Sony SRS-BTM30 - Wireless Speaker Sys User manual

SERVICE MANUAL
Sony Corporation
Personal Audio Division
Published by SonyTechno Create Corporation
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
WIRELESS SPEAKER SYSTEM
9-887-439-03
2007E16-1
© 2007.05
Ver. 1.2 2007.05
SPECIFICATIONS
SRS-BTM30
Speaker section
Speaker system
48 mm, Full range, magnetically shielded
Enclosure type
Bass reflex
Impedance
4 Ω
Rated input power
3 W
Maximum input power
6 W
Amplifier section
Rated output
3 W + 3 W (10% T.H.D., 1 kHz, 4 Ω)
Bass Boost
MEGA BASS
Audio input
Stereo minijack ×1
Input impedance
4.7 kΩ(at 1 kHz)
General
Power
Three R6 (size AA) batteries, DC 5.2V
(supplied AC power adaptor)
Dimensions (w/h/d)
Approx. 280 ×111 ×140 mm
(11
1
/
8
×4
3
/
8
×5
5
/
8
in.)
Mass
Approx. 750 g (1 lb. 10 oz.) including batteries
Communication System
BLUETOOTH Specification version 2.0
Output
BLUETOOTH Specification Power Class 2
Maximum communication range
Line of sight approx. 10 m (30 ft)*
1
Frequency band
2.4 GHz band (2.4000 GHz–2.4835 GHz)
Modulation method
FHSS
Compatible BLUETOOTH Profiles*
2
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio/Visual Remote Control Profile)
Volume UP/DOWN
Supported Codecs *
3
SBC *
4
, MP3
*
1
The actual range will vary depending on
factors such as obstacles between devices,
magnetic fields around a microwave oven,
static electricity, reception sensitivity, aerial’s
performance, operating system, software
application, etc.
*
2
BLUETOOTH standard profiles indicate the
purpose of BLUETOOTH communication
between devices.
*
3
Codec: Audio signal compression and
conversion format
*
4
Subband Codec
Supplied accessories
AC Power Cord (Mains lead) (1)
AC power adaptor (1)
Operating Instructions (1)
Optional accessories
Connecting cord RK-G136, RK-G138
Plug adaptor PC-234S, PC-236MS
The above optional accessories are not provided
in some areas.
Design and specifications are subject to change
without notice.
The Bluetooth word mark and logos are owned
by the Bluetooth SIG, Inc. and any use of such
marks by Sony Corporation is under license.
Other trademarks and trade names are those of
their respective owners.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.

2
SRS-BTM30
TABLE OF CONTENTS
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 6
2-2. Front Cabinet Assy, Rear Cabinet Assy........................... 7
2-3. AMP Board...................................................................... 8
2-4. BT Board ......................................................................... 8
2-5. Speaker Sub Assy ............................................................ 9
2-6. Rear Cabinet Sub Assy .................................................... 9
3. DIAGRAMS
3-1. Block Diagram ................................................................ 11
3-2. Printed Wiring Board – AMP Board (Side A) – ............. 12
3-3. Printed Wiring Board – AMP Board (Side B) – ............. 13
3-4. Schematic Diagram – AMP Board (1/2) – ..................... 14
3-5. Schematic Diagram – AMP Board (2/2) – ..................... 15
3-6. Printed Wiring Board – JACK Board – .......................... 16
3-7. Schematic Diagram – JACK Board – ............................. 16
4. EXPLODEDVIEWS
4-1. Overall Section ................................................................ 18
5. ELECTRICAL PARTS LIST .................................. 19
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 °C
during repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
On AC power adaptor
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd
Use only the supplied AC power adaptor. Do not use any
other AC power adaptor to avoid damaging the
transmitter.
Polarity of the plug
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Ver. 1.1

3
SRS-BTM30
SECTION 1
GENERAL This section is extracted
from instruction manual.
11(power) button/indicator
Press to turn on the unit. Press and
hold to turn off the unit.
The 1icon in the button lights up,
flashes, or goes off.
2ID SET (pairing) button
For pairing with other BLUETOOTH
device.
3VOLUME +/– buttons
Adjust the volume.
A beep sounds when the volume is set
to minimum or maximum.
4(communication status)
indicator
VOLUME
INPUT
DC IN 5.2V
5DC IN 5.2 V jack
Connects the supplied AC power
adaptor.
6INPUT (audio input) jack
Connects to the LINE OUT or to
headphone jack of a computer,
portable audio device, etc.
7Battery compartment
Insert three R6 (size AA) batteries
(optional).
Using the BLUETOOTH Connection
By using the BLUETOOTH connection, you can listen to the sound from a BLUETOOTH
stereo audio source device with this unit wirelessly.
Note
For details on how to operate the device to be connected, refer to the operating instructions supplied with
the device.
This unit
BLUETOOTH mobile phone or
other BLUETOOTH stereo
audio source device
Example
On pairing
What is pairing?
BLUETOOTH devices need to be “paired” with each other beforehand.
Once BLUETOOTH devices are paired, there is no need for pairing again, except in the
following cases:
• Pairing information is deleted after repair, etc.
• This unit is paired with 9 or more devices.
This unit can be paired with up to 8 BLUETOOTH stereo audio source devices. If a new
device is paired after 8 devices have been paired, the device whose latest connection time
is the oldest among the 8 paired devices is replaced by the new one.
• This unit is reset.
All pairing information is deleted.

