S&T Kontron COMe-cTL6 User manual


USER GUIDE
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COMe-cTL6
User Guide Rev. 1.7
Doc. ID: 1068-0490

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
COME
-CTL6 – USER GUIDE
Disclaimer
Kontron would like to point out that the information contained in this user guide may be subject to alteration,
particularly as a result of the constant upgrading of Kontron products. This document does not entail any guarantee on
the part of Kontron with respect to technical processes described in the user guide or any product characteristics set
out in the user guide. Kontron assumes no responsibility or liability for the use of the described product(s), conveys no
license or title under any patent, copyright or mask work rights to these products and makes no representations or
warranties that these products are free from patent, copyright or mask work right infringement unless otherwise
specified. Applications that are described in this user guide are for illustration purposes only. Kontron makes no
representation or warranty that such application will be suitable for the specified use without further testing or
modification. Kontron expressly informs the user that this user guide only contains a general description of processes
and instructions which may not be applicable in every individual case. In cases of doubt, please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be
reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer
language, in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), without the
express written permission of Kontron. Kontron points out that the information contained in this user guide is
constantly being updated in line with the technical alterations and improvements made by Kontron to the products and
thus this user guide only reflects the technical status of the products by Kontron at the time of publishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2022 by Kontron Europe GmbH
Kontron Europe GmbH
Gutenbergstraße 2
85737 Ismaning, Germany
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR
COMMUNICATION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE
SUPPORT OR LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A
HAZARDOUS ENVIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF
PRODUCTS COULD LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR
ENVIRONMENTAL DAMAGE (COLLECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron devices as a component in High Risk Applications is entirely at
your risk. To minimize the risks associated with your products and applications, you should provide adequate design
and operating safeguards. You are solely responsible for compliance with all legal, regulatory, safety, and security
related requirements concerning your products. You are responsible to ensure that your systems (and any Kontron
hardware or software components incorporated in your systems) meet all applicable requirements. Unless otherwise
stated in the product documentation, the Kontron device is not provided with error-tolerance capabilities and cannot
therefore be deemed as being engineered, manufactured or setup to be compliant for implementation or for resale as
device in High Risk Applications. All application and safety related information in this document (including application
descriptions, suggested safety measures, suggested Kontron products, and other materials) is provided for reference
only.
Handling and operation of the product is permitted only for trained personnel within a
work place that is access controlled. Please follow the “General Safety Instructions”
supplied with the system.
You find the most recent version of the “General Safety Instructions“ online in the download
area of this product.
This product is not suited for storage or operation in corrosive environments, in particular
under exposure to sulfur and chlorine and their compounds. For information on how to
harden electronics and mechanics against these stress conditions, contact Kontron Support.

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Revision History
Revision Brief Description of Changes Date of Issue Author
1.0 Initial version 2021-Sept-17 hjs
1.1 RTC range updated 2022-Jan-04 hjs
1.2 UART0 notice moved to 6.4.3 2022-Jan-31 hjs
1.3 BIOS Update 2022-Mar-18 CW
1.4 TDP parameter in Table 9 modified 2022-Apr-27 hjs
1.5 New coolers in Table 6: General Accessories 2022-May-19 hjs
1.6 I2C pin numbering changed Ch 4.1 2022-May-20 CW
1.7 GPIO Update Chapter 3.2 2022-Aug-01 CW
Terms and Conditions
Kontron warrants products in accordance with defined regional warranty periods. For more information about
warranty compliance and conformity, and the warranty period in your region, visit http://www.kontron.com/terms-
and-conditions.
Kontron sells products worldwide and declares regional General Terms & Conditions of Sale, and Purchase Order Terms
& Conditions. Visit http://www.kontron.com/terms-and-conditions.
For contact information, refer to the corporate offices contact information on the last page of this user guide or visit
our website CONTACT US.
Customer Support
Find Kontron contacts by visiting: https://www.kontron.de/support-and-services.
Customer Service
As a trusted technology innovator and global solutions provider, Kontron extends its embedded market strengths into
a services portfolio allowing companies to break the barriers of traditional product lifecycles. Proven product
expertise coupled with collaborative and highly-experienced support enables Kontron to provide exceptional peace of
mind to build and maintain successful products.
For more details on Kontron’s service offerings such as: enhanced repair services, extended warranty, Kontron
training academy, and more visit https://www.kontron.com/support-and-services.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
Kontron support. Detail any errors you find. We will correct the errors or problems as soon as possible and post the
revised user guide on our website.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60
V) when touching
products or parts of products. Failure to observe the precautions indicated and/or prescribed
by the law may endanger your life/health and/or result in damage to your material.
ESD Sensitive Device!
This symbol and title inform that the electronic boards and their components are sensitive to
static electricity. Care must therefore be taken during all handling operations and inspections
of this product in order to ensure product integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol informs of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before
servicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

