Sony MDR-IF3000 User manual

1
SERVICE MANUAL
US Model
Canadian Model
AEP Model
UK Model
E Model
Tourist Model
MDR-IF3000
CORDLESS STEREO HEADPHONES
Ver 1.2 2004.05
SPECIFICATIONS
•The MDR-IF3000 is the cordless ste-
reo headphones that comprises the
MDR-DS3000.
• MDR-DS3000 consists of the following models respectively.
Cordless stereo headphone MDR-IF3000
Digital surround processor DP-IF3000
General
Modulation System FM-IM (Based on IEC)
Secondary carrier wave frequency
Right channel 2.8 MHz
Left channel 2.3 MHz
Playback frequency range 20 – 20,000 Hz
Power requirements Rechargeable nickel-metal hydride
batteries (supplied) or commercially
available (size AAA) dry batteries
Mass Approx. 275 g (10 oz.) (including the
supplied rechargeable nickel-metal
hydride batteries)
Supplied accessories Rechargeable nickel-metal hydride batteries
BP-HP550 (550 mAh min.) (2)
Operating Instructions (1)
Design and specifications are subject to change without notice.
9-961-271-03
2004E02-1
© 2004.05
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation

2
MDR-IF3000
TABLE OF CONTENTS
1. GENERAL ............................................................................ 3
2. DISASSEMBLY
2-1. Front Plate (R) Assy ............................................................ 4
2-2. RX Board ............................................................................ 5
2-3. Hanger (R) ........................................................................... 5
2-4. Wiring on the Right Side ..................................................... 6
2-5. Front Plate (L) Assy ............................................................ 6
2-6. BATT Board ........................................................................ 7
2-7. Hanger (L) ........................................................................... 7
2-8. Wiring on the Left Side ....................................................... 8
2-9. Hanger Lid (L) .................................................................... 8
2-10. Wiring on the SW Board ..................................................... 9
2-11. How to Hang the Tension Spring ........................................ 9
3. ELECTRICAL ADJUSTMENTS
Tuning Adjustment ................................................................ 10
Mute ON Position Adjustment .............................................. 10
4. DIAGRAMS
4-1. Circuit Boards Location .................................................... 11
4-2. Printed Wiring Boards – Receiver Section – ..................... 12
4-3. Printed Wiring Boards – Power Section – ......................... 13
4-4. Schematic Diagram – Receiver Section – ......................... 14
4-5. IC Block Diagrams ............................................................ 15
5. EXPLODED VIEWS
5-1. Housing (L) Assy Section ................................................. 16
5-2. Housing (R) Assy Section ................................................. 17
6. ELECTRICAL PARTS LIST ......................................... 18
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
rUNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
r Repair DP-IF3000 with MDR-IF3000.

3
MDR-IF3000
SECTION 1
GENERAL This section is extracted
from instruction manual.
1Ear pad (left)
2Battery case
Press the button of the left housing to
open the battery compartment lid.
This battery case is for the rechargeable
nickel-metal hydride batteries (supplied)
or commercially available (size AAA) dry
batteries only.
3Infrared sensor
There are infrared sensors in two
locations on both sides.
4Self-adjusting band
The headphones automatically turn on
when you put them on.
5VOL (Volume) control
Use to adjust the volume.
6Ear pad (right)
7POWER indicator
By pulling up the self-adjusting band, the
indicator lights red when battery power is
sufficient.

4
MDR-IF3000
Note : This set can be disassemble according to the following sequence.
SECTION 2
DISASSEMBLY
2-1. FRONT PLATE (R) ASSY
Note : Follow the disassembly procedure in the numerical order given.
FRONT PLATE (R) ASSY
RX BOARD
SET
FRONT PLATE (L) ASSY
HANGER (R)
WIRING ON THE
RIGHT SIDE WIRING ON THE
LEFT SIDE
WIRING ON THE
SW BOARD
HOW TO HANG THE
TENSION SPRING
BATT BOARD
HANGER (L)
HANGER LID (L)
4 Removal the solder at 2 places.
2 two screws
(P 2.6 x 6)
3 screw
(P 2.6 x 6)
1 ear pad (R)
5 front plate (R) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
driver (R-CH) side
housing (R) assy
RED
from RX board
natural
+