4
SRS-BTM30
On indicators
Status 1indicator (green) indicator (blue)
Power on Lights up Off
Pairing mode Flashes Flashes
Connecting or Lights up Lights up
communicating
Pairing with a source device
Check the following before operating the unit.
– This unit is connected to a power source and the 1indicator (green) goes off.
1 Press and hold the ID SET button for 7 seconds or more.
When the 1indicator (green) and indicator (blue) start flashing together, release the
button. This unit enters pairing mode.
Note
Pairing mode is cancelled and this unit is turned off after about 5 minutes. If this unit is turned off
while performing the procedure, start over from step 1.
2 Perform pairing procedure on the BLUETOOTH stereo audio source
device to detect this unit.
The list of detected devices appear on the display of the BLUETOOTH stereo audio
source device.
This unit is displayed as “SRS-BTM30.”
If “SRS-BTM30” is not displayed, repeat from step 1.
Notes
• When pairing, be sure to place both the BLUETOOTH devices within 1 m (3 ft) of each other.
• Some devices cannot display the list of detected devices.
3 Select “SRS-BTM30” shown in the display of the BLUETOOTH stereo
audio source device.
4 If Passcode* input is required on the display of the BLUETOOTH stereo
audio source device, input “0000.”
* Passcode may be called “Passkey,” “PIN code,” “PIN number,” or “Password.”
5 Start the BLUETOOTH connection from the BLUETOOTH device.
Some BLUETOOTH stereo audio source devices may connect with the unit
automatically when pairing is complete.
When the BLUETOOTH connection is made properly, both the 1indicator (green)
and indicator (blue) light up indicating that pairing is complete, and pairing
information is memorized on this unit.
Note
If you turn off this unit or the BLUETOOTH stereo audio source device before the BLUETOOTH
connection is complete, pairing information is not memorized and pairing will not be completed.

5
SRS-BTM30
When pairing with a BLUETOOTH stereo audio source device that cannot display a list of
detected devices or that has no display
You may pair the device by setting both this unit and the BLUETOOTH stereo audio source device to
pairing mode. For details, refer to the operating instructions supplied with the device.
If pairing is not complete
Start over from step 1.
Tip
To pair with other BLUETOOTH devices, repeat steps 1to 5for each device.
Note
Passcode of this unit is fixed to “0000.” This unit cannot be paired with a BLUETOOTH stereo audio
source device whose Passcode is not “0000.”
What is BLUETOOTH technology?
BLUETOOTH wireless technology is a short-range wireless technology that enables
wireless data communication between digital devices, such as a computer or digital camera.
BLUETOOTH wireless technology operates within a range of about 10 meters (about 30
feet). Connecting two devices as necessary is common, but some devices can be connected
to multiple devices at the same time.*
You do not need to use a cable for connection since BLUETOOTH technology is a wireless
technology, nor is it necessary for the devices to face one another, such is the case with
infrared technology. For example, you can use such a device in a bag or pocket.
BLUETOOTH technology is an international standard supported by millions of companies
all over the world, and employed by various companies worldwide.
* This unit cannot be connected to multiple devices at the same time.
Communication System and Compatible BLUETOOTH Profiles of this
unit
Profile is standardization of the function for each BLUETOOTH device specification. This
unit supports the following BLUETOOTH version and profiles:
Communication System: BLUETOOTH Specification version 2.0
Compatible BLUETOOTH Profiles:
– A2DP (Advanced Audio Distribution Profile)
– AVRCP (Audio/Visual Remote Control Profile) Volume UP/DOWN
Initializing This Unit
You can reset this unit to its default and delete all pairing information.
1 If this unit is turned on, press and hold the 1button to turn off this
unit.
2While holding the 1button, press the ID SET button for 7 seconds or
more.
The 1indicator (green) and the indicator (blue) flash four times, and this unit is
reset to the default setting. All pairing information is deleted.

