Sony HCD-DX50/RG80 User manual

HCD-DX50/RG80
Canadian Model
HCD-RG80
Australian Model
E Model
HCD-DX50
SERVICE MANUAL
MINI HI-FI COMPONENT SYSTEM
Model Name Using Similar Mechanism NEW
CD CD Mechanism Type CDM58E-30BD60
Section Base Unit Name BU-30BD60
Optical Pick-up Name A-MAX.3
Tape deck Model Name Using Similar Mechanism NEW
Section Tape Transport Mechanism Type TCM-230PWR41C
SPECIFICATIONS
Ver 1.2 2002. 09
•HCD-DX50/RG80 are the tuner,
deck, CD and amplifier section in
MHC-DX50/RG80.
— Continued on next page —
Photo : HCD-DX50
Sony Corporation
Home Audio Company
Published by Sony Engineering Corporation
9-929-589-13
2002I1600-1
© 2002.09

2
HCD-DX50/RG80
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
otherthanthosespecified hereinmay result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE WITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.

3
HCD-DX50/RG80
TABLE OF CONTENTS
1. GENERAL ·········································································· 4
2. DISASSEMBLY······························································· 7
3. TEST MODE ···································································· 12
4. MECHANICAL ADJUSTMENTS ····························· 14
5. ELECTRICAL ADJUSTMENTS ······························· 14
6. DIAGRAMS
6-1. Circuit Board Location ················································· 20
6-2. Block Diagrams ···························································· 21
6-3. Schematic Diagram Main Section (1/4) ···················· 23
6-4. Schematic Diagram Main Section (2/4) ···················· 24
6-5. Schematic Diagram Main Section (3/4) ···················· 25
6-6. Schematic Diagram Main Section (4/4) ···················· 26
6-7. Printed Wiring Board Main Section ·························· 27
6-8. Schematic Diagram BD Section ································ 28
6-9. Printed Wiring Board BD Section ····························· 29
6-10. Schematic Diagram AMP Section ··························· 30
6-11. Printed Wiring Board AMP Section························· 31
6-12. Schematic Diagram Panel Section ··························· 32
6-13. Printed Wiring Board Panel Section ························ 33
6-14. Schematic Diagram Panel SW Section ···················· 34
6-15. Printed Wiring Board Panel SW Section ················· 35
6-16. Schematic Diagram Leaf SW Section ····················· 36
6-17. Printed Wiring Board Leaf SW Section ··················· 37
6-18. Schematic Diagram Driver Section ························· 38
6-19. Printed Wiring Board Driver Section ······················· 39
6-20. Schematic Diagram Trans Section ··························· 40
6-21. Printed Wiring Board Trans Section ························ 41
6-22. Printed Wiring Board Switch Section ······················ 42
6-23. IC Pin Function Description ······································· 42
6-24. IC Block Diagrams ····················································· 45
7. EXPLODED VIEWS
7-1. Cabinet Section ····························································· 47
7-2. Front Panel Section······················································· 48
7-3. Main Board Section ······················································ 49
7-4. Tape Mechanism Section-1 (TCM-230PWR41C)········ 50
7-5. Tape Mechanism Section-2 (TCM-230PWR41C)········ 51
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 52
7-7. Base Unit Section (BU-30BD60) ································· 53
8. ELECTRICAL PARTS LIST ······································· 54
SAFETY CHECK-OUT
After correcting the original service problem, perform the
following safety checks before releasing the set to the customer:
Checktheantennaterminals,metaltrim,“metallized”knobs,screws,
and all other exposed metal parts forAC leakage. Check leakage as
described below.
LEAKAGE
TheAC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operatedAC voltmeter. The “limit”indication
is 0.75V, so analog meters must have an accurate low-voltage
scale.The Simpson 250 and Sanwa SH-63Trd are examples of
a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2VAC range are suitable. (See
Fig. A)
Earth Ground
AC
voltmeter
(0.75V)
1.5kΩ
0.15µF
Fig. A. Using an AC voltmeter to check AC leakage.
To Exposed Metal
Parts on Set
MODEL IDENTIFICATION
—BACK PANEL —
MODEL
DX50 : E, SP, AR models
DX50 : KR, MX, AUS/RG80 models
PARTS No.
4-231-580-0s
4-231-580-2s
•Abbreviation
AUS : Australian model
SP : Singapore model
KR : Korea model
PARTS No.
MX : Mexican model
AR : Argentina model

