Samsung SGH-C230 User manual

GSMTELEPHONE
SGH-C230
GSMTELEPHONECONTENTS
1.Specification
2.Circuit Description
3. ExplodedViews and PartsList
4. ElectricalPartsList
5.BlockDiagrams
6.PCB Diagrams
7. FlowChartofTroubleshooting

Samsung ElectronicsCo.,Ltd.MAY.2005
Printedin Korea.
CodeNo.:GH68-07224A
BASIC.
T
hisServiceManual isa propertyofSamsung ElectronicsCo.,Ltd.
A
nyunauthorized use ofManualcan bepunished underapplicable
I
nternationaland/ordomesticlaw.
ⓒ

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1. Specification
1-1
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EGSM900
Phase2DCS1800 Phase1PCS1900 Phase1
Freq.Band[MHz]
Uplink/Downlink 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1960
ARFCNrange0~124 &975~1023 512~885 512~810
Tx/Rxspacing 45MHz95MHz80MHz
Mod.Bit rate/
Bit Period 270.833kbps 3.692us270.833kbps 3.692us270.833kbps 3.692us
TimeSlot
Period/FramePeriod 576.9us 4.615ms576.9us 4.615ms576.9us 4.615ms
Modulation 0.3GMSK0.3GMSK0.3GMSK
MS Power33dBm~5dBm30dBm~0dBm30dBm~0dBm
PowerClass 5pcl~19pcl0pcl~15pcl0pcl~15pcl
Sensitivity-102dBm-100dBm-100dBm
TDMAMux 8 8 8
Cell Radius35Km2Km2Km
Operating
Temperature-20°C~+50°C
1-1.GSMGeneralSpecification

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Specification
1-2
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2. Circuit Description
2-1
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2-1.SGH-C230 RFCircuitDescription
2-1-1.RX PART
—ASM(F100)→SwitchingTx,RxpathforGSM900,DCS1800 and PCS1900 bylogic controlling.
—ASMControlLogicTruthTable
VC1VC2VC3
EGSMTX H L L
DCS/PCSTXLHL
PCS_RXL L H
—SawFILTER
ToconvertElectromagneticFieldWavetoAcousticWave and then pass thespecificfrequency band.
-GSMFILTER(F102)→For filtering thefrequency band between 925 and 960 MHz.
-DCS FILTER(F102)→For filtering thefrequency band between 1805 and 1880 MHz
-PCS FILTER(F101)→For filtering thefrequency band between 1930 and 1990 MHz.
—Crystal(U102)
To generatethe26MHzreference clockto drivethelogic and RF.
Afteradditionalprocess,thereference clockappliestotheU801 RxIQdemodulatorand TxIQmodulator.
Theoscillator forRXIQdemodulatorand Txmodulatorare controlled by serialdatatoselectchanneland usefast lock
modeforGPRShigh class operation.
—Si4210 (U100)
Thereceivesection integratesfourdifferential-input lownoise amplifiersLNAs supporting theGSM850,EGSM900,
DCS1800 and PCS1900 bands.TheLNA inputsarematchedtothe150 ohmbalanced-outputSAWfiltersthrough externa
LCmatching network.
AquadratureImage-rejectmixerdownconvertstheRFsignal toa200 KHzintermediatefrequency(IF).Themixeroutput is
amplifiedwithananalog programmablegainamplifier(PGA)that iscontrolledwiththeAGAIN.ThequadratureIF? ?
isdigitizedwith high resolution analog-to-digitalconverts(ADC).
TheADCoutput isdownconvertedto baseband withadigitalquadratureLOsignal.Digitaldecimation and FIRfilters
performdigitalfiltering and removeADCquantization noise,blockersand reference interferers.
After filtering,thedigitaloutput is scaledwithadigitalPGA,whichiscontrolledwiththeDGAIN.DACsdrive a
differentialIand Qanalog signalontotheBIP,BIN,BQPand BQN pinstointerface tostandardanalog-inputbaseband
ICs.