6
SRS-BTM30 SECTION 2
DISASSEMBLY
2-1. DISASSEMBLY FLOW
Note: Disassemble the unit in the order as shown below.
2-2. FRONT CABINET ASSY,
REAR CABINET ASSY
(Page 7)
SET
2-4. BT BOARD
(Page 8)
2-5. SPEAKER SUB ASSY
(Page 9)
2-6. REAR CABINET
SUB ASSY
(Page 9)
2-3. AMP BOARD
(Page 8)

7
SRS-BTM30
1 battery case lid
4 three tapping screws
(+P 2.6
× 8)
8 rear cabinet assy
5 three tapping screws
(+P 2.6
× 8)
7 front cabinet assy
6 wire (flat type)
13core (CN901)
3 back panel
2 two tapping screws
(+P 2.6
× 8)
Note: Follow the disassembly procedure in the numerical order given.
2-2. FRONTCABINETASSY,REARCABINET ASSY

8
SRS-BTM30
1 four tapping screws
(+P B2.6)
3 connector
(CN301)
2 wire (flat type)
13core (CN801)
D603
17mm
11mm
below 10mm
angle
below 90
°
4
connector
(CN401)
6 AMP board AMP board
D602
5 flexible flat cable
24core (CN101)
PRECAUTION DURING AMP BOARD
INSTALLATION
2 screw
(+PTPWH 3
× 6)
3 screw
(+PTPWH 2
× 5)
4 BT board
1 flexible flat cable
24core (CN801)
2-3. AMP BOARD
2-4. BT BOARD

9
SRS-BTM30
4 four tapping screws
(+BV B3)
5 four tapping screws
(+BV B3)
6 speaker sub assy
red cable
red cable
black cable
black cable
7 speaker sub assy
8 front cabinet sub assy
3 four packing
sheets (w)
1 two notches
2 two notches
1 two tapping screws
(+P 2.6
× 8)
7 rear cabinet sub assy
5 two tapping screws
(+P 2.6
× 8)
6 JACK board
4 battery case assy
red cable
black cable
2 two screws
(+PTPWH 2
× 5)
3 connector (CN902)
2-5. SPEAKER SUB ASSY
2-6. REAR CABINET SUB ASSY

10
SRS-BTM30 SECTION 3
DIAGRAMS
Note on PrintedWiring Boards.
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
Caution:
Pattern face side: Partsonthepatternface sideseenfrom
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
•These boards are multi-layer printed board. However, the paterns
of intermediate-layer have not been included in the diagram.
Note on Schematic Diagrams.
•All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise specified.
• f: internal tolerance.
•C: panel designation.
•A: B+ Line.
•Power voltage is dc 5.2 V and fed with regulated dc power supply
from terminal (J902).
•Voltages and waveforms are dc with respect to ground under no-
signal (detuned) conditions.
no mark : POWER ON (Set DC IN 5.2V)
(): PAIRING MODE
∗ : Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
•Circled numbers refer to waveforms.
•Signal path.
F: AUDIO

1111
SRS-BTM30
SRS-BTM30
3-1. BLOCK DIAGRAM
• SIGNAL PATH
: AUDIO
IC102
BUFFER
SPK301
SPEAKER
L
D602,603
FILTER
Q201 Q202
S503
S502
S504
INPUT
J901
J902
42 IC803
RESET
5V
45 IC802
3.3V REG 3.3V
VREF
2
31
6
5
13
11
IC202
AUDIO AMP IC101 EVR
9
12
10
8
7
5
6 5
3
1 IN+ 5
7
VO+
VO-
12
LOUT
ROUT
6
11
LIN
RIN
5VREF
6
IC703
LR MIX AMP
7
IC701
AUDIO
DETECT
IC201,Q203
EQ IC301 POWER AMP
IC702
SWITCH
EQ
ON/OFF
R-CH
R-CH
71
MLEN14
MCK
15
MDT
16
5 6
BT BOARD
Q602-605
BEEP GEN
FILTER
R-CH
R-CH
D201
Q301
MUTE
ID SET
+
-
VOLUME
1(POWER)
DC IN 5.2V
12
IC801
LOW
VOLTAGE
DET
Q801,802
SWITCH
SRS_PWR
Q803,804
SWITCH
Q805,806
BUFFER
4
SHUTDOWN
15
7
IC311
POWER AMP
4
SPK401
SPEAKER
R
Q807
R-CH
R-CH
Q601
LED DRIVER
R-CH
DRY BATTERY
SIZE "AA"
R6 3PCS, 4.5V
IN+ VO+
VO-
SHUTDOWN