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For Your Safety
Your new Kontron product was developed and tested carefully to provide all features necessary to ensure its
compliance with electrical safety requirements. It was also designed for a long fault-free life. However, the life
expectancy of your product can be drastically reduced by improper treatment during unpacking and installation.
Therefore, in the interest of your own safety and of the correct operation of your new Kontron product, you are
requested to conform with the following guidelines.
High Voltage Safety Instructions
As a precaution and in case of danger, the power connector must be easily accessible. The power connector is the
product’s main disconnect device.
Warning
All operations on this product must be carried out by sufficiently skilled personnel only.
Electric Shock!
Before installing a non hot-swappable Kontron product into a system always ensure that
your mains power is switched off. This also applies to the installation of piggybacks. Serious
electrical shock hazards can exist during all installation, repair, and maintenance operations
on this product. Therefore, always unplug the power cable and any other cables which
provide external voltages before performing any work on this product.
Earth ground connection to vehicle’s chassis or a central grounding point shall remain
connected. The earth ground cable shall be the last cable to be disconnected or the first
cable to be connected when performing installation or removal procedures on this product.
Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to
ensure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is
otherwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the
batteries or conductive circuits on the product.

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Lithium Battery Precautions
If your product is equipped with a lithium battery, take the following precautions when replacing the battery.
Danger of explosion if the battery is replaced incorrectly.
Replace only with same or equivalent battery type recommended by the manufacturer.
Dispose of used batteries according to the manufacturer’s instructions.
General Instructions on Usage
In order to maintain Kontron’s product warranty, this product must not be altered or modified in any way. Changes or
modifications to the product, that are not explicitly approved by Kontron and described in this user guide or received
from Kontron Support as a special handling instruction, will void your warranty.
This product should only be installed in or connected to systems that fulfill all necessary technical and specific
environmental requirements. This also applies to the operational temperature range of the specific board version
that must not be exceeded. If batteries are present, their temperature restrictions must be taken into account.
In performing all necessary installation and application operations, only follow the instructions supplied by the
present user guide.
Keep all the original packaging material for future storage or warranty shipments. If it is necessary to store or ship
the product then re-pack it in the same manner as it was delivered.
Special care is necessary when handling or unpacking the product. See Special Handling and Unpacking Instruction.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with
environmental laws, regulations, and other environmentally oriented requirements. For more information regarding
Kontron’s quality and environmental responsibilities, visit http://www.kontron.com/about-kontron/corporate-
responsibility/quality-management.
Disposal and Recycling
Kontron’s products are manufactured to satisfy environmental protection requirements where possible. Many of the
components used are capable of being recycled. Final disposal of this product after its service life must be
accomplished in accordance with applicable country, state, or local laws or regulations.
WEEE Compliance
The Waste Electrical and Electronic Equipment (WEEE) Directive aims to:
Reduce waste arising from electrical and electronic equipment (EEE)
Make producers of EEE responsible for the environmental impact of their products, especially when the
product become waste
Encourage separate collection and subsequent treatment, reuse, recovery, recycling and sound
environmental disposal of EEE
Improve the environmental performance of all those involved during the lifecycle of EEE
Environmental protection is a high priority with Kontron.
Kontron follows the WEEE directive
You are encouraged to return our products for proper disposal.

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Table of Contents
Symbols .................................................................................................................................................................................................................6
For Your Safety....................................................................................................................................................................................................7
High Voltage Safety Instructions ..................................................................................................................................................................7
Special Handling and Unpacking Instruction ............................................................................................................................................7
Lithium Battery Precautions.......................................................................................................................................................................... 8
General Instructions on Usage...................................................................................................................................................................... 8
Quality and Environmental Management ................................................................................................................................................. 8
Disposal and Recycling.................................................................................................................................................................................... 8
WEEE Compliance.............................................................................................................................................................................................. 8
Table of Contents ...............................................................................................................................................................................................9
List of Tables ......................................................................................................................................................................................................11
List of Figures ....................................................................................................................................................................................................13
1/ Introduction..........................................................................................................................................................................................14
1.1. Product Description...................................................................................................................................................................................14
1.2. Product Naming Clarification ................................................................................................................................................................15
1.3. COM Express® Documentation.............................................................................................................................................................15
1.4. COM Express® Functionality .................................................................................................................................................................15
1.5. COM Express® Benefits...........................................................................................................................................................................16
2/ Product Specification ........................................................................................................................................................................17
2.1. Module Variants ........................................................................................................................................................................................17
2.1.1. Commercial Grade Modules (0°C to +60°C)................................................................................................................................... 17
2.1.2. Extended Temperature Grade Modules (E1, -25°C to 75°C).....................................................................................................17
2.1.3. E2 Modules (E2, -40°C to +85°C) ......................................................................................................................................................18
2.2. Accessories.................................................................................................................................................................................................18
2.3. Functional Specification........................................................................................................................................................................20
2.3.1. Technical Data .......................................................................................................................................................................................20
2.3.2. Block Diagram ........................................................................................................................................................................................21
2.3.3. Front View ..............................................................................................................................................................................................22
2.3.4. Rear View................................................................................................................................................................................................23
2.3.5. Processors..............................................................................................................................................................................................24
2.3.6. System Memory ................................................................................................................................................................................... 25
2.3.7. Graphics...................................................................................................................................................................................................26
2.3.8. HD Audio..................................................................................................................................................................................................28
2.3.9. General Purpose PCI Express 3.0....................................................................................................................................................28
2.3.10. PCI Express Reference Clock ..........................................................................................................................................................28
2.3.11. Universal Serial Bus (USB)...............................................................................................................................................................29
2.3.12. SATA 3.0.................................................................................................................................................................................................29
2.3.13. Gigabit Ethernet..................................................................................................................................................................................29
2.3.14. Storage ..................................................................................................................................................................................................30
2.3.15. COMe Features....................................................................................................................................................................................30
2.3.16. Kontron Features................................................................................................................................................................................30
2.3.17. LPC............................................................................................................................................................................................................31
2.3.18. I2C Bus ....................................................................................................................................................................................................31
2.3.19. SMBus ....................................................................................................................................................................................................32
2.3.20. Wake Signals.......................................................................................................................................................................................32
2.3.21. Suspend Control .................................................................................................................................................................................32
2.3.22. Power Good (PWR_OK)....................................................................................................................................................................32

