Samsung SGH-X100 User manual

SGH-X100
SERVICE
Manual
GSMTELEPHONECONTENTS
1.Specification
2.CircuitDescription
3.ExplodedViewsand PartsList
4.ElectricalPartsList
5.BlockDiagrams
6.PCB Diagrams
7.FlowChartofTroubleshooting
GSMTELEPHONE

ELECTRONICS
Samsung ElectronicsCo.,Ltd.June.2003
Printedin Korea.
CodeNo.:GH68-04326A
BASIC.
ⓒ
ThisServiceManual isa propertyofSamsung ElectronicsCo.,Ltd.
Anyunauthorized use ofManualcan bepunished underapplicable
Internationaland/ordomesticlaw.

SAMSUNG Proprietary-Contents may change without notice
1. SGH-X100 Specification
ThisDocumentcan notbe used withoutSamsung'sauthorization
1-1
GSM900
Phase1EGSM900 Phase2DCS1800 Phase1
Freq.Band[MHz]
Uplink/Downlink 890~915 935~960 880~915 925~960 1710~1785 1805~1880
ARFCNrange1~124 0~124 &975~1023 512~885
Tx/Rxspacing 45MHz45MHz95MHz
Mod.Bit rate/
Bit Period 270.833kbps 3.692us270.833kbps 3.692us270.833kbps 3.692us
TimeSlotPeriod/Frame
Period 576.9us 4.615ms576.9us 4.615ms576.9us 4.615ms
Modulation 0.3GMSK0.3GMSK0.3GMSK
MS Power33dBm~13dBm33dBm~5dBm30dBm~0dBm
PowerClass 5pcl~15pcl5pcl~19pcl0pcl~15pcl
Sensitivity-102dBm-102dBm-100dBm
TDMAMux 8 8 8
Cell Radius35Km35Km2Km
1. GSMGeneralSpecification

SAMSUNG Proprietary-Contents may change without notice
SGH-V200 Specification
1-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
TXPower
control levelGSM900
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
TXPower
control levelDCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2. GSMTXpower class

SAMSUNG Proprietary-Contents may change without notice
2. SGH-X100 Circuit Description
2-1
ThisDocumentcan notbe used withoutSamsung'sauthorization
1.SGH-X100 RFCircuit Description
1)RXPART
1.ASM(U100)→Switching Tx,Rx pathforGSM900,DCS1800 by logic controlling.
2.ASMControlLogic(U104,U106)→TruthTable
VC1VC2
GSMTxModeHL
DCSTxModeLH
GSMRxModeL L
DCSRxModeL L
3.FILTER
ToconvertElectromagneticFieldWavetoAcousticWave and then pass thespecificfrequency band.
-GSMFILTER(F101)→For filtering thefrequency band between 925 ~960 MHz
-DCS FILTER(F102)→For filtering thefrequency band 1805 and 1880 MHz.
4.VC-TCXO (OSC101)
To generatethe26MHzreference clockto drivethelogic and RF.Afteradditionalprocess,thereference clockappliesto
theU103 RxIQdemodulatorand TxIQmodulator.Theoscillator forRXIQdemodulatorand Txmodulatorare
controlled by serialdatatoselectchanneland usefast lockmodeforGPRShigh class operation.
5.Transceiver (U103)
Thereceiver front-end convertsthe aerialRFsignalfromEGSM,DCSbandsdowntoalowintermediatefrequency(IF)
of100 kHz.Thefirststagesaresymmetrical lownoise amplifiers(LNAs).Theyarematchedto 50 ohm.TheLNAsare
followed by anI,Qdown-mixer.Itconsistsoftwomixersin parallelbutdriven by quadratureoutofphaseLOsignals.
TheIn phase(I) and Quadraturephase(Q) IFsignalsarelowpass filteredto provideprotection fromhigh frequency
offset interferes.ThelowIFIand Qsignalsarethenfedintothe channelfilter.Thefront-end lowIFIand Qoutputs
entertheintegrated bandpass channelfilterwith provision for five8 dBgainstepsinfrontofthefilter.
2)TXPART
Baseband IQsignalfedinto offsetPLL,thisfunction isincludedinsideofU103 chip.OSC100 chip generatesmodulator
signalwhich powerlevel isabout6.5dBmand fedintoPowerAmplifier(U101).ThePAoutputpowerand power ramping
arewell controlled by AutoPowerControlcircuit.WeuseoffsetPLL below
Modulation Spectrum
200kHzoffset
30 kHzbandwidth
GSM-35dBc
DCS-35dBc
400kHzoffset
30 kHzbandwidth
GSM-66dBc
DCS-65dBc
600kHz~1.8MHzoffset
30 kHzbandwidth
GSM-75dBc
DCS-68dBc

