S&T Kontron OSM-S i.MX8M Mini User manual


USER GUIDE
www.kontron-electronics.de CONFIDENTIAL
OSM-S i.MX8M Mini
Doc. Rev. 0.5

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
OSM-S I.MX8M MINI - USER GUIDE
Disclaimer
Kontron Electronics would like to point out that the information contained in this user guide may be subject to altera-
tion, particularly as a result of the constant upgrading of Kontron Electronics products. This document does not entail
any guarantee onthe partof Kontron Electronicswith respectto technical processes described inthe user guide orany
product characteristics set out in the user guide. Kontron Electronics assumes no responsibility or liability for the use
of the described product(s), conveys no license or title under any patent, copyright or mask work rights to these prod-
ucts and makes no representations or warranties that these products are free from patent, copyright or mask work
rightinfringement unlessotherwise specified.Applicationsthataredescribedinthisuser guideareforillustrationpur-
poses only. Kontron Electronics makes no representation or warranty that such application will be suitable for the
specified use without further testing or modification. Kontron Electronics expressly informs the user that this user
guide onlycontains a general description ofprocesses andinstructions whichmay not be applicable inevery individual
case. In cases of doubt, please contact Kontron.
This user guide is protected by copyright. All rights are reserved by Kontron. No part of this document may be repro-
duced, transmitted, transcribed, stored in a retrieval system, or translated into any language or computer language, in
any formor by any means(electronic, mechanical, photocopying, recording, or otherwise),without the express written
permission of Kontron. Kontron Electronics points out that the information contained in this user guide is constantly
being updated in line with the technical alterations and improvements made by Kontron Electronics to the products
and thus this user guide only reflects the technical status of the products by Kontron Electronics at the time of pub-
lishing.
Brand and product names are trademarks or registered trademarks of their respective owners.
©2019 by Kontron Electronics GmbH
Kontron Electronics GmbH
Max-Planck-Str. 6
72636 Frickenhausen
Germany
www.kontron-electronics.de
Kontron Europe GmbH
Lise-Meitner-Str. 3-5
86156 Augsburg
Germany
www.kontron.com

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Intended Use
THIS DEVICE AND ASSOCIATED SOFTWARE ARE NOT DESIGNED, MANUFACTURED OR INTENDED FOR USE
OR RESALE FOR THE OPERATION OF NUCLEAR FACILITIES, THE NAVIGATION, CONTROL OR COMMUNICA-
TION SYSTEMS FOR AIRCRAFT OR OTHER TRANSPORTATION, AIR TRAFFIC CONTROL, LIFE SUPPORT OR
LIFE SUSTAINING APPLICATIONS, WEAPONS SYSTEMS, OR ANY OTHER APPLICATION IN A HAZARDOUS EN-
VIRONMENT, OR REQUIRING FAIL-SAFE PERFORMANCE, OR IN WHICH THE FAILURE OF PRODUCTS COULD
LEAD DIRECTLY TO DEATH, PERSONAL INJURY, OR SEVERE PHYSICAL OR ENVIRONMENTAL DAMAGE (COL-
LECTIVELY, "HIGH RISK APPLICATIONS").
You understand and agree that your use of Kontron Electronics devices as a component in High Risk Applications is
entirely at your risk. To minimize the risks associated with your products and applications,you should provide ade-
quate design and operating safeguards. You are solely responsible for compliance with alllegal, regulatory, safety,
and security related requirements concerning your products. You are responsible to ensure that your systems (and
any Kontron Electronics hardware or software components incorporated in your systems) meet all applicable re-
quirements. Unless otherwise stated inthe product documentation, the Kontron Electronics deviceis not provided
with error-tolerance capabilities and cannot therefore be deemed as being engineered, manufactured or setup to be
compliant for implementation or for resale as device in High Risk Applications. All application and safety related infor-
mation in this document (including application descriptions,suggested safety measures, suggested Kontron Electron-
ics products, and other materials) is provided for reference only.

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Revision History
Revision
Brief Description of Changes
Date of Issue
Au-
thor/Ed
itor
0.1
Basic draft
2021-04-21
Gb
0.2
Updated pin mux table
2022-01-14
Ar
0.3
Updated product name
2022-03-08
Gb
0.4
Change to OSM V1.1
2022-04-27
Gb
0.5
Typo correction
Updated pin mux table
2023-03-16
Gb
Customer Support
Find Kontron Electronics contacts by visiting: http://www.kontron-electronics.de.
Customer Comments
If you have any difficulties using this user guide, discover an error, or just want to provide some feedback, contact
[email protected]. Detail any errors you find. We will correct the errors or problems as soon as possible
and provide the revised user guide.