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CircuitDescription
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2-1-2.TX PART
Baseband IQsignalfedinto offsetPLL,thisfunction isincludedinsideofU801 chip.Thetransmit section ofU801
consistofanI/Qbaseband upconverter,an offsetphase-lockedloop (OPLL)and two 50 ohmoutputbuffersthatcan drive
anexternalPowerAmplifier(PA).Si4210 chip generatesmodulatorsignalwhich powerlevel isabout1.5dBmand fedinto
PowerAmplifier(U900).ThePAoutputpowerand power ramping arewell controlledbyAutoPowerControlcircuit.
WeuseoffsetPLL below.
Modulation Spectrum
200kHzoffset
30 kHzbandwidth
GSM-35dBc
DCS-35dBc
PCS-35dBc
400kHzoffset
30 kHzbandwidth
GSM-66dBc
DCS-65dBc
PCS-66dBc
600kHz~1.8MHzoffset
30 kHzbandwidth
GSM-75dBc
DCS-68dBc
PCS-75dBc
2-2.Baseband Circuitdescription ofSGH-C230
2-2-1.CSP2200B1
—Power Management
Sevenlow-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimal
systemperformance and long batterylife.AprogrammableLDO provides supportfor1.8V,3.0VSIMs,while a self-
resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,suchastwoLED
driversand twocall-alertdrivers,aidinreducing both boardarea and systemcomplexity.Afour-wireserial interface
unit(SIU)providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor full controlofthe
CSP2200B1and enables systemdesignerstomaximize bothstandby and talktimes.Error reporting isprovided via an
interruptsignaland statusregister.Supervisoryfunctions.including aresetgenerator,aninputvoltagemonitor,and a
thermalmonitor,supportreliablesystemdesign.Thesefunctionsworktogethertoensurepropersystembehaviorduring
start-up orinthe eventofafault condition(lowmicroprocessorvoltage,insufficientbatteryenergy,orexcessivedie
temperature).
—BatteryChargeManagement
Abatterychargemanagementblock,incorporating aninternalPMOSswitch,and an 8-bit ADC,providesfast,efficient
charging ofsingle-cell Li-Ion battery.Usedinconjunction witha current-limited voltagesource,thisblocksafely
conditionsnear-deadcellsand providestheoption ofhaving fast-charge and top-off controlledinternally orby thesystem's
microprocessor.

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CircuitDescription
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—BacklightLED Driver
ThebacklightLEDdriverisalow-side,programmable currentsource designedtocontrol thebrightness ofthekeyboard
illumination.LED1_DRViscontrolled viaLED1_[0:2]and can beprogrammedtosink from15mAto 60mAin 7.5mA
steps.LED2_DRViscontrolled viaLED2_[0:2]and can beprogrammedtosink from5mAto 40mAin 5mAsteps.
BothLEDdriversare capableofsinking theirmaximumoutputcurrentataworst-casemaximumoutputvoltageof0.6V.
Forefficientuse,theLEDsisconnected betweenthebatteryand theLED_DRVoutput.
—VibratorMotorDriver
Thevibratormotordriverisaindependentvoltageregulatorto driveasmall dcmotorthatsilentlyalertstheuserofan
incoming call.Thedriverisa3.3Vconstantsource whilesinking up to 140mAand controlledbyenablesignalofmain
chip.Forefficientuse and safety,thevibratormotorshould be connected betweentheregulatoroutputand theground.
2-2-2Connector
—JTAGConnector
TridenthastwoJTAG portswhichareforARMcore and DSP core(DSP16000).Sothis systemhastwo portconnector
fortheseports.Pins'initialsforARMcore are'CP_' and pins'initialsforDSP core are'DSP_'.
CP_TDIand DSP_TDIsignalareusedforinputofdata.CP_TDO and DSP_TDO signalsareusedfortheoutputofthe
data.CP_TCKand DSP_TCKsignalsareusedforclock becauseJTAG communication isasynchronous.CP_TMSand
DSP_TMSsignalsaretestmodesignals.Thedifference betweentheseistheRESET_INTsignalwhichisforARMcore
RESET.
—Keypadconnector
Thisisconsisted ofkeyinterface pinsinthetrident,KEY_ROW[0~4]and KEY_COL[0~4].Thesesignalscomposethe
matrix.Result ofmatrixinformsthekeystatusto keyinterface inthetrident.Somepinsare connectedto varistor for
ESDprotection.And poweron/off keyis seperatedfromthematrix.
So poweron/off signal isconnectedwithCSP2200 toenableCSP2200.
NinekeyLEDusethe +VBATT supply voltage.These are connectedtoBACKLIGHTsignal intheCSP2200.
This signalenablesLEDswithcurrentcontrol.
—EMIFiltering
This systemusestheEMIFiltertoreduce noisefromLCDpart.Some controlsignalsare connectedtoLCD withoutEMI
filtering.