4
HCD-DX50/RG80 SECTION 1
GENERAL This section is extracted from
instruction manual.

5
HCD-DX50/RG80

6
HCD-DX50/RG80

7
HCD-DX50/RG80
SECTION 2
DISASSEMBLY
Note : Follow the disassembly procedure in the numerical order given.
2-1. UPPER CASE (TOP)
Side panel (R)
4
qa
q;
q;
8
Upper case (Top)
Side panel (L)
5 Two screws (Case)
7 Two screws
(+BVTP 3
× 10)
3 Two screws
(+BVTP 3
× 10)
1 Two screws (Case)
9 Four screws (+BVTP 3 × 12)
6 Screw (Case)
2 Screw (Case)
•The equipment can be removed using the following procedure.
Driver board, Moter board and Address sensor board
Upper case (Top)
Loading panel assy
Front panel section
Panel board
Sub trans board and Main trans board Main board and Power board
Leaf SW board, Head (A) board and Head (B) board
Base unit
Set

8
HCD-DX50/RG80
2-3. FRONT PANEL SECTION
2-2. LOADING PANEL ASSY
2 Pull-out the disc tray.
1 Turn the pulley to the direction of arrow.
pulley
Loading panel
Front panel side
CD mechanism deck (CDM58E)
3
qf
qd
5
CD mechanism deck (CDM58E)
Front panel section
q; Connector
9 Connector
2 Connector
6 Flat type wire (17 core)
1 Flat type wire
(21 core)
qa Two screws (+BVTP 3 × 10 )
7 Screws (+BVTP 3 × 10
)
8 Screws
(+BVTP 3 × 10)
3 Screw
(+BVTP 3 × 10)
qs Screw
(+BVTP 3 × 10)
4 Screw (+BVTP 3 × 10)

9
HCD-DX50/RG80
2-4. PANEL BOARD
2-5. SUB TRANS BOARD AND MAIN TRANS BOARD
3 Two screws
(+BVTT 4
× 8)
8 Five screws
(+BVTP 3
× 10
)
7 Two screws
(+BVTP 3
× 10)
9 Back panel
4 Two screws
(+BVTT 4
× 8)
6 Main trans board
5 Power transformer (T910)
1 Connector (CN973)
2 Connector (CN977)
q; Screw (+BVTP 3 × 10)
qd Switch board
qa Sensor board
qs Screw
(+BVTP 3
× 8)
qf Three screws
(+BVTP 3
× 10)
qg Sub trans board
q; Panel board
7 CD Switch board
qs Pad
switch board
1 Knob (Volume)
2 Nut
3 Bracket ring
4 Ring volume
6 Four claws
9 Two claws
5 Four screws
(+BVTP 2.6
× 8)
8 Nine screws
(+BVTP 2.6
× 8)
qd Five screws
(+BVTP 2.6
× 8)
qa Eight screws
(+BVTP 2.6
× 8)
qf Tape mechanism deck

10
HCD-DX50/RG80
2-7. LEAF SW BOARD, HEAD (A) BOARD AND HEAD (B) BOARD
5 Screw (+PTT 2 × 4)
3 Screw (+PTT 2 × 4)
2 Leaf SW board
1 Five claws
4 Head (A) board
6 Head (B) board
Remove the four solderings.
2-6. MAIN BOARD AND POWER BOARD
4 Three screws (+BVTP 3 × 10)
6 Two screws (+BVTT 3 × 8)
7 Heat sink
3 Two screws (+BVTP 3 × 16)
1 Two screws (+BVTP 3 × 10
)
2 Main board
5 Power board
Main board

