Samsung SGH-E330N User manual

GSM TELEPHONE
SGH-E330N
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. October. 2005
Printed in Korea.
Code No.: GH68-08696A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ

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1. Specification
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1-1
GSM900
Phase 1 DCS1800 Phase 1 PC1900 Phase 1
Freq. Band[MHz]
Uplink/Downlink 890~915 935~960 1710~1785 1805~1880 1850~1910 1930~1990
ARFCN range 1~124 512~885 512~810
Tx/Rx spacing 45MHz 95MHz 80MHz
Mod. Bit rate/
Bit Period 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us
Time Slot
Period/Frame Period 576.9us 4.615ms 576.9us 4.615ms 576.9us 4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensitivity -102dBm -100dBm -100dBm
TDMA Mux 8 8 8
Cell Radius 35Km 2Km -
1-1. GSM General Specification

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Specification
1-2
TX Power
control level PCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level GSM900
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2. GSM TX power class

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2. Circuit Description
2-1
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2-1. SGH-E330N RF Circuit Description
2-1-1. RX PART
- ASM(U103) →Switching Tx, Rx path for GSM900, DCS1800, PCS1900 by logic controlling.
- ASM Control Logic (U103) →Truth Table
VC1 VC2 VC3
GSM Tx Mode H L L
DCS Tx Mode L H L
PCS Tx Mode H L L
GSM Rx Mode L L L
DCS Rx Mode L L L
PCS Rx Mode L L H
- FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM FILTER (F100) →For filtering the frequency band between 869 and 894 MHz
- DCS FILTER (F102) →For filtering the frequency band between 1805 and 1880 MHz.
- PCS FILTER (F101) →For filtering the frequency band between 1930 and 1990 MHz.
- VC-TCXO (OSC100)
This module generates the 26MHz reference clock to drive the logic and RF. After division by two a reference clock of
13MHz is supplied to the other parts of the system through the pin CLKOUT. After additional process, the reference
clock applies to the U100 Rx IQ demodulator and Tx IQ modulator. And then, the oscillator is controlled by serial data
to select channel and use fast lock mode for GPRS high class operation.
- Transceiver (U100)
The receiver front-end which amplifies the GSM, DCS aerial signal, converts the chosen channel down to a low IF signal
of 100 kHz. The first stages are symmetrical low noise amplifiers (LNAs). The LNAs are followed by an IQ down mixer.
It consists of two mixers in parallel but driven by quadrature out of phase LO signals. The In phase (I) and Quadrature
phase (Q) IF signals are low pass filtered to provide protection from high frequency offset interferes. The low IF I and Q
signals are then fed into the channel filter. The front-end low IF I and Q outputs enter the integrated bandpass channel
filter with provision for five 8 dB gain steps in front of the filter.
2-1-2. TX PART
I and Q baseband signals are applied to the IQ modulator that shifts the modulation spectrum up to the transmit IF. It is
designed for low harmonic distortion, low carrier leakage and high image rejection to keep the phase error as small as
possible.

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Circuit Description
2-2
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The modulator is loaded at its IF output by an integrated low pass filter that suppress unwanted spurs prior to get into
the phase detector. The clock drive is generated by division of the RFLO signal provided for the transmit offset mixer.
Baseband IQ signal fed into offset PLL, this function is included inside of U100 chip. OSC101 chip generates modulator
signal which power level is about 6.5dBm and fed into Power Amplifier(U102). The PA output power and power ramping
are well controlled by Auto Power Control circuit. We use offset PLL below table.
Modulation Spectrum
200kHz offset
30 kHz bandwidth
GSM -35dBc
DCS -35dBc
400kHz offset
30 kHz bandwidth
GSM -66dBc
DCS -65dBc
600kHz ~ 1.8MHz offset
30 kHz bandwidth
GSM -75dBc
DCS -68dBc
2-2. Baseband Circuit description of SGH-E330N
2-2-1. PCF50601
- Power Management
Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal system
performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V, and 5.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such
as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor full
control of the PCF50601 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a fault
condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
-Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET
to modulate the intensity of a series of LED’s or to control a DC/DC converter that drives LCD backlight.
But, this phone (SGH-E330N) is use UFB LCD. UFB LCD controls backlight brightness by contrast setting.
So "BL_VDD" voltage is always high value when phone is in active mode. When phone is in dimming mode "BL_VDD"
goes to about 10% duty PWM.
-Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32768 Hz crystal
oscillator provides an accurate low clock frequency for the PCF50601 and other circuitry.
2-2-2. LCD Connector
LCD is consisted of main LCD(color 65K UFB LCD) and sub LCD (4Gray LCD).
Chip select signals LCD_MAIN_CS and LCD_SUB_CS, can enable Each LCD. BACKLIGHT signal enables white LED
of main LCD. "RESET_2V8" signal initiates the reset process of the LCD.

