Samsung GT-B3310i User manual

GSM TELEPHONE
GT-B3310i
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Disassembly and Assembly
Instructions
8. Chart of Troubleshooting
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
GSM TELEPHONE CONTENTS

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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2. Specification
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2-1
GSM850 EGSM900 DCS1800 PCS1900
Freq. Band[MHz]
Uplink/Downlink
824-849
869-894
880~915
925~960
1710~1785
1805~1880
1850~1910
1930~1990
ARFCN range 128-251 0~124 &
975~1023 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80 MHz
Mod. Bit rate
/BitPeriod
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692 us
Time Slot Period
/ Frame Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
576.9 us
4.615 ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5~19(class4) 5~19(class4) 0~15(class1) 0~15(class1)
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMAMux8888
Cell Radius 35Km 35Km 2Km 2 Km
2-1. GSM General Specification

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Specification
2-2
TX Power
control level DCS1800 PCS1900
030±3
dBm 30±3 dBm
128±3
dBm 28±3 dBm
226±3
dBm 26±3 dBm
324±3
dBm 24±3 dBm
422±3
dBm 22±3 dBm
520±3
dBm 20±3 dBm
618±3
dBm 18±3 dBm
716±3
dBm 16±3 dBm
814±3
dBm 14±3 dBm
912±4
dBm 12±4 dBm
10 10±4 dBm 10±4 dBm
11 8±4dBm 8±4dBm
12 6±4 dBm 6±4 dBm
13 4±4 dBm 4±4 dBm
14 2±5 dBm 2±5 dBm
15 0±5 dBm 0±5 dBm
TX Power
control level GSM850 GSM900
533±2
dBm 33±2 dBm
631±2
dBm 31±2 dBm
729±2
dBm 29±2 dBm
827±2
dBm 27±2 dBm
925±2
dBm 25±2 dBm
10 23±2 dBm 23±2 dBm
11 21±2 dBm 21±2 dBm
12 19±2 dBm 19±2 dBm
13 17±2 dBm 17±2 dBm
14 15±2 dBm 15±2 dBm
15 13±2 dBm 13±2 dBm
16 11±3 dBm 11±3 dBm
17 9±3 dBm 9±3 dBm
18 7±3 dBm 7±3 dBm
19 5±3 dBm 5±3 dBm
2-2. GSM TX power class

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3. Operation Instruction and Installation
3-1
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Main Function
-Quad Band (GSM850+EGSM900+DCS1800+PCS1900)
-GPRS Rx/Tx, EDGE Rx only
-FM Radio
-Bluetooth v2.0 +EDR
-CSTN 2.0" QVGA 262K Color LCD
-2MCMOS Camera
-MP3 Player

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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
QFU0 1
QSP0 1
QCA0 1
QKP01
QME04
QME16
QCR03
QCR61
QFL01
QMI03
QHI02
QCK01
QCR93
QMW02
QVO01
QRE01
QFR01
QCR61
QCR03
QBA00
QCR03
QME01
QCR03
QMP01
QKP02
QLC02
QSC01
QLC01
QRF06
QHI01

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Exploded View and Parts List
4-2
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Design LOC Description SEC CODE
QCR03 SCREW-MACHINE 6001-001811
QCR03 SCREW-MACHINE 6001-001811
QCR03 SCREW-MACHINE 6001-001811
QCR61 SCREW-MACHINE 6001-002008
QME16 ASSY ETC-GTB3310_CON TO CON GH59-07898A
QME01 DOME SHEET-GTB3310_QWERTY 35 KEY GH59-07899A
QCA01 CAMERA MODULE GH59-10284A
QSP01 MODULE-GTB3310I_SPK GH59-10286A
QLC02 ASSY ETC-LCD SUB PBA(GTB3310I) GH59-10372A
QME04 KEY FPCB-TF KEY PBA (GT_B3310I) GH59-10373A
QSC01 TAPE-SCREW CAP GH74-44933C
QMP01 A/S ASSY-GTB3310I_PBA MAIN (SVC) GH82-05326A
QLC01 ELA MODULE-LCD 2.0" QVGA GT-B3310 TN ASS GH96-03890A
QBA00 ASSY COVER-BATT GH98-13409A
QKP01 ASSY KEYPAD-NUM/TA GH98-13413C
QKP02 ASSY KEYPAD-NAVI/TA GH98-13414C
QFR01 ASSY CASE-FRONT GH98-18838C
QFU01 ASSY CASE-SLIDE UPPER GH98-13405C
QMW02 PMO WINDOW-MAIN(OPEN/TA) GH72-54282C
QFL01 ASSY CASE-SLIDE LOWER GH98-13406C
QCR93 SCREW-MACHINE 6001-002263
QHI01 ASSY HINGE-SLIDE(GTB3310) GH98-13412C
QRE01 ASSY CASE-REAR VE(TA) GH98-18667C
QRF06 PMO COVER-USB GH72-54273A
QVO01 PMO KEY-VOLUME_VE GH72-57959A
QCK01 PMO KEY-CAM_VE GH72-57960A
QMI03 RMO RUBBER-MIC HOLDER GH73-13024A
4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List
5-1
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SEC CODE Design LOC Description
0403-001741 ZD301 DIODE-ZENER
0404-001172 ZD304 DIODE-SCHOTTKY
0406-001167 ZD303 DIODE-TVS
0406-001267 ZD302,ZD305,ZD306 DIODE-TVS
0406-001286 ZD500,ZD501 DIODE-TVS
0406-001369 U301 DIODE-TVS
0501-002606 Q300 TR-SMALL SIGNAL
0502-001322 Q301 TR-POWER
0504-001140 Q302,Q303 TR-DIGITAL
0505-001165 Q305 FET-SILICON
0505-002388 Q400 FET-SILICON
0601-002070 LED403 LED
0601-002268 LED400,LED401,LED402 LED
1001-001488 U303 IC-ANALOG SWITCH
1001-001598 U302 IC-ANALOG MULTIPLEX
1009-001035 U300 IC-HALL EFFECT S/W
1108-000355 UME200 MEMORY
1201-002944 U101 IC-RF AMP
1201-003025 PAM100 IC-POWER AMP
1203-005851 U403,U404 IC-MULTI REG
1203-006098 U402 IC-MULTI REG
1205-003517 U100 IC-BLUETOOTH
1205-003998 U500 IC-EXPANDER
1205-004030 UCP200 IC-MODEM
1404-001224 TH200 THERMISTOR
1405-001231 R319 VARISTOR
1405-001298 V300 VARISTOR
2007-000138 L303,R107,R108,R110 R-CHIP
2007-000138 R111,R305,R326,R401 R-CHIP
2007-000140 R109,R314 R-CHIP
2007-000141 R410,R411,R500,R501 R-CHIP
2007-000143 R213,R315,R322,R403 R-CHIP
2007-000143 R420,R421,R422,R423 R-CHIP
2007-000144 R416 R-CHIP
2007-000146 R200 R-CHIP