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CircuitDescription
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2-2-3. IFconnetor
It is24-pinconnector,and separatedintotwo parts.Oneisapowersupply partformainsystem.And theotheris
designedto useSDS,DEBUG,DLC-DETECT,JIG_ON,VEXT,VTEST,VF,and GND.Theyconnectedto powersupply
IC,microprocessorand signalprocessor IC.
2-2-4.Audio
AOUTAP,AOUTAN fromCSP2200 isconnectedtothespeakervia analog switch.AOUTBPand AOUTBNare connected
tothe ear-micspeakervia ear-jack.MICINand MICOUTare connectedtothemainMIC.And AUXINand AUXOUT
are connectedtotheEar-mic.
YMU762MA3isaLSI forportabletelephonethat iscapableofplaying high qualitymusicby utilizing FMsynthesizer
and ADPCMdecorderthatareincludedinthisdevice.
Asasynthesis,YMU762MA3isequipped 16 voiceswith different tones.Since thedevice iscapableofsimultaneously
generating up tosynchronouswiththeplay oftheFMsynthesizer,various sampled voicescan beusedas sound effects.
Since theplay dataofYMU762MA3areinterpretedatanytimethrough FIFO,thelength ofthedata(playing period)isnot
limited,sothedevice canflexiblysupportapplication suchasincoming call melody musicdistribution service.The
hardwaresequencerbuilt inthisdevice allowsplaying ofthe complexmusicwithoutgiving excessiveloadtotheCPUof
theportabletelephones.Moreover,theregistersoftheFMsynthesizercan beoperated directlyfor real timesound
generation,allowing,forexample,utilization ofvarious sound effectswhen using thegamesoftwareinstalledinthe
portabletelephone.
YMU762 includesaspeakeramplifierwith high rippleremovalratewhosemaximumoutput is550mW(SPVDD=3.6V).
Thedevice isalsoequippedwithconventionalfunction including avibartorand a circuit forcontrolling LEDs synchornous
withmusic.
Fortheheadphone,it isprovidedwithastereophonicoutput terminal.
Forthepurposeofenabling YMU762MA3to demonstrateitsfull capabilities,Yamahapurposeto use"SMAF:Synthetic
musicMobileApplication Format"asadatadistribution format that iscompatiblewithmultimedia.
Since theSMAFtakesastructurethatsetsimportance on thesynchronization betweensound and images,variouscontents
can bewrittenintoit including incoming call melody withwordsthatcan beusedfortraining karaoke,and commercial
channel thatcombinestexts,imagesand sounds,and others.ThehardwaresequencerofYMU762MA3 directlyinterprets
and playsblocksrelevant tosynthesis(playing music and reproducing ADPCMwithFMsynthesizer) thatareincludedin
datadistributedinSMAF.
2-2-5.Memory
This systemusesSHARP'smemory,LRS18B0.
It isconsisted of256Mbitsflashmemoryand 64MbitsSCRAM.Ithas16 bit dataline,D[0~15]whichisconnectedto
trident,LCDorCSP2200.Ithas23 bit address lines,A[1~23].Theyare alsoconnected.CP_CSROMENsignal,chip
selectsignal inthetrident,enableflashmemories.They usesupply voltages,VCCDand VCC_1.8A.