11
HCD-DX50/RG80
2-8. BASE UNIT
2-9. DRIVER BOARD, MOTER BOARD AND ADDRESS SENSOR BOARD
9 Pull-out the disc tray.
4 Two screws (+BVTP 2.6 × 8)
q; Screw (+PTPWH 2.6 × 8)
qa Tray
1 Screw (+BVTP 2.6 × 8)
qs Screw (+BVTP 2.6 × 8)
6 Flat type wire (8 core)
3 Flat type wire
(8 core)
8 Motor board
qd Address sensor board
2 Driver board
5 Remove the two solderings of motor.
7 Connector
Base unit
qa
9 Two screws (+PTPWH M2.6)
1 Screw (+PTPWH M2.6)
q; Screws (DIA. 12)
7 Two screws (+BVTP 2.6 × 8)
6 BD board
5 Rivet
qs Two insulators
2 Holder assy
qs Two insulators
8 Two stoppers
3 Flat type wire (21 core)
4 Flat type wire (16 core)

12
HCD-DX50/RG80 SECTION 3
TEST MODE
[Cold Reset]
• The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning
the set to the customer.
Procedure:
1. Press three buttons x, ENTER , and ?/1simultaneously.
2. The fluorescent indicator tube becomes blank instantaneously,
and the set is reset.
[Hot Reset]
• This mode resets the set with the preset data kept stored in the
memory. The hot reset mode functions same as if the power
cord is plugged in and out.
Procedure:
1. Press three buttons x, ENTER , and DISPLAY
simultaneously.
2. The fluorescent indicator tube becomes blank instantaneously,
and the set is reset.
[Tuner Step Change]
• A step ofAM channels can be changed over between 9 kHz and
10 kHz.
Procedure:
1. Press ?/1button to turn the set ON.
2. Select the function “TUNER”, and press TUNER/BAND button
to select the BAND “AM”.
3. Press ?/1button to turn the set OFF.
4. Press ENTER and ?/1buttonssimultaneously,andthedisplay
of fluorescent indicator tube changes to “AM 9 k STEP” or
“AM 10 k STEP”, and thus the channel step is changed over.
[Function Change Mode]
• Select either VIDEO or MD of the external FUNCTION input.
Procedure:
1. Turn on the power.
2. Hold down MD (VIDEO) button then press ?/1 button , and
release ?/1button first in order not to switch off the set
immediately.
The another function of the previous function is selected , the
input level is also changed and displayed “ MD ” or “VIDEO”.
[GC Test Mode]
• This mode is used to check the software version, FL tube, LED,
keyboard and VACS.
Procedure:
1. Press three buttons x, ENTER ,and DISC 2 simultaneously.
2. LEDs and fluorescent indicator tube are all turned on.
3. When you want to enter the software version display mode,
press DISC 1 . The model number and destination are displayed.
4. Each time DISC 1 is pressed, the display changes starting
from MC version, GC version, CD version, CDDM version,
CDMA version, CDMB, version BDA version, BDB version,
ST version, TA version, TM version and TC version in this
order, and returns to the model number and destination display.
5. When DISC 3 is pressed while the version numbers are being
displayed except model number and destination, year, month
and day of the software creation appear. When DISC 3 is
pressed again, the display returns to the softwareversion display.
When DISC 1 is pressed while year, month and day of the
software creation are being displayed, the year, month and day
of creation of the software versions are displayed in the same
order of version display.
6. Press DISC 2 button, and the key check mode is activated.
7. In the key check mode, the fluorescent indicator tube displays
“K0V0”. Each time a button is pressed, “KEY” value increases.
However, once a button is pressed, it is no longer taken into
account.
“VOL” value increases like 1, 2, 3 ... if rotating VOLUME
knob in “+” direction, or it decreases like 0, 9, 8 ... if rotating in
“–” direction.
8. Also when DISC 3 is pressed after lighting of all LEDs and FL
tubes, value of VACS appears.
9. To exit from this mode, press three buttons in the same manner
as step 1, or disconnect the power cord.
[MC Test Mode]
• This mode is used to check operations of the respective sections
of Amplifier, Tuner, and Tape.
Procedure:
* To enter MC Test Mode
1. Press the ?/1button to turn on the set.
2. Press the three buttons of x, ENTER and DISC 3
simultaneously.
3. The messages MUSIC, MOVIE, GAME and P FILE flash on
the FL display tube.
The input FUNCTION is Changed to VIDEO.
* Check of Amplifier
1. When f(CURSOR UP) button is pressed, GEQ increases to
its maximum and a message “GEQ MAX” appears.
2. When F(CURSOR DOWN) button is pressed, GEQ decreases
to its minimum and a message “GEQ MIN” appears.
3. When g(CURSOR LEFT) or G(CURSOR RIGHT) button
is pressed, GEQ is set to flat and a message “GEQ FLAT”
appears.
4. When the VOLUME control knob is turned clockwise even
slightly, the sound volume increases to its maximum and a
message “VOLUME MAX” appears for two seconds, then the
display returns to the original display.
5. When the VOLUME control knob is turned counter-clockwise
even slightly, the sound volume decreases to its minimum and a
message “VOLUME MIN” appears for two seconds, then the
display returns to the original display.
* Check of clock frequency
1. To check the frequency of clock used to run the time in the unit,
the clock output is available at pin 39 (IC 501, MASTER
CONTROL) only during MC test mode.
2. The frequency is 32.768 kHz or so.
* Tuner function
1. In the test mode, the default-preset channel is called even when
the TUNER is selected and an attempt is made to call the preset
channel that has been stored in memory. (It means that the
memory is cleared.)
2. The minimum, center and maximum frequency of each band is
set then.