SAMSUNG Proprietary-Contents may change without notice
2-2
SGH-X100 CircuitDescription
ThisDocumentcan notbe used withoutSamsung'sauthorization
2. Baseband CircuitdescriptionofSGH-X100
1)PCF50601
1.1PowerManagement
Tenlow-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimalsystem
performance and long batterylife.Aprogrammableboostconverterprovides supportfor1.8V,3.0V,and 5.0VSIMs,while
self-resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,suchasRTC
module and High VoltageChargepump,Clock generator,aidinreducing both boardarea and systemcomplexity.
I2C BUSserial interface providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor full
controlofthePCF50601 and enables systemdesignerstomaximize bothstandby and talktimes.Supervisoryfunctions.
including aresetgenerator,aninputvoltagemonitor,and atemperaturesensor,supportreliablesystemdesign.These
functionsworktogethertoensurepropersystembehaviorduring start-up orinthe eventofafault condition(low
microprocessorvoltage,insufficientbatteryenergy,orexcessivedietemperature).
1.2.BacklightBrightness Modulator
TheBacklightBrightness Modulator (BBM)containsaprogrammablePulse-widthmodulator (PWM)and FET tomodulate
theintensity ofaseriesofLEDortocontrolaDC/DCconverterthatdrivesLCDbacklight.Thisphone(SGH-X100)is
notusePWM,butuseDC CONTROL(BACKLIGHT).So"BACKLIGHT"voltageishigh value,backlight isbright.
1.3.ClockGenerator
TheClockGenerator (CG)generatesall clocksforinternaland externalusage.The32768 Hz crystaloscillatorprovidesan
accuratelowclockfrequencyforthePCF50601 and othercircuitry.
2)Connector
2-1.LCDConnector
LCDisconsisted ofmainLCD(color65KSTNLCD).ChipselectsignalsintheU304,LCD_CScanenableLCD.
LCD_CSsignal isLCDselectsignal.This signal isfromENABLE partofOM6357.
"RESET_2V8"signal initiatestheResetprocess oftheLCD.
16-bit datalines(HD(0)~HD(15)) transfersdata and commandstoLCDthrough by pass capacitor.Data and commandsuse
"RS"signal.If this signal ishigh,InputstoLCDare commands.If it islow,InputstoLCDaredata.Thesignalwhich
informstheinputoroutputstatetoLCD,isrequired.But this systemisnotnecessarythis signal.So"L_WR"signal is
usedtowritedataorcommandstoLCD.Powersignali forLCDis"VDD3".
2-2.Key
Thisisconsisted ofkeyinterface pinsamong OM6357,KBIO(0:7).Thesesignalscomposethematrix.Result ofmatrix
informsthekeystatusto keyinterface intheOM6357.Poweron/off keyis seperatedfromthematrix.So poweron/off
signal isconnectedwithPCF50601 toenablePCF50601.Ten keyLEDsusethe"VDD_KEY"supply voltage.
"VDD_KEY"signalenablesLEDswithcurrentcontrol.

