Sony MDR-IF3000 User manual

1
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Tourist Model
MDR-IF3000
CORDLESS STEREO HEADPHONES
Ver 1.2 2004.05
SPECIFICATIONS
•The MDR-IF3000 is the cordless ste-
reo headphones that comprises the
MDR-DS3000.
• MDR-DS3000 consists of the following models respectively.
Cordless stereo headphone MDR-IF3000
Digital surround processor DP-IF3000
General
Modulation System FM-IM (Based on IEC)
Secondary carrier wave frequency
Right channel 2.8 MHz
Left channel 2.3 MHz
Playback frequency range 20 – 20,000 Hz
Power requirements Rechargeable nickel-metal hydride
batteries (supplied) or commercially
available (size AAA) dry batteries
Mass Approx. 275 g (10 oz.) (including the
supplied rechargeable nickel-metal
hydride batteries)
Supplied accessories Rechargeable nickel-metal hydride batteries
BP-HP550 (550 mAh min.) (2)
Operating Instructions (1)
Design and specifications are subject to change without notice.
9-961-271-03
2004E02-1
© 2004.05
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation

2
MDR-IF3000
TABLE OF CONTENTS
1. GENERAL ............................................................................ 3
2. DISASSEMBLY
2-1. Front Plate (R) Assy ............................................................ 4
2-2. RX Board ............................................................................ 5
2-3. Hanger (R) ........................................................................... 5
2-4. Wiring on the Right Side ..................................................... 6
2-5. Front Plate (L) Assy ............................................................ 6
2-6. BATT Board ........................................................................ 7
2-7. Hanger (L) ........................................................................... 7
2-8. Wiring on the Left Side ....................................................... 8
2-9. Hanger Lid (L) .................................................................... 8
2-10. Wiring on the SW Board ..................................................... 9
2-11. How to Hang the Tension Spring ........................................ 9
3. ELECTRICAL ADJUSTMENTS
Tuning Adjustment ................................................................ 10
Mute ON Position Adjustment .............................................. 10
4. DIAGRAMS
4-1. Circuit Boards Location .................................................... 11
4-2. Printed Wiring Boards – Receiver Section – ..................... 12
4-3. Printed Wiring Boards – Power Section – ......................... 13
4-4. Schematic Diagram – Receiver Section – ......................... 14
4-5. IC Block Diagrams ............................................................ 15
5. EXPLODED VIEWS
5-1. Housing (L) Assy Section ................................................. 16
5-2. Housing (R) Assy Section ................................................. 17
6. ELECTRICAL PARTS LIST ......................................... 18
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
rUNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
r Repair DP-IF3000 with MDR-IF3000.

3
MDR-IF3000
SECTION 1
GENERAL This section is extracted
from instruction manual.
1Ear pad (left)
2Battery case
Press the button of the left housing to
open the battery compartment lid.
This battery case is for the rechargeable
nickel-metal hydride batteries (supplied)
or commercially available (size AAA) dry
batteries only.
3Infrared sensor
There are infrared sensors in two
locations on both sides.
4Self-adjusting band
The headphones automatically turn on
when you put them on.
5VOL (Volume) control
Use to adjust the volume.
6Ear pad (right)
7POWER indicator
By pulling up the self-adjusting band, the
indicator lights red when battery power is
sufficient.

4
MDR-IF3000
Note : This set can be disassemble according to the following sequence.
SECTION 2
DISASSEMBLY
2-1. FRONT PLATE (R) ASSY
Note : Follow the disassembly procedure in the numerical order given.
FRONT PLATE (R) ASSY
RX BOARD
SET
FRONT PLATE (L) ASSY
HANGER (R)
WIRING ON THE
RIGHT SIDE WIRING ON THE
LEFT SIDE
WIRING ON THE
SW BOARD
HOW TO HANG THE
TENSION SPRING
BATT BOARD
HANGER (L)
HANGER LID (L)
4 Removal the solder at 2 places.
2 two screws
(P 2.6 x 6)
3 screw
(P 2.6 x 6)
1 ear pad (R)
5 front plate (R) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
driver (R-CH) side
housing (R) assy
RED
from RX board
natural
+