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Circuit Description
2-3
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16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD through bypass capacitor. Data and commands use
"RS" signal. If this signal is high, inputs to LCD are commands. If it is low, inputs to LCD are data.
The signal which informs the state of LCD is whether input or output, is required. But in this system, there is no input
state from LCD. So only "L_WR" signal is used to indicate write data or command to LCD. Power signals for LCD are
"VBAT and "VDD2".
"M_SCL", "M_SCA", "PCLK", "FVALID", "LVALID" and "STANDBY" signals are all related to camera working.
"CAMERA_FLASH_SUPPLY" is voltage supply to flash led , and "SVC_LED" is signal for service led when the signal
is low led is on and vice versa. "SPK_P" and "SPK_N" are used for audio speaker containing voice or melody. And
"VDD_VIB" from PCF50601 enables the motor.
2-2-3. Key
This is consisted of key interface pins among OM6359, KBIO(0:7). These signals compose the matrix. Result of matrix
informs the key status to key interface in the OM6359. Power on/off key is separated from the matrix. So power on/off
signal is connected with PCF50601 to enable PCF50601. Fifteen key LEDs are use the "VBAT" as supply voltage.
"VDD_KEY" signal enables LEDs. "FLIP" informs the status of folder (open or closed) to the OM6359. This uses the
hall effect IC, SH248CSP. A magnet under main LCD enables SH248CSP.
2-2-4. EMI ESD Filter
This system uses the EMI ESD filter, EMIF09 to protect noise from IF CONNECTOR part.
2-2-5. IF connetor
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, TXD0, RXD0, RTS0, CTS0, JIG_REC,
CHARGER_OK, RXD1, TXD1, AUX_MIC, AUX_SPK and GND. They connected to power supply IC, microprocessor
and signal processor IC.
2-2-6. Battery Charge Management
A complete constant-current/constant-voltage linear charger is used for single cell lithium-ion batteries.
If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging
process.
2-2-7. Audio
EARP_P and EARP_N from OM6359 are connected to the main speaker. AUXSP is connected to the Hands free kit.
MIC_P and MIC_N are connected to the main MIC. And AUX_MIC_P and AUX_MIC_N are connected to the Hands
free kit.
YMU762C is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer and
ADPCM decoder that are included in this device.
As a synthesis, YMU762C is equipped 32 voices with different tones. Since the device is capable of simultaneously
generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects.
Since the play data of YMU762C are interpreted at anytime through FIFO, the length of the data(playing period) is not
limited, so the device can flexibly support application such as incoming call melody music distribution service. The
hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of
the portable telephones.