5
MDR-IF3000
2-2. RX BOARD
2-3. HANGER (R)
1 removal the solder at 8 places.
3 RX board
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
WHT
BLK
to BATT board
to PD2 board
RED
natural
GRN
natural
RED
to driver (R-CH)
natural
to Driver (L-CH)
housing (R) assy
2
2
3
4
1 two screws (P 2.6 x6)
5 hanger (R)
Pay attention to the leads
when assembling.
Pay attention to the leads
when assembling.
hanger lid (R)
projection

6
MDR-IF3000
2-4. WIRING ON THE RIGHT SIDE
2-5. FRONT PLATE (L) ASSY
RD2 board (R-CH front)
RD1 board (R-CH rear)
+
4 Removal the solder at 2 places.
2 two screws
(P 2.6 x6)
1 ear pad (L)
3 screw (P 2.6 x6)
housing (L) assy
front plate (L) assy
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
driver (L-CH) side
GRN
from RX board
natural

7
MDR-IF3000
2-6. BATT BOARD
2-7. HANGER (L)
3
1 Removal the solder at 4 places.
4 BATT board
2 two screws
(P2 x 6)
Note for installation : Solder the leads at the
places shown below with
attention to their colors.
to SW board
housing (L) assy
to RX board
RED
natural
RED
RED
2
3
4
Pay attention to the leads
when assembling.
Pay attention to the leads
when assembling.
1 two screws (P 2.6 x6)
5 hanger (L)
hanger lid (L)
projection

8
MDR-IF3000
2-8. WIRING ON THE LEFT SIDE
2-9. HANGER LID (L)
RD2 board (L-CH rear)
RD1 board (L-CH front)
1 screw (P 2.6 x6)
2 screw (P 2.6 x6)
3 head ban
d
hanger lid (L)

9
MDR-IF3000
2-10. WIRING ON THE SW BOARD
2-11. HOW TO HANG THE TENSION SPRING
SW board
head boar
d
Note for installation : Insert the end of the
suspender assy under the
S103 on the SW board.
SW board
suspender assy
suspender assy
tensin spring
hanger lid (L)
housing (L) assy S703

10
MDR-IF3000
SECTION 3
ELECTRICAL ADJUSTMENTS
PRECAUTION
1. These adjustments should be performed in the order in which
they appear. It is required as a rule to adjust the processor
section (DP-IF3000) before adjusting the headphone section
(MDR-IF3000).
2. Adjustment and measurement should be made on each channel
unless otherwise specified.
3. Adjust on the left channel before adjusting on the right
channel.
4. Supply a power voltage of 9 V to the processor section (DP-
IF3000) and a power voltage of 2.4 V to the headphones
section (MDR-IF3000).
Headphones Section -10 dBV = 315mVrms
Note:
1. Use the processor section (DP-IF3000) as a jig for
adjusting the headphones section (MDR-IF3000).
Tuning Adjustment
Preparation:
low-frequency
oscillator
attenuator jig
processor
INPUT IN
jack (J051)
1 kHz 315 mV (-10 dBV)
stabilized
power (9 V dc)
600
Ω
1. Apply the input to the jig (DP-IF3000), and connect a
stabilized power to the DC IN 9V jack (J301).
2. Supply 2.4 V dc between BATT (+) and BATT (–) on the BATT
board.
3. Set the RV602 (volume control) on the RX board to the mini-
mum level.
Connection:
100 µ F/16 V
+
+
RX board
TP7 (L-ch)
TP8 (R-ch)
distortion mete
r
Adjustment Method:
1. Connect a distortion meter to TP7 (L-ch) or TP8 (R-ch) on the
RX board.
2. Adjust the L606 (L-ch) or L605 (R-ch) so as to minimize the
reading on the distortion meter.
L-ch L606 Minimum
R-ch L605 Minimum
FM RF
signal generator
Carrier frequency : 2.8 MHz
Modulation : 1 kHz, 16 kHz deviation
Output level : 34 dB
µ V (EMF)
RX board
SIG
TP1 (GND
)
0.1 µ F
10 k
Ω
RX board
+
level meter
TP8 (R-ch)
Mute ON Position Adjustment
Preparation:
Connection:
Adjustment Method:
1. Connect a level meter to TP8 (R-ch) on the RX board.
2. Short between TP2 and TP3 on the RX board.
3. Write down the reading on the level meter at this time.
4. Remove the short between TP2 and TP3 made in item 2.
5. Adjust the RV601 on the RX board so that the reading on the
level meter is 5 dB to 10 dB below the value written down in
item 3.