13
HCD-DX50/RG80
* Tape function
1. When a tape is inserted in Deck B and recording is started, the
input source function selects VIDEO automatically.
When CD SYNC/HI-DUB button is pressed during Rec in
function, ALC is turned on.
2. When xbutton is pressed to stop recording, the Tape (Deck)
B is selected and tape is rewound, tape is rewound using m
button, tape is stops at around the record-starting position and
playbackoftherecordedportion of the tapeisstarted. IfPAUSE
is inserted even once during recording, tape is rewound to the
position around the PAUSE position and is played back.
3. When CD SYNC / HI-DUB button is pressed during playback
of Deck B, either normal speed or high speed can be selected
by this button.
* AMS Test Mode
1. Set TAPE function
2. Select the desired loop by pressing the PLAY MODE button.
Insert a test tapeAMS-110A or AMS-120 to DeckA.
3. Press the SPECTRUM button to enter the AMS test mode.
4. After a tape is rewound first, the FF AMS is checked, and the
mechanism is shut off after detecting the AMS signal twice.
5. Then the REWAMS is checked and the mechanism is shut off
after detecting the AMS signal twice.
6. When the check is complete, a message of either OK or NG
appears.
* To return to normal mode again.
1. When you want to exit this mode, press the ?/1button.
2. The cold reset is enforced at the same time.
[VACS ON/OFF Mode]
• This mode is used to switch ON and OFF the VACS (Variable
Attenuation Control System).
Procedure:
Press the ENTER and SPECTRUM buttons simultaneously. The
message “VACS OFF” or “VACS ON” appears.
[CD Service Mode]
• This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the pickup.
Procedure:
1. Press ?/1button to turn the set ON.
2. Select the function “CD”.
3. Press three buttons x, ENTER , and OPEN/CLOSE simul-
taneously.
4. The CD service mode is selected.
5. With the CD in stop status, press M button to move the pickup
to outside track, or press m button to inside track.
6. To exit from this mode, perform as follows:
1) Move the pickup to the most inside track.
2) Press ?/1button to turn the set OFF.
Note: • Always move the pickup to most inside track when exiting from
this mode. Otherwise, a disc will not be unloaded.
• Do not run the sled motor excessively, otherwise the gear can be
chipped.
[CD Ship Mode (Memory Clear) ]
• This mode moves the pickup to the position durable to vibra-
tion. Use this mode when returning the set to the customer after
repair.
Procedure:
1. Press 1/ubutton to turn the set ON.
2. Press three buttons x, ENTER and GAME simultaneously.
3. After the "STANDBY" display blinks six times, a message
“LOCK” is displayed on the fluorescent indicator tube, and the
CD ship mode is set.
[CD Ship Mode (No Memory Clear) ]
• This mode moves the pickup to the position durable to vibra-
tion. Use this mode when returning the set to the customer after
repair.
Procedure:
1. Press 1/ubutton to turn the set ON.
2. Press CD button and 1/ubutton simultaneously.
3. After the "STANDBY" display blinks six times, a message
“LOCK” is displayed on the fluorescent indicator tube, and the
CD ship mode is set.
+
–