5
MDR-IF3000
2-2. RX BOARD
2-3. HANGER (R)
1 removal the solder at 8 places.
3 RX board
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
WHT
BLK
to BATT board
to PD2 board
RED
natural
GRN
natural
RED
to driver (R-CH)
natural
to Driver (L-CH)
housing (R) assy
2
2
3
4
1 two screws (P 2.6 x6)
5 hanger (R)
Pay attention to the leads
when assembling.
Pay attention to the leads
when assembling.
hanger lid (R)
projection

6
MDR-IF3000
2-4. WIRING ON THE RIGHT SIDE
2-5. FRONT PLATE (L) ASSY
RD2 board (R-CH front)
RD1 board (R-CH rear)
+
4 Removal the solder at 2 places.
2 two screws
(P 2.6 x6)
1 ear pad (L)
3 screw (P 2.6 x6)
housing (L) assy
front plate (L) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
driver (L-CH) side
GRN
from RX board
natural

7
MDR-IF3000
2-6. BATT BOARD
2-7. HANGER (L)
3
1 Removal the solder at 4 places.
4 BATT board
2 two screws
(P2 x 6)
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
to SW board
housing (L) assy
to RX board
RED
natural
RED
RED
2
3
4
Pay attention to the leads
when assembling.
Pay attention to the leads
when assembling.
1 two screws (P 2.6 x6)
5 hanger (L)
hanger lid (L)
projection

8
MDR-IF3000
2-8. WIRING ON THE LEFT SIDE
2-9. HANGER LID (L)
RD2 board (L-CH rear)
RD1 board (L-CH front)
1 screw (P 2.6 x6)
2 screw (P 2.6 x6)
3 head ban
d
hanger lid (L)

9
MDR-IF3000
2-10. WIRING ON THE SW BOARD
2-11. HOW TO HANG THE TENSION SPRING
SW board
head boar
d
Note for installation : Insert the end of the
suspender assy under the
S103 on the SW board.
SW board
suspender assy
suspender assy
tensin spring
hanger lid (L)
housing (L) assy S703

10
MDR-IF3000
SECTION 3
ELECTRICAL ADJUSTMENTS
PRECAUTION
1. These adjustments should be performed in the order in which
they appear. It is required as a rule to adjust the processor
section (DP-IF3000) before adjusting the headphone section
(MDR-IF3000).
2. Adjustment and measurement should be made on each channel
unless otherwise specified.
3. Adjust on the left channel before adjusting on the right
channel.
4. Supply a power voltage of 9 V to the processor section (DP-
IF3000) and a power voltage of 2.4 V to the headphones
section (MDR-IF3000).
Headphones Section -10 dBV = 315mVrms
Note:
1. Use the processor section (DP-IF3000) as a jig for
adjusting the headphones section (MDR-IF3000).
Tuning Adjustment
Preparation:
low-frequency
oscillator
attenuator jig
processor
INPUT IN
jack (J051)
1 kHz 315 mV (-10 dBV)
stabilized
power (9 V dc)
600
Ω
1. Apply the input to the jig (DP-IF3000), and connect a
stabilized power to the DC IN 9V jack (J301).
2. Supply 2.4 V dc between BATT (+) and BATT (–) on the BATT
board.
3. Set the RV602 (volume control) on the RX board to the mini-
mum level.
Connection:
100 µ F/16 V
+
+
RX board
TP7 (L-ch)
TP8 (R-ch)
distortion mete
r
Adjustment Method:
1. Connect a distortion meter to TP7 (L-ch) or TP8 (R-ch) on the
RX board.
2. Adjust the L606 (L-ch) or L605 (R-ch) so as to minimize the
reading on the distortion meter.
L-ch L606 Minimum
R-ch L605 Minimum
FM RF
signal generator
Carrier frequency : 2.8 MHz
Modulation : 1 kHz, 16 kHz deviation
Output level : 34 dB
µ V (EMF)
RX board
SIG
TP1 (GND
)
0.1 µ F
10 k
Ω
RX board
+
level meter
TP8 (R-ch)
Mute ON Position Adjustment
Preparation:
Connection:
Adjustment Method:
1. Connect a level meter to TP8 (R-ch) on the RX board.
2. Short between TP2 and TP3 on the RX board.
3. Write down the reading on the level meter at this time.
4. Remove the short between TP2 and TP3 made in item 2.
5. Adjust the RV601 on the RX board so that the reading on the
level meter is 5 dB to 10 dB below the value written down in
item 3.