1212
SRS-BTM30
SRS-BTM30
3-2. PRINTEDWIRING BOARD – AMP BOARD (SIDE A) – :Uses unleaded solder.
JACK BOARD
CN901
(Page 16)
A
SPEAKER
SUB ASSY
L-CH
SPEAKER
SUB ASSY
R-CH
BT BOARD
IC701
IC301
IC311
IC202
IC803
IC201
IC102
IC501
IC411
IC401
1
2
345
6
78
9
1
1
2
3
3
4
4
5
5
1
3
4
5
6
78
9
1
2
345
6
78
9
1
2
345
6
78
9
13
4
6
13
4
6
12
A
B
C
D
E
F
G
H
345678910111213
1
2
3
4
1
2
3
4
1
23
4
D802
TP101
TP103
TP105
TP107
TP108
TP312
TP302
TP311
TP301
TP113
TP114
TP402
TP401
TP411
TP412
TP116
TP121
TP803TP802
TP122
TP123
TP805
TP804
TP115
TP124
TP117
TP118
TP119
TP120
TP809
TP811
TP812
TP810
Q601
FB106
Q803
CN401
C209
FB105
VDR311
CN801
C601
VDR312
FB313
FB314
FB311
FB312
D311
D312
C104 VDR411
VDR412
FB414
FB413
C103
FB411
FB412
D411
D412
VDR402
VDR401
FB404
FB403
FB401
FB402
D401
D402
VDR301
VDR302
FB303
FB304
C308
FB301
FB302
D301
D302
Q203
Q805
Q806
FB107
C118
C102
C101
C117
C112
C106C109
C802
Q602
Q603
Q604
Q605
C701
C805
IC802
Q503
Q801
CN301
Q301
Q401
Q807
C509
C809
CN101
TP106
TP104
C306
C305
C309
C318
C307
C304
C303
C302
C608
C301
C312
C311
C316
C315
C124
C313
C314
C317
C135
C319
C127
C132
C128
C130
C129
C131
C801
C806
C807
C808
C501
C502
C504
C510
C508
C216
C604
C605 C606
C607
C704
C703
C401
C403
C404
C407
C406
C405
C402
C408
C419
C418
C416
C415 C414
C417
C411
C412
C413
C814
C813
C812
R301
R302
R116
R118
R119
R117
R104
R604
R605
R121
R101
R105
R106
R102
R702
R701
R311
R312
R611
R220
R219
R217
R201
R208
R202
R209
R212
R210
R218
R215
R304
R216
R227
R606
R607
R608
R609
R710
R709
R708
R411
R412 R401
R814
R812
R813
R511
R530
R811
R810
C702
R610
R402
R517
R514
R515
R518
R513
R516
R512
R509
R510
R508
R502
R501
C119
C202
C201
C208
C207
C206
R214
R213
R211
C205
R120
R115
R114
R113
R519
C506
C505
C409
C507
R520
C204
C811
R815
R816
TP806
D601
TP813 TP814
TP801
1-872-963-
• Semiconductor
Location
Ref. No. Location
D301 C-3
D302 C-3
D311 D-4
D312 E-3
D401 D-11
D402 C-11
D411 E-10
D412 D-11
D601 G-4
IC102 F-6
IC201 D-6
IC202 G-4
IC301 C-3
IC311 E-4
IC401 C-11
IC411 D-10
IC501 E-9
IC701 C-9
IC802 F-7
IC803 G-10
Q203 C-6
Q301 C-7
Q401 D-10
Q503 D-8
Q601 G-3
Q602 C-7
Q603 C-7
Q604 C-7
Q605 D-8
Q801 F-8
Q803 F-7
Q805 F-11
Q806 F-11
Q807 E-10
Ver. 1.1

1313
SRS-BTM30
SRS-BTM30
3-3. PRINTEDWIRING BOARD – AMP BOARD (SIDE B) – :Uses unleaded solder.
IC703
IC702
IC801
IC101
5
3
4
1
12
A
B
C
D
E
F
G
H
345678910111213
1-872-963-
D603
D602
S504S501
Q202
FB104
Q804
Q501
Q201
Q505
C111
Q802
C705
C125
C126
C107
C212
C215
C214
C513
C511
C512
C804
C706
C707
R303
R313
R103
R110
R112
R111
R109
R108
R107
R204
R205
R203
R206
R207
R225
R226
R524
R523
R223
R224
R521
R522
R504
R507
R505
R503
R506
R806
R803
R804
R805
R807
R801
R802
R808
R809
R413
R403
C213
C514
C803
C114
C115
C120
C105
C116
C121
R122
C108
C110
C113
C123
R703
C503
C203
1
1
+
S503
ID
SET
VOLUME
S502
• Semiconductor
Location
Ref. No. Location
D602 C-4
D603 H-7
IC101 E-6
IC702 D-9
IC703 D-9
IC801 F-9
Q201 C-6
Q202 D-7
Q501 E-8
Q505 E-9
Q802 E-9
Q804 G-9
Ver. 1.1