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CircuitDescription
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During wrting process,CP_WENislowand it enableswriting process toflashmemoryand SCRAM.During reading
process,CP_OENislowand it output information whichislocatedat the address fromthetrident intheflashmemory or
SCRAMto datalines.Eachchipselectsignalsinthetridentselectflashmemory orSCRAM.Reading orwriting
procedureisprocessedafterCP_WENorCP_OENisenabled.MemoriesuseFLASH_RESET,whichisbufferedsignalof
RESET fromCSP2200,forESDprotection.A[0]signalenableslowerbyteofSCRAMand UPPER_BYTE signalenables
higherbyteofSCRAM.
2-2-6.Trident
Trident isconsisted ofARMcore and DSP core.Ithas20K*16bitsRAM144K*16bitsROMintheDSP.Ithas
4K*32bitsROMand 2K*32bitsRAMintheARMcore.DSP isconsisted oftimer,onebit input/outputunit(BIO),JTAG,
EMIand HDS(HardwareDevelopmentSystem).ARMcoreisconsisted ofEMI,PIC(ProgrammableInterruptController),
reset/power/clock unit,DMAcontroller,TIC(TestInterface Controller),peripheralbridge,PPI,SSI(SynchronousSerial
Interface),ACCs(Asynchronouscommunicationscontrollers),timer,ADC,RTC(Real-TimeClock)and keyboardinterface.
DSP_AB[0~8],address linesofDSP core and DSP_DB[0~15],datalinesofDSP core are connectedtoCSP2200.A[0~20],
address linesofARMcore and D[0~15],datalinesofARMcore are connectedtomemory,LCDand YMU762.
ICP(InterprocessorCommunication Port)controlsthe communication betweenARMcore and DSP core.
CSROMEN,CSRAMENand CS1NtoCS4NintheARMcore are connectedtoeachmemory.WENand OENcontrol the
process ofmemory.ExternalIRQ(InterruptReQuest)signalsfromeach units,suchas,YMU,Ear-jack,Ear-mic and
CSP1093,needthe compatibleprocess.
SomePPIpinshasmany specialfunctions.CP_KB[0~9] receivethestatusfromkeyFPCB and areusedforthe
communicationsusing datalink cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
And UP_CS/SCLK/SDI,controlsignalsforCSP2200 areoutputtedthrough PPIpins.Ithas signalportfor
charging(CHG_DET),SIM_RESET and FLIP_SNSwithwhichweknowsopen.closedstatusof folder.Ithas JTAG control
pins(TDI/TDO/TCK) forARMcore and DSP core.Itrecieves13MHz clockinCKIpinfromexternalTCXO and receives
32.768KHz clockfromX1RTC.ADC(Analog toDigitalConvertor) partreceivesthestatusoftemperature,batterytype and
battery voltage.And controlsignals(DSP_INT,DSP_IOand DSP_RWN) forDSP core areused.ItenablesmainLCD with
DSP IPpins.
2-2-7.CSP2200
CSP2200 isintegratedthetiming and controlfunctionsforGSM2+mobile application withtheADCand DACfunctions,
and powermanagementblock.TheCSP2200 interfacestothetrident,via a 16-bit parallel interface.Itservesasthe
interface thatconnectsaDSP totheRFcircuitryinaGSM2+mobiletelephone.DSP canload 148 bitsofburstdata
intoCSP2200’ sinternalregister,and programCSP2200’ sevent timing and controlregisterwiththe exact timetosend the
burst.Whenthetiming portion ofthe event timing and controlregistermatchestheinternalquarter-bit counterand internal
frame counter,the148 bitsintheinternalregisterareGMSKmodulatedaccording toGSM2+standards.Theresulting
phaseinformation istranslatedintoIand Qdifferentialoutputvoltagesthatcan be connected directlytoanRFmodulator
at theTXOPand TXON pins.TheDSP isnotifiedwhenthetransmission iscompleted.For receiving baseband data,a
DSP can programCSP2200’ sevent timing and controlregisterwiththe exact timetostartreceiving Iand Qsamples
through TXIPand TXINpins.

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CircuitDescription
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Whenthat timeisreached,the controlportion ofthe event timing and controlregisterwill start thebaseband receive
section converting Iand Qsamplepairs.Thesamplesarestoredinadouble-bufferedregisteruntil theregistercontains32
samplepairs.CSP2200 then notifiestheDSP which has sampletimetoreadtheinformation outbeforethenext32
samplepairsarestored.Thevoice band ADCconverterissuesaninterrupt totheDSP wheneverit finishesconverting a
16-bit PCMword.TheDSP thenreadsthenewinputsample and simultaneouslyloadsthevoice band outputDAC
converterwithanewPCMoutputword.Thevoice band outputcan be connected directlytoaspeakerviaAOUTAN and
AOUTAPpinsand be connectedtoaEar-micspeakerviaAOUTBNand AOUTBPpins.
There are7LDOswhicharepowersourcesofmicroprocessor,LCD,etc.These7LDOsoutputareprogrammable.