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Circuit Description
2-4
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Moreover, the registers of the FM synthesizer can be operated directly for real time sound generation, allowing, for
example, utilization of various sound effects when using the game software installed in the portable telephone.
YMU762C includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V).
The device is also equipped with conventional function including a vibrator and a circuit for controlling LEDs
synchronous with music.
For the headphone, it is provided with a stereophonic output terminal.
For the purpose of enabling YMU762C to demonstrate its full capabilities, Yamaha purpose to use "SMAF:Synthetic music
Mobile Application Format" as a data distribution format that is compatible with multimedia. Since the SMAF takes a
structure that sets importance on the synchronization between sound and images, various contents can be written into it
including incoming call melody with words that can be used for training karaoke, and commercial channel that combines
texts, images and sounds, and others. The hardware sequencer of YMU762C directly interprets and plays blocks relevant
to synthesis (playing music and reproducing ADPCM with FM synthesizer) that are included in data distributed in SMAF.
2-2-8. Memory
Signals in the OM6359 enable two memories. They use only one volt supply voltage, VDD3 in the PCF50601. This
system uses Samsung's memory, KBB06A500M-T402. It is consisted of 128M bits flash NOR memory and 128M bits
flash NAND memory and 64M bits SCRAM. It has 16 bit data line, HD[0~15] which is connected to OM6359 and
MV317S. It has 26 bit address lines, HA[1~26]. CS_NAND and NCSRAM signals are chip select. Writing process,
HWR_N is low and it enables writing process to flash memory and SRAM. During reading process, HRD_N is low and
it enables reading process to flash memory and SRAM. Each chip select signals in the OM6359 select memory among 2
flash memory and SCRAM. Reading or writing procedure is processed after HWR_N or HRD_N is enabled. Memories
use reset, which is VDD3 delay from PCF50601. HA[25] signal enables lower byte of SRAM and HA[26] signal enables
higher byte of SRAM.
2-2-9. OM6359
OM6359 is consisted of ARM core and DSP core. It has 8x1Kword on-chip program/data RAM, 55 Kwords
on-chip program ROM in the DSP. It has 4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted
of KBS, JTAG, EMI and UART. ARM core is consisted of EMI, PIC(Programmable Interrupt Controller),
reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial
Interface), ACC(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface.
KBIO(0:7), address lines of DSP core and HD[0~15]. HA[1~26], address lines of ARM core and HD[0~15], data lines of
ARM core are connected to memory, YMU762C. MV317S(Camera DSP Chip) controls the communication between ARM
core and DSP core.
CS_NAND, NCSRAM, NCSFLASH in the ARM core are connected to each memory. HWR_N and HRD_N control the
process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, PMU need the compatible process.
KBIO[0~7] receive the status from key and RXD0/TXD0 are used for the communication using data link
cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
It has JTAG control pins(TDI/TDO/TCK) for ARM core and DSP core. It receives 13MHz clock in CKI pin from
external TCXO. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and battery voltage.

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Circuit Description
2-5
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2-2-10. TOH2600DGI4KRA(26MHz)
This system uses the 26MHz TCXO, TOH2600DGI4KRA, SEM. AFC control signal from OM6359 controls frequency
from 26MHz x-tal. The clock output frequency of UAA3536 is 13MHz. This clock is connected to OM6359, YMU762C.
2-2-11. Camera DSP(MV3018SAQ)
MV3018 is a Camera Control Processor providing the most efficient camera functions for portable terminal devices such
as mobile handsets. MV3018 provides rich video functions up to 30-frame display with minimized tasks in the handset
main processor as well as hardware based real-time JPEG compression and decompression. MV3018 directly transmits and
previews the RGB data to the LCD graphic memory by processing the sensor output data according to the cell phone's
command. MV3018 can allow the host processor to download with scalable sized compressed data. In addition, MV3018
can download the compressed image to either store the original RGB data or transfer the image to the LCD. This feature
allows the main processor to minimize its function while obtaining the result of the image process. MV3018 can support
sensors up to 300K pixels.
The main processor to minimize its function while obtaining the result of the image process. MV3018 can support sensors
up to VGA pixels.

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Circuit Description
2-6
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3. Exploded Views and Parts List
3-1
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3-1. Exploded View
QAN02
QCR08
QMI01
QMP01
QFR01
QMI03
QME01
QKP01
QCR21
QCK01
QRF01
QRE01
QBA19
QCA01
QCR53
QMW02
QVO01
QIF01
QRF03
QSC08
QLC01
QFU01
QWD02
QMO01
QSP01
QFL01
QSC14