MDR-IF3000
11 11
BATT (+)
RV602
VOL
TP2
SIG
RV601
mute on position adjustment
L605
tuning adjustmen
t
(R-CH)
L606
tuning adjustment
(L-CH)
TP3
TP1
(GND)
TP8
(R-ch)
TP7
(L-ch)
BATT ( )
BATT board (pattern side) RX board (pattern side)
Adjustment Location:
SECTION 4
DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
for schematic diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•H: adjustment for repair.
•Power voltage is dc 2.4 V and fed with regulated dc power
supply from battery terminal.
•Voltage is dc with respect to ground under no-signal
(detuned) conditions.
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Signal path.
F: ANALOG
J: RF
for printed wiring boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
4-1. CIRCUIT BOARDS LOCATION
RX board
BATT board
SW board
PD1 board
(L-CH front)
PD1 board
(R-CH rear)
PD2 board
(L-CH rear)
PD2 board
(R-CH front)

MDR-IF3000
1212
4-2. PRINTED WIRING BOARD – RECEIVER SECTION – • : Uses unleaded solder.
TP3
TP2
TP9
TP7
TP8
JR602
JR603
JR604
FB602
R605
C623
R621
C625
L604
JR601
R601
IC604
C603
SIG
B+
R617
C621
R616
R641
R622
C632
RV601
C644 C643
C610
C602
C647
IC601
R603
R606
FB603
FB601
C612
FB604
C624
Q601
C626
R609
C618
IC603
Q602
C641
IC602
Q603 L601
C646
L602
L603
C615
R608
C634
C645
TP1
C614
R610
C606
C617
R607
R602
R604
C607
C616
R611
C608
C604
C601
C622
C609
C631
C620
R612
R613
C636
R615
C628
C627
FB605
C635
R618
C611
C619
R614
C605
C613
FL601
L605
FL602
L606
C648
RV602
D605
(POWER)
B+(RED)
+
(RED)
+
(GRN)
GND(NAT)
–
(NAT)
–
(NAT)
A
BATT
BOARD
(Page 13)
MDD601
DRIVER
(R-CH)
MDD602
DRIVER
(L-CH)
RX BOARD
11
(11)
1-860-185-
PD2 BOARD
11
(11)
1-860-184-
11
(11)
1-860-183-
B+ SIG
D705
(RF SENSOR)
D704
(LR SENSOR)
D703
(RR SENSOR)
D702
(LF SENSOR)
(R-CH FRONT SECTION)
PD1 BOARD
(R-CH REAR SECTION)
B+
SIG
B+
SIG
B+
SIG
PD2 BOARD
11
(11)
1-860-184- 11
(11)
1-860-183-
B+ SIG
(L-CH FRONT SECTION)
PD1 BOARD
(L-CH REAR SECTION)
B+
SIG
B+
SIG
1
3
4
5
13
1
3
4
5
4
5
13
4
5
1
3
4
5
1
4
58
1
4
58
N
VOL
23 4 5 6 7
A
1
B
C
D
E
D605 D-3
D702 C-6
D703 A-6
D704 C-5
D705 A-5
IC601 B-3
IC602 D-2
IC603 D-3
IC604 C-4
Q601 B-3
Q602 A-3
Q603 A-2
• Semiconductor
Location
Ref. No. Location
• See page 11 for Circuit Boards Location.

