Samsung SGH-Z140 User manual

SGH-Z140
UMTS TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
UMTS TELEPHONE

Samsung Electronics Co.,Ltd. September. 2005
Printed in Korea.
Code No.: GH68-08261A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ

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1. Specification
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1-1
EGSM900 DCS1800 PCS1900 W-CDMA
Freq.
Band[MHz]
Uplink/Downlink
890~915
935~960 1710~1785 1805~1880 1850~1910 1930~1990 1920~1980 2110~2170
ARFCN range 0~124 &
975~1023 512~885 512~810 UL:9612~9888 DL:10562~10838
Tx/Rx spacing 45MHz 95MHz 80MHz 190MHz
Mod. Bit rate/
Bit Period 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us 3.84Mcps
Time Slot
Period/Frame
Period
576.9us
4.615ms 576.9us 4.615ms 576.9us 4.615ms Frame length : 10ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK QPSK
HQPSK
MS Power 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm 24dBm ~ - 50dBm
Power Class 4
(max +33dBm) 1 (max +30dBm) 1 (max +30dBm) 3 (max +24dBm)
Sensitivity -102dBm -100dBm -100dBm -106.7dBm
TDMA Mux 8 8 8
Cell Radius 35Km 2Km 2Km 2Km
1-1. GSM General Specification

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Specification
1-2
TX Power
control level GSM900
533±2dBm
631±2dBm
729±2dBm
827±2dBm
925±2dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
030±3dBm
128±3dBm
226±3dBm
324±3dBm
422±3dBm
520±3dBm
618±3dBm
716±3dBm
814±3dBm
912±4dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level PCS1800
030±3dBm
128±3dBm
226±3dBm
324±3dBm
422±3dBm
520±3dBm
618±3dBm
716±3dBm
814±3dBm
912±4dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2. GSM TX power class

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2. Circuit Description
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2-1
2-1. SGH-Z140 RF Circuit Description
- Antenna Switch Module (U103)
The antenna switch module allows multiple operating bands and modes to share the same antenna. A common
antenna connects to one of seven paths: 1) UMTS-2100 Rx/Tx, 2) EGSM-900 Rx, 3) EGSM-900 Tx, 4) DCS-1800
Rx, and 5) DCS-1800 Tx. 6) PCS-1900 Tx, 7) PCS-1900 Rx, UMTS operation requires simultaneous reception and
transmission.
- Filter
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
· GSM Rx FILTER (F100) →For filtering the frequency band between 925 ~ 960 MHz.
· DCS Rx FILTER (F101) →For filtering the frequency band 1805 and 1880 MHz.
· PCS Rx FILTER (F102) →For filtering the frequency band 1930 and 1990 MHz.
· WCDMA Rx FILTER (F200) →For filtering the frequency band 2110 and 2170 MHz.
· WCDMA Tx FILTER (F201) →For filtering the frequency band 1920 and 1980 MHz.
- VCTCXO (OSC200)
To generate the 19.2MHz reference clock to drive the logic and RF.
-Duplexer(F203)
A duplexer splits a single operating band into receive and transmit paths.
- WCDMA PAM (U201)
This is a key component in the transmitter chain and must complement the RTR6200 IC precisely; jointly they
dominate the UMTS transmitter performance characteristics. Parameters such as gain, output power level, ACLR,
harmonics, Rx-band noise, and power supply current are critical.
- GSM/DCS PAM (U102)
The PAM is a key component in any transmitter chain and must complement the rest of the transmitter precisely.
For GSM, DCS, PCS operation, the closed-loop transmit power control functions add even more requirements relative
to the UMTS PA. In addition to gain control and switching requirements, the usual RF parameters such as gain,
output power level, several output spectrum requirements, and power supply current are critical.
- GSM/DCS Dual Tx VCO (OSC101)
The dual Tx VCO outputs, one for EGSM and one for DCS, drive a resistive network that splits the active signal
into two signals: 1) the input to the active PAM – this is the low loss path, and 2) the OPLL feedback signal.
- Dual VCO (OSC201)
The dual-band UHF VCO is a key component within its phase-locked loop; VCO performance directly impacts PLL
and transceiver performance. GSM/DCS Rx/Tx LO & UMTS Rx LO signal is generated from this dual VCO's output.

