Sony Ericsson Developer's Board User manual

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Developer's Board Manual

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1 INTRODUCTION.............................................................................................................................................................4
1.1 OVERVIEW....................................................................................................................................................................4
1.2 SERVICE AND SUPPORT.................................................................................................................................................4
1.2.1 Web Page.............................................................................................................................................................4
1.3 RELATED DOCUMENTS.................................................................................................................................................4
1.4 ABBREVIATIONS...........................................................................................................................................................5
2 USING THE DEVELOPER'S KIT..................................................................................................................................6
2.1 DEVELOPER'S KIT CONTENTS.......................................................................................................................................6
2.2 ASSEMBLING THE DEVELOPER'S BOARD ......................................................................................................................6
2.2.1 Mounting a DM-xx Module..................................................................................................................................7
2.2.2 Mounting a CM-4x Module..................................................................................................................................8
2.3 SYSTEM REQUIREMENTS ..............................................................................................................................................9
2.4 CONNECTING THE HARDWARE ...................................................................................................................................10
2.4.1 DM-xx Family Connection.................................................................................................................................10
2.4.2 CM-4x Family Connection.................................................................................................................................11
2.5 CONFIGURING THE HARDWARE ..................................................................................................................................11
2.5.1 DM-15/25 Family Setup ....................................................................................................................................12
2.5.2 CM-4x Family Setup..........................................................................................................................................12
2.5.3 DM-10/20 Family Setup ....................................................................................................................................12
2.6 TESTING THE INSTALLATION ......................................................................................................................................13
2.6.1 Testing Voice Call Capability............................................................................................................................13
3 FUNCTIONAL DESCRIPTION....................................................................................................................................14
3.1 GENERAL....................................................................................................................................................................14
3.2 MECHANICAL DESCRIPTION .......................................................................................................................................19
3.3 POWER INTERFACE.....................................................................................................................................................19
3.4 OPERATION MODE......................................................................................................................................................20
3.5 MODULE_PWR_EN_B / WAKE SELECTION ..............................................................................................................21
3.6 SERIAL INTERFACE .....................................................................................................................................................21
3.7 SYSTEM CONNECTOR HEADER ...................................................................................................................................22
3.8 RF INTERFACE ...........................................................................................................................................................24
3.9 AUDIO INTERFACE......................................................................................................................................................24
3.10 FLASHING FIRMWARE.................................................................................................................................................24
3.11 OPERATION.................................................................................................................................................................24
3.11.1 Power On...........................................................................................................................................................24
3.11.2 Flow Control......................................................................................................................................................24
3.11.3 Power Down ......................................................................................................................................................25
4 TROUBLESHOOTING YOUR APPLICATION.........................................................................................................26
4.1 SYSTEM CONNECTOR HEADER ...................................................................................................................................26
4.2 SERIAL CONTROL .......................................................................................................................................................27
4.3 AUDIO INTERFACE......................................................................................................................................................27
4.3.1 Development System FAQ .................................................................................................................................28

