Sony HCD-RV22 User manual

1
Ver 1.1 2004. 08
Model Name Using Similar Mechanism NEW
CD CD Mechanism Type CDM74-K4BD49
Section Base Unit Name BU-K4BD49
Optical Pick-up Name KSM-213DHAP
Model Name Using Similar Machanism HCD-GN700
TAPE HCD-RG330
Section Tape Mechanism Type CWM43RR35
CWM43FF13
SERVICE MANUAL
E Model
HCD-RV22/RV55
Amplifier section
HCD-RV55
Front speaker
The following measured at AC 120, 127, 220, 240 V, 50/60 Hz
DIN power output (rated):
120 + 120 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
150 + 150 watts
(6 ohms at 1 kHz, 10% THD)
HCD-RV22
The following measured at AC 120, 127, 220, 240 V, 50/60 Hz
DIN power output (rated):
100 + 100 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
120 + 120 watts
(6 ohms at 1 kHz, 10% THD)
SPECIFICATIONS
Inputs
VIDEO/SAT IN (phono jacks) (HCD-RV55 only):
voltage 450/250 mV,
impedance 47 kilohms
GAME INPUT AUDIO L/R (phono jacks):
voltage 250 mV,
impedance 47 kilohms
GAME INPUT VIDEO (phono jack):
1 Vp-p, 75ohms
MIC (phone jack): sensitivity 1 mV,
impedance 10 kilohms
Outputs
PHONES (stereo phone jack):
accepts headphones of
8 ohms or more
VIDEO/SAT OUT (phono jacks) (HCD-RV55 only):
impedance 1 kilohm
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
9-879-126-02
2004H04-1
© 2004. 08
– Continued on next page –
MINI Hi-Fi COMPONENT SYSTEM
(Photo: HCD-RV55)
• HCD-RV22/RV55 are the tuner,
deck, CD and amplifier
section in MHC-RV22/RV55.

2
HCD-RV22/RV55
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
VIDEO OUT (phono jack):
max. output level 1 Vp-p,
unbalanced, Sync negative
load impedance 75 ohms
SPEAKER: accepts impedance of 6 to
16 ohms
SURROUND SPEAKER (HCD-RV55 only):
accepts impedance of
24 ohms
CD player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=770 – 810 nm)
Emission duration:
continuous
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Signal-to-noise-ratio More than 90 dB
Dynamic range More than 90 dB
Video color system format
NTSC, PAL
Tape deck section
Recording system 4-track 2-channel, stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I cassettes
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
(50 kHz step)
Antenna FM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range
Saudi Arabian model: 531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Other models: 530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,602 kHz
(with the tuning interval
set at 9 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
Power requirements
Saudi Arabian model: 120 – 127/220 or 230 – 240 VAC,
50/60 Hz
Adjustable with voltage selector
Thai model: 220 VAC, 50/60 Hz
Other models: 120 V, 220V or 230 – 240 VAC,
50/60 Hz
Adjustable with voltage selector
Power consumption
HCD-RV55: 150 watts
HCD-RV22: 180 watts
Dimensions (w/h/d) incl.projecting parts and controls
Amplifier/Tuner/Tape/CD Section:
Approx. 280 ×327 ×425 mm
Mass
HCD-RV55: Approx. 10.6 kg
HCD-RV22: Approx. 10.1 kg
Supplied accessories: Remote Commander (1)
R6 (Size AA) batteries (2)
AM loop antenna (1)
FM lead antenna (1)
Speaker pads (8)
Video cable (1)
Design and specifications are subject to change without
notice.

3
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
HCD-RV22/RV55
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270°C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons usinga temperatureregulatorshould be setto about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
This appliance is
claassified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.