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2.3.23. Carrier Board Reset (CB_RESET#) ............................................................................................................................................... 33
2.3.24. System Reset (SYS_RESET#) ........................................................................................................................................................ 33
2.3.25. Power Button (PWRBTN#) .............................................................................................................................................................33
2.3.26. Batlow ...................................................................................................................................................................................................33
2.3.27. LID Switch (LID#) ...............................................................................................................................................................................33
2.3.28. Sleep Button (SLEEP#) ....................................................................................................................................................................33
2.3.29. External SPI/GSPI Support .............................................................................................................................................................34
2.3.30. Speaker Out (SPKR)...........................................................................................................................................................................34
2.3.31. Watchdog Timeout (WDT)...............................................................................................................................................................34
2.3.32. General Purpose IOs ......................................................................................................................................................................... 35
2.3.33. External Fan support........................................................................................................................................................................ 35
2.3.34. UART Serial Ports .............................................................................................................................................................................. 35
2.3.35. Hardware Monitor (HWM).............................................................................................................................................................. 35
2.3.36. Trusted Platform Module (TPM) ..................................................................................................................................................36
2.3.37. Embedded Controller (CPLD)......................................................................................................................................................... 36
2.3.38. SPI BIOS Memory ...............................................................................................................................................................................36
2.4. Electrical Specification .......................................................................................................................................................................... 37
2.4.1. Power Supply Specifications ............................................................................................................................................................ 37
2.4.2. Power Management ...........................................................................................................................................................................38
2.4.3. Power Supply Control Settings .......................................................................................................................................................38
2.4.4. Power Supply Modes..........................................................................................................................................................................39
2.4.5. Single Supply Mode.............................................................................................................................................................................40
2.5. Thermal Management ............................................................................................................................................................................41
2.5.1. Heatspreader and Active or Passive Cooling Solutions............................................................................................................41
2.5.2. Active or Passive Cooling Solutions................................................................................................................................................41
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly...............................................................................................41
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly........................................................................................41
2.5.5. Temperature Sensors.........................................................................................................................................................................42
2.5.6. Onboard Fan Connector.....................................................................................................................................................................43
2.6. Environmental Specification................................................................................................................................................................44
2.7. Compliance ................................................................................................................................................................................................44
2.7.1. MTBF .........................................................................................................................................................................................................45
2.8. Mechanical Specification......................................................................................................................................................................47
2.8.1. Dimensions .............................................................................................................................................................................................47
2.8.2. Height.......................................................................................................................................................................................................48
2.8.3. Heatspreader Dimension ..................................................................................................................................................................48
3/ Features and Interfaces..................................................................................................................................................................49
3.1. Fast I2C ........................................................................................................................................................................................................49
3.2. GPIO..............................................................................................................................................................................................................49
3.3. Kontron Security Solution.....................................................................................................................................................................49
3.4. LPC................................................................................................................................................................................................................49
3.5. Real Time Clock (RTC) ............................................................................................................................................................................50
3.6. Serial Peripheral Interface (SPI)..........................................................................................................................................................50
3.6.1. SPI Boot....................................................................................................................................................................................................50
3.7. Trusted Platform Module (TPM 2.0) ..................................................................................................................................................51
3.8. UART .............................................................................................................................................................................................................51
3.9. Watchdog Timer (WTD) Dual Stage ...................................................................................................................................................51
3.9.1. WDT Signal.............................................................................................................................................................................................. 52
4/ System Resources............................................................................................................................................................................. 53