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3. ExplodedViewand Parts List
3-1
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QRF03
QVO01
QKP01
QSP01
QMO01
QFR01
QLC01
QMP01
QME01
QAN01
QRE01
QCR11
QBA01
QIF01
QMI01
QRF01
3-1.Exploded View

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Explodedviewand PartList
3-2
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LocationNO.DescriptionSEC CODERemark
QFR01 MEC-FRONTCASEGH75-06758A
QVO01 MEC-SIDEKEYGH75-04859A
QKP01 MEC-KEYPADGH75-06834B
QSP01 SPEAKER3001-001760
QMO01 MOTORDCGH31-00163A
QLC01 LCD-SGHC210 MAINGH07-00701A
QMP01 MAINPBAGH92-02137A
QME01 UNIT-METALDOMEGH59-02124A
QMI01 MICROPHONE-ASSYGH30-00187A
QAN01 ANTENNAGH42-00551A
QRF03 PMO-EARCOVERGH72-21155A
QRE01 MEC-REARCASEGH75-06760A
QIF01 PMO-IFCOVERGH72-21397A
QCR11 SCREW-MACHINE6001-001654
QRF01 MPR-RFSHEETGH74-14935A
QBA01 BATTERYGH43-01803A
3-2.PartsList

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Explodedviewand PartList
3-3
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DescriptionSEC CODE
BAGPE;LDPE,T0.05,W80,L180,TRP,-,-6902-00634
ADAPTOR-TAD;TAD137USE,SGH-E800,AC/DCGH44-00770A
UNIT-EARPHONE;SGH-i270,EM-SS550E-ST,GH59-01543A
LABEL(P)-WATER SOAK;SCH-X110,NORGE,1GH68-02026A
MANUAL-USE;SGH-C230,XSP,ENGLISH,SIPLGH68-06943A
LABEL(R)-MAIN(EU);SGH-C230,EU,POLYESGH68-07006A
BOX(P)-UINIT(SEA);SGH-C230,SC300+S12 GH69-02620A
CUSHION-CASE(1-2);SGH-C230,PULP,T0.8GH69-02914A
MPR-ESDTAPE;SGH-C200,3M851,7X5,-,-GH74-05583A
MPR-MAINWINDOWBOHOVI;SGH-C207,STAGH74-09827A
MPR-MAINWINDOWBOHO;SGH-C200,S.T55 GH74-11299A
MPR-MAINWINDOWBOHO;SGH-C200,ST 555 GH74-11636A
MPR-LDISPONGE;SGH-C230,PSRPORON,31 GH74-15399A

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Explodedviewand PartList
3-4
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3-3.TestJig(GH80-00865A)
3-3-1.RF TestCable
(GH39-00283A)3-3-2.TestCable (GH39-00127A)3-3-3.Serial Cable
3-3-4.PowerSupplyCable3-3-5.DATACABLE
(GH39-00143B)3-3-6.TA
(GH44-00184A)

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4. ElectricalParts List
4-1
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Design LOC Description SEC CODE
C103 C-CER,CHIP 2203-000438
C104 C-CER,CHIP 2203-000438
C105 C-CER,CHIP 2203-000995
C108 C-CER,CHIP 2203-002668
C109 C-TA,CHIP 2404-001397
C110 C-CER,CHIP 2203-006090
C111 C-CER,CHIP 2203-002668
C112 C-CER,CHIP 2203-005050
C113 C-CER,CHIP 2203-000530
C114 C-CER,CHIP 2203-001432
C115 C-CER,CHIP 2203-000438
C116 C-CER,CHIP 2203-000995
C117 C-CER,CHIP 2203-000254
C120 C-CER,CHIP 2203-005482
C121 C-CER,CHIP 2203-000854
C122 C-CER,CHIP 2203-000278
C123 C-CER,CHIP 2203-000233
C124 C-CER,CHIP 2203-002677
C125 C-CER,CHIP 2203-005450
C126 C-CER,CHIP 2203-002677
C127 C-CER,CHIP 2203-000278
C128 C-CER,CHIP 2203-005234
C129 C-CER,CHIP 2203-005234
C130 C-CER,CHIP 2203-001017
C131 C-CER,CHIP 2203-000696
C132 C-CER,CHIP 2203-000696
C133 C-CER,CHIP 2203-005482
C134 C-CER,CHIP 2203-000386
C135 C-CER,CHIP 2203-001412
C136 C-CER,CHIP 2203-005482
C137 C-CER,CHIP 2203-001072
C200 C-CER,CHIP 2203-000254
C201 C-CER,CHIP 2203-000254
C202 C-CER,CHIP 2203-000254
C203 C-CER,CHIP 2203-000254
C204 C-CER,CHIP 2203-005496
C205 C-CER,CHIP 2203-005061
C206 C-CER,CHIP 2203-000679
C207 C-CER,CHIP 2203-000254
C208 C-CER,CHIP 2203-001405
C209 C-CER,CHIP 2203-000254
C210 C-CER,CHIP 2203-000254
C211 C-CER,CHIP 2203-000254
C212 C-CER,CHIP 2203-000254
C213 C-CER,CHIP 2203-005496
C214 C-CER,CHIP 2203-000254
C216 C-CER,CHIP 2203-000330
C217 C-CER,CHIP 2203-000330
C218 C-CER,CHIP 2203-006438
C300 C-CER,CHIP 2203-000254