SAMSUNG Proprietary-Contents may change without notice
2. SGH-X100 Circuit Description
2-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
2-3.EMIESDFilter
This systemusestheEMIESDfilter,EMIF09 to protectnoisefromIFCONNECTORpart.
2-4.IFconnetor
It is18-pinconnector.Theyaredesignedto useVBAT,V_EXT_CHARGE,TXD0,RXD0,RTS0,CTS0,JIG_REC,
CHARGER_OK,RXD1,TXD1,AUX_MIC,AUX_SPKand GND.Theyconnectedto powersupplyIC,microprocessorand
signalprocessor IC.
3)BatteryChargeManagement
a complete constant-current/constant-voltagelinearcharger forsingle cell lithium-ion batteries.If ta connectedto phone,
"V_EXT_CHARGE"enable charger ICand supplycurrent to battery.whenfault condition caused,"CHG_ON"signal level
changelowto high and charger ICstop charging process.
4)Audio
REC_Pand REC_NfromOM6357 are connectedtothemainreceiver.AUXSP isconnectedtotheHandsfree kit.
MIC_Pand MIC_Nare connectedtothemainMIC.And AUX_MIC_Pand AUX_MIC_Nare connectedtotheHands
free kit.
YMU762MA3isaLSI forportabletelephonethat iscapableofplaying high qualitymusicby utilizing FMsynthesizer
and ADPCMdecorderthatareincludedinthisdevice.Asasynthesis,YMU762MA3isequipped 32 voiceswith different
tones.Since thedevice iscapableofsimultaneously generating up tosynchronouswiththeplay oftheFMsynthesizer,
various sampled voicescan beusedas sound effects.Since theplay dataofYMU762MA3areinterpretedatanytime
through FIFO,thelength ofthedata(playing period)isnot limited,sothedevice canflexiblysupportapplication suchas
incoming call melody musicdistribution service.Thehardwaresequencerbuilt inthisdevice allowsplaying ofthe
complexmusicwithoutgiving excessiveloadtotheCPUoftheportabletelephones.Moreover,theregistersoftheFM
synthesizercan beoperated directlyfor real timesound generation,allowing,forexample,utilization ofvarious sound
effectswhen using thegamesoftwareinstalledintheportabletelephone.YMU762 includesaspeakeramplifierwith high
rippleremovalratewhosemaximumoutput is550mW(SPVDD=3.6V).Thedevice isalsoequippedwithconventional
function including avibartorand a circuit forcontrolling LEDs synchornouswithmusic.Fortheheadphone,it isprovided
withastereophonicoutput terminal.Forthepurposeofenabling YMU762MA3to demonstrateitsfull capablities,Yamaha
purposeto use"SMAF:SyntheticmusicMobileApplication Format"asadatadistribution format that iscompatiblewith
multimedia.Since theSMAFtakesastructurethatsetsimportance on thesynchronization betweensound and images,
variouscontentscan bewrittenintoit including incoming call melody withwordsthatcan beusedfortraning karaoke,
and commercialchannel thatcombinestexts,imagesand sounds,and others.ThehardwaresequencerofYMU762MA3
directlyinterpretsand playsblocksrelevant tosysthesis(playing music and reproducing ADPCMwithFMsynthesizer) that
areincludedin datadistributedinSMAF.