14
HCD-DX50/RG80
SECTION 4
MECHANICAL ADJUSTMENTS
SECTION 5
ELECTRICAL ADJUSTMENTS
0 dB=0.775 V
DECK SECTION
1. Demagnetize the record/playback head with a head
demagnetizer.
2. Do not use a magnetized screwdriver for the adjustments.
3. After the adjustments, apply suitable locking compound to the
parts adjust.
4. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
5. The adjustments should be performed in the order given in this
service manual. (As a general rule, playback circuit adjustment
should be completed before performing recording circuit
adjustment.)
6. The adjustments should be performed for both L-CH and R-
CH.
7. Switches and controls should be set as follows unless otherwise
specified.
• Test Tape
Record/Playback Head Azimuth Adjustment
Tape Signal Used for
P-4-A100 10 kHz, –10 dB Azimuth Adjustment
WS-48B 3 kHz, 0 dB Tape Speed Adjustment
P-4-L300J 315 Hz, 0 dB Level Adjustment
DECK A DECK B
Note: Perform this adjustments for both decks
Procedure:
1. Mode: Playback
Precaution
1. Clean the following parts with a denatured alcohol-moistened
swab:
record/playback heads pinch rollers
erase head rubber belts
capstan idlers
2. Demagnetize the record/playback head with a head
demagnetizer.
3. Do not use a magnetized screwdriver for the adjustments.
4. After the adjustments, apply suitable locking compound to the
parts adjusted.
5. The adjustments should be performed with the rated power
supply voltage unless otherwise noted.
Torque Measurement
set
main board
CN301
Pin 3(L-CH)
Pin 1(R-CH)
main board
CN301
Pin 2(GND)
+
–
level mete
r
test tape
P-4-A100
(10 kHz, –10 dB)
3.06 N • m to 6.96 N • m
31 to 71 g • cm
(0.43 – 0.98 oz • inch)
0.19 N • m to 0.58 N • m
2 to 6 g • cm
(0.02 – 0.08 oz • inch)
3.06 N • m to 6.96 N • m
31 to 71 g • cm
(0.43 – 0.98 oz • inch)
0.19 N • m to 0.58 N • m
2 to 6 g • cm
(0.02 – 0.08 oz • inch)
6.96 N • m to 14.02 N • m
71 to 143 g • cm
(0.98 – 1.99 oz • inch)
9.80 N • m
100 g or more
(3.53 oz or more)
9.80 N • m
100 g or more
(3.53 oz or more)
Mode Torque meter
CQ-102C
CQ-102C
CQ-102RC
CQ-102RC
CQ-201B
CQ-403A
CQ-403R
Meter reading
FWD
FWD
back tension
REV
REV
back tension
FF/REW
FWD tension
REV tension