MDR-IF3000
13 13
4-3. PRINTED WIRING BOARDS — POWER SECTION — • See page 11 for Circuit Boards Location • : Uses unleaded solder.
CHARGE
TERMINAL
IC701
Q701
Q702
RED
RED
B+(RED)
GND(NAT)
RED
RED
C701
S703
(AUTO 0N/OFF)
C702
CHG(+) CHG(-)
R701
R702
R703
R704
D701
S702
(BATT DET)
C704
S701
(BATT DET)
BATT (–)
BATT (+)
1
23
4
E
E
BATT BOARD
11
(11)
1-860-181-
SW BOARD
11
(11)
1-860-182-
BAT101
RECHARGEABLE
BATTERY
BP–HP550
1.2V 550mAh X2
A
RX
BOARD
(Page 12)
23 4 5
A
1
B
C
D
E
D701 B-3
IC701 B-4
Q701 C-3
Q702 C-3
• Semiconductor
Location
Ref. No. Location

MDR-IF3000
1414
4-4. SCHEMATIC DIAGRAM — RECEIVER SECTION —
MDD601
C626
FB602
IC602
C627 C628
C624
R618
FB604
C634
IC603
R622
C632
C636
C635
C621
C622
C619
C620
R616
R615
R614
R613
C618
R612
C617
R611
FL602
C616
C648
C609
C610
L604
JR604
C607
L603
33µH
39µH
33µH
JR601
R606
Q602
R603
C604
C603
Q601
R601
C601 R604 R605
C605
Q603
L602
C606
C646
C608
JR602
JR603
R607
C611
RV601
R608 C613
FL601
2.8MHzBPF
R610
R609
IC601
C645
C644
IC604
D605
R641
C647
C641
C702
Q702
R703
Q701
R702
C704
R704
C701
D701
S703
D705
D702
C625
L601
22µH
C602
C612 C614
C615
R617
C623
R621
C631
FB603
FB605
FB601
TP1
R701
RV602
S701
S702
R602
IC701
MDD602
C643
L606 L605
TP2 TP3
TP7
TP8
D704
D703
030F032//K
0.1
0UH
NJM2113V-TE2
DRIVER AMP
10
16V
3.3
50V
68p
68k
0uH
0.1
NJM2113V-TE2
DRIVER AMP
68k
68p
3.3
50V
10
16V
1
1
0.068
0.068
2.7k
100
100
2.7k
1
3.6k
560p
3.3k
56p
0.1
0.1
0.1
0
82p
0
560
2SC2712G
RF AMP
1k
10p
0.01
2SK209G
RF AMP
1.5k
47
4V
1.5k 22k
0.1
2SC2712G
BUFFER
160p
10p
0.1
0
0
3.3k
47
4V
2.2k
10k 330p
33k
33k
TA2056FN
MIXER/LIMITER
DEMODULATOR
0.22
0.01
TK11115CS
+1.5V REG
SLR-342VC3F
(POWER)
470
0.1
100
4V
0.01
2SC2412K-T
1k
2SB1690K
10k
2.2
1M
0.01
RB501V-40TE-17
AUTO ON/OFF
PP508
(RF SENSOR)
PP508
(LF SENSOR)
100
4V
0.01
0.01 150p
150p
3.9k
10
16V
3.9k
10
16V
0UH
0uH
0uH
100k
50k/50k
BATT DET
BATT DET
47k
XC61CN1902NR
BATTERY DOWN DET
030F032//K
0.22
PP508
(LR SENSOR)
PP508
(RR SENSOR)
-
+
CHARGE
TERMINAL
(
(
BATTERY
RECHARGEABLE
(BP-HP55)
1.2V 550mAh x 2
MUTE ON
POSITION
TUNING TUNING
VOL
Q701,702
AUTO ON/OFF
(L-CH)
(R-CH)
DRIVER
DRIVER
(R-CH FRONT SECTION)
(R-CH
REAR SECTION)
(L-CH
(L-CH FRONT SECTION)
REAR SECTION)
B+
SIG