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Circuit Description
2-2
- RFL6200 (U200)
The RFL6200 includes an LNA circuit optimized for UMTS-2100 operation. The LNA is separated from all other
receive functions contained within the RFR6200 receiver IC to improve mixer LO to RF isolation – a critical
parameter in the Zero-IF architecture.
- RFR6200 (U203)
The RFR6200 provides the Zero-IF receiver signal path, from RF to analog baseband, for UMTS-2100 applications.
The RFR6200 accepts its UMTS input signal from the handset RF front-end design. The UMTS input is configured
differentially to optimize second-order inter-modulation and common mode rejection performance, and implements
MSM-controlled gain adjustments to extend the receiver dynamic range.
- RTR6250 (U101)
The RTR6250 supports multi-band, multi-mode phones with two receiver signal paths and three transmitter signal
paths:
1) Receiver paths
- EGSM-900
- DCS-1800
- PCS-1900
2) Transmitter paths
- EGSM-900 (using OPLL technique)
- DCS-1800 (using OPLL technique)
- PCS-1900
- UMTS-2100
Numerous secondary functions are integrated on-chip as well:
3) Phase-locked loop circuits
- PLL#1 and an on-chip VCO supports UMTS Tx
- PLL#2 and an external VCO supports EGSM Rx and Tx, DCS Rx and Tx, DCS Rx and Tx and UMTS Rx
4) Transceiver LO generation and distribution circuits
- EGSM-900 Rx and Tx
- DCS-1800 Rx and Tx
- PCS-1900 Rx and Tx
- UMTS-2100 Tx

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Circuit Description
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2-3
2-2. Baseband Circuit description of SGH-Z140
2-2-1. PM6650
- Power Management
Ten low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. It provides seven LDO support for 1.375V, 1.8V, 2.6V, 2.85V, 3.0V, 3.3V
while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,
such as RTC module and RTC charger, Clock Buffer, aid in reducing both board area and system complexity.
SBI BUS serial interface provides access to control and configuration registers. This interface gives full control of
the MSM6250 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a ADC Conertte support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
- TCXO Controller and Buffers
The PM6650 IC includes circuits for controlling the TCXO warm-up and buffering its signal for distribution
throughout the handset. Performance specifications are presented below.
2-2-2. Connector
- LCD Connector
LCD is consisted of main LCD(color 260K TFT LCD) and small LCD(color 65K LCD). Main LCD has 1.8", 176x220
resolution and sub LCD has 1.07", 96x96 resolution. Sub LCD uses STR to improve reflection performance. Chip
select signals in MSM6250, MLCD_CS_N can enable main LCD and SLCD_CS_N can enable small LCD.
MLCD_BL_EN enables white LED of main LCD. MLCD_RESET signal initiates the reset
process of the main LCD. SLCD_RESET signal initiates the Reset process of the small LCD.
-Key
This is consisted of key interface pins among U301, KEY_N(0:4). These signals compose the matrix. Result of
matrix informs the key status to key interface in the U301. Power on/off key is seperated from the matrix. The key
LED use the "VREG_KEY_LED" supply voltage. "HALL_SW" informs the status of folder (open or closed) to the.
- EMI ESD Filter
This system uses the EMI ESD filter, GMF05LC to protect noise from IF CONNECTOR part.
- IF connetor
It is 24-pin connector. They are designed to use VBATT, VF, MSM_TDI, MSM_TDO, MSM_TCK, MSM_TMS,
MSM_TRST, MSM_RTCK, RFR, CTS, JIG_ON, USB_VBUS, RXD, TXD, BOOT_SW and GND. They connected to
power supply IC, microprocessor and signal processor IC.