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Main Electrical Parts List
5-2
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SEC CODE Design LOC Description
2007-000148 C405,R309,R311,R312 R-CHIP
2007-000148 R313,R316,R317,R318 R-CHIP
2007-000148 R502,R503 R-CHIP
2007-000157 R400,R419 R-CHIP
2007-000162 R116,R205,R206,R209 R-CHIP
2007-000162 R302,R321 R-CHIP
2007-000168 R310 R-CHIP
2007-000170 R404 R-CHIP
2007-000172 R303,R304 R-CHIP
2007-000242 R308,R324,R325 R-CHIP
2007-000831 R306 R-CHIP
2007-000932 R301 R-CHIP
2007-001119 R323 R-CHIP
2007-001284 R408,R409 R-CHIP
2007-001288 R412,R413,R414,R415 R-CHIP
2007-001292 R327,R328 R-CHIP
2007-001307 R115 R-CHIP
2007-001316 R113,R114 R-CHIP
2007-001339 R402 R-CHIP
2007-003015 R105 R-CHIP
2007-007001 R300 R-CHIP
2007-007015 R320 R-CHIP
2007-007142 R204 R-CHIP
2007-007488 R405 R-CHIP
2007-008780 R307 R-CHIP
2203-000233 C233 C-CERAMIC
2203-000254 C107,C118 C-CERAMIC
2203-000278 C103 C-CERAMIC
2203-000386 C106,C305,C306 C-CERAMIC
2203-000438 C124,C207,C210 C-CERAMIC
2203-000585 C326,C327 C-CERAMIC
2203-000627 C222,C223 C-CERAMIC
2203-000643 C100 C-CERAMIC
2203-000679 C328 C-CERAMIC
2203-000812 C117,C309,C310,C315 C-CERAMIC
2203-000812 C318,C319,C323,C403 C-CERAMIC

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Main Electrical Parts List
5-3
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SEC CODE Design LOC Description
2203-000812 C404 C-CERAMIC
2203-000995 C302,C311 C-CERAMIC
2203-001153 C324,C325 C-CERAMIC
2203-001385 C131 C-CERAMIC
2203-002443 C119,C120,C225 C-CERAMIC
2203-002487 C220,C228 C-CERAMIC
2203-002668 C135,C226 C-CERAMIC
2203-002677 C134 C-CERAMIC
2203-002709 C218 C-CERAMIC
2203-005234 C116,C126 C-CERAMIC
2203-005281 C114 C-CERAMIC
2203-005344 C303 C-CERAMIC
2203-005480 C221 C-CERAMIC
2203-005481 C122,C123,C203,C219 C-CERAMIC
2203-005483 C313,C314 C-CERAMIC
2203-005552 C111 C-CERAMIC
2203-005968 C234 C-CERAMIC
2203-006048 C101,C105,C200,C201 C-CERAMIC
2203-006048 C205,C209,C213,C224 C-CERAMIC
2203-006048 C231,C300,C301,C321 C-CERAMIC
2203-006048 C322 C-CERAMIC
2203-006190 C202 C-CERAMIC
2203-006201 C110 C-CERAMIC
2203-006257 C208,C214,C308 C-CERAMIC
2203-006260 C211,C229,C230 C-CERAMIC
2203-006324 C217 C-CERAMIC
2203-006361 C331,C334 C-CERAMIC
2203-006399 C121,C204,C212,C232 C-CERAMIC
2203-006399 C235,C304,C312,C316 C-CERAMIC
2203-006399 C401,C402,C413,C500 C-CERAMIC
2203-006562 C215,C400,C414,C415 C-CERAMIC
2203-006562 C416,C417,C418,C419 C-CERAMIC
2203-006872 C109 C-CERAMIC
2203-007240 C227,C317 C-CERAMIC
2203-007270 C206 C-CERAMIC
2203-007271 C216,C406,C407,C408 C-CERAMIC