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ElectricalPartsList
4-2
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Design LOC Description SEC CODE
C301 C-CER,CHIP 2203-001072
C302 C-CER,CHIP 2203-005482
C303 C-CER,CHIP 2203-006093
C304 C-CER,CHIP 2203-000812
C305 C-CER,CHIP 2203-000812
C306 C-CER,CHIP 2203-000812
C307 C-CER,CHIP 2203-005061
C308 C-CER,CHIP 2203-001598
C309 C-CER,CHIP 2203-000233
C310 C-TA,CHIP 2404-001240
C311 C-CER,CHIP 2203-006053
C312 C-CER,CHIP 2203-006053
C313 C-CER,CHIP 2203-006053
C314 C-CER,CHIP 2203-006053
C315 C-CER,CHIP 2203-006053
C316 C-CER,CHIP 2203-001598
C317 C-CER,CHIP 2203-000254
C318 C-CER,CHIP 2203-005061
C322 C-CER,CHIP 2203-005065
C324 C-TA,CHIP 2404-001268
C325 C-CER,CHIP 2203-000233
C326 C-TA,CHIP 2404-001268
C327 C-CER,CHIP 2203-006257
C401 C-CER,CHIP 2203-000812
C402 C-CER,CHIP 2203-000812
C403 C-CER,CHIP 2203-005496
C404 C-CER,CHIP 2203-000995
C405 C-CER,CHIP 2203-000628
C406 C-CER,CHIP 2203-000425
C407 C-CER,CHIP 2203-005496
C409 C-CER,CHIP 2203-000812
C410 C-TA,CHIP 2404-001305
C411 C-CER,CHIP 2203-000233
C412 C-CER,CHIP 2203-005496
C414 C-CER,CHIP 2203-000995
C415 C-CER,CHIP 2203-000278
C416 C-CER,CHIP 2203-005496
C418 C-CER,CHIP 2203-000254
C419 C-CER,CHIP 2203-006137
C420 C-CER,CHIP 2203-005061
C421 C-TA,CHIP 2404-001380
C422 C-TA,CHIP 2404-001380
C501 C-CER,CHIP 2203-005480
C502 C-CER,CHIP 2203-000254
C503 C-CER,CHIP 2203-005480
C504 C-CER,CHIP 2203-000995
C505 C-CER,CHIP 2203-000679
C506 C-CER,CHIP 2203-005480
C507 C-CER,CHIP 2203-005065
C508 C-CER,CHIP 2203-005061