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Circuit Description
2-4
2-2-3. Audio
YMU765 has a built-in amplifier, and thus, is an ideal device for outputting sounds that are used by mobile phones
in addition to game sounds and ringing melodies that are replayed by a synthesizer.
The synthesizer section adopts "stereophonic hybrid synthesizer system" that are given advantages of both FM
synthesizers and Wave Table synthesizers to allow simultaneous generation of up to 32 FM voices and 32 Wave
Table voices. Furthermore, YMU765 has a built-in hardware sequencer that helps to realize complex play without
heavily loading the host CPU. And this device also has a built-in circuit for controlling vibrators and LEDs
synchronizing with play of music. The consumed electric current can be stopped to the minimum by power down
mode when not operating.
The hardware sequence built in this device allows playing of the complex music without giving excessive load to the
CPU of the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time
sound generation, allowing, for example, utilization of various sound effects when using the game software installed
in the portable telephone.
2-2-4. Memory
The signals in the MSM6250 enable two memories. They use volt supply voltage, VREG_MSMP, VREG_MSME
from the PM6650. This system uses SEC's memory, KBE00F005M-F411. It is consisted of 1G bits flash NAND
memory and 512M bits SDRAM memory. It has 16 bit data line, D1[0~15] which is connected to MSM6250.
2-2-5. Camera
The camera module consists of VGA pixel of system LSI(Samsung Techwin), 1/5.8" VGA CMOS image sensor with
an embedded image signal processor. Pixel size is 4.0 um and effective resolution is 640(H) x 480(V).
2-2-6. Irda
This system uses IRDA module, HSDL_32085, Agilent's. It uses two power signals, "VREG_MSMP" for circuit and
"VBATT" for LED.
2-2-7. Bluetooth
This system uses Bluetooth module, LBDA245AN0, Murata's. Chip solution is of Broadcom, BCM2004. It uses a
power signal, "VREG_BT". This system uses Blue-Q interface in that module has RF circuit and base band bluetooth
part is in MSM6250.

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3. Exploded View and Parts List
3-1
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3-1. Exploded View
QFR01
QCK01
QKP01
QME01
QSH01
QMP01
QIF01
QCR04
QBA01
QRF03
QRE01
QVO01
QAN01
QMW02
QFL01
QSP01
QMO01
QLC01
QFU01
QCR06
QRF01
QSC13
QSC01
QHI01
QCA01

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Exploded view and Part List
3-2
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3-2. Parts List
Location NO. Description SEC CODE
QBA01 ㅤBATTERY-1000MAH,BLK,ENG,M;BST456ABVC GH43-01797A
QCA01 ㅤUNIT-CAMERA;SGH-Z140,S5K53BEA,-,USA, GH59-02091A
QCK01 ㅤPMO-CAMERA KEY;SGH-Z140,PC+POLY URET GH72-24665A
QCR04 ㅤSCREW-MACHINE;PH,+,M1.4,L4,NYLOK,SWR 6001-001479
QCR06 ㅤSCREW-MACHINE;PH(PI2.5),+,M1.4,L3.5, 6001-001155
QIF01 ㅤPMO-IF COVER;SGH-Z140,PC+POLY URETHA GH72-22380A
QLC01 ㅤLCD-SGHZ140 LCD;LTD180QC-F0A,SGH-Z14 GH07-00712A
QME01 ㅤUNIT-KEY PAD;SGH-Z140,KBSGHZ140KM R2 GH59-02092A
QMO01 ㅤMOTOR DC-SPHA880 MOTOR;DMJBRK20ML,SP GH31-00145A
QMP01 ㅤPBA MAIN-SGHZ140;SGHZ140,SEG,GERM,PB GH92-02145A
QMW02 ㅤPCT-MAIN WINDOW V2;SGH-Z140,ACRYL SH GH72-24809A
QRF01 ㅤMPR-TAPE RF COVER;SGH-Z140,PET,PI7XT GH74-15117A
QSC01 ㅤMPR-SCREW CAP PC SHEET;SGH-Z140,PC S GH74-15486A
QSC13 ㅤRMO-REAR SCREW CAP RUBBE;SGH-Z140,SI GH73-05129A
QSH01 ㅤMEC-SHIELD CAN;SGH-Z140,EU,-,-,-,-,S GH75-07325A
QSP01 ㅤSPEAKER;0.7W,8ohm,89dB+-2dB,800Hz,14 3001-001766
QVO01 ㅤPMO-VOLUME KEY;SGH-Z140,PC+POLY URET GH72-24664A
QFL01 ㅤMEC-FOLDER LOWER;SGH-Z140,EU,-,-,-,- GH75-07178A
ㅤQHI01 MEC-HINGE;SGH-Z140,EU,-,-,-,-,SIL,- GH75-07179A
QCH03 ㅤMEC-CAMERA HINGE;SGH-Z140,EU,-,-,-,- GH75-07180A
QFR01 ㅤMEC-FRONT COVER;SGH-Z140,EU,-,-,-,-, GH75-07181A
ㅤQRF03 PMO-EAR COVER;SGH-Z140,PC+POLY URETH GH72-22392A
QKP01 ㅤMEC-KEYPAD;SGH-Z140,EU,-,-,-,-,BLK,- GH75-07257A
QFU01 ㅤMEC-FOLDER UPPER V2;SGH-Z140,EU,-,-, GH75-07996A
ㅤQLB02 MEC-SUB LCD BRACKET V2;SGH-Z140,EU,- GH75-08025A
QAN01 ㅤANTENNA-SGHZ140;HFP-01502-0000AA,SGH GH42-00562A
QRE01 ㅤMEC-REAR COVER;SGH-Z140,EU,-,-,-,-,B GH75-07182A