1414
SRS-BTM30
SRS-BTM30
3-4. SCHEMATIC DIAGRAM – AMP BOARD (1/2) – • See page 17 for IC Block Diagram.
1
13
Q804
CN801
Q806
Q805
TP103
TP108
TP113
TP114
TP115
TP116
TP121
TP122
TP123
TP124
TP101
TP802
TP803
TP804
TP805
TP809
TP810
TP806
TP801
TP117
TP118
TP119
TP120
IC101
C802
C805
IC803
TP105
TP107
TP106
TP104
D603
CN101
C801
C126 R103
C127
R101
R104
R117
R116
C132
C120
C103
C109 C108
C107
C122
C124
C106
C117 C118
C114
C115
C116
C123
C121C113
C104
C125
C119
R109
R108
R107
R114
R113
R115
R112
R111
R110
S504S503
S502S501
R808
R807
R806
C804
C803R802
R801
R804
R805
R803
C811
R813
Q802
R809
C812
R812
R814
R816
C814
R815
C813
FB105
FB107
FB106
C128 R105
C135
R102
R118
C131
R120R121
C130
C129 R106
R119
C102
C101
C110
C111
C112
IC202
C105
D602
Q601
IC801
Q807
R605
R604
Q803Q801
IC102
C601
D601
DTC114EUA-T106
13P
DTC114EUA-T106
DTC114EUA-T106
IC SM6451BT-G-E2
220
10V
220
10V
PST3620UL
SLR343BC4T
24P
0.1
122k
1
82k
22k
22k
22k
1
100p
10
16V
10
16V 0.022
0.022
100p
1
10
16V
0.1 10
16V
100p
100p
100p
100p100p0.022
10 16V
1
0.1
100
100
100
0
0
0
10k
10k
10k
220k
100
220k
0.1
0.01
220k
56k
220k
0
220k
1
22k
2SK3018-T106
100
0.1
6.8k
22k
220k
1
220k
1
0
0
0
122k
0.1
82k
22k
1
5.6k
5.6k
1
122k
22k
10
16V
10
16V
0.022
10 16V
10 16V
NJU7043RB1(TE2)
0.001
DIODE L-34VGCK
-F01
RN1705(TE85R-F)
S-80943CNMC
-G9DT2G
2SC2712G-TE85L
220
220
UPA1919E-T1UPA1919TE-T1
SN74LVC07APWR
10
16V
1SS355TE-17
16
15
BT BOARD

1515
SRS-BTM30
SRS-BTM30
Q603
TP311
TP312
TP301
TP302
TP401
TP402
TP411
TP412
TP811
TP812
Q401
IC301
IC401
IC411
IC311
Q602
TP813
TP814
C201
C202 R202
R201 C204
R208
R210
R205
C216
R209
R212
C205
R211
R227
C206
R216
R220
C209
R217
R218 R219
C207
R214
R207
R206
R204R203
C203
R701
R702
C702
C707
R710
C701
C706
C505
R511
R530
R508
C504
C510
R505
R502
R501
R516 C506
R504
C503 R506
R507
R515
R503
R514
R513
C507
C508
R518 R519
C509
R520
R609
C606
C605
R608R607R606
C807
C806
IC802
C411
C412 R411
R412
C414 C415
C413
C417
FB412
FB411 FB413
FB414
VDR411 VDR412
R403
FB402
FB401 FB403
FB404
VDR401
VDR402
C407
C405
C404
C403
R610
C607
C401
C402
R401
R402
R524
C512R522
R521 R523
R226
R224
R225
C213
C212
R223
C312 C314 C315
C313
R312
C311
R311
C317
FB311
FB312
R313
VDR311 VDR312
FB314
FB313
CNP301
CN301
SPK301
VDR302
VDR301
R303
FB304
FB303
FB302
FB301
C307C305
C304
C303
C302
C301
R301
R304
R611
C208
R215
R213
IC702
C501
R709
IC701
R703
R708
C502
R510
R509
R517
C604
C809
R811
R810
C808
Q301
C608
C306
R302
C316
C511
C406
C416
R413
CNP401
CN401
SPK401
R512
Q201
Q202
IC201
Q203
C308 C309
C318 C319
D311 D312
D301 D302
C214 C215
C514
C513
C704
C703
IC703
IC501
Q503
Q505
Q501
Q604 Q605 D411 D412 C418 C419
C409C408
D402
D401
C705
DTC114EUA-T106
FET 2SK3018-T106
IC TPA2010D1YZFR
IC TPA2010D1YZFR
IC TPA2010D1YZFR
IC TPA2010D1YZFR
DTA114EUA-T106
10
330p 4.7k
22k 0.47
22k
2.2k
8.2k
0.1
47k
47k
1
22k
100k
1
4.7k
1k
47
10V
220k
180 6.8k
0.015
47k
100
150
100150
0.068
10k
10k
0.1
0.1
15k
0.1
0.1
1
22k
100k
22k
0.47
0.1
8.2k
4.7k
22k
4.7k 1
100
0.068 150
100
1.2k
150
47k
10k
0.015
0.015
180 6.8k
47
10V
1k
4.7k
0.010.01
22k
22k
2.2k
0.01
1
MM1613DNLE
1
1
47k
47k
100p 100p
100p
1
0
0
0
0
0
1
100p
100p
100p
1M
0.1
1
1
47k
47k
10k
2.21k
1k 10k
10k
1k
10k
2.2
2.2
1k
1100p 100p
100p
47k
1
47k
1
0
0
0
4P
4P
0
0
0
1100p
100p
100p
1
1
47k
0
1M
0.015
1.2k
10k
TC7W66FK(TE85R)
10
15k
NJM2072M(TE2)
100k
0
330p
2.2k
47k
220k
0.1
10 16V
10k
10k
1
2SK3018-T106
0.1
0.01
47k
0.01
2.2
0.01
0.01
0
4P
4P
47k
2SC2712G-TE85L
2SC2712G-TE85L
NJM2746RB1(TE2)
2SC2712G
-TE85L
0.001 0.001
0.001 0.001
BAV99 BAV99
BAV99 BAV99
0.0033 0.0033
0.0033
0.0033
0.001
0.001
NJM2746RB1(TE2)
NJM2746RB1(TE2)
2SC2712G-TE85L
2SC2712G
-TE85L
2SC2712G-TE85L
2SC2712G-TE85L 2SC2712G-TE85L BAV99 BAV99 0.001 0.001
0.0010.001
BAV99
BAV99
10 16V
14
EQ
EQ
EQ
ON/OFF
EQ
EQ
3-5. SCHEMATIC DIAGRAM – AMP BOARD (2/2) – • See page 17 for IC Block Diagrams. Ver. 1.1