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Main Electrical Parts List
5-4
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SEC CODE Design LOC Description
2203-007271 C409,TA302 C-CERAMIC
2203-007279 C102 C-CERAMIC
2203-007290 C113 C-CERAMIC
2409-001172 BAT200 CAPACITOR
2703-000213 L120 INDUCTOR-SMD
2703-001747 L122 INDUCTOR-SMD
2703-001749 L108,L110,L114,L115 INDUCTOR-SMD
2703-001749 L116,L118,L123,L124 INDUCTOR-SMD
2703-001750 L104,L105 INDUCTOR-SMD
2703-001838 L301 INDUCTOR-SMD
2703-001990 L113 INDUCTOR-SMD
2703-002199 L109,L112 INDUCTOR-SMD
2703-002203 L101 INDUCTOR-SMD
2703-002204 L107 INDUCTOR-SMD
2703-002369 L106 INDUCTOR-SMD
2703-003869 L201 INDUCTOR-SMD
2801-004896 OSC201 CRYSTAL-UNIT
2801-004902 OSC200 CRYSTAL-UNIT
2901-001408 F400,F401,F402 FILTER-EMI SMD
2904-001923 F102 FILTER-SAW
2904-001924 F101 FILTER-SAW
3003-001136 MIC300 MIC-CONDENSOR
3301-001342 F300 CORE-FERRITE BEAD
3301-001729 L305 CORE-FERRITE BEAD
3301-001812 L307,L308 CORE-FERRITE BEAD
3301-001986 L302,L304 CORE-FERRITE BEAD
3301-002000 L200 CORE-FERRITE BEAD
3404-001303 TAC400,TAC401,TAC402 SWITCH-TACT
3705-001731 RFS100 CONNECTOR-COAXIAL
3709-001627 SIM300 CONNECTOR-CARD EDGE
3709-001630 U501 CONNECTOR-CARD EDGE
3711-006105 HEA400 CONNECTOR-HEADER
3711-006919 HEA401 CONNECTOR-HEADER
3711-006137 BTC300 HEADER-BATTERY
3712-001348 ANT100,ANT101 CONNECTOR
3712-001363 ANT102,ANT103 CONNECTOR

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Main Electrical Parts List
5-5
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SEC CODE Design LOC Description
3722-002840 IFC300 JACK-PHONE
4709-001615 F100 RF-MODULE
GH70-03349A SC101,SC103,SC105 IPR SHIELD-CAN CLIP
GH70-04828A SC100,SC102,SC104 IPR SHIELD-CAN CLIP
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.

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6. Array course control
6-1
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6-1. S/W Download
6-1-1. Pre-requsite for S/W Downloading
•Downloader Program("FlashTool_E2_ROU")
•GT-E1170 Mobile Phone
•Data Cable
•JIG BOX (GH99-36900A)
•RF Test Cable (GH39-00985A)
•JIG Cable (GH39-01290A)
•Adapter (GH99-38251A)
•Serial Cable
•Binary files
（Settings
Connect to ANYWAY JIG BOX
&JIG CABLE (Phone to JIG)

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Array course control
6-2
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6-1-2. S/W Downloader Program
1.Load the binary download program by executing the "FlashTool_E2.exe"

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Array course control
6-3
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2.Select the Communication Driver /Baud rate /Download-setup that the
mobile phone is connected to..

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Array course control
6-4
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3.Select the Download file (*.
fls ,*. dffs -total 4file)
*Caution :Keep order of files

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Array course control
6-5
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4.Click 'Start' Button.

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Array course control
6-6
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5.Click 'Start USB1'.And connect phone(without battery) by USB DATA cable.
6.Insert battery to phone. Download is starting.
7.Confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#

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7. Disassembly and Assembly Instructions
7-1
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7-1. Disassembly
31) Remove the Slide FPCB Connector from
the the board.
41) Unscrew the 1point below the speaker.
2) Unscrew the 1point beside the RF S/W.
①
②
1) Be careful not to occur any damages and scratches.
1) Be careful not to occur any damages and scratches.
2) Be careful not to change shape of the REAR during
disassembly.
1) Be careful not to occur any damages to the slide
FPCB.
1) Be careful not to occur any damages to components
around screws during disassembly.
1) Remove the battery cover and the battery
11) Unscrew 6screw points.
2) Unlock the set from the top to the bottom.
2