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4.1. I2C Bus .........................................................................................................................................................................................................53
4.2. System Management (SM) Bus.......................................................................................................................................................... 53
5/ COMe Interface Connectors (X1A and X1B) ...............................................................................................................................54
5.1. Connecting COMe Interface Connector to Carrier Board ............................................................................................................54
5.2. X1A and X1B Signals ................................................................................................................................................................................ 55
5.3. X1A and X1B Pin Assignment................................................................................................................................................................ 55
5.3.1. Connector X1A Row A1 – A110............................................................................................................................................................56
5.3.2. Connector X1A Row B 1 - B 110 ..........................................................................................................................................................61
5.3.3. Connector X1B Row C 1 - C 110.......................................................................................................................................................... 65
5.3.4. Connector X1B Row D 1 - D 110.........................................................................................................................................................68
5.4. Bootstrap Signals.....................................................................................................................................................................................71
6/ UEFI BIOS .............................................................................................................................................................................................. 72
6.1. Starting the UEFI BIOS ............................................................................................................................................................................ 72
6.2. The UEFI Shell........................................................................................................................................................................................... 73
6.2.1. Basic Operation of the UEFI Shell.................................................................................................................................................... 73
6.3. UEFI Shell Scripting.................................................................................................................................................................................74
6.3.1. Startup Scripting...................................................................................................................................................................................74
6.3.2. Create a Startup Script.......................................................................................................................................................................74
6.3.3. Examples of Startup Scripts............................................................................................................................................................. 74
6.4. Setup Menus.............................................................................................................................................................................................74
6.4.1. Main Setup Menu...................................................................................................................................................................................75
6.4.2. Advanced Setup Menu ........................................................................................................................................................................77
6.4.3. Chipset Menu.........................................................................................................................................................................................89
6.4.4. Security Setup Menu ..........................................................................................................................................................................98
6.4.5. Boot Menu ............................................................................................................................................................................................100
6.4.6. Save and Exit Setup Menu ...............................................................................................................................................................101
7/ Technical Support ........................................................................................................................................................................... 102
7.1. Warranty ...................................................................................................................................................................................................102
7.2. Returning Defective Merchandise.................................................................................................................................................... 103
Appendix A: List of Acronyms....................................................................................................................................................................104
About Kontron – Member of the S&T Group ........................................................................................................................................ 106
List of Tables
Table 1: IOs of Type 6 and COMe-cTL6 ......................................................................................................................................................15
Table 2: Commercial Grade Modules (0°C to +60°C) ............................................................................................................................17
Table 3: E2 Modules (E2, -40°C to +85°C operating)............................................................................................................................18
Table 4: Product Accessories .......................................................................................................................................................................18
Table 5: COMe Type 6 Specific Accessories.............................................................................................................................................18
Table 6: General Accessories........................................................................................................................................................................19
Table 7: Memory ...............................................................................................................................................................................................19
Table 8: Technical Data .................................................................................................................................................................................20
Table 9: 11th Generation Intel® Processor Specifications.................................................................................................................. 25
Table 10: System Memory ............................................................................................................................................................................ 25
Table 11: Display Resolution.........................................................................................................................................................................26
Table 12: Display Interfaces.........................................................................................................................................................................26
Table 13: DDI1 Interfaces ...............................................................................................................................................................................26
Table 14: DDI2 Interfaces .............................................................................................................................................................................. 27
Table 15: DDI3 Interfaces............................................................................................................................................................................... 27
Table 16: LVDS Bridge..................................................................................................................................................................................... 27
Table 17: Audio..................................................................................................................................................................................................28