4
HCD-RV22/RV55
MODEL IDENTIFICATION
– BACK PANEL –
MODEL PARTS No.
RV22: PH 4-254-522-0s
RV22: EA 4-254-523-0s
RV22: TH 4-254-524-0s
RV55: PH 4-254-528-0s
RV22: E3, E15 4-254-800-0s
RV22: MY, SP 4-254-802-0s
RV55: E3, E15 4-254-803-0s
RV55: MY, SP 4-254-804-0s
RV55: EA 4-254-807-0s
•Abbreviation
E3 : 240 V AC area in E model
E15 : Iran model
PH : Philippine model
EA : Saudi Arabia model
TH : Thai model
PLAYABLE DISC
You can playback the following discs on this system. The other
discs cannot be played back.
List of playable discs
Format of discs Disc logo
VIDEO CDs
Audio CDs
CD-R/CD-RW
(audio data/MP3
files)
Part No.

5
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. Service Position of CD Mechanism Deck........................... 6
1-2. Service Position of Amp Board........................................... 6
2. GENERAL
List of Button Locations and Reference Pages........................ 7
3. DISASSEMBLY
3-1. Case (Top) ......................................................................... 10
3-2. CD Door ............................................................................ 10
3-3. Front Panel Section ........................................................... 11
3-4. CD Mechanism Deck ........................................................ 11
3-5. Tape Mechanism Deck, Mic Board ................................... 12
3-6. Panel Board ....................................................................... 12
3-7. Back Panel Section, Sub Trans Board............................... 13
3-8. Trans Board ....................................................................... 13
3-9. Main Board ....................................................................... 14
3-10. Amp Board ........................................................................ 14
3-11. BD49 Board ...................................................................... 15
3-12. VCD Connect Board, VMP43GY Board .......................... 15
3-13. Driver Board, SW Board ................................................... 16
3-14. Optical Pick-up ................................................................. 16
3-15. Sensor Board ..................................................................... 17
3-16. Motor (TB) Board ............................................................. 17
3-17. Motor (LD) Board .............................................................18
4. TEST MODE ..................................................................... 19
5. ELECTRICAL ADJUSTMENTS................................. 23
6. DIAGRAMS
6-1. Circuit Boards Location .................................................... 25
6-2. Printed Wiring Board –CD Mechanism Section (1/2)– .... 28
6-3. Schematic Diagram –CD Mechanism Section (1/2)– ....... 29
6-4. Printed Wiring Boards –CD Mechanism Section (2/2)–... 30
6-5. Schematic Diagram –CD Mechanism Section (2/2)– ....... 31
6-6. Printed Wiring Board –VCD Connect Section–................ 32
6-7. Schematic Diagram –VCD Connect Section– .................. 32
6-8. Printed Wiring Board –VMP Section–.............................. 33
6-9. Schematic Diagram –VMP Section (1/2)–........................ 34
6-10. Schematic Diagram –VMP Section (2/2)–........................ 35
6-11. Schematic Diagram –Main Section (1/2)– ........................ 36
6-12. Schematic Diagram –Main Section (2/2)– ........................ 37
6-13. Printed Wiring Board –Main Section– ..............................38
6-14. Printed Wiring Boards –Panel Section– ............................ 39
6-15. Schematic Diagram –Panel Section (1/2)– ....................... 40
6-16. Schematic Diagram –Panel Section (2/2)– ....................... 41
6-17. Printed Wiring Boards –Jack Section–.............................. 42
6-18. Schematic Diagram –Jack Section– ..................................43
6-19. Printed Wiring Board
–Power Section (1/2) (HCD-RV22)– ................................ 44
6-20. Printed Wiring Boards
–Power Section (2/2) (HCD-RV22)– ................................ 45
6-21. Schematic Diagram –Power Section (HCD-RV22)– ........ 46
6-22. Schematic Diagram –Power Section (HCD-RV55)– ........ 47
6-23. Printed Wiring Board
–Power Section (1/2) (HCD-RV55)– ................................ 48
6-24. Printed Wiring Boards
–Power Section (2/2) (HCD-RV55)– ................................ 49
6-25. IC Block Diagrams............................................................ 50
7. EXPLODED VIEWS
7-1. Main Section ..................................................................... 60
7-2. Front Panel Section (1)...................................................... 61
7-3. Front Panel Section (2)...................................................... 62
7-4. Front Panel Section (3)...................................................... 63
7-5. Main Board Section .......................................................... 64
7-6. CD Mechanism Deck Section (1) ..................................... 65
7-7. CD Mechanism Deck Section (2) ..................................... 66
7-8. CD Mechanism Deck Section (3) ..................................... 67
7-9. Base Unit Section .............................................................. 68
8. ELECTRICAL PARTS LIST ........................................ 69
HCD-RV22/RV55