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ElectricalPartsList
4-3
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Design LOC Description SEC CODE
C509 C-TA,CHIP 2404-001105
C511 C-CER,CHIP 2203-006093
C514 C-CER,CHIP 2203-006257
C515 C-CER,CHIP 2203-005480
C517 C-TA,CHIP 2404-001240
C519 C-CER,CHIP 2203-005496
C520 C-CER,CHIP 2203-006257
C521 C-CER,CHIP 2203-006090
C522 C-CER,CHIP 2203-006257
C523 C-CER,CHIP 2203-005496
C527 C-CER,CHIP 2203-002687
C531 C-TA,CHIP 2404-001268
C532 C-CER,CHIP 2203-005061
C534 C-CER,CHIP 2203-005496
C538 C-CER,CHIP 2203-005061
C539 C-CER,CHIP 2203-000585
C542 C-CER,CHIP 2203-006208
C543 C-CER,CHIP 2203-006190
C544 C-CER,CHIP 2203-000438
C545 C-CER,CHIP 2203-005061
C546 C-CER,CHIP 2203-006562
C548 C-CER,CHIP 2203-006257
C549 C-TA,CHIP 2404-001088
C550 C-CER,CHIP 2203-006348
C551 C-CER,CHIP 2203-005482
C552 C-CER,CHIP 2203-000233
C600 C-CER,CHIP 2203-005061
C601 C-CER,CHIP 2203-005061
C602 C-CER,CHIP 2203-000233
C603 C-CER,CHIP 2203-000254
C700 C-CER,CHIP 2203-000438
C701 C-CER,CHIP 2203-000233
C703 C-CER,CHIP 2203-006348
C704 C-CER,CHIP 2203-006562
C705 C-TA,CHIP 2404-001268
C706 C-CER,CHIP 2203-000854
C710 C-NETWORK 2503-001053
C711 C-NETWORK 2503-001041
C712 C-NETWORK 2503-001041
C713 C-NETWORK 2503-001053
C714 C-NETWORK 2503-001053
C715 C-NETWORK 2503-001053
C716 C-NETWORK 2503-001053
CN100 CONNECTOR-COAXIAL 3705-001347
CN300 CONNECTOR-CARD EDGE 3709-001229
CN400 JACK-EAR PHONE [phone]
CN701 CONNECTOR-INTERFACE 3710-001611
CN702 CONNECTOR-HEADER 3711-005558
D500 DIODE-ARRAY 0407-001002
F100 DUPLEXER-ASM 2911-000002

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-4
ThisDocumentcan notbe used withoutSamsung'sauthorization
Design LOC Description SEC CODE
F101 FILTER-SAW 2904-001480
F102 FILTER-SAW 2904-001523
L101 INDUCTOR-SMD 2703-002367
L102 INDUCTOR-SMD 2703-002199
L103 INDUCTOR-SMD 2703-002205
L105 INDUCTOR-SMD 2703-002544
L106 INDUCTOR-SMD 2703-002205
L107 INDUCTOR-SMD 2703-002544
L108 INDUCTOR-SMD 2703-002199
L109 INDUCTOR-SMD 2703-002558
L110 INDUCTOR-SMD 2703-002170
L112 INDUCTOR-SMD 2703-002269
L401 INDUCTOR-SMD 2703-002202
L402 INDUCTOR-SMD 2703-002202
L403 INDUCTOR-SMD 2703-001231
L501 INDUCTOR-SMD 2703-001673
L503 INDUCTOR-SMD 2703-002206
L701 INDUCTOR-SMD 2703-002339
L702 BEAD-SMD 3301-001659
LED601 LED 0601-002020
LED602 LED 0601-002020
LED603 LED 0601-002020
LED604 LED 0601-002020
LED605 LED 0601-002020
LED606 LED 0601-002020
LED607 LED 0601-002020
LED608 LED 0601-002020
LED609 LED 0601-002020
LED610 LED 0601-002020
OSC200 CRYSTAL-SMD 2801-003856
PCB PCB-SGHC230PCB GH41-00865A
Q300 TR-DIGITAL 0504-000168
R100 R-CHIP 2007-000171
R101 R-CHIP 2007-001313
R102 R-CHIP 2007-001298
R103 R-CHIP 2007-000171
R104 R-CHIP 2007-002797
R105 R-CHIP 2007-000148
R106 R-CHIP 2007-001308
R107 R-CHIP 2007-000171
R200 R-CHIP 2007-000171
R201 R-CHIP 2007-000157
R202 R-CHIP 2007-000172
R203 R-CHIP 2007-000157
R204 R-CHIP 2007-000171
R205 R-CHIP 2007-000171
R206 R-CHIP 2007-007480
R207 R-CHIP 2007-000157
R208 R-CHIP 2007-007538
R209 R-CHIP 2007-000171