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Table 18: General Purpose PCI Express 3.0.............................................................................................................................................28
Table 19: PCI Express Graphics 4.0 (PEG) ................................................................................................................................................28
Table 20: PCI Express Reference Clock ....................................................................................................................................................28
Table 21: USB.....................................................................................................................................................................................................29
Table 22: USB Overcurrent...........................................................................................................................................................................29
Table 23: SATA..................................................................................................................................................................................................29
Table 24: Ethernet...........................................................................................................................................................................................30
Table 25: COM Features ................................................................................................................................................................................30
Table 26: Kontron Features..........................................................................................................................................................................30
Table 27: LPC ......................................................................................................................................................................................................31
Table 28: External user-accessible I2C (I2C_EXT) ................................................................................................................................31
Table 29: Internal I2C (I2C_INT)...................................................................................................................................................................31
Table 30: SMBus ..............................................................................................................................................................................................32
Table 31: SMB Alert .........................................................................................................................................................................................32
Table 32: Wake Signals..................................................................................................................................................................................32
Table 33: Suspend Control ...........................................................................................................................................................................32
Table 34: Carrier Board Reset (CB_RESET#).......................................................................................................................................... 33
Table 35: System Reset (SYS_RESET#) ................................................................................................................................................... 33
Table 36: Power Button (PWRBTN#)........................................................................................................................................................33
Table 37: Batlow .............................................................................................................................................................................................. 33
Table 38: LID Switch (LID#)..........................................................................................................................................................................33
Table 39: Sleep Button (SLEEP#) ...............................................................................................................................................................33
Table 40: External SPI/GSPI Support........................................................................................................................................................34
Table 41: External BIOS ROM Support ......................................................................................................................................................34
Table 42: Speaker Out (SPKR) .....................................................................................................................................................................34
Table 43: Watchdog Timeout (WDT) ........................................................................................................................................................34
Table 44: General Purpose IOs.................................................................................................................................................................... 35
Table 45: External Fan Control ................................................................................................................................................................... 35
Table 46: UART Serial Ports......................................................................................................................................................................... 35
Table 47: Power Supply Control Settings................................................................................................................................................38
Table 48: ATX mode settings.......................................................................................................................................................................39
Table 49: Single Supply Mode Settings....................................................................................................................................................40
Table 50: Heatspreader Test Temperature Specifications.................................................................................................................41
Table 51: Onboard Fan Connector ..............................................................................................................................................................43
Table 52: Standards Compliance................................................................................................................................................................44
Table 53: MTBF.................................................................................................................................................................................................45
Table 54: Supported BIOS Features...........................................................................................................................................................50
Table 55: SPI Boot Pin Configuration.........................................................................................................................................................50
Table 56: Supported SPI Boot Flash Types for 8-SOIC Package .......................................................................................................51
Table 57: Dual Stage Watchdog Timer- Time-out Events ................................................................................................................. 52
Table 58: I2C Bus Port Address................................................................................................................................................................... 53
Table 59: SMBus Address ............................................................................................................................................................................. 53
Table 60: General Signal Description........................................................................................................................................................ 55
Table 61: Connector X1A Row A Pin Assignment (A1- A110)............................................................................................................... 56
Table 62: Connector X1A Row B Pin Assignment (B1-B110)................................................................................................................61
Table 63: Connector X1B Row C Pin Assignment (C1-C110)................................................................................................................ 65
Table 64: Connector X1B Row D Pin Assignment (D1-D110) ..............................................................................................................68
Table 65: Bootstrap Signals..........................................................................................................................................................................71
Table 66: Navigation Hot Keys Available in the Legend Bar.............................................................................................................. 72
Table 67: Main Setup Menu Sub-screens.................................................................................................................................................75
Table 68: Advanced Setup menu Sub-screens and Functions..........................................................................................................77
Table 69: Chipset menu Sub-screens and Functions..........................................................................................................................90
Table 70: Chipset PCH-IO Configuration ..................................................................................................................................................94
Table 71: Security Setup Menu Functions................................................................................................................................................98
Table 72: Boot Menu Functions ................................................................................................................................................................100
Table 73: Save and Exit Setup Menu Functions....................................................................................................................................101

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Table 74: List of Acronyms.........................................................................................................................................................................104
List of Figures
Figure 1: COMe-cTL6........................................................................................................................................................................................14
Figure 2: Block Diagram COMe-cTL6..........................................................................................................................................................21
Figure 3: Front View COMe-cTL6................................................................................................................................................................22
Figure 4: Rear View COMe-cTL6 .................................................................................................................................................................23
Figure 5: Block Diagram 11th Generation processor (Source: Intel)................................................................................................24
Figure 6: Temperature Sensor #1 Location: CPU...................................................................................................................................42
Figure 7: Temperature Sensor #2 Location: HW-Monitor .................................................................................................................42
Figure 8: Fan Connector 3-Pin.....................................................................................................................................................................43
Figure 9: MTBF De-rating Values (Reliability report article number 36030-0000-18-2).......................................................45
Figure 10: MTBF De-rating Values (Reliability report article number 36031-1600-18-7) .......................................................46
Figure 11: Module Dimensions.....................................................................................................................................................................47
Figure 12: Module Height...............................................................................................................................................................................48
Figure 13: Heatspreader Location and Dimensions..............................................................................................................................48
Figure 14: X1A and X1B COMe Interface Connectors ............................................................................................................................54
Figure 15: Main Setup Menu..........................................................................................................................................................................75
Figure 16: Advanced Setup Menu ................................................................................................................................................................77
Figure 17: Chipset Menu Initial Screen......................................................................................................................................................89
Figure 18: Chipset> System Agent (SA) Configuration Setup Menu Initial Screen.....................................................................90
Figure 19: Chipset PCH-IO Configuration Setup menu Initial Screen ..............................................................................................94
Figure 20: Security Setup Menu Initial Screen .......................................................................................................................................98
Figure 21: Boot Screen..................................................................................................................................................................................100
Figure 22: Save and Exit Setup Menu Initial Screen............................................................................................................................101