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Exploded Views and Parts List
3-2
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3-2. Parts List
Location No Description SEC Code
QAN02 ㅤINTENNA-SGHE330N;IAPT0GDP3815SC,SGH- GH42-00623A
QBA19 ㅤBATTERY-800MAH,ANT SIL,EU,M;BST5068S GH43-01988A
QCA01 ㅤUNIT-CAMERA;SGH-E335,MOMFH150G2A,-,U GH59-02050A
QCK01 ㅤMEC-CAMERA KEY ASSY;SGH-X640,XEF,-,- GH75-06567A
QCR08 ㅤSCREW-MACHINE;CH,+,M1.4,L3,BLK,SWRCH 6001-001456
QCR21 ㅤSCREW-MACHINE;BH(1.0),+,M1.7,L3.5,BL 6001-001507
QCR53 ㅤSCREW-MACHINE;CH,+,M1.7,L5,ZPC(BLK), 6001-001639
QFL01 ㅤMEC-FOLDER LOWER;SGH-E330N,EU,-,-,-, GH75-07535A
QIF01 ㅤPMO-IF COVER;SGH-E330N,PC+RUBBER,SIL GH72-23262A
QKP01 ㅤMEC-KEYPAD;SGH-E330N,EU,-,-,-,-,SIL, GH75-07639A
QLC01 ㅤLCD-SGHE335 MAIN MODULE;UG-12R110-C, GH07-00689A
QME01 ㅤUNIT-METAL DOME;SGH-E330N,-,-,XET,12 GH59-02405A
QMI01 ㅤMICROPHONE-ASSY;2,130~500uA,-44dB,2. GH30-00130A
QMO01 ㅤMOTOR-DC;12000rpm,0g.cm,3V,80mA 3101-001401
QMP01 ㅤPBA MAIN-SGHE330N;SGH-E330N,XEF,UNKD GH92-02281A
QMW02 ㅤPCT-MAIN WINDOW;SGH-E330N,ACRYLIC,TR GH72-23488A
QRE01 ㅤMEC-REAR COVER;SGH-E330N,EU,-,-,-,-, GH75-07536A
QRF01 ㅤMPR-RF SHEET;SGH-X640,PET+TESA 4972, GH74-13063A
QSC08 ㅤMPR-SCREW SHEET L;SGH-E330N,PC SHEET GH74-16222A
QSC14 ㅤMPR-TAPE FRONT FPC;SGH-E330,3M 1352 GH74-08876A
QSP01 ㅤSPEAKER;0.8W,8ohm,86,750Hz±20% 3001-001731
QVO01 ㅤMEC-VOLUME KEY ASSY;SGH-X640,XEF,-,- GH75-06566A
QFU01 ㅤMEC-FOLDER UPPER;SGH-E330N,EU,-,-,-, GH75-07534A
ㅤQWD02 PCT-WINDOW DUAL;SGH-E335,ACRYL,TRP,- GH72-19294A
QFR01 ㅤMEC-FRONT COVER;SGH-E330N,EU,-,-,-,- GH75-07547A
ㅤQRF03 PMO-EAR COVER;SGH-E330N,PC,SIL,-,-,- GH72-19199F
ㅤQMI03 RMO-MIC RUBBER;SGH-X640,UR RUBBER,7X GH73-04064A

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Exploded Views and Parts List
3-3
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Description SEC Code
BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634
ADAPTOR-TAD;TAD137ESE,SGH-P100,-,110 GH44-00482A
UNIT-EARPHONE;SGH-C200,AEP299SLE,-,E GH59-01694A
SPRING ETC-LOCKER;SGH-T108,KSD3509,0 GH61-00028A
LABEL(P)-WATER SOAK;COMM,NORGE,100G, GH68-02026A
MANUAL-SFC LEAFLET;COMM,XEE,ENGLISH, GH68-06655A
MANUAL-SFC CARD;COMM,XEE,ENGLISH,NOW GH68-06656A
MANUAL-WEEE CARD;COMM,SEC,ENGLISH,UN GH68-07013A
LABEL(R)-MAIN(EU);SGH-E330N,CHAN,POL GH68-07492A
MANUAL-USER;SGH-E330N,XEE,SWEDISH,SW GH68-08465A
MANUAL-USER;SGH-E330N,XEE,NORWEGIAN, GH68-08466A
MANUAL-USER;SGH-E330N,XEE,DANISH,DNM GH68-08467A
MANUAL-USER;SGH-E330N,XEE,FINNISH,FI GH68-08468A
CUSHION-CASE;SGH-E630,PULP,T0.8,185, GH69-02409A
BOX(P)-UINIT(EU);SGH-E330N,SC300+S12 GH69-03103A
PMO-BATT LOKER;SGH-E330N,PC,SIL,-,-, GH72-19203F
MPR-F/LOWER BOHO VINYL;SGH-S500,3M 4 GH74-05004A
MPR-LOWER FINAL PROTECT;SCH-E510,VIN GH74-08502A
MPR-TAPE WINDOW MAIN;SGH-E330,3M-949 GH74-08864A
MPR-TAPE DOME SHEET;SGH-E330,GOLD FA GH74-10850A
MPR-TAPE WINDOW DUAL;SGH-E335,3M 949 GH74-12787A
MPR-LCD TAPE SHOT;SGH-E335,3M 1352 B GH74-14727A
MPR-LCD TAPE GAP;SGH-E335,DPF-100,32 GH74-14728A
MPR-TAPE LCD BIT;SGH-E335,3M 851,26X GH74-14729A
MPR-TAPE LCD MAIN;SGH-E335,DPF-100 C GH74-14955A
MPR-BOHO VINYL LCD CONN;SGH-E730,#95 GH74-15350A
MPR-GASKET L;SGH-E330N,GASKET SPONGE GH74-16546A
MPR-GASKET R;SGH-E330N,GASKET SPONGE GH74-16547A
MPR-TAPE PBA;SGH-E330N,TPF-100,3.5X4 GH74-16734A
MEC-HAND STRAP;SGH-E620,SEC,-,-,ANTI GH75-03207U

