281 C417
2404-001281 C433
2404-001305 C529
2404-001339 C509
2404-001348 C406
2703-001512 L401
2703-001751 L405
2703-002201 C451
2703-002204 L402
2703-002624 L301
2703-002759 L403
2801-003747 OSC201
2809-001264 OSC401
2909-001225 U402
3705-001287 U401
3709-001335 CN101
3710-002017 CN601
4302-001130 BAT101
GH09-00029A U201

SAMSUNG Proprietary-Contents may change without notice
ThisDocumentcan notbe used withoutSamsung'sauthorization
5. SGH-N700 BlockDiagrams
5-1
1.RFSolutionBlockDiagram
EGSMRX(925~960 MHz)
LN A
PGA
PGAADC
ADC
VCT CXO
(OSC401)
EGSMTX
(880 ~ 91 5 MHz)
DCS TX
(1710 ~ 17 85 MHz)
Dua lPAM
(U403)
Front
End
Mod ule
(U402)
RF
Cone ctor
(U401)
Si42 05
(U404)
RF
PLL IF
PLL
PD
LPF
Mi xer
Channel
Filt er
PGA
PGADAC
DAC
10 0
kH z
CSP
22 00 B1
(U101)
Bryce Park
I
Q
I
Q
SDATA
SCLK
SENB
PDNB
LN A
DCSRX(1880 MHz)

SAMSUNG Proprietary-Contents may change without notice
BlockDiagrams
ThisDocumentcan notbe used withoutSamsung'sauthorization
5-2
2.Base Band SolutionBlockDiagram