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1/ Introduction
1.1. Product Description
The COMe-cTL6 (E2) deliver high-performance, feature-rich Computer-on-Modules based on the standardized COM
Express® compact form factor and Intel`s single package BGA1449 System-on-Chip (SoC). The SoCs are containing
Intel® 11th Generation Core™/Celeron family. Through the use of COM Express connectors, the COMe-cTL6 is easily
exchangeable and offers the most flexibility for customers designing it into their embedded devices based on
individual carrier boards.
The Kontron COMe-cTL6 (E2) modules allow up to 48 GB of DDR4 memory. The board is also suited for harsh
operating conditions in industrial environments. For example, rugged modules are available that can be used within a
temperature range from -40°C to +85°C. The option with a soldered main memory (memory down) of up to 16 GB
DDR4 ensures even more robustness.
The COMe-cTL6 is ideally suited as a powerful successor for existing solutions, as it takes over their pin assignment
and feature implementation. Typical applications include communication, digital signage, professional gaming and
entertainment, medical imaging, surveillance and security, industrial edge computing as well as industrial plant-,
machine- and robot-control at the shop floor level and from the control room.
Basic COMe-cTL6 features are:
Dual/Quad -Core CPU on COM Express® compact form factor (Pin-out Type 6 compliant)
Based on 11th Gen Intel® Core™ technology
Up to 48 GB DDR4 non-ECC memory via 1x SO-DIMM socket (for up to 32 GB memory modules) + up to 16 GB non-
ECC memory down (on 2nd channel, optional)
Intel® Iris®Xe Graphics with up to four independent display support with 4K resolutions (up to 8K)
LVDS/eDP support
Up to 2.5Gb Ethernet, TSN support, WOL support
SATA 6 Gb/s & USB 3.1 Gen2 support
Support for Audio and common features (SPI, LPC, SMB)
TPM support
Optional vPro support
Optional NVMe SSD onboard
E2 versions for industrial grade temp. range (-40°C up to +85°C)
Figure 1: COMe-cTL6

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1.2. Product Naming Clarification
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a super component. The product names for Kontron COM Express® Computer-on-Modules
consist of:
Short form of the industry standard
COMe-cTL6
Module form factor
b=basic (125 mm x 95 mm)
c=compact (95mm x 95 mm)
m=mini (84 mm x 55 mm)
Processor code name
TL = Tiger Lake
Pinout type
Type 6
Available temperature variants
Extended (E1)
Industrial by design (E2)
Processor Identifier
Chipset identifier (if chipset assembled)
Memory size
Memory Down
1.3. COM Express® Documentation
The COM Express® specification defines the COM Express® module form factor, pinout and signals. The COM Express
document is available at the PICMG® website.
1.4. COM Express® Functionality
All Kontron COM Express® basic and compact modules contain two 220-pin connectors. Each connector has two rows
called Row A & B on primary connector and Row C & D on secondary connector. COM Express® Computer-On-Modules
feature the following maximum amount of interfaces according to the PICMG module pinout type:
Table 1: IOs of Type 6 and COMe-cTL6
Feature Type 6 Pinout COMe-cTL6 Pinout
HD Audio 1x 1x
Gb Ethernet 1x 1x
Serial ATA 4x 2x
PCI Express x 1 8x 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x
without Ethernet & SATA)
PCI Express x16 (PEG) 1x 4x PCIe 3.0 on PEG Lanes #0-3
USB 4x USB 3.0 (incl. USB
2.0) + 4x USB 2.0
4x USB 3.1 Gen 2 (Incl. USB 2.0) + 4x USB 2.0
Corresponding USB ports are configured to USB 3.1

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Feature Type 6 Pinout COMe-cTL6 Pinout
Gen1 by default as support depends on appropriate
carrier board design
VGA 1x 1x (optional)
LVDS Dual Channel Dual Channel LVDS with option to overlay with
embedded Display port (eDP)
DP++
(eDP/DP/HDMI/DVI/VGA)
3x 2x
LPC 1x 1x
External SMB 1x 1x
External I2C 1x 1x
GPIO 8x 8x
SDIO shared w/GPIO 1x optional 1x optional
UART (2-wire COM) 2x 2x
Fan PWM out 1x 1x
1.5. COM Express® Benefits
COM Express® defines a Computer-On-Module, or COM, with all the components necessary for a bootable host
computer, packaged as a highly integrated computer. All Kontron COM Express® modules are very compact and
feature a standardized form factor and a standardized connector layout that carry a specified set of signals. Each
COM is based on the COM Express® specification. This standardization allows designers to create a single-system
baseboard that can accept present and future COM Express® modules.
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can
place connectors precisely where needed for the application, on a baseboard optimally designed to fit a system’s
packaging.
A single baseboard design can use a range of COM Express® modules with different sizes and pinouts. This flexibility
differentiates products at various price and performance points and provides a built-in upgrade path when designing
future-proof systems. The modularity of a COM Express® solution also ensures against obsolescence when computer
technology evolves. A properly designed COM Express® baseboard can work with several successive generations of
COM Express® modules.
A COM Express® baseboard design has many advantages of a customized computer-board design and, additionally,
delivers better obsolescence protection, heavily reduced engineering effort, and faster time to market.