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List of Tables
TABLE 1: DEVELOPER'S KIT CONTENT LIST.................................................................................................................................6
TABLE 2: BASELINE JUMPER SETTINGS FOR DM-15/25 .............................................................................................................12
TABLE 3: BASELINE DIP SETTINGS FOR DM-15/25....................................................................................................................12
TABLE 4: BASELINE JUMPER SETTINGS FOR CM-4X..................................................................................................................12
TABLE 5: BASELINE DIP SETTINGS FOR CM-4X.........................................................................................................................12
TABLE 6: BASELINE JUMPER SETTINGS FOR DM-10/20 .............................................................................................................12
TABLE 7: BASELINE DIP SETTINGS FOR DM-10/20....................................................................................................................12
TABLE 8: DESCRIPTION OF CONNECTORS, SWITCHES AND INDICATORS.....................................................................................19
TABLE 9: VDIG HEADER SETTINGS (X103) ..............................................................................................................................19
TABLE 10: VCC HEADER SETTINGS (X104)..............................................................................................................................20
TABLE 11: VOLTAGE LEVELS FOR EACH MODULE FAMILY .........................................................................................................20
TABLE 12: JUMPER SETTINGS FOR EACH MODULE FAMILY .........................................................................................................20
TABLE 13: VREF HEADER SETTINGS (X101)............................................................................................................................20
TABLE 14: DESCRIPTION OF OPERATION MODE SWITCH SETTINGS ...........................................................................................20
TABLE 15: MODULE ON STATE .................................................................................................................................................21
TABLE 16: RS-232 DB9 PIN-OUT ..............................................................................................................................................21
TABLE 17: RS-232 DB9 J22 ROUTING ......................................................................................................................................21
TABLE 18: HEADER X102 SETTINGS (J22-DCD) .......................................................................................................................21
TABLE 19: S3 SETTINGS TO ENABLE HW FLOW CONTROL ........................................................................................................22
TABLE 20: S3 SETTINGS TO DISABLE HW FLOW CONTROL .......................................................................................................22
TABLE 21: DIRECTION OF SERIAL DATA SIGNALS......................................................................................................................22
TABLE 22: PIN-OUT OF SYSTEM CONNECTOR HEADER ..............................................................................................................23
List of Figures
FIGURE 1: EXPLODED VIEW DRAWING OF DEVELOPER'S BOARD WITH DM-15/25 ........................................................................7
FIGURE 2: EXPLODED VIEW DRAWING OF DEVELOPER'S BOARD WITH HEAT SINK.........................................................................8
FIGURE 3: EXPLODED VIEW DRAWING OF DEVELOPER'S BOARD WITH CM-4X..............................................................................9
FIGURE 4: DM-XX CONNECTION DIAGRAM ...............................................................................................................................10
FIGURE 5: CM-4X CONNECTION DIAGRAM................................................................................................................................11
FIGURE 6: ASSEMBLE DRAWING OF DEVELOPER'S BOARD (REVISION P1F)...............................................................................15
FIGURE 7: ASSEMBLE DRAWING OF DEVELOPER'S BOARD (REVISION P1E) ..............................................................................16
FIGURE 8: ASSEMBLE DRAWING OF DEVELOPER'S BOARD (REVISION P1D)..............................................................................17
Revision History
Release Date Summary of Changes
A 5/17/02 Initial Release - JPL

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1 Introduction
1.1 Overview
This manual is intended to familiarize the user with the developer's platform, demonstrate recommended HW
implementations for your applications and explain how to use the development platform in conjunction with your
application to accelerate your development.
The manual is broken into four chapters. Chapter 1 presents an overview of the development platform, how to
get support and information to help you use the manual. Chapter 2 discusses how to setup the developer's kit.
Chapter 3 describes the functionality of the developer's kit. Chapter 4 is designed to show how the user can use
the developer's board to troubleshoot their application.
1.2 Service and Support
1.2.1 Web Page
For more information about where you can buy our modules or for recommendations of accessories and
components please visit our web-site:
http://www.sonyericsson.com/m2m/
To register for product news and announcements or for product questions, contact the Sony Ericsson M2M
Technical Support group:
•Telephone: [phone] (Staffed Monday-Friday 9:00 AM - 5:00 PM EST).
•E-mail: [e-mail]
1.3 Related Documents
Document Title Document Number Rev1
CM-42 Integrator's Manual SEM/CX-02:0076/DES A
CM-42 AT Command Manual N/A B
DM-15/25 Integrator's Manual SEM/CX-02:0080/MAN B
DM-15 AT Command Manual N/A A
DM-10/DM-20 Integrator's Manual EUS/TB-01:0281/DES E
1The revision is the latest as of this manual release.

