SEMIKRON SEMITRANS IGBT User manual

SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 1 of 8
23.08.2011
©
by
SEMIKRON
Mounting Instructions
SEMITRANS® IGBT Modules
Norbert Schäfer
Mai 2011
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 2 of 8
23.08.2011
©
by
SEMIKRON
1 ESD Protection
SEMITRANS®IGBT modules are electrostatic sensitive devices. All modules SEMITRANS®2,3 and 4 are
supplied with ESD protection via a conductive connection between the gate and emitter terminals. This
connection should be kept intact until the driver has been connected.
Module assembly must be carried out by qualified staff wearing conductive grounded bracelets at ESD
protected, grounded workstations.
2 Heat sink specifications
Preparation, surface specifications
In order to ensure good thermal contact and to obtain the thermal contact resistance values specified in
the datasheets, the contact surface of the heat sink must be clean and free from dust particles, as well as
fulfilling the following mechanical specifications:
♦The heat sink must be free from grease and particles
♦Unevenness of heat sink mounting area must be ≤50 µm per 100 mm (DIN EN ISO 1101)
♦Roughness “Rz” ≤10 µm (DIN EN ISO 4287)
♦No steps > 10 µm (DIN EN ISO 4287)
Fig. 1 Heat sink surface specifications
3 Thermal compound
Before assembly onto the heat sink, the module baseplate or the contact surface of the heat sink is to be
evenly coated with a thin layer (50µm – 100µm) of a thermal compound such as P12 from WACKER
CHEMIE or silicone-free paste HTC from ELECTROLUBE.
SEMIKRON recommends using screen printing to apply thermal paste. In certain cases a hard rubber
roller might be suitable for the application of thermal paste.
Rz
≤
10 µm
> 10 µm
Heat sink
≤
50 µm per 100 mm
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 3 of 8
23.08.2011
©
by
SEMIKRON
The thickness of the layer can be determined using a measurement gauge.
Supplier:
ELCOMETER Instruments GmbH
Ulmer Strasse 68
D-73431 Aalen
Germany
phone: [phone]
web: www.elcometer.de
Fig. 1 Wet Film Thickness Gauge 5 – 150 µm
4 Mounting torques
To secure SEMITRANS®IGBT modules, the use of either M6 steel screws (DIN 7045, property class 4.8)
in combination with suitable washers and spring lock washers or combination screws is strongly
recommended. When doing so, the torque value specified must be observed. The screws must be
tightened in diagonal order with equal torque in several steps until the specified torque value Mshas been
reached.
Housing Screw
Mounting torque M
s
[Nm]
Min
Max
SEMITRANS
®
2
M6 3 5
SEMITRANS
®
3
M6 3 5
SEMITRANS
®
4
M6 3 5
Table 1: Tightening torque for module mounting
It is further recommended that the screws are re-tightened according to the given torque value following a
period of a few hours, as part of the heat sink compound may spread under the mounting pressure.
For the electrical terminals, suitable screws, washers and spring lock washers or combination screws are
to be used. Here, the maximum and minimum thread reaches, which can be taken from the module
drawings (see data sheets), and the permissible tightening torque values Mtmust be observed:
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 4 of 8
23.08.2011
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SEMIKRON
Housing
Screw
M
t
[Nm]
Auxiliary
terminal Power terminal Min Max
SEMITRANS
®
2
- M5 2,5 5,0
SEMITRANS
®
3
- M6 2,5 5,0
SEMITRANS
®
4
(M4) M6 (1,1) 2,5 (2,0) 5,0
Table 2: Tightening torque for electrical terminals
5 Power Terminals
Where possible, laminated DC-link bus bars should be used for connections on the DC side of the circuit.
In this way, a minimum of stray inductance is produced, which in turn guarantees a low load with
switching surges. In most applications, the use of inductance pulse capacitors (MKP, MKT … 0.22 µF …
1µF) at the DC terminals (collector TOP-IGBT/emitter BOT IGBT) is recommended to prevent parasitic
oscillations.
6 Terminal pull forces
SEMITRANS®2
Cable connections of half bridge modules must be mounted in such way that the resulting pull forces per
power terminal of the module are limited to 200N and the resulting pull forces per control terminal of the
module are limited to 60N.
Fig. 3 Half bridge module (SEMITRANS®2)
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 5 of 8
23.08.2011
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SEMITRANS®3
Cable connections of half bridge modules must be mounted in such way that the resulting pull forces per
power terminal of the module are limited to 250N and the resulting pull forces per control terminal of the
module are limited to 60N.
Fig. 4 Half bridge module (SEMITRANS®3)
SEMITRANS®4
Cable connections of ingle switch modules must be mounted in such way that the resulting pull forces per
power terminal of the module are limited to 250N and the resulting pull forces per control terminal of the
module are limited to 150N.
Fig. 5 Single switch module (SEMITRANS®4)
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 6 of 8
23.08.2011
©
by
SEMIKRON
7 Terminal push forces
SEMITRANS®2
Cable connections of half bridge modules must be mounted in such way that the resulting pull forces per
power terminal of the module are limited to 250N and the resulting pull forces per control terminal of the
module are limited to 60N.
Fig. 6 Half bridge module (SEMITRANS®2)
SEMITRANS®3
Cable connections of half bridge modules must be mounted in such way that the resulting pull forces
per power terminal of the module are limited to 200N and the resulting pull forces per control terminal of
the module are limited to 60N.
Fig. 7 Half bridge module (SEMITRANS®3)
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 7 of 8
23.08.2011
©
by
SEMIKRON
SEMITRANS®4
Cable connections of ingle switch modules must be mounted in such way that the resulting pull forces per
power terminal of the module are limited to 250N and the resulting pull forces per control terminal of the
module are limited to 250N.
Fig. 8 Single switch module (SEMITRANS®4)
8 Driver connections
All control cables must be twisted conductor cables and kept as short as possible in order to minimize
stray inductance and avoid electromagnetic interference and oscillation.
SEMIKRON recommends the use of SEMIKRON drivers (data sheets available on the internet under:
http://www.semikron.com)
9 Mounting accessories
SEMIKRON offers a standard accessories kit (ID No. 33321100) for 10 SEMITRANS®2, 3 and 4 modules
each or 4 SEMITRANS®6, 7 modules each.
Units
Type
30 Cross recessed screws M4x8 Z4-1 DIN 7045-4.8
30 Cross recessed screws M5x12 Z4-1 DIN 7045-4.8
30 Cross recessed screws M6x12 Z4-1 DIN 7045-4.8
40 Cross recessed screws M6x16 Z4-1 DIN 7045-4.8
50 Push-on receptacles A2.8-0.5 (2.8 x 0.5)
Table 3: Content of accessories kit
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SEMITRANS
®
-
Technical Information
Version 1.0 - /2011
Page 8 of 8
23.08.2011
©
by
SEMIKRON
10 Disclaimer
SEMIKRON does not take on any liability for literal mistakes in the above displayed “Technical
Information”. The content of the information is according to today’s standards and knowledge
and written up with necessary care. A liability for usableness and correctness is excluded. A
liability for direct or secondary damages resulting from use of this information is excluded, unless
regulated by applicable law. The given examples are not taking in consideration individual cases,
therefore a liability is excluded. The content is subject to change without further notice. In
addition to that, the SEMIKRON terms and condition apply exclusively, valid version displayed
under http://www.semikron.com.
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