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Exploded Views and Parts List
3-4
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3-3. Test Jig (GH80-01909A)
3-3-1. RF Test Cable
(GH39-00283A) 3-3-2. Test Cable (GH39-00217A) 3-3-3. Serial Cable
3-3-4. Power Supply Cable 3-3-5. DATA CABLE
(GH39-00219A)
C:\Documents and Settings\redjung\바탕 화면\☞ SENST10\수출 SVC 진행사항\SG H-V205(미주)GH68-00000A▶1204\SGH-V205TEST.jpg
3-3-6. TA
(GH44-00482A)

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4. Electrical Parts List
4-1
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE STATUS
BAT30 BATTERY-LI(2ND) 4302-001157 SA
C100 C-CER,CHIP 2203-005482 SA
C101 C-CER,CHIP 2203-005057 SA
C102 C-CER,CHIP 2203-005057 SA
C103 C-CER,CHIP 2203-005482 SA
C104 C-CER,CHIP 2203-000995 SA
C105 C-CER,CHIP 2203-005138 SA
C106 C-CER,CHIP 2203-000359 SA
C107 C-CER,CHIP 2203-000836 SA
C108 C-CER,CHIP 2203-005482 SA
C109 C-CER,CHIP 2203-000812 SA
C110 C-CER,CHIP 2203-001101 SA
C111 C-CER,CHIP 2203-000854 SA
C112 C-CER,CHIP 2203-000812 SA
C113 C-CER,CHIP 2203-005057 SA
C114 C-CER,CHIP 2203-005482 SA
C115 C-CER,CHIP 2203-000812 SA
C116 C-CER,CHIP 2203-000854 SA
C117 C-CER,CHIP 2203-000812 SA
C118 C-CER,CHIP 2203-005496 SA
C119 C-CER,CHIP 2203-000438 SA
C120 C-CER,CHIP 2203-000438 SA
C121 C-CER,CHIP 2203-000278 SA
C122 C-CER,CHIP 2203-005496 SA
C123 C-CER,CHIP 2203-000233 SA
C124 C-CER,CHIP 2203-000278 SA
C125 C-CER,CHIP 2203-006053 SA
C126 C-CER,CHIP 2203-000254 SA
C127 C-CER,CHIP 2203-005482 SA
C128 C-CER,CHIP 2203-005057 SA
C129 C-CER,CHIP 2203-005057 SA
C130 C-CER,CHIP 2203-005482 SA
C131 C-CER,CHIP 2203-000233 SA
C132 C-CER,CHIP 2203-001153 SA
C133 C-CER,CHIP 2203-000604 SA
C134 C-CER,CHIP 2203-000854 SA
C135 C-CER,CHIP 2203-000278 SA
C136 C-CER,CHIP 2203-000585 SA
C137 C-CER,CHIP 2203-000585 SA
C138 C-CER,CHIP 2203-000585 SA
C139 C-CER,CHIP 2203-000585 SA
C141 C-TA,CHIP 2404-001239 SA
C142 C-CER,CHIP 2203-000254 SA
C144 C-CER,CHIP 2203-000812 SA
C145 C-CER,CHIP 2203-000233 SA
C146 C-CER,CHIP 2203-000233 SA
C147 C-CER,CHIP 2203-001383 SA
C148 C-CER,CHIP 2203-000311 SA
C149 C-CER,CHIP 2203-000585 SA
C150 C-CER,CHIP 2203-002443 SA