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1.4 Abbreviations
AGND Analog GrouND
CTS Clear To Send
DCCH Digital Control Channel
DCD Data Carrier Detect
DFMS Data From Mobile Station
DTMS Data To Mobile Station
DTR Data Terminal Ready
EDB External Data Bus
EMI Electromagnetic Interference
ESD Electrostatic Discharge
ESN Electronic Serial Number
GND Chassis GrouND
HW Hardware
ISO International Standards Organization
LED Light-Emitting Diode
LSB Least Significant Bit
ME Mobile Equipment
MO Mobile Originated
MS Mobile Station
MT Mobile Terminated
NAM Number Assignment Module
OEM Original Equipment Manufacturer
PCB Printed Circuit Board
PCM Pulse Code Modulation
PIN Personal Identification Number
RD Receive Data, also known as DFMS
RF Radio Frequency
RLP Radio Link Protocol
RTS Request To Send
TA Terminal Adapter
TD Transmit Data, also known as DTMS
TE Terminal Equipment

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2 Using the Developer's Kit
The developer's kit is intended to help you developer you application using one or more of our families of wireless
transceiver modules. This is accomplished by giving you a stable platform to familiar yourself with our modules
as well as demonstrating several of the recommended HW circuit implementations for your application.
2.1 Developer's Kit Contents
Description Manufacturer, Part # QTY
Power Supply, 12VDC Astrodyne, SPU45-105 1
Line Cord, 110 VAC SPC Technology 1
Serial Cable, DB9MF Assman, AK131-2 1
Hands-Free, 2.5mm Plug Ericsson, HBH0043-015430 1
Antenna, 800/1900 MHz Radiall/Larsen, MSC/P3USMA NS 1
Developer's Board TVK 117 2403 P1F 1
4-40, 3/16" O.D., 5/8" Length Standoffs Keystone, 1839 4
4-40, 3/16" O.D., 3/4" Length Standoffs Keystone, 3481 2
#4 Lock Washer, Inside Tooth, Stainless Steel Various 10
4-40 x 5/16" Phillips Panhead Stainless Steel Machine Screw Various 8
4-40 x 3/8" Phillips Panhead Stainless Steel Machine Screw Various 10
Aluminum Heat-Sink Sony Ericsson 1
Thermal Pad Chomerics 1
Documentation CD Sony Ericsson 1
Table 1: Developer's Kit Content List
2.2 Assembling the Developer's Board
The developer's board has been designed to work with several families of modules. Therefore you will need to
assemble the mounting hardware based on the particular version of the module you will using. There are two
different assemblies: the first is for the DM-xx family which does not require the included heat-sink and the second
which is for the CM-4x which requires the heat sink for 3W usage.

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2.2.1 Mounting a DM-xx Module
This assembly will require (included in kit):
Description Manufacturer, Part # QTY
4-40, 3/16" O.D., 5/8" Length Standoffs Keystone, 1839 4
4-40 x 5/16" Phillips Panhead Stainless Steel Machine Screw Various 4
4-40 x 3/8" Phillips Panhead Stainless Steel Machine Screw Various 4
#4 Lock Washer, Inside Tooth, Stainless Steel Various 4
Figure 1: Exploded view drawing of developer's board with DM-15/25
Assembly instructions:
•Use 3/8" screw with lock washer through the bottom of board to attach each 5/8" long standoff.
•Attach module to standoff using 5/16" screw, one for each standoff.
•Attach 40-conductor to 30-conductor ribbon cable to JP2 and the module respectively.