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Exploded view and Part List
3-3
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Description SEC CODE
BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634
CBF INTERFACE-DATA LINK CABLE;SGH-Z1 GH39-00421A
CHARGER-SGHZ500 TC;TCH137EBE,SGH-Z50 GH44-01007A
S/W CD-VODA_PN;SGH-Z500V,SGH-Z500V,E GH46-00151A
UNIT-EARPHONE;SGH-C230,EM-SS550E-STB GH59-02166A
LABEL(P)-WATER SOAK;COMM,NORGE,100G, GH68-02026A
MANUAL-SVR CARD;COMM,XEP,PORTUGUESE, GH68-02552A
LABEL(R)-MAIN( EU);SGH-Z140,EU,POLYE GH68-07010A
MANUAL-WEEE CARD;COMM,SEC,ENGLISH,UN GH68-07013A
MANUAL-USER;SGH-Z140,XEP,PORTUGUESE, GH68-07596A
BOX(P)-UNIT(EU);SGH-Z140,SC300+S120+ GH69-02623A
CUSHION-CASE(1-2);SGH-Z140,PULP,T0.8 GH69-03037A
PMO-BATT LOCKER;SGH-Z140,PC,BLK,-,-, GH72-22394A
MPR-SPK CUSHION;SGH-S100,PORON,PI8XT GH74-03121A
MPR-BOHO VINYL IF;SGH-E720,#950,85X1 GH74-13606A
MPR-BOHO VINYL F/UP 2;SGH-Z140,ST-55 GH74-15134A
MPR-BOHO VINYL M/WIN 1;SGH-Z140,ST-5 GH74-15135A
MPR-BOHO VINYL M/WIN 2;SGH-Z140,SP-3 GH74-15136A
MPR-BOHO VINYL REAR;SGH-Z140,ST-5543 GH74-15142A
MEC-HANGER;SGH-Z500,TMN,STRAP,-,BLK, GH75-03673H

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Exploded view and Part List
3-4
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3-3. Test Jig (GH80-03308A)
3-3-1. RF Test Cable
(GH39-00283A) 3-3-2. Test Cable (GH39-00337E) 3-3-3. Serial Cable
3-3-4. Power Supply Cable 3-3-5. DATA CABLE
(GH39-00279A) 3-3-6. TC (GH44-00701A)