SAMSUNG Proprietary-Contents may change without notice
2-4
SGH-X100 CircuitDescription
ThisDocumentcan notbe used withoutSamsung'sauthorization
5)Memory
SignalsintheOM6357 enabletwomemories.They useonly onevolt supply voltage,VDD3inthePCF50601.This
systemusesSamsung'smemory,KBB06A300M-T402.It isconsisted of128MbitsflashNORmemoryand 128Mbits
flashNAND memoryand 32MbitsUtRAM.Ithas16 bit dataline,HD[0~15]whichisconnectedtoOM6357.Ithas23
it address lines,HA[1~23].CS_NAND and NCSRAMsignalsischipselect.Wrting process,HWR_Nislowand it
enableswriting process toflashmemoryand SRAM.During reading process,HRD_Nislowand it enablesreading
process toflashmemoryand SRAM.EachchipselectsignalsintheOM6357 selectmemoryamong 2 flashmemoryand
UtRAM.Reading orwriting procedureisprocessedafterHWR_NorHRD_Nisenabled.Memoriesusereset,whichis
VDD3 delayfromPCF50601.HA[22]signalenableslowerbyteofSRAMand HA[22]signalenableshigherbyteof
SRAM.
6)OM6357
OM6357 isconsisted ofARMcore and DSP core.Ithas8x1Kword on-chip program/dataRAM,55 Kwordson-chip
programROMintheDSP.Ithas4K*32bitsROMand 2K*32bitsRAMintheARMcore.DSP isconsisted ofKBS,
JTAG,EMIand UART.ARMcoreisconsisted ofEMI,PIC(ProgrammableInterruptController),reset/power/clock unit,
DMAcontroller,TIC(TestInterface Controller),eripheralbridge,PPI,SSI(SynchronousSerialInterface),ACC(Asynchronous
communicationscontrollers),timer,ADC,RTC(Real-TimeClock)and keyboardinterface.
KBIO(0:7),address linesofDSP core and HD[0~15].HA[1~23],address linesofARMcore and HD[0~15],datalinesof
ARMcore are connectedtomemory,YMU759.
CS_NAND,NCSRAM,NCSFLASHintheARMcore are connectedtoeachmemory.HWR_Nand HRD_Ncontrol the
process ofmemory.ExternalIRQ(InterruptReQuest)signalsfromeach units,suchas,PMUneedthe compatibleprocess.
KBIO[0~7] receivethestatusfromkeyand RXD0/TXD fordatalink cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
Ithas JTAG controlpins(TDI/TDO/TCK) forARMcore and DSP core.Itrecieves13MHz clockinCKIpinfrom
externalTCXO.ADC(Analog toDigitalConvertor) partreceivesthestatusoftemperature,batterytype and battery voltage.
7)TCO-9141G(26MHz)
This systemusesthe26MHzTCXO,TCO-9141G,Toyocom.AFCcontrolsignalformOM6357 controlsfrequencyfrom
13MHzx-tal.Itgeneratesthe clockfrequency.ThisclockisconnectedtoUAA3536.

SAMSUNG Proprietary-Contents may change without notice
3. SGH-X100 ExplodedViewand its Partslist
ThisDocumentcan notbe used withoutSamsung'sauthorization
3-1
1.CellularphoneExplodedView
1
2
3
5
6
4
9
10
11
7
8
13
12
14 15
16

SAMSUNG Proprietary-Contents may change without notice
SGH- X100 Explodedviewand its Partlist
ThisDocumentcan notbe used withoutSamsung'sauthorization
3-2
2.CellularphonePartslist
NODESCRIPTIONSEC CODEREMARK
1 FRONT COVER GH75-03497A
2 KEYPAD GH75-03518A
3MOTOR GH31-00064A
4 DOME SHEET GH59-00929A
5 MIC GH30-00044A
6 IF COVER GH73-02203A
7 MICRO SPEAKER 3001-001445
8 VOLKEY GH75-03728A
9 LCD GH07-00394A
10 MAIN PBA GH92-01558A
11 SCREW 6001-001654
12 INTENNA GH42-00308A
13 REAR COVER GH75-03496A
14 RF COVER GH72-09251A
15 SCREW 6001-001654
16 BATTERY GH43-00994A

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 Explodedviewand its Partlist
ThisDocumentcan notbe used withoutSamsung'sauthorization
3-3
3.TestJig(GH80-01909A)
3-1.RFTestCable
(GH39-00140A)3-2.TestCable (GH39-00217A)3-3.SerialCable
3-4.PowerSupplyCable3-5.DATACABLE
(GH39-00219A)3-6.TA (GH44-00482G)