15
MDR-IF3000
IC602, 603 NJM2113V-TE2
4-5. IC BLOCK DIAGRAMS
5VOUT1
V+
GND
VOUT2
–VIN
+VIN
VREF
CD
–
+
–
+
1
2
3
4
6
7
8

16
MDR-IF3000 SECTION 5
EXPLODED VIEWS
Ref. No. Part No. Description Remark
5-1. HOUSING (L) ASSY SECTION
Ref. No. Part No. Description Remark
NOTE:
•The mechanical parts with no reference
number in the exploded views are not supplied.
•Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
•-XX and -X mean standardized parts, so
they may have some difference from the
original one.
•Accessories are given in the last of this parts
list.
1
2
3
5
4
6
7
8
9
10
11
13
12
not
supplied
MDD602
not supplied
(SW board)
A
A
B
B
14
not supplied
(PD2 board)
(PD1 board)
not supplied
13
1X-3383-955-1 LID ASSY, BATTERY
23-246-142-01 HOUSING (L)
3 3-246-148-01 BUTTON
43-246-140-01 LID (L), HANGER
53-246-138-01 HANGER (L)
63-257-911-01 SPRING, TENSION
7 3-246-151-02 TERMINAL (-), BATTERY
83-246-150-02 TERMINAL (+), BATTERY
*9A-4541-344-A BATT BOARD, COMPLETE
10 3-246-152-02 TERMINAL, CHARGE
11 X-3383-914-2 PLATE (L) ASSY, FRONT
12 3-246-153-01 PAD (L), EAR
13 3-253-143-01 SCREW (B2.6), (+) P TAPPING
14 3-254-070-11 SCREW
MDD602 X-3384-083-1 DRIVER ASSY
Ver 1.2

17
MDR-IF3000
5-2. HOUSING (R) ASSY SECTION
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
51
52
54
53
56
57
59
58
60
61
62 62
63
63
54
64
not supplied
(PD1 board)
not supplied
not
supplied
MDD601
not supplied
(PD2 board)
54
51 3-246-154-01 PAD (R), EAR
52 X-3383-915-2 PLATE (R) ASSY, FRONT
*53 A-4541-343-A RX BOARD, COMPLETE
54 3-253-143-01 SCREW (B2.6), (+) P TAPPING
56 3-257-778-01 HOUSING (R)
57 X-3383-954-1 CAP (R) ASSY, HOUSING
58 3-246-139-01 HANGER (R)
59 3-246-141-01 LID (R), HANGER
60 3-246-137-01 BAND, HEAD
61 A-4540-731-A SUSPENDER ASSY
62 4-966-791-01 STOPPER (UPPER)
63 4-966-792-01 STOPPER, (LOWER)
64 3-254-082-11 SCREW
MDD601 X-3384-083-1 DRIVER ASSY
Ver 1.2