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4. Electrical Parts List
4-1
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Design LOC Description SEC CODE
AN1 ANTENNA(BLUETOOTH) 4202-001048
BAT500 BATTERY 4302-001177
C100,C103,C118,C127 C-CERAMIC,CHIP 2203-000254
C101,C104,C108,C109 C-CERAMIC,CHIP 2203-000812
C102,C116,C141,C151 C-CERAMIC,CHIP 2203-000438
C105,C110,C112,C115 C-CERAMIC,CHIP 2203-005482
C111,C117,C122,C126 C-CERAMIC,CHIP 2203-000812
C113,C203,C244 C-CERAMIC,CHIP 2203-000885
C114,C123,C129,C356 C-CERAMIC,CHIP 2203-000854
C119,C200,C206,C217 C-CERAMIC,CHIP 2203-000233
C120,C124,C144,C238 C-CERAMIC,CHIP 2203-000995
C121,C128,C138,C139 C-CERAMIC,CHIP 2203-005482
C130 C-CERAMIC,CHIP 2203-000725
C132,C137,C140,C146 C-CERAMIC,CHIP 2203-000812
C133 C-CERAMIC,CHIP 2203-000836
C134,C142,C215,C216 C-CERAMIC,CHIP 2203-002668
C145 C-CERAMIC,CHIP 2203-006141
C147,C229,C505,C517 C-CERAMIC,CHIP 2203-006208
C148,C201,C218,C220 C-CERAMIC,CHIP 2203-005482
C149,C150,C156,C168 C-CERAMIC,CHIP 2203-000254
C152 C-CERAMIC,CHIP 2203-000311
C153,C720 C-TA,CHIP 2404-001274
C154,C341 C-CERAMIC,CHIP 2203-005480
C159,C210,C248,C340 C-CERAMIC,CHIP 2203-000812
C160 C-CERAMIC,CHIP 2203-005503
C161 C-CERAMIC,CHIP 2203-002443
C162 C-CERAMIC,CHIP 2203-005234
C163,C165,C345,C617 C-CERAMIC,CHIP 2203-000386
C169,C235,C239,C337 C-CERAMIC,CHIP 2203-000254
C204,C236,C411 C-TA,CHIP 2404-001225
C205,C207,C211,C232 C-CERAMIC,CHIP 2203-000330
C208,C209,C645,C646 C-CERAMIC,CHIP 2203-000278
C221,C227,C231,C234 C-CERAMIC,CHIP 2203-000233
C222,C225 C-CERAMIC,CHIP 2203-005288
C223,C241,C421,C689 C-CERAMIC,CHIP 2203-000438
C224,C226,C230,C233 C-CERAMIC,CHIP 2203-005482
C228,C242 C-CERAMIC,CHIP 2203-000679

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Electrical Parts List
4-2
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Design LOC Description SEC CODE
C237,C406,C576 C-CERAMIC,CHIP 2203-006257
C240,C424,C428,C540 C-CERAMIC,CHIP 2203-005482
C243,C575 C-CERAMIC,CHIP 2203-000940
C247,C339,C423,C566 C-CERAMIC,CHIP 2203-000233
C300,C320,C330,C353 C-CERAMIC,CHIP 2203-006093
C301,C302,C303,C304 C-CERAMIC,CHIP 2203-006194
C305,C308,C309,C404 C-CERAMIC,CHIP 2203-005806
C306,C307,C331,C332 C-CERAMIC,CHIP 2203-006194
C310,C311,C312,C313 C-CERAMIC,CHIP 2203-006423
C314,C315,C316,C317 C-CERAMIC,CHIP 2203-006423
C318,C319,C321,C322 C-CERAMIC,CHIP 2203-006423
C323,C324,C325,C326 C-CERAMIC,CHIP 2203-006423
C327,C328,C329,C343 C-CERAMIC,CHIP 2203-006423
C333,C403,C414 C-CERAMIC,CHIP 2203-006194
C334,C335 C-CERAMIC,CHIP 2203-000628
C336 C-CERAMIC,CHIP 2203-000489
C338,C342,C420,C422 C-CERAMIC,CHIP 2203-000254
C344 C-TA,CHIP 2404-001380
C346,C348,C350,C352 C-CERAMIC,CHIP 2203-006423
C347,C351 C-CERAMIC,CHIP 2203-006091
C354,C520,C524,C527 C-CERAMIC,CHIP 2203-006201
C355,C400,C401,C402 C-CERAMIC,CHIP 2203-006423
C409,C410,C417,C427 C-CERAMIC,CHIP 2203-006324
C412,C413,C416,C419 C-CERAMIC,CHIP 2203-006423
C415,C536,C537,C541 C-CERAMIC,CHIP 2203-005806
C418,C426,C702 C-CERAMIC,CHIP 2203-006053
C425 C-TA,CHIP 2404-001394
C429 C-TA,CHIP 2404-001386
C500,C501 C-CERAMIC,CHIP 2203-005138
C502,C506,C511,C514 C-CERAMIC,CHIP 2203-006423
C508,C516,C530,C532 C-CERAMIC,CHIP 2203-006093
C509 C-CERAMIC,CHIP 2203-005736
C515,C549,C550,C551 C-CERAMIC,CHIP 2203-006423
C518,C522,C523,C546 C-CERAMIC,CHIP 2203-006208
C521,C526,C529,C531 C-CERAMIC,CHIP 2203-006344
C528,C560,C577 C-CERAMIC,CHIP 2203-006201
C533 C-CERAMIC,CHIP 2203-006344