SAMSUNG Proprietary-Contents may change without notice
4. SGH-X100 MAIN ElectricalParts List
ThisDocumentcan notbe used withoutSamsung'sauthorization
4-1
SEC CODEDesignLOC
0403-001427 ZD601
0403-001446 ZD600
0404-001089 D600
0406-001104 Q400
0504-001012 Q400
0504-001012 Q401
0504-001042 U104
0504-001042 U106
0504-001134 Q301
0505-001332 Q302
0505-001423 U410
0506-000107 U405
0601-001402 RI401
0601-001611 LED402
0601-001611 LED405
0601-001611 LED408
0601-001611 LED409
0601-001647 LED401
0601-001647 LED403
0601-001647 LED404
0601-001647 LED406
0601-001647 LED407
0601-001647 LED410
0801-002237 U300
0801-002540 U210
0801-002540 U303
0801-002540 U304
1001-001183 U212
1003-001440 Q403
1109-001280 U305
SEC CODEDesignLOC
1201-001954 U101
1202-001036 U203
1203-002633 U307
1203-002980 U309
1204-002161 U301
1205-002257 U400
1205-002276 U200
1205-002327 U103
1404-001221 TH200
2909-001204 U100
1405-001082 V202
1405-001082 V204
1405-001082 V205
1405-001082 V207
1405-001082 V211
1405-001082 V212
1405-001082 V400
1405-001082 V402
1405-001082 V403
1405-001082 V404
1405-001121 V405
1405-001121 V407
1405-001121 V506
2007-000137 R434
2007-000138 R132
2007-000140 R123
2007-000140 R124
2007-000140 R305
2007-000140 R324
2007-000141 R105

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 ElectricalPartsList
4-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODEDesignLOC
2007-000141 R225
2007-000141 R226
2007-000143 R135
2007-000143 R136
2007-000143 R137
2007-000143 R138
2007-000143 R362
2007-000144 R115
2007-000147 R116
2007-000148 R126
2007-000148 R202
2007-000148 R204
2007-000148 R205
2007-000148 R210
2007-000148 R227
2007-000148 U732
2007-000157 R321
2007-000162 R102
2007-000162 R103
2007-000162 R203
2007-000162 R211
2007-000162 R212
2007-000162 R229
2007-000162 R234
2007-000162 R270
2007-000162 R300
2007-000162 R302
2007-000162 R303
2007-000162 R304
2007-000162 R306
SEC CODEDesignLOC
2007-000162 R350
2007-000162 R360
2007-000162 R361
2007-000162 R436
2007-000171 R100
2007-000171 R107
2007-000171 R109
2007-000171 R139
2007-000171 R213
2007-000171 R214
2007-000171 R228
2007-000171 R307
2007-000172 R120
2007-000172 R131
2007-000174 R129
2007-000242 R200
2007-000242 R206
2007-000566 R125
2007-000566 R127
2007-000636 R432
2007-000636 R433
2007-001217 R425
2007-001288 R108
2007-001288 R112
2007-001301 R401
2007-001301 R404
2007-001301 R407
2007-001301 R408
2007-001305 R118
2007-001305 R122

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 ElectricalPartsList
4-3
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODEDesignLOC
2007-001305 R230
2007-001305 R231
2007-001308 R110
2007-001308 R111
2007-001308 R113
2007-001308 R114
2007-001313 U735
2007-001325 U734
2007-001339 R430
2007-001339 R431
2007-003025 R328
2007-007001 R218
2007-007001 R219
2007-007008 R426
2007-007009 R400
2007-007009 R402
2007-007009 R403
2007-007009 R405
2007-007009 R406
2007-007009 R409
2007-007100 R415
2007-007107 R201
2007-007107 R209
2007-007136 R311
2007-007137 R310
2007-007137 R313
2007-007148 R104
2007-007311 R128
2007-007334 R215
2007-007480 R220
SEC CODEDesignLOC
2007-007573 R428
2007-007588 R429
2007-007981 R224
2007-008312 R221
2007-008354 R427
2203-000233 C119
2203-000233 C120
2203-000233 C144
2203-000254 C145
2203-000254 C209
2203-000254 C301
2203-000254 C408
2203-000254 U726
2203-000278 C102
2203-000278 C104
2203-000278 C136
2203-000278 C140
2203-000278 C223
2203-000278 C234
2203-000278 C404
2203-000330 C409
2203-000330 C413
2203-000359 C124
2203-000359 C314
2203-000386 C210
2203-000386 C211
2203-000386 C229
2203-000438 C142
2203-000438 C236
2203-000438 C237