15
HCD-DX50/RG80
2. Turn the adjustment screw and check output peaks. If the peaks
do not match for L-CH and R-CH, turn the adjustment screw
so that outputs match within 1dB of peak.
3. Mode: Playback
4. After the adjustments, apply suitable locking compound to the
pats adjusted.
Adjustment Location: Playback Head (Deck A).
Record/Playback/Erase Head (Deck B).
Tape Speed Adjustment DECK B
Note: Start the Tape Speed adjustment as below after setting to the test
mode.
In the test mode, the tape speed is high during pressing the
CD SYNC/HI-DUB button.
Procedure:
1. Turn the power switch on.
2. Press the xbutton, ENTER button and DISC 3 button
simultaneously.
(The “TEST MODE” on the fluorescent indicator tube display
while in the test mode.)
To exit from the test mode, press the ?/1button.
Mode: Playback
1. Insert the WS-48B into the deck B.
2. Press the gG button on the deck B.
3. Press the CD SYNC/HI-DUB button in playback mode.
Then at HIGH speed mode.
4. Adjust RV1001 on the LEAF SW board so that frequency
counter reads 6,000 ±30 Hz.
5. Press the CD SYNC/HI-DUB button.
Then back to NORMAL speed mode.
6. Adjust RV1002 on the LEAF SW board so that frequency
counter reads 3,000 ±15 Hz.
Adjustment Location: LEAF SW board
Playback level Adjustment DECK A DECK B
Procedure:
Mode: Playback
1. Confirm that level difference between the channels is with ±
0.5 dB.
2. After check, adjust the following RVs.
Deck A is RV302 (L-CH), Deck B is RV303 (L-CH) so that
adjustment within adjustment level as follows.
Adjustment Level:
CN301 PB level: 334.4 to 748.7 mV (–7.3 to –0.3 dB)
Adjustment Location: MAIN board
Sample Volue of Wow and Flutter: 0.3% or less W. RMS
(WS-48B)
Screw
position
L-CH
peak
within
1dB
Output
level
L-CH
peak R-CH
peak
within
1dB
Screw
position
R-CH
peak
MAIN
board
CN301
set
test tape
P-4-A100
(10 kHz, –10 dB)
pin 1
oscilloscop
e
L-CH
R-CH
VH
waveform of oscilloscope
in phase 45°90°135°180°
good wrong
pin 2
pin 3
L
R
+
–
set
test tape
WS-48B
(3 kHz, 0 dB)
main board
CN301 (Pin 3: L-CH)
(Pin 1: R-CH)
frequency counte
r
+
–
set
test tape
P-4-L300J
(315 Hz, 0 dB)
main board
CN301 (Pin 3: L-CH)
(Pin 1: R-CH)
level meter
forward
reverse

16
HCD-DX50/RG80
4. Mode: Record
5. Mode: Playback
6. Confirm the play back signal recorded in step 3 becomes
adjustable level as follows.
If these levels are not adjustable level, adjust the RV301 (L-
CH) and RV351 (R-CH) on the MAIN board to repeat steps 4
and 5.
Adjustable level:
CN301 PB level: 47.2 to 53.0 mV (–24.3 to –23.3 dB)
Adjustment Location: MAIN board
[MAIN BOARD] (Component Side)
[LEAF SW BOARD] (Component Side)
REC Bias Adjustment DECK B
Procedure:
In the MC test mode, the “REC memory mode” is convenient for
this adjustment. In the “REC memory mode” , when the REC starts
the input signal FUNCTION is switched to VIDEO automatically.
When the REC stops, the tape returns near to the recording start
position.
1. Press MD (VIDEO) button to selectVIDEO. (This step is not
necessary if the above test mode has already been set.)
2. Insert a tape into deck B.
3. After press REC PAUSE/START button, press REC PAUSE/
START button, then recording start.
4. Mode: Record
5. Mode: Playback
6. Confirm the playback signal recorded in step 3 becomes
adjustable level as follows.
If these levels are not adjustable level, adjust the RV304 (L-
CH) and RV354 (R-CH) on the MAIN board to repeat steps 4
and 5.
Adjustable level: Playback output of 315 Hz to playback output
of 10 kHz: ±1.0 dB
Adjustment Location: MAIN board
REC Level Adjustment DECK B
Procedure:
In the MC test mode, the “REC memory mode” is convenient for
this adjustment. In the “REC memory mode” , when the REC starts
the input signal FUNCTION is switched to VIDEO automatically.
When the REC stops, the tape returns near to the recording start
position.
1. Press MD (VIDEO) button to selectVIDEO. (This step is not
necessary if the above test mode has already been set.)
2. Insert a tape into deck B.
3. After press REC PAUSE/START button, press REC PAUSE/
START button, then recording start.
attenuator
set
MD/VIDEO (AUDIO) IN (J101)
1) 315 Hz
2) 10 kHz 50 mV (–23.8 dB)