18
MDR-IF3000 SECTION 6
ELECTRICAL PARTS LIST
NOTE:
•Due to standardization, replacements in
the parts list may be different from the
parts specified in the diagrams or the
components used on the set.
•-XX and -X mean standardized parts, so
they may have some difference from the
original one.
•RESISTORS
All resistors are in ohms.
METAL:Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F:nonflammable
•Items marked “*” are not stocked since
they are seldom required for routine service.
Some delay should be anticipated
when ordering these items.
•SEMICONDUCTORS
In each case, u : µ, for example:
uA.. : µA.. uPA.. : µPA..
uPB.. : µPB.. uPC.. : µPC.. uPD.. : µPD..
• CAPACITORS
uF : µF
•COILS
uH : µH
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
When indicating parts by reference
number, please include the board.
RX
PD2PD1BATT
*A-4541-344-A BATT BOARD, COMPLETE
******************
< CAPACITOR >
C701 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C702 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C704 1-165-884-91 CERAMIC CHIP 2.2uF 10% 6.3V
< DIODE >
D701 8-719-058-24 DIODE RB501V-40TE-17
< IC >
IC701 6-702-083-01 IC XC61CN1902NR
< TRANSISTOR >
Q701 6-550-363-01 TRANSISTOR 2SB1690KT146
Q702 8-729-901-81 TRANSISTOR 2SC2412K-T-146-R
< RESISTOR >
R701 1-216-845-11 METAL CHIP 100K 5% 1/10W
R702 1-216-833-11 METAL CHIP 10K 5% 1/10W
R703 1-216-821-11 METAL CHIP 1K 5% 1/10W
R704 1-216-857-11 METAL CHIP 1M 5% 1/10W
< SWITCH >
S701 1-786-130-11 SWITCH, PUSH (1 KEY) (BATT DET)
S702 1-762-917-11 SWITCH, DETECTION (SMALL TYPE) (BATT DET)
******************************************************
PD1 BOARD (L-CH FRONT)
*********
< DIODE >
D702 8-719-058-49 DIODE PP508 (LF SENSOR)
******************************************************
PD1 BOARD (R-CH REAR)
*********
< DIODE >
D704 8-719-058-49 DIODE PP508 (RR SENSOR)
******************************************************
PD2 BOARD (L-CH REAR)
*********
< DIODE >
D703 8-719-058-49 DIODE PP508 (LR SENSOR)
******************************************************
PD2 BOARD (R-CH FRONT)
*********
< DIODE >
D705 8-719-058-49 DIODE PP508 (RF SENSOR)
******************************************************
*A-4541-343-A RX BOARD, COMPLETE
******************
< CAPACITOR >
C601 1-126-607-11 ELECT CHIP 47uF 20% 4V
C602 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C603 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C604 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C605 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C606 1-164-385-11 CERAMIC CHIP 160PF 5% 50V
C607 1-162-926-11 CERAMIC CHIP 82PF 5% 50V
C608 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C609 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C610 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C611 1-126-607-11 ELECT CHIP 47uF 20% 4V
C612 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C613 1-162-959-11 CERAMIC CHIP 330PF 5% 50V
C614 1-164-217-11 CERAMIC CHIP 150PF 5% 50V
C615 1-164-217-11 CERAMIC CHIP 150PF 5% 50V
C616 1-162-924-11 CERAMIC CHIP 56PF 5% 50V
C617 1-164-739-11 CERAMIC CHIP 560PF 5% 50V
C618 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C619 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16V
C620 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16V
C621 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C622 1-125-837-91 CERAMIC CHIP 1uF 10% 6.3V
C623 1-124-779-00 ELECT CHIP 10uF 20% 16V
C624 1-162-951-11 CERAMIC CHIP 68PF 5% 50V
C625 1-126-209-11 ELECT CHIP 100uF 20% 4V
C626 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C627 1-124-779-00 ELECT CHIP 10uF 20% 16V
C628 1-126-602-11 ELECT CHIP 3.3uF 20% 50V
C631 1-124-779-00 ELECT CHIP 10uF 20% 16V
Ver 1.1
•Abbreviation
CND : Canadian model