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 ElectricalPartsList
4-4
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODEDesignLOC
2203-000438 C304
2203-000438 C310
2203-000440 C127
2203-000550 C147
2203-000585 C137
2203-000609 C148
2203-000679 C224
2203-000679 C233
2203-000679 C307
2203-000679 C308
2203-000679 C450
2203-000679 U736
2203-000812 C118
2203-000812 C213
2203-000812 C219
2203-000812 C230
2203-000854 C108
2203-000854 C110
2203-000854 C114
2203-000940 C139
2203-000995 C203
2203-000995 C215
2203-000995 C225
2203-000995 C226
2203-000995 C227
2203-000995 C228
2203-000995 C471
2203-001153 C146
2203-001652 C411
2203-001652 C423
SEC CODEDesignLOC
2203-002443 C135
2203-003054 C220
2203-003054 C231
2203-005054 C201
2203-005054 C217
2203-005056 C222
2203-005057 C112
2203-005057 C115
2203-005057 C122
2203-005057 C134
2203-005057 C150
2203-005057 C156
2203-005061 C113
2203-005061 C116
2203-005061 C121
2203-005061 C133
2203-005061 C149
2203-005061 C155
2203-005061 C204
2203-005061 C205
2203-005061 C206
2203-005061 C207
2203-005061 C208
2203-005061 C212
2203-005061 C221
2203-005061 C242
2203-005061 C243
2203-005061 C244
2203-005061 C245
2203-005061 C246

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 ElectricalPartsList
4-5
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODEDesignLOC
2203-005061 C247
2203-005061 C248
2203-005061 C249
2203-005061 C250
2203-005061 C251
2203-005061 C305
2203-005061 C311
2203-005061 C316
2203-005061 C400
2203-005061 C402
2203-005061 C403
2203-005065 C416
2203-005065 C421
2203-005065 C425
2203-005138 C123
2203-005444 C303
2203-005481 C130
2203-005482 C235
2203-005482 C238
2203-005482 C306
2203-005482 C309
2203-005482 C313
2203-005482 C410
2203-005482 C420
2203-005482 C470
2203-005482 C472
2203-005496 C141
2203-005496 C315
2203-005503 C138
2203-005503 C151
SEC CODEDesignLOC
2203-005503 C152
2203-005503 C153
2203-005503 C154
2203-005840 C350
2203-006053 C126
2203-006053 C412
2203-006053 C424
2203-006053 C426
2203-006053 C427
2203-006053 C428
2203-006053 C429
2203-006053 C476
2203-006090 C418
2203-006090 C419
2203-006105 C312
2203-006105 C401
2203-006105 C407
2203-006105 C415
2203-006105 C422
2203-006201 C414
2203-006201 C417
2301-001197 C125
2301-001213 C128
2404-001020 C132
2404-001086 C319
2404-001101 C318
2404-001225 C406
2404-001239 C129
2404-001239 C131
2503-001053 CA401

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 ElectricalPartsList
4-6
ThisDocumentcan notbe used withoutSamsung'sauthorization
SEC CODEDesignLOC
2503-001053 CA402
2503-001053 CA403
2503-001053 CA404
2703-000172 L300
2703-001709 L114
2703-001751 L110
2703-001751 L115
2703-001751 L121
2703-001791 L106
2703-002198 L117
2703-002201 L109
2703-002201 L111
2703-002203 L108
2703-002208 L105
2703-002208 L107
2703-002268 L116
2703-002519 L119
2801-004025 X400
2806-001317 OSC100
2809-001279 OSC101
2901-001246 U302
2901-001254 L120
2904-001417 F101
2904-001424 F102
3301-001105 L400
3404-001152 SW1
3404-001152 SW2
3705-001322 CN100
3709-001244 CN400
3710-001611 CN301
SEC CODEDesignLOC
3710-001853 BAT301
3711-004988 SPK201
3722-001715 EAR201
4302-001130 BAT401