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Symbols
The following symbols may be used in this user guide
DANGER indicates a hazardous situation which, if not avoided,
will result in death or serious injury.
WARNING indicates a hazardous situation which, if not avoided,
could result in death or serious injury.
NOTICE indicates a property damage message.
CAUTION indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury.
Electric Shock!
This symbol and title warnof hazards due to electrical shocks (> 60 V) when touching prod-
ucts or parts of products. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your material.
ESD Sensitive Device!
This symbol and titleinform that theelectronic boards and theircomponents are sensitiveto
staticelectricity. Caremusttherefore betakenduring allhandling operationsand inspections
of this product in order to ensureproduct integrity at all times.
HOT Surface!
Do NOT touch! Allow to cool before servicing.
Laser!
This symbol inform of the risk of exposure to laser beam and light emitting devices (LEDs)
from an electrical device. Eye protection per manufacturer notice shall review before ser-
vicing.
This symbol indicates general information about the product and the user guide.
This symbol also indicates detail information about the specific product configuration.
This symbol precedes helpful hints and tips for daily use.

OSM-S i.MX8M Mini Rev. 0.5
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Special Handling and Unpacking Instruction
ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. Therefore, care
must be taken during all handling operations and inspections of this product, in order to en-
sure product integrity at all times.
Do not handle this product out of its protective enclosure while it is not used for operational purposes unless it is oth-
erwise protected.
Whenever possible, unpack or pack this product only at EOS/ESD safe work stations. Where a safe work station is not
guaranteed, it is important for the user to be electrically discharged before touching the product with his/her hands
or tools. This is most easily done by touching a metal part of your system housing.
It is particularly important to observe standard anti-static precautions when changing piggybacks, ROM devices,
jumper settings etc. If the product contains batteries for RTC or memory backup, ensure that the product is not placed
on conductive surfaces, including anti-static plastics or sponges. They can cause short circuits and damage the bat-
teries or conductive circuits on the product.
Quality and Environmental Management
Kontron aims to deliver reliable high-end products designed and built for quality, and aims to complying with envi-
ronmental laws, regulations, and other environmentally oriented requirements.
responsibilities, visit https://www.kontron-
electronics.de/unternehmen/qualitaet/.

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Table of Contents
Symbols.................................................................................................................................................................................................................7
Special Handling and Unpacking Instruction ........................................................................................................................................... 8
Quality and Environmental Management................................................................................................................................................ 8
Table of Contents...............................................................................................................................................................................................9
List of Tables.......................................................................................................................................................................................................9
List of Figures....................................................................................................................................................................................................10
1/ Introduction..........................................................................................................................................................................................11
2/ Description...........................................................................................................................................................................................12
2.1. Product Variants and Accessories.......................................................................................................................................................13
3/ System Specifications......................................................................................................................................................................14
3.1. Component Main Data.............................................................................................................................................................................14
3.2. Environmental Conditions.....................................................................................................................................................................15
3.3. Functional Block Diagram......................................................................................................................................................................16
4/ Board and Connectors......................................................................................................................................................................17
4.1.1. Connectors ...............................................................................................................................................................................................17
4.2. SoM view and locations.........................................................................................................................................................................17
4.3. Bottom Side................................................................................................................................................................................................18
4.4. Mechanical Drawings.............................................................................................................................................................................19
4.5. Pinout diagram of OSM-S i.MX8M Mini.............................................................................................................................................21
4.5.1. Pinout of OSM-S i.MX8M Mini..........................................................................................................................................................22
5/ Installation..........................................................................................................................................................................................33
5.1. Power Control............................................................................................................................................................................................33
5.1.1. Power Supply..........................................................................................................................................................................................33
5.1.2. Supply voltage.......................................................................................................................................................................................34
5.1.3. Supply current .......................................................................................................................................................................................34
5.1.4. Output Voltage.......................................................................................................................................................................................34
5.1.5. IO voltage.................................................................................................................................................................................................35
5.2. Reset pin.....................................................................................................................................................................................................35
5.3. Boot Mode..................................................................................................................................................................................................35
5.3.1. SD/MMC manufacture mode............................................................................................................................................................35
5.3.2. Serial Downloader...............................................................................................................................................................................36
5.4. SD card........................................................................................................................................................................................................36
5.5. Console........................................................................................................................................................................................................ 37
6/ Thermal considerations .................................................................................................................................................................38
7/ Reflow profile.....................................................................................................................................................................................39
8/ Technical Support.............................................................................................................................................................................40
8.1. First Steps Startup-Information Baseboard...............................................................................................................................40
8.2. Extended Support....................................................................................................................................................................................40
8.3. Disclaimer & License Information......................................................................................................................................................40
About Kontron Electronics............................................................................................................................................................................41
List of Tables
Table 1: Product Variants of OSM-S i.MX8M Mini..................................................................................................................................13
Table 2: Component Main Data....................................................................................................................................................................14
Table 3: Environmental Conditions ............................................................................................................................................................15
Table 4: Connectors of OSM-S i.MX8M Mini ...........................................................................................................................................17