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Electrical Parts List
4-2
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Design LOC Description SEC CODE STATUS
C151 C-CER,CHIP 2203-005053 SA
C152 C-CER,CHIP 2203-000438 SA
C153 C-CER,CHIP 2203-001153 SA
C155 C-CER,CHIP 2203-000438 SA
C156 C-CER,CHIP 2203-000438 SA
C200 C-CER,CHIP 2203-005061 SA
C202 C-CER,CHIP 2203-005482 SA
C203 C-CER,CHIP 2203-005061 SA
C204 C-CER,CHIP 2203-000679 SA
C205 C-CER,CHIP 2203-000995 SA
C206 C-CER,CHIP 2203-000254 SA
C207 C-CER,CHIP 2203-005482 SA
C208 C-CER,CHIP 2203-000254 SA
C209 C-CER,CHIP 2203-000643 SA
C210 C-CER,CHIP 2203-005482 SA
C211 C-CER,CHIP 2203-005482 SA
C212 C-CER,CHIP 2203-005482 SA
C214 C-CER,CHIP 2203-006093 SA
C215 C-CER,CHIP 2203-005482 SA
C300 C-CER,CHIP 2203-000233 SA
C301 C-CER,CHIP 2203-000679 SA
C302 C-CER,CHIP 2203-005061 SA
C303 C-CER,CHIP 2203-000438 SA
C304 C-CER,CHIP 2203-005061 SA
C305 C-CER,CHIP 2203-005496 SA
C306 C-CER,CHIP 2203-006208 SA
C307 C-CER,CHIP 2203-005061 SA
C308 C-CER,CHIP 2203-001432 SA
C309 C-CER,CHIP 2203-002687 SA
C310 C-CER,CHIP 2203-005483 SA
C312 C-CER,CHIP 2203-006208 SA
C313 C-CER,CHIP 2203-005061 SA
C314 C-CER,CHIP 2203-000254 SA
C315 C-CER,CHIP 2203-005061 SA
C316 C-CER,CHIP 2203-000330 SA
C317 C-CER,CHIP 2203-005061 SA
C318 C-CER,CHIP 2203-000330 SA
C319 C-CER,CHIP 2203-006053 SA
C320 C-CER,CHIP 2203-000254 SA
C321 C-CER,CHIP 2203-005061 SA
C322 C-CER,CHIP 2203-006053 SA
C400 C-CER,CHIP 2203-005482 SA
C402 C-CER,CHIP 2203-006208 SA
C403 C-CER,CHIP 2203-005482 SA
C406 C-CER,CHIP 2203-000254 SA
C407 C-CER,CHIP 2203-000278 SA
C408 C-CER,CHIP 2203-006208 SA
C409 C-TA,CHIP 2404-001225 SA
C411 C-CER,CHIP 2203-000386 SA
C412 C-CER,CHIP 2203-005482 SA

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-3
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE STATUS
C413 C-CER,CHIP 2203-000386 SA
C414 C-CER,CHIP 2203-006257 SA
C415 C-CER,CHIP 2203-006053 SA
C416 C-CER,CHIP 2203-006324 SA
C417 C-CER,CHIP 2203-000888 SA
C418 C-CER,CHIP 2203-006208 SA
C419 C-CER,CHIP 2203-006208 SA
C420 C-CER,CHIP 2203-006208 SA
C421 C-TA,CHIP 2404-001225 SA
C422 C-CER,CHIP 2203-005482 SA
C424 C-TA,CHIP 2404-001225 SA
C425 C-CER,CHIP 2203-001652 SA
C426 C-CER,CHIP 2203-006053 SA
C427 C-TA,CHIP 2404-001225 SA
C428 C-CER,CHIP 2203-006053 SA
C429 C-CER,CHIP 2203-006053 SA
C430 C-CER,CHIP 2203-006053 SA
C431 C-CER,CHIP 2203-006053 SA
C502 C-CER,CHIP 2203-005061 SA
C505 C-CER,CHIP 2203-005061 SA
C506 C-TA,CHIP 2404-001268 SA
C507 C-TA,CHIP 2404-001268 SA
C508 C-CER,CHIP 2203-005061 SA
C600 C-CER,CHIP 2203-000330 SA
C602 C-CER,CHIP 2203-000995 SA
C603 C-CER,CHIP 2203-005061 SA
C604 C-CER,CHIP 2203-005061 SA
C605 C-CER,CHIP 2203-002443 SA
C606 C-CER,CHIP 2203-000854 SA
C608 C-CER,CHIP 2203-000628 SA
C609 C-CER,CHIP 2203-000278 SA
C610 C-CER,CHIP 2203-005061 SA
C611 C-CER,CHIP 2203-000386 SA
C612 C-CER,CHIP 2203-000330 SA
C613 C-CER,CHIP 2203-000278 SA
C614 C-CER,CHIP 2203-000679 SA
C615 C-CER,CHIP 2203-000679 SA
C617 C-CER,CHIP 2203-000854 SA
C619 C-CER,CHIP 2203-005482 SA
C620 C-CER,CHIP 2203-000438 SA
C621 C-CER,CHIP 2203-000438 SA
C622 C-CER,CHIP 2203-005482 SA
C625 C-CER,CHIP 2203-000812 SA
C626 C-TA,CHIP 2404-001352 SA
C627 C-TA,CHIP 2404-001352 SA
C628 C-CER,CHIP 2203-000278 SA
C703 C-CER,CHIP 2203-006257 SA
C704 C-CER,CHIP 2203-001437 SA
CN400 CONNECTOR-CARD EDGE 3709-001273 SA
CN500 CONNECTOR-INTERFACE 3710-001994 SA