1616
SRS-BTM30
SRS-BTM30
3-6. PRINTEDWIRING BOARD – JACK BOARD – :Uses unleaded solder.
DC IN 5.2V
AMP BOARD
CN801
(Page 12)
A
DRY BATTERY
(IEC DESIGNATION R6)
3PCS, 4.5V
12
A
B
C
D
E
F
G
H
I
345678
TP904TP908
TP909
J901
TP910
TP911
TP912
TP913
VDR901
FB902
FB901
CN901
D901
C902
C903
FB904
C901
J902
J902
FB903
CN902
J901
INPUT
1-872-962-
1-872-962-
3-7. SCHEMATIC DIAGRAM – JACK BOARD –
FB902
CN901
CN902
TP913
TP912
TP911
TP910
TP909
TP908
TP904
D901
C901
FB901
C903
J902
J901
C902
VDR901
FB904
FB903 0
13P
2P
RB051L-40TE25
0.1
0
0.1
0.1
0
0
1
13
14
Ver. 1.1

17
SRS-BTM30
•IC Block Diagrams
– AMP Board –
IC101 SM6451BT-G-E2
Attenuation Control
ADRS2 RSTN ADRS1
VRR
AVSS
RIN
ROUT
DVSS
MLEN
MCK
MDT
LOUT AVDD LIN
1/2 VDD
1/2 VDD
VRL DVDD
Attenuation DecoderInterface Control
Chip
Address
Decoder
Reference
Voltage
Circuits
Attenuation Control
12 3 45678
9
10
11
12
13
141516
IC301, IC311, IC401, IC411 TPA2010D1YZFR
_
+_
+_
+_
+
150 k
150 k
_
+
_
+
Deglitch
Logic
Deglitch
Logic
Gate
Drive
Gate
Drive
OC
Detect
Startup
Protection
Logic
Ramp
Generator
Biases
and
References
TTL
Input
Buffer
SD
*Gain = 2 V/V
300 k
Notes:
*Total gain = 150 k
RI
2 x
150 k
RI
*Gain =
IN–
IN+
VDD
PVDD
VO+
VO–
GND
GND
SHUTDOWN
1 2 3 4 5 6789