600 Ω
blank tap
e
CN-123
AF OSC
+
–
set
recorded
portion
CN301 (Pin 3: L-CH)
(Pin 1: R-CH)
level mete
r
set
MD/VIDEO (AUDIO) IN (J101)
315 Hz, 50 mV (–23.8 dB)
blank tape
CS-123
600 Ω
attenuator
AF OSC
+
–
set
recorded
portion
CN301 (Pin 3: L-CH)
(Pin 1: R-CH)
level mete
r
TAPE SPEED
RV1002 RV1001
(NORMAL) (HIGH)
CN1001
         
T11
RV11
RV351
RV354
RV304
RV303
RV302
RV301
CN301 CN304
CN302
CN303
13
REC LEVEL (L)
(B)
PB LEVEL (L)
(B)
PB LEVEL (L)
(A)
REC BIAS (R)
(B)
REC BIAS (L)
(B)
REC LEVEL (R)
(B)

17
HCD-DX50/RG80
FM Tuned Level Adjustment
Procedure:
1. Supply a 98 MHz signal at 28 dB from theANTENNA terminal.
2. Tune the set to 98 MHz.
3. Adjust RV11to the point (moment) whentheTUNED indicator
will change from going off to going on.
Adjustment Location: MAIN board
Null Adjustment
Procedure:
1. Supply a 98 MHz signal at 60 dB from theANTENNA terminal.
2. Tune the set to 98 MHz.
3. Measure voltage between pin 22 and pin 3 of IC11. Adjust
T11 until the voltage becomes 0 V.
Adjustment Location: MAIN board
Adjustment Location
[MAIN BOARD] (Component Side)
FM RF SIGNAL GENERATOR
75 Ωcoaxial
Carrier frequency : 98 MHz
Modulation : AUDIO 1 kHz, 75 kHz
deviation (100%)
Output level : 28 dB (at 75 Ωopen)
FM ANTENNA terminal
(TM1)
set
FM RF SIGNAL GENERATOR
75 Ωcoaxial
Carrier frequency : 98 MHz
Modulation : AUDIO 1 kHz, 75 kHz
deviation (100%)
Output level : 60 dB (at 75 Ωopen)
FM ANTENNA terminal
(TM1)
set
CD SECTION
Note :
1. CD Block is basically designed to operate without adjustment.
Therefore, check each item in order given.
2. Use LUV-P01 (4-999-032-01) unless otherwise indicated.
3. Use an oscilloscope with more than 10MΩimpedance.
4. Clean the object lens by an applicator with neutral detergent
when the signal level is low than specified value with the
following checks.
S-Curve Check
Procedure :
1. Connect an oscilloscope to TP (FEO).
2. Connect between TP (FEI) and TP (DVC) ( 1.65 V) by lead
wire.
3. Turn Power switch on.
4. Load a disc (LUV-P01) and actuate the focus search. (In
consequence of open and close the disc tray, actuate the focus
search)
5. Confirm that the oscilloscope waveform (S-curve) is
symmetrical betweenA and B.And confirm peak to peak level
within 2 ±0.5 Vp-p.
6. After check, remove the lead wire connected in step 2.
Note : • Try to measure several times to make sure than the ratio
of A : B or B :A is more than 10 : 7.
• Take sweep time as long as possible and light up the
brightness to obtain best waveform.
RF Level Check
Procedure :
1. Connect an oscilloscope CH1 to TP (RFDC) and CH2 to TP
(RFAC).
2. Turn Power switch on.
3. Load a disc (LUV-P01) and playback.
4. Confirm that oscilloscope waveform is clear and check if RF
signal level is correct or not.
BD board
Oscilloscope
TP(FEO)
TP(DVC)
T11
RV11
RV351
RV354
RV304
RV303
RV302
RV301
CN301 CN304
CN302
CN303
13
NULL
FM TUNED LEVEL
TUNER SECTION
symmetry
S-curve waveform
within 2 ±0.5Vp-p
A
B
TP(RFDC)
TP(RFAC)
BD board oscilloscope
TP(DVC)