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Table 5: Mechanical Dimensions................................................................................................................................................................20
Table 6: Pinout of OSM-S i.MX8M Mini ....................................................................................................................................................32
Table 7: Supply voltage .................................................................................................................................................................................34
Table 8: Supply current VCC_IN_5V..........................................................................................................................................................34
Table 9: RTC_PWR current...........................................................................................................................................................................34
Table 10: Output Current...............................................................................................................................................................................34
Table 11: FORCE_RECOVERY# pin settings..............................................................................................................................................35
Table 12: Reflow profile.................................................................................................................................................................................39
List of Figures
Figure 1: 30x30mm SoM with LGA package.............................................................................................................................................12
Figure 2: Block Diagram..................................................................................................................................................................................16
Figure 3: Top View............................................................................................................................................................................................17
Figure 4: Bottom View.....................................................................................................................................................................................18
Figure 5: Dimensions of OSM-S i.MX8M Mini (top view).....................................................................................................................19
Figure 6: Footprint Grid...................................................................................................................................................................................19
Figure 7: Keep out area on baseboard (bottom view).........................................................................................................................20
Figure 8: pin assignment (top view)...........................................................................................................................................................21
Figure 9: power supply scheme..................................................................................................................................................................33
Figure 10: SD-Card connection example..................................................................................................................................................36
Figure 11: Reflow Classification Profile ....................................................................................................................................................39

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1/ Introduction
This user guide describes the 30mmx30mm SoM form factor module - OSM-S i.MX8M Mini . The Advanced RISC Ma-
chines (ARM) based module is equipped with NXP i.MX8M Mini processor. The quad core SoC takes advantage of the
optimized power consumption and performance ratio.
The use of this user guide implies a basic knowledge of PC hardware and software. This user guide is focused on de-
scribing the special features and is not intended to be a standard PC textbook. New users are recommended tostudy
the short installation procedure, before switching on the power.
All configuration and setup ofthe module is performed using the u-Boot CLI.
Latest revision of this user guide, datasheet, and BSPs (Board Support Packages) can be downloaded from Kontron
Electronics Web Page.

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2/ Description
The OSM-S i.MX8M Mini is a very small System-on-Module (SoM) using NXPs i.MX8M Mini processor with ARM
Quad Cortex A53 and Cortex M4. The OSM-S i.MX8M Mini is a highly integrated, small sized module for integra-
tion in embedded systems with 30mmx30mm footprint. The module is compatible with SGETs OSM standard size
s.
The complexity of the DDR4 memory, power management and processor connection are contained in the SOM
and simplifies baseboard development.
Figure 1: 30x30mm SoM with LGA package
Main characteristics of the OSM-S i.MX8M Mini are:
quad Arm® Cortex®-A53 core with up to 1.6 GHz and Cortex®-M4 400 MHz core processor is forlow-power pro-
cessing
Up to 4 GB LPDDR4 memory down
4 to 64 GB eMMC
2 MB QSPI boot flash
8kB EEPROM
1x ultra low power RTC
2D GPU and 3D GPU (1x shader, OpenGL ES 2.0)
1x MIPI DSI (4-lane) with PHY
1x MIPI CSI (4-lane) with PHY
Video Playback with 1080p60
1x Gigabit Ethernet (MAC) with AVB and IEEE 1588, Energy Efficient Ethernet (EEE) for low power
2x USB 2.0 OTG controllers with integrated PHY
4x UART
2x I2C
2x SPI
24x GPIO
3x PWM
1x PCIe 2.0 (1-lane) with L1 low power substates
1x I2S
2x SDIO (1x 4bit, 1x 8bit)