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-4
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE STATUS
CN501 HEADER-BATTERY 3711-005783 SA
CN502 CONNECTOR-COAXIAL 3705-001355 SA
EAR60 JACK-EAR PHONE [phone] SA
F100 FILTER-SAW 2904-001469 SA
F101 FILTER-SAW 2904-001537 SA
F102 FILTER-SAW 2904-001540 SA
F103 FILTER-EMI SMD 2901-001254 SA
F700 FILTER-EMI SMD 2901-001286 SA
F701 FILTER-EMI SMD 2901-001286 SA
F702 FILTER-EMI SMD 2901-001286 SA
F703 FILTER-EMI SMD 2901-001286 SA
F704 FILTER-EMI SMD 2901-001286 SA
F705 FILTER-EMI SMD 2901-001286 SA
HDC70 HEADER-BOARD TO BOARD 3711-005551 SA
L100 INDUCTOR-SMD 2703-001728 SA
L101 INDUCTOR-SMD 2703-001613 SA
L102 INDUCTOR-SMD 2703-001728 SA
L103 INDUCTOR-SMD 2703-001722 SA
L104 INDUCTOR-SMD 2703-002267 SA
L105 INDUCTOR-SMD 2703-002199 SA
L106 INDUCTOR-SMD 2703-001748 SA
L107 INDUCTOR-SMD 2703-001722 SA
L109 INDUCTOR-SMD 2703-002204 SA
L110 INDUCTOR-SMD 2703-001723 SA
L111 R-CHIP 2007-000171 SA
L112 INDUCTOR-SMD 2703-001723 SA
L113 INDUCTOR-SMD 2703-001723 SA
L114 INDUCTOR-SMD 2703-002200 SA
L620 BEAD-SMD 3301-001729 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001602 SA
LED70 LED 0601-001790 SA
LED71 LED 0601-001602 SA
LED71 LED 0601-001602 SA
LED71 LED 0601-001790 SA
LED71 LED 0601-001790 SA
LED71 LED 0601-001790 SA
OSC10 OSCILLATOR-VCO 2806-001329 SA
OSC10 OSCILLATOR-VCTCXO 2809-001294 SA
OSC30 CRYSTAL-SMD 2801-004285 SA
Q700 TR-DIGITAL 0506-000107 SA
R100 R-CHIP 2007-007148 SA
R101 R-CHIP 2007-000141 SA
R102 R-CHIP 2007-007528 SA