SAMSUNG Proprietary-Contents may change without notice
5-1
5. SGH-X100 BlockDiagrams
ThisDocumentcan notbe used withoutSamsung'sauthorization
1.RFSolutionBlockDiagram
100 kHz+fmod
REFIN VTCXO
GSM
DCS/PCS
I+
fmod
I-
Q+
Q-
~
~
VAPC
EPCOS EGSM RX SAW Filter
B7820 (2.0X1.4)
IL=1.9dB typ 2.7dB max
Ripple=0.8dB typ 1.4dB max
Vcc_RF_VCO
Discrete
3
rd
Order
Loop Filter
fc = ? kHz
?㉥???TX VCO
VOU1810F27KRA (8.0X6.0X1.6)
GSM = 880 ~ 915MHz
(Vt=0.5V ~ 3.0V )
kV = 55+-11 MHz/V Typ
DCS = 1710 ~ 1785MHz
(Vt=0.5V ~ 3.0V )
kV = 115+-23 MHz/V Typ
Pout= 6.5+-3 dBm typ.,Ic <= 30mA
Harmonics <= -10dBc
Micro Devices Quadband PAM
RF3140 (10 X10)
GSM: Pout = 35.0 dBm Eff = 60%
DCS: Pout= 33.0 dBm Eff = 55%
RXON
Vcc_Tx_BURST
VBAT
HITACHI METAL ANT S/W
SHS-M090TC
Imax = 10 mA
Freq (MHz)Loss
880 - 915 1.1 dB
925 - 960 0.8 dB
1710 -1785 1.3 dB
1805 -1880 1.15 dB
Atten 2xfo : 39dB,30dB(GSM,DCS)
3xfo : 35dB,20dB(GSM,DCS)
EN
CLK
DATA
DCS S/W
OFFSET Mixer input power
-16dBm max, -22dBm min
f compRF =26MHz
Philips Transceiver
UAA3536
Pins IA,IB,QA and QB
V IQ : 1.25V typ . , 1.15V min , 1.35V max
V mod : 0.5V pp
QUAD
DIV
PFD
CP
VREG
~
Vcc_RF_LO
FracN
DIV
1:1/
2
VREG
26MHz
Vcc_REF(2.4V typ.)
Vcc_SYN
FESW1
FESW2
3
W
BUS
CTL
REG
PW
R
EN
GSM/DCS/PCS
DIV
QUAD
PFD
CP
f TXIF
60/114MHz
+I OUT
-
-
+
FESWON
SYNON
TXON
GSM S/W
PMU
HVS
VDD1 (1.35V min 2.95V max , 150mA )
VBat (3.6V typ 3.0V min)
V_MODE
RF1_VDD
RF2_VDD
RF1_VDDS
RF2_VDDS
VDD2 (1.35V min 3.45V max , 150mA )
VDD3 (1.35V min 3.45V max , 100mA )
VDD4 (1.35V min 3.45V max , 150mA )
AVDD (1.35V min 2.65V max , 100mA )
VCC_RX_TX (2.7V ,100mA )
VCC_SYN (2.7V , 100mA )
VCC_RF_VCO (2.70V , 100mA )
VCC_CP (4.0V , 25mA )
VCC_TX_BURST (2.7V , 100mA )
PON_SYNT
PON_TX
SAWTEK DCS RX SAW Filter
856079 (2.5X2)
IL=2.8dB typ 3.5dB max
Ripple=0.8dB typ 1.8dB max
EGSM_MODE_SW
VCC_RX_TX
Vc_EGSM
DCS_MODE_SW
Vc_DCS
Inverter circuits
I OUT
Q OUT
Q OUT

SAMSUNG Proprietary-Contents may change without notice
SGH-X100 BlockDiagrams
5-2
ThisDocumentcan notbe used withoutSamsung'sauthorization
2.Base Band SolutionBlockDiagram

SAMSUNG Proprietary-Contents may change without notice
6-1
6. SGH-X100 PCB Diagrams
ThisDocumentcan notbe used withoutSamsung'sauthorization
1.MainPCB TopDiagram