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2/ Product Specification
2.1. Module Variants
The COMe-cTL6 is available in different processor and temperature variants to cover demands in performance, price
and power.
2.1.1. Commercial Grade Modules (0°C to +60°C)
Commercial Grade Modules (0°C to +60°C) are available as a standard product number.
Table 2: Commercial Grade Modules (0°C to +60°C)
Product Number Product Name Description
36030-1610-18-7 COMe-cTL6 i7-1185G7E
16 GB/1 TB
COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Core™ i7-1185G7E, 4x 1.8 GHz, 16 GB
memory down, DDR4 SO DIMM Socket, 1024 GB NVMe
36030-1600-18-7 COMe-cTL6 i7-1185G7E 16 GB COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Core™ i7-1185G7E, 4x 1.8 GHz, 16 GB
memory down, DDR4 SO DIMM Socket
36030-0000-18-7 COMe-cTL6 i7-1185G7E COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Core™ i7-1185G7E, 4x 1.8 GHz, DDR4
SO DIMM Socket
36030-8000-15-5 COMe-cTL6 i5-1145G7E 8 GB COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Core™ i5-1145G7E, 4x 1.5 GHz, 8 GB
memory down, DDR4 SO DIMM Socket
36030-0000-15-5 COMe-cTL6 i5-1145G7E COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Core™ i5-1145G7E, 4x 1.5 GHz, DDR4
SO DIMM Socket
36030-0000-22-3 COMe-cTL6 i3-1115G4E COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Core™ i3-1115G4E, 2x 2.2 GHz, DDR4
SO DIMM Socket
36030-0000-18-2 COMe-cTL6 6305E COM Express® compact pin-out type 6 Computer-on-
Module with Intel® Celeron® 6305E, 2x 1.8 GHz, DDR4 SO
DIMM Socket
2.1.2. Extended Temperature Grade Modules (E1, -25°C to 75°C)
Extended Temperature grade modules (E1, -25°C to 75°C) are available as a standard product number, on request. For
further information, contact your local Kontron sales representative or Kontron Inside Sales.

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2.1.3. E2 Modules (E2, -40°C to +85°C)
The following table provides a list of E2 modules available for E2 temperature grade (-40°C to +85°C) by design.
Table 3: E2 Modules (E2, -40°C to +85°C operating)
Product Number Product Name Description
36031-1600-18-7 COMe-cTL6 E2 i7-1185GRE 16 GB COM Express® compact pin-out type 6 Computer-
on-Module with Intel® Core™ i7-1185GRE, 4x 1.8 GHz,
16 GB memory down, DDR4 SO DIMM Socket,
industrial temperature grade
36031-8000-15-5 COMe-cTL6 E2 i5-1145GRE 8 GB COM Express® compact pin-out type 6 Computer-
on-Module with Intel® Core™ i5-1145GRE, 4x 1.5 GHz,
8 GB memory down, DDR4 SO DIMM Socket,
industrial temperature grade
36031-0000-22-3 COMe-cTL6 E2 i3-1115GRE COM Express® compact pin-out type 6 Computer-
on-Module with Intel® Core™ i3-1115GRE, 2x 2.2 GHz,
DDR4 SO DIMM Socket, industrial temperature grade
2.2. Accessories
Accessories are either COMe-cTL6 product specific, COMe Type 6 specific or general accessories.
Table 4: Product Accessories
Part Number Heatspreader (validated ref.types) Description
36030-0000-99-0 HSP COMe-cTL6 Cu-core threaded Heatspreader for COMe-cTL6, Cu-core, threaded
mounting holes
36030-0000-99-1 HSP COMe-cTL6 Cu-core through Heatspreader for COMe-cTL6, Cu-core, through
mounting holes
Table 5: COMe Type 6 Specific Accessories
Part Number COMe Carrier Project Code Comment
38115-0000-00-x COM Express®
Reference Carrier-i Type 6
ADTI Thin-mITX Carrier with 5 mm
COMe connector
38116-0000-00-5 COM Express® Eval Carrier2 Type
6
ADT6 ATX Carrier with 5 mm COMe
connector
Part Number COMe Adapter/Card Project Code Comment
96007-0000-00-3 ADA-PCIe-DP APDP PCIe x16 to DP Adapter for
Evaluation Carrier
96007-0000-00-7 ADA-Type6-DP3 DVO6 (sandwich) Adapter Card for 3x
DisplayPort
38019-0000-00-0 ADA-COMe-Height-dual EERC Height Adapter