19
MDR-IF3000
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
SW
C632 1-162-951-11 CERAMIC CHIP 68PF 5% 50V
C634 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C635 1-124-779-00 ELECT CHIP 10uF 20% 16V
C636 1-126-602-11 ELECT CHIP 3.3uF 20% 50V
C641 1-126-209-11 ELECT CHIP 100uF 20% 4V
C643 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C644 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C645 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C646 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C647 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C648 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
< DIODE >
D605 8-719-059-98 DIODE SLR-342VC3F (POWER)
< FERRITE BEAD >
FB601 1-414-229-11 FERRITE 0uH
FB602 1-414-229-11 FERRITE 0uH
FB603 1-414-229-11 FERRITE 0uH
FB604 1-414-229-11 FERRITE 0uH
FB605 1-414-229-11 FERRITE 0uH
< FILTER >
FL601 1-239-763-11 FILTER, BAND PASS
FL602 1-239-762-11 FILTER, BAND PASS
< IC >
IC601 8-759-364-96 IC TA2056FN-EL
IC602 8-759-347-33 IC NJM2113V-TE2
IC603 8-759-347-33 IC NJM2113V-TE2
IC604 6-703-086-01 IC TK11115CSCL-G
< JUMPER RESISTOR >
JR601 1-216-864-11 METAL CHIP 0 5% 1/10W
JR602 1-216-864-11 METAL CHIP 0 5% 1/10W
JR603 1-216-864-11 METAL CHIP 0 5% 1/10W
JR604 1-216-864-11 METAL CHIP 0 5% 1/10W
< COIL >
L601 1-412-955-11 INDUCTOR 22uH
L602 1-412-957-11 INDUCTOR 33uH
L603 1-412-957-11 INDUCTOR 33uH
L604 1-412-958-21 INDUCTOR 39uH
L605 1-411-531-21 COIL (DET) (TUNING)
L606 1-411-530-21 COIL (DET) (TUNING)
< TRANSISTOR >
Q601 8-729-220-93 TRANSISTOR 2SK209G-TE85L
Q602 8-729-230-49 TRANSISTOR 2SC2712G-TE85L
Q603 8-729-230-49 TRANSISTOR 2SC2712G-TE85L
< RESISTOR >
R601 1-216-823-11 METAL CHIP 1.5K 5% 1/10W
R602 1-216-841-11 METAL CHIP 47K 5% 1/10W
R603 1-216-821-11 METAL CHIP 1K 5% 1/10W
R604 1-216-823-11 METAL CHIP 1.5K 5% 1/10W
R605 1-216-837-11 METAL CHIP 22K 5% 1/10W
R606 1-216-818-11 METAL CHIP 560 5% 1/10W
R607 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R608 1-216-833-11 METAL CHIP 10K 5% 1/10W
R609 1-216-839-11 METAL CHIP 33K 5% 1/10W
R610 1-216-839-11 METAL CHIP 33K 5% 1/10W
R611 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R612 1-220-158-11 METAL CHIP 3.6K 5% 1/10W
R613 1-216-826-11 METAL CHIP 2.7K 5% 1/10W
R614 1-216-809-11 METAL CHIP 100 5% 1/10W
R615 1-216-809-11 METAL CHIP 100 5% 1/10W
R616 1-216-826-11 METAL CHIP 2.7K 5% 1/10W
R617 1-216-828-11 METAL CHIP 3.9K 5% 1/10W
R618 1-216-843-11 METAL CHIP 68K 5% 1/10W
R621 1-216-828-11 METAL CHIP 3.9K 5% 1/10W
R622 1-216-843-11 METAL CHIP 68K 5% 1/10W
R641 1-216-817-11 METAL CHIP 470 5% 1/10W
< VARIABLE RESISTOR >
RV601 1-223-274-11 RES, ADJ, CERMET (3 TYPE) 2.2K
(MUTE ON POSITION)
RV602 1-227-536-11 RES, VAR, CARBON 50K/50K (VOL )
******************************************************
SW BOARD
********
< SWITCH >
S703 1-762-003-11 SWITCH, PUSH (AUTO ON/OFF)
******************************************************
MISCELLANEOUS
*************
MDD601 X-3384-083-1 DRIVER ASSY
MDD602 X-3384-083-1 DRIVER ASSY
******************************************************
ACCESSORIES
***********
1-756-316-21 BATTERY, NICKEL.HYDROGEN (BP-HP550)
(US,CND)
1-756-316-31 BATTERY, NICKEL.HYDROGEN (BP-HP550)
(EXCEPT US,CND)
3-259-537-12 MANUAL, INSTRUCTION
(ENGLISH, FRENCH, SPANISH, KOREAN)
3-259-537-21 MANUAL, INSTRUCTION
(GERMAN, DUTCH, ITALIAN, PORTUGUESE)
(AEP)
w
RX
Ver 1.2

20
MDR-IF3000
REVISION HISTORY
Clicking the version allows you to jump to the revised page.
Also, clicking the version at the upper right on the revised page allows you to jump to the next revised
page.
Ver. Date Description of Revision
1.0 2003.09 New
1.1 2004.02 Additon of US, Canadian, AEP, E, Korean and Tourist models.
(ENG-03059)
1.2 2004.05 Correction of part No. (Ref. No.MDD601,602) (SPM-04037)