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-5
ThisDocumentcan notbe used withoutSamsung'sauthorization
Design LOC Description SEC CODE
R210 R-CHIP 2007-000171
R211 R-CHIP 2007-007142
R212 R-CHIP 2007-000140
R213 R-CHIP 2007-000171
R214 R-CHIP 2007-000171
R215 R-CHIP 2007-007308
R216 R-CHIP 2007-000162
R217 R-CHIP 2007-007308
R218 R-CHIP 2007-000171
R219 R-CHIP 2007-000171
R220 R-CHIP 2007-000171
R221 R-CHIP 2007-000171
R222 R-CHIP 2007-000171
R223 R-CHIP 2007-000143
R224 R-CHIP 2007-000143
R225 R-CHIP 2007-000157
R226 R-CHIP 2007-000157
R300 R-CHIP 2007-000171
R301 R-CHIP 2007-001319
R302 R-CHIP 2007-000172
R303 R-CHIP 2007-000171
R304 R-CHIP 2007-000167
R310 R-CHIP 2007-007142
R311 R-CHIP 2007-008263
R312 R-CHIP 2007-000157
R400 R-CHIP 2007-007468
R401 R-CHIP 2007-007142
R402 R-CHIP 2007-000148
R403 R-CHIP 2007-007142
R404 R-CHIP 2007-007468
R405 R-CHIP 2007-001320
R406 R-CHIP 2007-000142
R407 R-CHIP 2007-001317
R408 R-CHIP 2007-000171
R409 R-CHIP 2007-000171
R410 R-CHIP 2007-001320
R411 R-CHIP 2007-000142
R412 R-CHIP 2007-007142
R413 R-CHIP 2007-007134
R414 R-CHIP 2007-007134
R415 R-CHIP 2007-007142
R416 R-CHIP 2007-007573
R417 R-CHIP 2007-007480
R418 R-CHIP 2007-001339
R419 R-CHIP 2007-000162
R420 R-CHIP 2007-000162
R421 R-CHIP 2007-000173
R422 R-CHIP 2007-000173
R423 R-CHIP 2007-000171
R424 R-CHIP 2007-000171

SAMSUNG Proprietary-Contents may change without notice
ElectricalPartsList
4-6
ThisDocumentcan notbe used withoutSamsung'sauthorization
Design LOC Description SEC CODE
R425 R-CHIP 2007-001317
R502 R-CHIP 2007-000171
R503 R-CHIP 2007-003001
R505 R-CHIP 2007-000171
R506 R-CHIP 2007-000162
R507 R-CHIP 2007-001291
R508 R-CHIP 2007-000171
R509 R-CHIP 2007-000162
R514 R-CHIP 2007-000171
R515 R-CHIP 2007-000146
R518 R-CHIP 2007-001319
R519 R-CHIP 2007-001325
R526 R-CHIP 2007-001291
R528 R-CHIP 2007-001291
R529 R-CHIP 2007-000171
R530 R-CHIP 2007-000171
R531 R-CHIP 2007-000171
R532 R-CHIP 2007-000171
R533 R-CHIP 2007-000171
R534 R-CHIP 2007-000171
R535 R-CHIP 2007-000171
R536 R-CHIP 2007-000171
R538 R-CHIP 2007-000171
R539 R-CHIP 2007-000775
R540 R-CHIP 2007-001325
R541 R-CHIP 2007-000171
R542 R-CHIP 2007-000171
R600 R-CHIP 2007-000174
R601 R-CHIP 2007-000174
R602 R-CHIP 2007-000174
R603 R-CHIP 2007-000174
R604 R-CHIP 2007-000174
R605 R-CHIP 2007-000174
R606 R-CHIP 2007-000174
R607 R-CHIP 2007-000174
R608 R-CHIP 2007-000174
R609 R-CHIP 2007-000174
R610 R-CHIP 2007-000172
R611 R-CHIP 2007-000171
R700 R-CHIP 2007-000171
R701 R-CHIP 2007-000171
R702 R-CHIP 2007-000171
R703 R-CHIP 2007-000171
R704 R-CHIP 2007-000140
R705 R-CHIP 2007-003001
R707 R-CHIP 2007-000566
R708 R-CHIP 2007-000566
R709 R-CHIP 2007-000566
R710 R-CHIP 2007-000566
R711 R-CHIP 2007-000566