18
SRS-BTM30
10 3-252-829-01 SCREW (B3), (+) BV TAPPING
11 3-669-480-32 SCREW +PTPWH (2X5)
12 3-254-151-01 SCREW (B2.6), (+) P TAPPING
13 3-831-441-99 CUSHION, STOPPER
SPK301 X-2176-058-1 SPEAKER SUB ASSY, SVX
SPK401 X-2176-058-1 SPEAKER SUB ASSY, SVX
#1 7-685-903-11 SCREW +PTPWH 3X6 (TYPE2)
SECTION 4
EXPLODED VIEWS
NOTE:
•-XX and -X mean standardized parts, so they
may have some difference from the original
one.
•The mechanical parts with no reference
numberin theexplodedviewsare notsupplied.
Ref. No. Part No. Description Remark
1X-2148-693-1 FRONT CABINET SUB ASSY
2X-2177-139-1 BT BOARD, COMPLETE
31-831-264-11 CABLE, FLEXIBLE FLAT (24 CORE)
4A-1199-815-A AMP BOARD, COMPLETE
51-828-328-11 WIRE (FLAT TYPE) (13 CORE)
6X-2149-590-1 REAR CABINET SUB ASSY
72-695-659-01 PANEL, BACK
8A-1234-100-A LID ASSY
9A-1206-202-A BATTERY CASE ASSY
4-1. OVERALL SECTION
Ref. No. Part No. Description Remark
•Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
1
11 9
8
10
10 12
6
712
4
11
5
12
3
212
12 7
not
supplied
#1
not
supplied SPK401
SPK301
not
supplied
13
Ver. 1.1

19
SRS-BTM30
SECTION 5
ELECTRICAL PARTS LIST
NOTE:
•Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.
•-XX and -X mean standardized parts, so they
may have some difference from the original
one.
•Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
•CAPACITORS
uF: µF
•COILS
uH: µH
•RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
•SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. . uPA. . : µPA. .
uPB. . : µPB. . uPC. . : µPC. .
uPD. . : µPD. .
•Accessories are given in the last of this parts
list.
•Abbreviation
AUS:Australian model
CND : Canadian model
E18 : 100 – 240V AC area in E model
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
AMP
When indicating parts by reference number,
please include the board name.
A-1199-815-A AMP BOARD, COMPLETE
********************
< CAPACITOR >
C101 1-124-779-00 ELECT CHIP 10uF 20% 16V
C102 1-124-779-00 ELECT CHIP 10uF 20% 16V
C103 1-124-779-00 ELECT CHIP 10uF 20% 16V
C104 1-124-779-00 ELECT CHIP 10uF 20% 16V
C105 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C106 1-124-779-00 ELECT CHIP 10uF 20% 16V
C107 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C108 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C109 1-124-779-00 ELECT CHIP 10uF 20% 16V
C110 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C111 1-124-779-00 ELECT CHIP 10uF 20% 16V
C112 1-124-779-00 ELECT CHIP 10uF 20% 16V
C113 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C114 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C115 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C116 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C117 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C118 1-124-779-00 ELECT CHIP 10uF 20% 16V
C119 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C120 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C121 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C122 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C123 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C124 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C125 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C126 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C127 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C128 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C129 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C130 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C131 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C132 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C135 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C201 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C202 1-162-959-11 CERAMIC CHIP 330PF 5% 50V
C203 1-127-955-21 FILM CHIP 0.068uF 5% 16V
C204 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C205 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C206 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C207 1-164-245-11 CERAMIC CHIP 0.015uF 10% 25V
C208 1-164-245-11 CERAMIC CHIP 0.015uF 10% 25V
C209 1-126-204-11 ELECT CHIP 47uF 20% 16V
C212 1-100-742-91 CERAMIC CHIP 2.2uF 20% 10V
C213 1-100-742-91 CERAMIC CHIP 2.2uF 20% 10V
C214 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C215 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C216 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C301 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C302 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C303 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C304 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C305 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C306 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C307 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C308 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C309 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C311 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C312 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C313 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C314 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C315 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C316 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C317 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C318 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C319 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C401 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C402 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C403 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C404 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C405 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C406 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C407 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C408 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C409 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C411 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C412 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C413 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C414 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C415 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C416 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C417 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C418 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C419 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C501 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C502 1-162-959-11 CERAMIC CHIP 330PF 5% 50V
C503 1-127-955-21 FILM CHIP 0.068uF 5% 16V
C504 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10V
C505 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
Ver. 1.2
The components identified by mark 0or
dotted line with mark 0are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque 0
sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant le
numéro spécifié.