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2.2.2 Mounting a CM-4x Module
This assemble will require (included in kit):
Description Manufacturer, Part # QTY
4-40, 3/16" O.D., 5/8" Length Standoffs Keystone, 1839 4
4-40, 3/16" O.D., 3/4" Length Standoffs Keystone, 3481 2
#4 Lock Washer, Inside Tooth, Stainless Steel Various 10
4-40 x 5/16" Phillips Panhead Stainless Steel Machine Screw Various 8
4-40 x 3/8" Phillips Panhead Stainless Steel Machine Screw Various 10
Aluminum Heat-Sink Sony Ericsson 1
Thermal Pad Chomerics 1
Figure 2: Exploded view drawing of developer's board with heat sink
Assembly instructions:
•Use 3/8" screw with lock washer through the bottom of board to attach each 5/8" long standoff for heat sink.
•Use 3/8" screw with lock washer through the bottom of board to attach each 3/4" long standoff.
•Attach heat sink to the 5/8" standoffs using 3/8" screw and lock washer from the topside.

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Figure 3: Exploded view drawing of developer's board with CM-4x
Assembly instructions:
•Place Thermal pad on center of heat sink, making sure to align screw holes.
•Attach module to standoff and heat sink using 5/16" screws in eight positions. Six are placed along the
perimeter of the board, the remaining two are under the hexagon shield can.
•Attach 40-conductor to 40-conductor ribbon cable to JP2 and the module.
Note: Components under shield cans are sensitive to ESD and should be handled with
appropriate measures.
2.3 System Requirements
The system requirements are:
•Personal Computer (PC) or unit compatible for RS232 communications.
•An unused serial port (COM1…. COM4) for communication between the developer's board and the PC.
•A second serial port may also be required for additional functionality.
•A terminal program such as HyperTerminal, Kermit, Procomm, etc …

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2.4 Connecting the Hardware
Once you have successfully mounted the module on the developer's board and confirmed the system
requirements you may setup the developer's board. The following drawings indicate how to do this.
2.4.1 DM-xx Family Connection
Figure 4: DM-xx Connection Diagram
•Connect serial cable from Suzy board port 1 to an available serial port on the PC.
•The DC power supply provides the necessary 12VDC.
•Connect the power cable to the power supply and the AC outlet. The included cable is for North America.
Elsewhere, you may simply substitute the appropriate line cord.
•Connect the output of the power supply to the power jack on the Suzy board.
•Attach the provided antenna cable to the SMA antenna jack on the Suzy board or directly to the primary RF
output port of the module.
•For voice calls plug-in the provided Hands-free Speaker/Microphone.

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2.4.2 CM-4x Family Connection
Figure 5: CM-4x Connection Diagram
•Connect serial cable from Suzy board port 1 to an available serial port on the PC.
•The DC power supply provides the necessary 12VDC.
•Connect the power cable to the power supply and the AC outlet. The included cable is for North America.
Elsewhere, you may simply substitute the appropriate line cord.
•Connect the output of the power supply to the power jack on the Suzy board.
•Attach the provided antenna cable to the SMA antenna jack on the Suzy board or directly to the primary RF
output port of the module.
•For voice calls plug-in the provided Hands-free Speaker/Microphone.
2.5 Configuring the Hardware
This section details the specific developer's board settings for each module family. It is important that you verify
these settings before powering up the developer's board and module.
The following information is valid for revisions P1E and P1F of the developer's board. Revision P1D is for CM-42
only, unless specifically modified for other modules. Refer to Section 3.1 to determine the revision of your
developer's board. Refer to Chapter 3 for a functional description of the board and details about these settings.