6
HCD-RV22/RV55
1-2. SERVICE POSITION OF AMP BOARD
1-1. SERVICE POSITION OF CD MECHANISM DECK
SECTION 1
SERVICE NOTE
front panel
CD mechanism deck
AMP boar
d
To inspect the AMP board, turn both of the front panel
and the CD mechanism deck so that the left side of the product faces down.
BD49 board
CD mechanism dec
k
Remove the CD mechanism deck and place it on top of the pedestal as shown.
Inspect the BD49 board in this set up.

7
HCD-RV22/RV55
SECTION 2
GENERAL This section is extracted
from instruction manual.

8
HCD-RV22/RV55

9
HCD-RV22/RV55
SECTION 3
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
3-1. CASE (TOP)
(Page 10)
3-2. CD DOOR
(Page 10)
SET
3-3. FRONT PANEL SECTION
(Page 11)
3-11. BD49 BOARD
(Page 15)
3-12. VCD CONNECT BOARD,
VMP43GY BOARD
(Page 15)
3-15. SENSOR BOARD
(Page 17)
3-16. MOTOR (TB) BOARD
(Page 17)
3-17. MOTOR (LD) BOARD
(Page 18)
3-13. DRIVER BOARD,
SW BOARD
(Page 16)
3-14. OPTICAL PICK-UP
(Page 16)
3-4. CD MECHANISM DECK
(Page 11)
3-8. TRANS BOARD
(Page 13)
3-6. PANEL BOARD
(Page 12)
3-5. TAPE MECHANISM DECK,
MIC BOARD
(Page 12)
3-7. BACK PANEL SECTION,
SUB TRANS BOARD
(Page 13)
3-9. MAIN BOARD
(Page 14)
3-10. AMP BOARD
(Page 14)

10
HCD-RV22/RV55
3-2. CD DOOR
Note : Follow the disassembly procedure in the numerical order given.
3-1. CASE (TOP)
5
qg
qf
qf
qa
6 case (side-R)
qs case (side-L)
qh case (top)
1 two screws
(case 3 TP2)
qd two screws
(+BVTP 3
× 10)
7 two screws
(case 3 TP2)
2 screw
(case 3 TP2)
8 screw
(case 3 TP2)
3 screw
(+BVTP 3
× 10)
9 screw
(+BVTP 3
× 10)
0 screw
(+BVTP 3
× 10)
4 screw
(+BVTP 3
× 10)
3 four claws
4 CD door
2 Pull-out the disc tray.
1 Turn the pulley to the direction of the arrow.
pulley
Front panel side
CD mechanism deck (CDM74)

11
HCD-RV22/RV55
3-3. FRONT PANEL SECTION
3-4. CD MECHANISM DECK
9
2 CN302 (29P)
qh front panel section
0 CN309 (5P)
qd CN103 (8P)
qa CN304 (8P)
1 CN805 (2P)
3 CN823 (11P)
qs CN102 (3P)
qg CN301 (3P)
6 three screws
(+BVTP 3 × 8)
7 screw (+BVTP 3 × 10)
5 screw (+BVTP 3 × 8)
4 screw
(+BVTP 3 × 8)
qf screw
(+BV (3 − CR))
8 screw
(+BVTP 3 × 10)
MAIN board
MAIN board
2 CN701 (12P)
4 CD mechanism deck
3 CN883 (11P)
1 three screws
(+BVTP 3
× 10)

12
HCD-RV22/RV55
3-5. TAPE MECHANISM DECK, MIC BOARD
3-6. PANEL BOARD
1 connector
2 six screws
(+BVTP 2.6
× 8
)
3 tape mechanism deck
7 MIC board
jack bracket
5 two screws
(+BVTP 2.6
× 8)
4 two MIC knobs
6 two screws
(+BVTP 3
× 8)
4 seven claws
6 CN604 (6P)
5 CN605 (5P)
1 connector (13P)
7 PANEL board
2 eight screws
(+BVTP 2.6
× 8
)
3 two screws
(+BVTP 2.6
× 8)

