Sony MDR-RF940R User manual

HEADPHONES
MICROFILM
AEP Model
SPECIFICATIONS
SERVICE MANUAL
MDR-RF940R
MDR-RF940R is headphones
in MDR-RF940RK.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or
unsoldering

– 2 –
This section is extracted from
instruction manual. SECTION 1
GENERAL

– 3 – – 4 –
MDR-RF940R
Note: Follow the disassembly procedure in the numerical order given.
HOUSING (R)
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
HOUSING (L), SW BOARD
(Page 3)
HOUSING (R)
(Page 3)
HANGER (L)
(Page 4)
HANGER (R), RX BOARD
(Page 4)
SET
1 ear pad
2 four screws
(P 2
× 6)
4 front plate (R)
5 housing (R)
3 two bosses
HOUSING (L), SW BOARD
2 two screws
(P 2
× 6)
3 screw (P 2 × 6)
5 front plate (L)
6 housing (L)
7 SW board
4 two bosses
1 ear pad
HANGER (R), RX BOARD
5 screw
(PWH 2.6
× 6)
2 two screws
(P 2
× 10)
1 two screws
(P 2
× 6)
3 hanger (R)
4 RX board
6 two head bands
7 suspender ass’y
HANGER (L)
4 screw
(PWH 2.6
× 6)
2 two screws
(P 2
× 10)
1 two screws
(P 2
× 6)
5 two head bands
3 hanger (L)
6 suspender ass’y