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The following configurations should be considered the baseline whenever attempting to resolve issues with the
board or module.
2.5.1 DM-15/25 Family Setup
Voltage Settings:
Jumper Setting X101 (VREF) X103 (VDIG) X104 (VCC)
DM-x5 / MM-15 1-2 1-2 3-4
Table 2: Baseline Jumper Settings for DM-15/25
Operation Mode Settings:
Switch Position (S3) Function ON/OFF
Position 1 DTMS ON
Position 2 CTS OFF
Position 3 DTR OFF
Position 4 DFMS ON
Position 5 RTS OFF
Position 6 WAKE OFF
Table 3: Baseline Dip Settings for DM-15/25
2.5.2 CM-4x Family Setup
Voltage Settings:
Jumper Setting X101 (VREF) X103 (VDIG) X104 (VCC)
CM-4x 1-2 3-4 3-4
Table 4: Baseline Jumper Settings for CM-4x
Operation Mode Settings:
Switch Position (S3) Function ON/OFF
Position 1 DTMS ON
Position 2 CTS OFF
Position 3 DTR ON
Position 4 DFMS ON
Position 5 RTS OFF
Position 6 Module_Pwr_En_B ON
Table 5: Baseline Dip Settings for CM-4x
2.5.3 DM-10/20 Family Setup
Voltage Settings:
Jumper Setting X101 (VREF) X103 (VDIG) X104 (VCC)
DM-10 / DM-20 1-2 1-2 1-2
Table 6: Baseline Jumper Settings for DM-10/20
Operation Mode Settings:
Switch Position (S3) Function ON/OFF
Position 1 DTMS ON
Position 2 CTS OFF
Position 3 DTR OFF
Position 4 DFMS ON
Position 5 RTS OFF
Position 6 WAKE OFF
Table 7: Baseline Dip Settings for DM-10/20

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2.6 Testing the Installation
Once the hardware has been connected according to the previous section, you can test the proper
communication with the module just using a standard program for serial communication with the PC.
The serial communication program may be configured as follows:
•When HW Flow control is disabled:
Bits per second: 9600
Data bits: 8
Parity: None
Stop bits: 1
Flow control: None
•When HW Flow control is enabled:
Bits per second: 9600
Data bits: 8
Parity: None
Stop bits: 1
Flow control: Hardware
2.6.1 Testing Voice Call Capability
2.6.1.1 Outgoing Voice Call:
1. Start a standard program for serial communication with a PC and open the port.
2. Disable HW Flow as it is explained above.
3. Enter the phone number you want to dial via the ATD command (see the AT Command section of the
target module Integrator's Manual).
2.6.1.2 Incoming Voice Call:
1. Start a standard program for serial communication with a PC and open the port.
2. Disable HW Flow as it is explained above.
3. When the RING indicator appears type ATA command.

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3 Functional Description
3.1 General
The developer's board was designed to give you a platform to familiarize yourself with the operation of the various
module families and allow you to start developing your application.
The developer's board provides an RS-232 interfaces, appropriate voltage levels, audio interface, IO control and a
mechanical mounting platform.
The current revision of the developer's board is P1F. The discussion in this manual is written around this revision
of the board. Assembly drawings of several revisions are included for completeness. The reference designators
are consistent across the revision to facilitate using this manual for common features.
The revision of the developer's board is imprinted on the backside of the PCB. Turn over the board and locate the
TVK 117 2403 number. The revision is the alphanumeric at the end of this number

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Figure 6: Assemble Drawing of Developer's Board (Revision P1F)

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Figure 7: Assemble Drawing of Developer's Board (Revision P1E)

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Figure 8: Assemble Drawing of Developer's Board (Revision P1D)