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Electrical Parts List
4-3
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
C538,C539,C544,C703 C-CERAMIC,CHIP 2203-000812
C542,C543,C672 C-CERAMIC,CHIP 2203-005806
C545 C-TA,CHIP 2404-001281
C547,C548,C657,C673 C-CERAMIC,CHIP 2203-006208
C552,C553,C554,C562 C-CERAMIC,CHIP 2203-006423
C561,C564,C565,C578 C-CERAMIC,CHIP 2203-006093
C563,C628,C658,C669 C-CERAMIC,CHIP 2203-006423
C567,C569,C729 C-CERAMIC,CHIP 2203-000233
C571,C704,C706,C707 C-CERAMIC,CHIP 2203-005482
C572 C-CERAMIC,CHIP 2203-006324
C573,C574 C-CERAMIC,CHIP 2203-000425
C602,C603,C604,C606 C-CERAMIC,CHIP 2203-006093
C607,C615,C641,C642 C-TA,CHIP 2404-001348
C608,C663,C686,C688 C-CERAMIC,CHIP 2203-006093
C610,C621,C625,C626 C-CERAMIC,CHIP 2203-000854
C616,C635,C639,C643 C-CERAMIC,CHIP 2203-003054
C624,C668,C716 C-TA,CHIP 2404-001381
C629,C630,C633,C650 C-CERAMIC,CHIP 2203-000854
C636,C640,C644,C670 C-CERAMIC,CHIP 2203-000386
C637,C638,C647,C648 C-CERAMIC,CHIP 2203-006137
C651,C655,C656,C665 C-CERAMIC,CHIP 2203-000854
C662,C671 C-CERAMIC,CHIP 2203-006190
C666,C667,C687 C-CERAMIC,CHIP 2203-000854
C674,C675,C694,C696 C-CERAMIC,CHIP 2203-006423
C690,C691 C-TA,CHIP 2404-001348
C692 C-CERAMIC,CHIP 2203-006137
C693,U611,U612 C-TA,CHIP 2404-001339
C695 C-CERAMIC,CHIP 2203-000654
C697 C-CERAMIC,CHIP 2203-000438
C698,C699 C-CERAMIC,CHIP 2203-005481
C701 C-TA,CHIP 2404-001268
C708 C-CERAMIC,CHIP 2203-000254
C709,C715,C727 C-CERAMIC,CHIP 2203-005482
C710,C711 C-CERAMIC,CHIP 2203-006093
C721 C-CERAMIC,CHIP 2203-006423
C722,C723,C724 C-CERAMIC,CHIP 2203-000386
C730,C731 C-CERAMIC,CHIP 2203-000386