20
SRS-BTM30
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
AMP
C506 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C507 1-164-245-11 CERAMIC CHIP 0.015uF 10% 25V
C508 1-164-245-11 CERAMIC CHIP 0.015uF 10% 25V
C509 1-126-204-11 ELECT CHIP 47uF 20% 16V
C510 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C511 1-100-742-91 CERAMIC CHIP 2.2uF 20% 10V
C512 1-100-742-91 CERAMIC CHIP 2.2uF 20% 10V
C513 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C514 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50V
C601 1-124-779-00 ELECT CHIP 10uF 20% 16V
C604 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C605 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C606 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C607 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C608 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C701 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C702 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C703 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C704 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C705 1-124-779-00 ELECT CHIP 10uF 20% 16V
C706 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C707 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C801 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C802 1-128-394-11 ELECT CHIP 220uF 20% 10V
C803 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C804 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C805 1-128-394-11 ELECT CHIP 220uF 20% 10V
C806 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C807 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C808 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C809 1-124-779-00 ELECT CHIP 10uF 20% 16V
C811 1-127-573-11 CERAMIC CHIP 1uF 10% 16V
C812 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C813 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C814 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
< CONNECTOR >
CN101 1-779-336-51 CONNECTOR, FFC/FPC 24P
*CN301 1-764-250-11 PIN, CONNECTOR (PC BOARD) 4P
*CN401 1-764-250-11 PIN, CONNECTOR (PC BOARD) 4P
CN801 1-784-865-51 CONNECTOR, FFC (LIF (NON-ZIF)) 13P
< DIODE >
D301 8-719-909-90 DIODE BAV99
D302 8-719-909-90 DIODE BAV99
D311 8-719-909-90 DIODE BAV99
D312 8-719-909-90 DIODE BAV99
D401 8-719-909-90 DIODE BAV99
D402 8-719-909-90 DIODE BAV99
D411 8-719-909-90 DIODE BAV99
D412 8-719-909-90 DIODE BAV99
D601 8-719-988-61 DIODE 1SS355TE-17
D602 6-501-026-01 DIODE L-34VGCK-F01(1)
D603 6-501-572-01 DIODE SLR343BC4T ( )
< FERRITE BEAD >
FB105 1-216-864-11 SHORT CHIP 0
FB106 1-216-864-11 SHORT CHIP 0
FB107 1-216-864-11 SHORT CHIP 0
FB301 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB302 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB303 1-216-864-11 SHORT CHIP 0
FB304 1-216-864-11 SHORT CHIP 0
FB311 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB312 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB313 1-216-864-11 SHORT CHIP 0
FB314 1-216-864-11 SHORT CHIP 0
FB401 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB402 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB403 1-216-864-11 SHORT CHIP 0
FB404 1-216-864-11 SHORT CHIP 0
FB411 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB412 1-469-324-21 INDUCTOR (EMI FERRITE) (2012)
FB413 1-216-864-11 SHORT CHIP 0
FB414 1-216-864-11 SHORT CHIP 0
< IC >
IC101 6-703-615-01 IC SM6451BT-G-E2
IC102 8-759-648-70 IC SN74LVC07APWR
IC201 6-707-702-01 IC NJM2746RB1 (TE2)
IC202 6-703-879-01 IC NJU7043RB1 (TE2)
IC301 Not supplied IC TPA2010D1YZFR
IC311 Not supplied IC TPA2010D1YZFR
IC401 Not supplied IC TPA2010D1YZFR
IC411 Not supplied IC TPA2010D1YZFR
IC501 6-707-702-01 IC NJM2746RB1 (TE2)
IC701 8-759-701-51 IC NJM2072M
IC702 8-759-647-75 IC TC7W66FK (TE85R)
IC703 6-707-702-01 IC NJM2746RB1 (TE2)
IC801 6-703-390-01 IC S-80943CNMC-G9DT2G
IC802 6-707-281-01 IC MM1613DNLE
IC803 6-705-019-01 IC PST3620UL
< TRANSISTOR >
Q201 8-729-230-49 TRANSISTOR 2SC2712-YG
Q202 8-729-230-49 TRANSISTOR 2SC2712-YG
Q203 8-729-230-49 TRANSISTOR 2SC2712-YG
Q301 8-729-048-50 TRANSISTOR 2SK3018-T106
Q401 8-729-048-50 TRANSISTOR 2SK3018-T106
Q501 8-729-230-49 TRANSISTOR 2SC2712-YG
Q503 8-729-230-49 TRANSISTOR 2SC2712-YG
Q505 8-729-230-49 TRANSISTOR 2SC2712-YG
Q601 6-550-975-01 TRANSISTOR RN1705 (TE85R.F)
Q602 8-729-028-73 TRANSISTOR DTA114EUA-T106
Q603 8-729-907-00 TRANSISTOR DTC114EU
Q604 8-729-230-49 TRANSISTOR 2SC2712-YG
Q605 8-729-230-49 TRANSISTOR 2SC2712-YG
Q801 6-551-317-01 TRANSISTOR UPA1919TE-T1
Q802 8-729-048-50 TRANSISTOR 2SK3018-T106
Q803 6-551-317-01 TRANSISTOR UPA1919TE-T1
Q804 8-729-907-00 TRANSISTOR DTC114EU
Q805 8-729-907-00 TRANSISTOR DTC114EU
Q806 8-729-907-00 TRANSISTOR DTC114EU
Q807 8-729-230-49 TRANSISTOR 2SC2712-YG
IC301, IC311, IC401, IC411 on AMP board cannot be replaced
individually. Replace it with “AMP BOARD, COMPLETE” for service.