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3.2 Mechanical Description
The Developer’s kit board is a four-layer PCB that measures 4.5 x 8.5 inches. The module is plugged into the
developer's board using a ribbon cable connected to JP2.
Following is a list of the connectors, indicators and switches available on the developer’s board.
Reference Type Connects to Purpose/main use
CR1 LED Indicates if Flash voltage is ON/OFF
CR2 LED Indicates if the module is powered ON/OFF
CR3 LED Test Indicator
CR4 LED Indicates VREF voltage is active
CR5 LED Indicates an incoming call to the module
CR6 LED HW Shutdown Indicator
J1 2.5 mm jack 12 VDC power supply Power supply input
J2 DB9 female PC Serial Port Primary RS-232 serial port
J201 2.5 mm jack Portable hands-free or
External audio source
Analog Audio IN/OUT
J22 DB9 female PC Serial Port Secondary RS-232 serial port
J3 SMA jack Module Connection for the antenna to the module
J5 MMCX jack Antenna RF Jumper to the module antenna connector
JP2 Header Module System connector of the
Module via a ribbon cable
R230 Thumb-wheel Controls ear-piece volume
S1 Slide switch Switch the module ON/OFF
S2 Slide switch Select Normal or Flashing operation
S201 Slide switch Audio amplifier bypass
S3 Dip switch Operation mode switch
S5 Push-button Initiates a HW shutdown in the module
X101 Header Chooses between VREF and VDIG to power
RS-232 transceivers
X102 Header Drives DCD HIGH/LOW on J22
X103 Header Sets VDIG voltage level to the module
X104 Header Sets VCC voltage level to the module
System connector
Header
Header Application Direct access to the 40 pin signals
of the module system connector
Table 8: Description of Connectors, Switches and Indicators
3.3 Power Interface
The developer's board is designed to work from a single 12VDC supply. This 12V is supplied directly to the
module and regulated to provide VCC and VDIG. Both VCC and VDIG are configurable to allow compatibility with
several generations of module families.
In order to support several different families of modules it is necessary to be able to set the logic voltage (VDIG)
and supply voltage (VCC). These levels are used on the developer's board and provided to the module.
Header X103 is used to set the level for VDIG. Jumper the appropriate pins to set the corresponding level:
Pin Numbers VDIG (Volts) Resistor Value (Ω) Mounted
1-2 3.3 169 Yes
3-4 2.9 133 Yes
5-6 2.75 118 No
7-8 2.5 75 No
Table 9: VDIG Header Settings (X103)

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Header X104 is used to set the level for VCC. Jumper the appropriate pins to set the corresponding level:
Pin Numbers VCC (Volts) Resistor Value (Ω) Mounted
1-2 6.0 464 Yes
3-4 5.0 360 Yes
5-6 4.0 270 No
7-8 3.3 200 No
Table 10: VCC Header Settings (X104)
The following tables summarize how to correctly configure the developer's board for each module family.
Voltage Levels VCC (Volts) VDIG (Volts)
DM-10/20 6.00 3.3
CM-4x 5.00 2.9
DM-x5/ MM-15 5.00 3.3
Table 11: Voltage levels for each module family
Jumper Setting X103 (VDIG) X104 (VCC)
DM-10/20 1-2 1-2
CM-4x 3-4 3-4
DM-x5/ MM-15 1-2 3-4
Table 12: Jumper settings for each module family
Jumper X101 allows you to select between the regulated VDIG and the VREF signal output by the module to
drive the RS-232 Level shifters.
X101 Function
1-2 VDIG supplied by regulator.
2-3 VDIG supplied by module. (CM-4x family only)
Table 13: VREF Header Settings (X101)
3.4 Operation Mode
Serial communication between the target module and the RS-232 level shifters is easily enabled/disabled via dip
switches (S3). This allows testing of flow control (HW or None). This feature also allows the connection of your
application's serial interface to the module while providing other connections, such as power, through the
developer's board.
Switch Signal ON OFF
Position 1 DTMS Normal Operation If External application is directly connected
to System Connector Header
Position 2 CTS HW Flow Control enable If External application is directly connected
to System Connector Header
Position 3 DTR Normal Operation If External application is directly connected
to System Connector Header
Position 4 DFMS Normal Operation If External application is directly connected
to System Connector Header
Position 5 RTS HW Flow Control enable If External application is directly connected
to System Connector Header
MODULE_PWR_EN_BPosition 6
WAKE
Signal is grounded
(Logic Low)
Signal is floating
(Logic High)
Table 14: Description of Operation Mode Switch Settings
When switches 1 through 5 are in the OFF position, they are disconnected from the level shifters on the
developer's board. Hence the module determines the state of the signal at the System Connector Header. Refer
to the appropriate Integrator's Manual for a description of the signals.