2
SRF-HM01V
TABLE OF CONTENTS
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 4
2-2. MICROCOMPUTER Board ........................................... 4
2-3. MAIN Board ................................................................... 5
2-4. BATTERY Board ............................................................ 5
2-5. Putting the Sheet (A)....................................................... 6
3. ELECTRICAL ADJUSTMENTS......................... 7
4. DIAGRAMS
4-1. Block Diagram – TUNER Section – ............................. 9
4-2. Block Diagram – MAIN Section – ................................ 10
4-3. Note for Printed Wiring Boards
and Schematic Diagrams ................................................ 11
4-4. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 12
4-5. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 13
4-6. Printed Wiring Board – BATTERY Board – ................. 14
4-7. Schematic Diagram – BATTERY/MAIN Boards – ...... 15
4-8. Printed Wiring Board
– MICROCOMPUTER Board (Component Side) –.... 16
4-9. Printed Wiring Board
– MICROCOMPUTER Board (Conductor Side) –...... 17
4-10. Schematic Diagram
– MICROCOMPUTER Board –................................... 18
4-11. IC Pin Function Description ........................................... 20
5. EXPLODED VIEWS
5-1. Cabinet (R) Section......................................................... 21
5-2. Board Section .................................................................. 22
5-3. Cabinet (L) Section ......................................................... 23
6. ELECTRICAL PARTS LIST ............................... 24
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