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2.1. Product Variants and Accessories
Order Information:
Table 1: Product Variants of OSM-S i.MX8M Mini
Board
Description
Product Number
OSM-S i.MX8M Mini
1GB/8GB -25..+85°
SoM with NXP I.MX8M Mini quad core processor, 1 GB
LPDDR4 and 8 GB eMMC
40099 227
OSM-S i.MX8M Mini
2GB/8GB -25..+85°
SoM with NXP I.MX8M Mini quad core processor, 2 GB
LPDDR4 and 8 GB eMMC
40099 229
OSM-S i.MX8M Mini
4GB/32GB -25..+85°
SoM with NXP I.MX8M Mini quad core processor, 4 GB
LPDDR4 and 32 GB eMMC
40099 231
Table 2: Development Kits of OSM-S i.MX8M Mini
Board
Description
Product Number
TBD
TBD

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3/ System Specifications
3.1. Component Main Data
The table below summarizes the features of the SoM.
Table 2: Component Main Data
OSM-S I.MX8MM
Form factor
30x30mm with 332 LGA pads
Processor
NXP MIMX8MM6CVTKZAA with 14mm x 14mm BGA package in 0.5mm pitch (industrial
version) up to 1.6 GHz
Memory
1.6 GHz 32-bit LPDDR4
1 GByte: 1x 8 Gbit density 256 M x32 LPDDR4 parts
2 GByte: 1x 16 Gbit density 512 M x32 LPDDR4 parts
4 GByte: 1x 32 Gbit density 1024 M x32 LPDDR4 parts
Boot Flash
2 MB SPI NOR flash in USON (2x3mm) package connected on ECSPI1
EEPROM
8kB EEPROM on I2C1
Bootloader/BIOS
U-Boot Bootloader
embedded Multi-
media Card
(eMMC)
4 to 64 GB MLC (Multi-level Cell) connected on SD1
Display
1x MIPI DSI (4-lane) with PHY
Resolution: up to Full-HD 1080p @60 fps
Onboard Controllers
Ethernet Controller
Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE),
Ethernet AVB, and IEEE 1588, no phy on SoM
Watchdog Timer
CPU internal watchdog, configurable timeout counter with timeout periods from 0.5 to 128
seconds
System Manage-
ment Controller
No dedicated System Management Controller on module System settings can be arranged
in U-Boot environment variables
H/W Status Moni-
tor
CPU internal temperature monitoring sensor
Power manage-
ment
PCA9450AHN from NXP
RTC
1x RV-3028-C7 on I2C1, 45 nA @ 3 V, factory calibrated to ±1 ppm @ 25°C
Operating System
Support
Linux Yocto
Default Interfaces
I2C
3x (2x general purpose, 1x dedicated for PCIe and CSI)
LAN, USB
1x Gigabit Ethernet, 2x USB 2.0 OTG
Display
1x MIPI DSI (4-lane) with up to 1920 x 1080 @60fps
Camera
1x MIPI CSI (4-lane)
SD-Card
2x SDIO (1x 4bit, 1x 8bit)
UART
4x (1x console, 3x general purpose)
GPIO
24x

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PWM
3x
other Connectivity
1x SAI (I2S)
2x SPI
1x PCIe
Power
Consumption
Maximum Power consumption of the board is measured to <3,5 W
Input Voltage
Single Supply 5V ±5%
3.2. Environmental Conditions
Table 3: Environmental Conditions
Operating
industrial: -25°C to 85°C
relative humidity (non-condensing) 10 % to 93 % at 40°C
Storage
commercial grade: -40°C to +85°C
relative humidity (non-condensing) 10 % to 93 % at 40°C

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3.3. Functional Block Diagram
The block diagram shows a detailed structure of the OSM-S i.MX8M Mini module.
Figure 2: Block Diagram

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4/ Board and Connectors
4.1.1. Connectors
Table 4: Connectors of OSM-S i.MX8M Mini
Connector
Function
Remark
LGA package
Central Interface
solderable
4.2. SoM view and locations
Figure 3: Top View
1. PMIC
2. LPDDR4
3. eMMC
4. i.MX8M Mini
5. NOR-Flash
3
2
1
5
4

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4.3. Bottom Side
Figure 4: Bottom View
1. Pin A1 (missing)
2. Unique ID
3. Test points (factory use only)
4. Keep out area on base board
2
4
3
1

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4.4. Mechanical Drawings
Figure 5: Dimensions of OSM-S i.MX8M Mini (top view)
Figure 6: Footprint Grid

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Figure 7: Keep out area on baseboard (bottom view)
Dimension
Description
Size
30 mm x 30 mm
PCB Thickness
1.5 mm ± 0.1 mm
Total height
2.5 ± 0.1 mm
Weigth
max. 5 g
Table 5: Mechanical Dimensions