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Table 6: General Accessories
Part Number Cooling Solutions Comments
36099-0000-99-4 COMe Active Uni Cooler2 (w/o
HSP)
COM Express® Universal Active Cooler for
Heatspreader Mounting (95x95x14.3) - 90° turnable
36099-0000-99-5 COMe Passive Uni Cooler2 (w/o
HSP)
COM Express® Universal Passive Cooler for
Heatspreader Mounting (95x95x14.3) - 90° turnable
Part Number Mounting Comments
38017-0000-00-5 COMe Mount KIT 5 mm 1 set Mount. Kit for 1 module + screws for 5 mm conn.
38017-0100-00-5 COMe Mount KIT 5 mm 100 sets Mount. Kit for 100 module + screws for 5 mm conn.
38017-0000-00-0 COMe Mount KIT 8 mm 1 set Mount. Kit for 1 module + screws for 8 mm conn.
38017-0100-00-0 COMe Mount KIT 8 mm 100 sets Mount. Kit for 100 module + screws for 8 mm conn.
Part Number Display Adapter Comment
96006-0000-00-8 ADA-DP-LVDS DP to LVDS adapter
96082-0000-00-0 KAB-ADAPT-DP-DVI DP to DVI adapter cable
96083-0000-00-0 KAB-ADAPT-DP-VGA DP to VGA adapter cable
96084-0000-00-0 KAB-ADAPT-DP-HDMI DP to HDMI adapter cable
Part Number Cables Comment
96079-0000-00-0 KAB-HSP 200mm Cable adapter to connect FAN to module
(COMe basic/compact)
96079-0000-00-2 KAB-HSP 40 mm Cable adapter to connect FAN to module
(COMe basic/compact)
Table 7: Memory
Part Number Memory Description
97020-3232-CTL6 DDR4-3200 SODIMM 32GB_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 32 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6
97020-1632-CTL6 DDR4-3200 SODIMM 16GB_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 16 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6
97020-0832-CTL6 DDR4-3200 SODIMM 8GB_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 8 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6
97020-0432-CTL6 DDR4-3200 SODIMM 4GB_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 4 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6
97021-3232-CTL6 DDR4-3200 SODIMM 32GB E2_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 32 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6 E2
97021-1632-CTL6 DDR4-3200 SODIMM 16GB E2_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 16 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6 E2
97021-0832-CTL6 DDR4-3200 SODIMM 8GB E2_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 8 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6 E2
97021-0432-CTL6 DDR4-3200 SODIMM 4GB E2_CTL6 Memory for Computer-on-Module COMe-cTL6; min.
specification: DDR4-3200, 4 GB, 260P, 1600 MHz,
PC4-3200 SODIMM; validated for: COMe-cTL6 E2

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2.3. Functional Specification
2.3.1. Technical Data
Table 8: Technical Data
Function Definition
Compliance COM Express® compact, Pin-out Type 6
Dimensions (H X W) 95mm x 95 mm
CPUs Intel 11th generation processors:
i7-1185G7E
i5-1145G7E
i3-1115G4E
6305E
i7-1185GRE
i5-1145GRE
i3-1115GRE
Main Memory 1x DDR4 SO-DIMM up to 32 GByte
2nd channel DDR4 memory down up to 16 GByte
Graphics Controller Intel® Iris®Xe Graphics on i7/i5 processors
Intel® UHD Graphics on i3/Celeron® processors
Graphic Interfaces 3x DP++, LVDS
Ethernet Controller Intel® I225LM/I225IT
Ethernet Up to 2.5 Gb Ethernet with TSN support (depending on SKU)
Storage 2x SATA 6 Gb/s, up to 1 TByte NVMe SSD (on request)
PCI Express 5x PCIe 3.0 (On request: 6x without Ethernet, up to 8x without Ethernet & SATA),
1 x4 PCIe 4.0 on PEG Lanes #0-3
USB 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0
Serial 2x serial interface (RX/TX only)
Audio High Definition Audio interface
Other Features (G)SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
Special Features POSCAP capacitors, Trusted Platform Module TPM 2.0
Features on Request vPRO (AMT/TXT/AES Support), eDP instead of LVDS, VGA, up to 3x PCIe x1 additional
w/o Ethernet & SATA, NVMe SSD, Fail Safe via 2nd SPI Flash
BIOS AMI Aptio V
Power Management ACPI 6.0
Power Supply 8.5 V – 20 V Wide Range, Single Supply Power
Operating Systems Windows®10, Linux, VxWorks
Temperature Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating,
Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating,
Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Humidity 93 % relative Humidity at 40 °C, non-condensing (according to IEC 60068-2-78)