18
HCD-DX50/RG80
Note : Clear RF signal waveform means that the shape “ ◊”can be clearly
distinguished at the center of the waveform.
E-F Balance (1 Track jump) Check
Procedure :
1. Connect an oscilloscope to TP (TEO) and TP (DVC).
2. Turn Power switch on.
3. Load a disc (LUV-P01) and playback the number nine track.
4. Press the gG button. (Becomes the 1 track jump mode.)
5. Confirm that the level B andA (DC voltage) on the oscilloscope
waveform.
6. Adjust RV101 on the BD board so that the center of waveform
becomes the same voltage of DVC. (i.e. A=0V)
Adjustment Location:
[BD BOARD] (Conductor Side)
RF signal waveform
VOLT/DIV : 200mV
TIME/DIV : 500ns
level : 0.65 ±0.15Vp-p (RFDC)
1.1 ±0.4Vp-p (RFAC)
TP(TEO)
TP(DVC)
BD board
oscilloscop
e
level=1.0 ±0.5Vp-p symmetry
A (DC voltage
)
center of
waveform
B
DVC
1 track jump waveform
TP (TEO)
TP
(RFAC)
TP
(FEI) TP
(RFDC)
TP (FEO)
IC101
IC103
RV101
TP (DVC)
1
15
30
1
2021
40
60
80
41
61
16

19
HCD-DX50/RG80
SECTION 6
DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•¢: internal component.
•C: panel designation.
Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•: Pattern from the side which enables seeing.
• Indication of transistor.
•A:B+ Line.
•B:B– Line.
•H: adjustment for repair.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
• Voltages are taken with aVOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: FM
f: AM
E: PB (DECK A)
d: PB (DECK B)
G: REC (DECK B)
J: CD
c: digital out
• Abbreviation
AR : Argentina model
AUS : Australian model
E51 :Chilean and Peruvian model
KR : Korea model
MX : Mexican model
SP : Singapore model
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
C
B
These are omitted.
E
Q
B
These are omitted.
CE
Q
Note:
The components identi-
fied by mark 0or dotted
line with mark 0are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 0sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.

20
HCD-DX50/RG80
6-1. CIRCUIT BOARD LOCATION
MOTOR board
ADDRESS SENSOR board
DRIVER board
MAIN TRANS board
SWITCH board
SENSOR board
BD board
SUB TRANS board
MAIN board
POWER board
LEAF SW board
HEAD (A) board
HEAD (B) board
PANEL board
CD SWITCH board
PAD SWITCH board
• WAVEFORMS
4IC101 wh (MDP)
2IC101 ra
(TE)(CD Play mode)
1IC101 ta
(RFAC)(CD Play mode)
3IC101 el
(FE)(CD Play mode)
2.5 Vp-p
7.5
µ s
0.3 Vp-p
0.4 Vp-p
1.1 Vp-p
–BD BOARD ––PANEL BOARD –
1 IC601 is
STOP MODE
3.0Vp-p
4MHz
1IC501 qa
STOP MODE
3.1Vp-p
32.768kHz
3.8Vp-p
2IC501 qd
STOP MODE
4T301 4
TAPE B REC MODE
16MHz
120Vp-p
4.6Vp-p
3IC51 ws
TUNER (FM)
4.5MHz
80.8kHz
–MAIN BOARD –