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Electrical Parts List
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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
CA600 VARISTOR 1405-001119
CN100 CONNECTOR-COAXIAL3705-001358
CN500 CONNECTOR-CARDEDGE3709-001355
CN600 JACK-PHONE[phone]
CN701 CONNECTOR-HEADER 3711-005370
CN703 CONNECTOR-HEADER 3711-005962
CN704 CONNECTOR-HEADER 3711-005296
CN705 CONNECTOR-SOCKET 3710-002120
CN706 CONNECTOR-HEADER 3711-005783
D501,D700 DIODE-ARRAY 0407-001002
F100 FILTER-SAW 2904-001550
F101 FILTER-SAW 2904-001570
F102 FILTER-SAW 2904-001571
F200 FILTER-SAW 2904-001439
F201 FILTER-SAW 2904-001438
F203 FILTER-Duplexer 2910-000004
F700,F701,F702,F703 FILTER-EMI SMD2901-001311
F704,F705,F706 FILTER-EMI SMD2901-001311
L101 INDUCTOR-SMD2703-002207
L102 INDUCTOR-SMD2703-002200
L103,L125,L126,L200 INDUCTOR-SMD2703-002314
L105 INDUCTOR-SMD2703-001723
L107,L109 INDUCTOR-SMD2703-002208
L108,L112,L113,L709 INDUCTOR-SMD2703-002203
L110,L400,L600,L701 CORE-FERRITEBEAD3301-001534
L111,L114,L115,L117 INDUCTOR-SMD2703-001229
L116,L119,L121,L123 INDUCTOR-SMD2703-002176
L118,L204 INDUCTOR-SMD2703-002268
L120 INDUCTOR-SMD2703-002199
L128 INDUCTOR-SMD2703-002369
L201 INDUCTOR-SMD2703-002198
L202 INDUCTOR-SMD2703-002205
L203 INDUCTOR-SMD2703-002267
L205 INDUCTOR-SMD2703-001750
L206,L209,L210 CORE-FERRITEBEAD3301-001729
L207,L208,L211 INDUCTOR-SMD2703-002368
L501,L502 INDUCTOR-SMD2703-002782

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Electrical Parts List
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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
L601,L602 CORE-FERRITEBEAD3301-001630
L603,L604 CORE-FERRITEBEAD3301-001756
L702,L703,L704,L705 CORE-FERRITEBEAD3301-001534
L706,L707 CORE-FERRITEBEAD3301-001534
L712 INDUCTOR-SMD2703-001178
LED400 PHOTO-IRDA 0604-001261
MIS201 ISOLATOR 4709-001370
OSC101 OSCILLATOR-VCO 2806-001360
OSC200 OSCILLATOR-VCTCXO2809-001280
OSC201 OSCILLATOR-VCO 2806-001361
OSC501 CRYSTAL-UNIT 2801-004339
Q400 TR-DIGITAL0504-000168
R100,R207 R-CHIP 2007-007491
R101,R126,R127,R130 R-CHIP 2007-000138
R102,R312 R-CHIP 2007-000140
R105,R108,R110,R203 R-CHIP 2007-007318
R106,R112,R212 R-CHIP 2007-000172
R107,R633 R-CHIP 2007-007316
R111 R-CHIP 2007-000145
R114,R128,R129 R-CHIP 2007-001217
R115,R116 R-CHIP 2007-001291
R117,R123 R-CHIP 2007-001301
R118,R119,R120,R121 R-CHIP 2007-001307
R122,R420,R421,R422 R-CHIP 2007-001305
R124 R-CHIP 2007-000147
R125,R330,R520,R720 R-CHIP 2007-007142
R131,R213,R214,R303 R-CHIP 2007-000171
R200,R206,R208,R315 R-CHIP 2007-007314
R201 R-CHIP 2007-000173
R202,R210,R211 R-CHIP 2007-000138
R204 R-CHIP 2007-000141
R209,R505 R-CHIP 2007-001298
R216 R-CHIP 2007-007001
R217 R-CHIP 2007-000146
R307,R309,R324,R336 R-CHIP 2007-008542
R310 R-CHIP 2007-007135
R313 R-CHIP 2007-000137