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-5
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE STATUS
R103 R-CHIP 2007-000566 SA
R104 R-CHIP 2007-003010 SA
R105 R-CHIP 2007-007142 SA
R106 R-CHIP 2007-007311 SA
R107 R-CHIP 2007-001313 SA
R108 R-CHIP 2007-001313 SA
R109 R-CHIP 2007-000566 SA
R110 R-CHIP 2007-000148 SA
R111 R-CHIP 2007-001305 SA
R112 R-CHIP 2007-008117 SA
R113 R-CHIP 2007-001305 SA
R114 R-CHIP 2007-001308 SA
R115 R-CHIP 2007-001305 SA
R116 R-CHIP 2007-000142 SA
R117 R-CHIP 2007-000142 SA
R118 R-CHIP 2007-000775 SA
R119 R-CHIP 2007-000142 SA
R120 R-CHIP 2007-000171 SA
R121 R-CHIP 2007-000142 SA
R123 R-CHIP 2007-000171 SA
R124 R-CHIP 2007-001288 SA
R125 R-CHIP 2007-001313 SA
R126 R-CHIP 2007-001313 SA
R127 R-CHIP 2007-000171 SA
R128 R-CHIP 2007-007314 SA
R129 R-CHIP 2007-000147 SA
R130 R-CHIP 2007-000148 SA
R131 R-CHIP 2007-000148 SA
R132 R-CHIP 2007-000171 SA
R200 R-CHIP 2007-000171 SA
R201 R-CHIP 2007-000162 SA
R202 R-CHIP 2007-007107 SA
R203 R-CHIP 2007-007142 SA
R204 R-CHIP 2007-007107 SA
R205 R-CHIP 2007-007142 SA
R206 R-CHIP 2007-000162 SA
R207 R-CHIP 2007-000162 SA
R208 R-CHIP 2007-007001 SA
R209 R-CHIP 2007-000141 SA
R210 R-CHIP 2007-000141 SA
R211 R-CHIP 2007-000162 SA
R212 R-CHIP 2007-000172 SA
R213 R-CHIP 2007-000172 SA
R300 R-CHIP 2007-007014 SA
R301 R-CHIP 2007-001313 SA
R302 R-CHIP 2007-007014 SA
R303 R-CHIP 2007-001325 SA
R304 R-CHIP 2007-000153 SA
R305 R-CHIP 2007-000171 SA
R306 R-CHIP 2007-001319 SA

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-6
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE STATUS
R307 R-CHIP 2007-007013 SA
R308 R-CHIP 2007-007001 SA
R310 R-CHIP 2007-000162 SA
R311 R-CHIP 2007-000162 SA
R312 R-CHIP 2007-000162 SA
R313 R-CHIP 2007-000162 SA
R314 R-CHIP 2007-000162 SA
R315 R-CHIP 2007-000162 SA
R317 R-CHIP 2007-000143 SA
R318 R-CHIP 2007-007100 SA
R400 R-CHIP 2007-000148 SA
R401 R-CHIP 2007-007100 SA
R402 R-CHIP 2007-001325 SA
R403 R-CHIP 2007-000171 SA
R500 R-CHIP 2007-000162 SA
R501 R-CHIP 2007-000162 SA
R507 R-CHIP 2007-007573 SA
R508 R-CHIP 2007-000162 SA
R509 R-CHIP 2007-007334 SA
R511 R-CHIP 2007-007317 SA
R512 R-CHIP 2007-007588 SA
R600 R-CHIP 2007-000162 SA
R601 R-CHIP 2007-000140 SA
R603 R-CHIP 2007-000148 SA
R605 R-CHIP 2007-000242 SA
R607 R-CHIP 2007-000148 SA
R608 R-CHIP 2007-007334 SA
R610 R-CHIP 2007-007334 SA
R611 R-CHIP 2007-002796 SA
R612 R-CHIP 2007-000171 SA
R613 R-CHIP 2007-000171 SA
R614 R-CHIP 2007-007981 SA
R615 R-CHIP 2007-007489 SA
R700 R-CHIP 2007-000143 SA
R701 R-CHIP 2007-000143 SA
R703 R-CHIP 2007-000174 SA
R704 R-CHIP 2007-000174 SA
R705 R-CHIP 2007-000174 SA
R706 R-CHIP 2007-000174 SA
R707 R-CHIP 2007-000174 SA
R708 R-CHIP 2007-000174 SA
R709 R-CHIP 2007-000174 SA
R710 R-CHIP 2007-000174 SA
R711 R-CHIP 2007-000174 SA
R712 R-CHIP 2007-000174 SA
R713 R-CHIP 2007-000174 SA
R714 R-CHIP 2007-000174 SA
R715 R-CHIP 2007-000174 SA
R716 R-CHIP 2007-000174 SA
R719 R-CHIP 2007-008672 SA