
1 (E)
SNC-CS50N/CS50P
Table of Contents
Manual Structure
Purpose of this manual ...........................................................3 (E)
Related manuals .....................................................................3 (E)
Trademarks .............................................................................3 (E)
1. Service Overview
1-1. Board Location ........................................................ 1-1 (E)
1-2. Unleaded Solder....................................................... 1-1 (E)
1-3. Removing/Installing the Cabinet ............................. 1-1 (E)
1-3-1. Lower Cover................................................... 1-1 (E)
1-3-2. Upper Cover ................................................... 1-2 (E)
1-3-3. Front Assembly .............................................. 1-2 (E)
1-3-4. Rear Assembly ............................................... 1-3 (E)
1-4. Removing/Installing the Board ................................ 1-3 (E)
1-4-1. CT-240 Board................................................. 1-3 (E)
1-4-2. Switching Regulator ....................................... 1-4 (E)
1-4-3. PR-291 Board ................................................. 1-4 (E)
1-4-4. SY-337 Board................................................. 1-5 (E)
1-5. Removing/Installing the CCD Assembly
and Optical Filter ..................................................... 1-6 (E)
1-6. Description of Internal Switch ................................. 1-6 (E)
1-7. Precautions when Replacing the Parts of
SY-337 Board .......................................................... 1-6 (E)
1-8. Matching Connector/Cable ...................................... 1-7 (E)
1-9. Signal Inputs/Outputs .............................................. 1-7 (E)
2. Alignment
2-1. Preparation ............................................................... 2-1 (E)
2-1-1. Required Equipment....................................... 2-1 (E)
2-1-2. Starting an Adjustment Program .................... 2-2 (E)
2-1-3. Connection Diagram ...................................... 2-4 (E)
2-2. Adjustment............................................................... 2-5 (E)
2-2-1. Read of Data in EEPROM ............................. 2-5 (E)
2-2-2. SYNC Level Adjustment ............................... 2-6 (E)
2-2-3. Burst Level Adjustment ................................. 2-6 (E)
2-2-4. 0 dB Adjustment............................................. 2-6 (E)
2-2-5. WB Adjustment (Preset at 3200 K)................ 2-7 (E)
2-2-6. Color Reproduction Adjustment .................... 2-7 (E)
2-2-7. Read of Detection Data at 3200 K ................. 2-8 (E)
2-2-8. Termination Processing.................................. 2-8 (E)
2-3. Confirmation after Adjustment................................ 2-9 (E)
2-3-1. Preparation for Confirmation ......................... 2-9 (E)
2-3-2. Confirmation of SYNC Level Adjustment..... 2-9 (E)
2-3-3. Confirmation of Burst Level Adjustment....... 2-9 (E)
2-3-4. Confirmation of 0 dB Adjustment................ 2-10 (E)
2-3-5. Confirmation of Color Reproduction
Adjustment ................................................... 2-10 (E)
2-4. Check of SY-337 Board......................................... 2-11 (E)
2-4-1. Preparation ................................................... 2-11 (E)
2-4-2. Sensor 1 Check............................................. 2-11 (E)
2-4-3. Sensor 2 Check............................................. 2-11 (E)
2-4-4. Serial Terminal Check.................................. 2-11 (E)
2-4-5. Alarm Output Check .................................... 2-11 (E)
2-4-6. LED Check ................................................... 2-11 (E)
2-4-7. Audio IN/OUT Check .................................. 2-12 (E)
2-4-8. PC Card Check ............................................. 2-12 (E)
2-4-9. Security Chip Check..................................... 2-12 (E)
2-4-10. Automatic Day/Night Mode Check.............. 2-12 (E)
2-4-11. Manual Day/Night Mode Check .................. 2-12 (E)
2-4-12. ATW Check.................................................. 2-12 (E)
2-4-13. One-push WB Check.................................... 2-12 (E)
2-4-14. ATW-PRO Check ........................................ 2-13 (E)
2-5. Defect Correction................................................... 2-13 (E)
2-6. Error Message List during Adjustment and
Defect Correction................................................... 2-16 (E)
3. Circuit Description
3-1. BI-193 Board ........................................................... 3-1 (E)
3-2. PR-291 Board .......................................................... 3-1 (E)
3-3. SY-337 Board .......................................................... 3-1 (E)
3-4. CT-240 Board .......................................................... 3-1 (E)
3-5. PSA-016 Power Board............................................. 3-2 (E)
4. Semiconductor Pin Assignments
5. Spare Parts
5-1. Notes on Repair Parts .....................................................5-1
5-2. Exploded Views ..............................................................5-2
5-3. Electrical Parts List.........................................................5-4
5-4. Supplied Accessories ....................................................5-16