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Electrical Parts List
4-6
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
R314,R602,R603,R614 R-CHIP 2007-007318
R327,R332 R-CHIP 2007-000148
R328,R331,R620 R-CHIP 2007-001339
R339,R521,R650 R-CHIP 2007-000566
R341,R342 R-CHIP 2007-008588
R344,R408,R657 R-CHIP 2007-008542
R345,R346,R347,R348 R-CHIP 2007-007014
R349 R-CHIP 2007-007014
R350,R351 R-CHIP 2007-003001
R400,R404,R405,R406 R-CHIP 2007-000171
R403,R419 R-CHIP 2007-000162
R410,R503 R-CHIP 2007-008516
R411,R412,R700 R-CHIP 2007-008055
R414,R448,R507 R-CHIP 2007-000171
R413,R511,R617 R-CHIP 2007-007107
R415 R-CHIP 2007-001313
R418 R-CHIP 2007-001311
R423 R-CHIP 2007-001305
R500,R501 R-CHIP 2007-003015
R504 R-CHIP 2007-008483
R506 R-CHIP 2007-007468
R508 R-CHIP 2007-000151
R510,R514,R515,R516 R-CHIP 2007-000171
R517,R518,R519,R631 R-CHIP 2007-000171
R604,R605,R610,R612 R-CHIP 2007-007137
R615 R-CHIP 2007-007318
R616,R618 R-CHIP 2007-007334
R623,R625 R-CHIP 2007-007311
R634,R638,R642,R651 R-CHIP 2007-000171
R643 R-CHIP 2007-000159
R644,R645 R-CHIP 2007-000775
R646,R647 R-CHIP 2007-007529
R652,R653,R659,R710 R-CHIP 2007-000171
R702,R705,R706 R-CHIP 2007-008542
R701,R703 R-CHIP 2007-008419
R704 R-CHIP 2007-008045
R709 R-CHIP 2007-007139

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Electrical Parts List
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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
R711,R712,R713,R714 R-CHIP 2007-000171
R715,R716,R717,R718 R-CHIP 2007-000171
R719,R721 R-CHIP 2007-000171
R722 R-CHIP 2007-007193
TH300 THERMISTOR 1404-001196
U101 IC-TRANSCEIVER 1205-002645
U102 IC-POWER AMP 1201-002218
U103 IC-SWITCH 1205-002724
U200 IC-RF AMP 1201-001984
U201 IC-POWER AMP 1201-002219
U203 IC-RECEIVER 1205-002297
U300,U402,U502 IC-SWITCH 1205-002568
U301 IC-MODEM 1205-002527
U302,U503 IC-POSI.FIXED REG. 1203-003105
U400 IC-MCP 1108-000005
U401,U603 IC-ANALOGSWITCH 1001-001231
U403 IC-CMOS LOGIC0801-002345
U405,U604,U608,U613 IC-ANALOGSWITCH 1001-001296
U407 FILTER-EMI SMD2901-001283
U408 BLUETOOTH MODULE 4709-001363
U409 IC-POWER 1203-003728
U410 FET-SILICON 0505-001889
U500 IC-POWERSUPERVISOR 1203-003335
U501 IC-POSI.FIXED REG. 1203-002236
U601 IC-VOLTAGECOMP. 1202-001036
U605 IC-ANALOGMULTIPLEX 1001-001306
U607 IC-MELODY 1204-002138
U609 IC-AUDIOAMP 1201-002195
U610 IC-AUDIOAMP 1201-002240
U615 FILTER-EMI SMD2901-001294
X300 RESONATOR-CERAMIC2802-001182
ZD406 DIODE-ZENER 0403-001387
ZD500,ZD707 DIODE-TVS0406-001200
ZD600,ZD601,ZD709 DIODE-TVS0406-001197
ZD710,ZD712,ZD717 DIODE-TVS0406-001197
ZD718,ZD719 DIODE-TVS0406-001197
ZD720 DIODE-ZENER 0403-001427

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Electrical Parts List
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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
ZD721 DIODE-ZENER 0403-001411