13
HCD-RV22/RV55
3-7. BACK PANEL SECTION, SUB TRANS BOARD
3-8. TRANS BOARD
1 CN904 (4P)
3 CN901 (2P)
4 CN101 (11P)
5 CN308 (3P)
9
2
CN906 (7P)
6 two screws
(+BVTP 3
× 10)
0 two screws
(+BVTP 3
× 10)
qa SUB TRANS board
qs back panel section
8 screw
(+BVTP 3
× 10)
7 two screws
(+BVTP 3
× 10)
1 CN905 (5P)
2 CN907 (10P)
4 earth wire
3 screw
(+BVIT 3
× 8R )
5 four screws
(screw)
6 TRANS board

14
HCD-RV22/RV55
3-9. MAIN BOARD
3-10. AMP BOARD
MAIN board
1 CN907 (10P)
3 CN441
4 MAIN board
2 two screws
(+BVTP 3
× 8)
6
2 two screws
(+BVTT 4
× 8)
5 two screws
(transistor)
3 screw
(+BVTP 3
× 14)
1 CN905 (5P)
8 AMP board
7 heat sink
4 screw
(+BV (3
− CR))

15
HCD-RV22/RV55
3-12. VCD CONNECT BOARD, VMP43GY BOARD
3-11. BD49 BOARD
3 screw
(+BVTP 2.6
× 8 )
4 gap tube
6 BD49 board
5 Remove soldering from the four points.
1 CN101 (29P)
2 CN102 (16P)
2 two screws
(+BVTP 2.6
× 8 )
5 two screws
(+BVTP 2.6
× 8 )
3 VCD CONNECT board
6 VMP43GY boar
d
1 CN881 (19P)
4 CN101 (29P)

16
HCD-RV22/RV55
3-13. DRIVER BOARD, SW BOARD
3-14. OPTICAL PICK-UP
1 two screws
(+BTTP (M2.6))
5 screw
(+BTTP (M2.6))
4 DRIVER board
3 CN703 (4P)
6 SW board
2 CN702 (5P)
2 coil spring
(insulator)
6 three coil springs
(insulator)
3 insulator
7 three insulators
4 three screws
(BVTT M2.6)
5 three stoppers (BU)
8 optical pick-up
(BU-K4BD49)
1 floating screw
(+PTPWH M2.6)

17
HCD-RV22/RV55
3-15. SENSOR BOARD
3-16. MOTOR (TB) BOARD
2 t ray
3 b elt (table)
5 p ulley (table)
8 s crew
(+BTTP (M2.6))
0 SENSOR board
7 g ear (geneva)
1 floating screw
(+PTPWH M2.6)
6 floating screw
(+PTPWH M2.6)
4 floating screw
(+PTPWH M2.6)
9 CN731 (3P)
6 Remove the two solderings of motor.
8 MOTOR (TB) board
table assy
7 t able motor assy (M741)
5 two screws
(+BTTP (M2.6))
4
1
stopper
2 stopper
3 CN742 (5P)

18
HCD-RV22/RV55
3-17. MOTOR (LD) BOARD
4 Remove the two solderings of motor.
3 MOTOR (LD) board
1 b elt (loading)
5 l oading motor assy (M751)
2 two screws
(+BTTP (M2.6))

19
HCD-RV22/RV55
SECTION 4
TEST MODE
MC COLD RESET
The cold reset clears all data including preset data stored in the
RAM to initial conditions. Execute this mode when returning the
set to the customer.
Procedure:
1. Press the I/1button to turn the power ON.
2. Press three buttons of x, [PLAY MODE/TUNING MODE] and
[DISC 1] simultane-ously.
3. The message “COLD RESET” is displayed on the fluorescent
indicator tube momentarily, then becomes standby states.
AM TUNING INTERVAL CHANGE-OVER
A step of AM tuning interval can be changed over between 9 kHz
and 10 kHz.
Procedure:
1. Press the I/1button to turn the power on.
2. Press the [TUNER/BAND] button to select “AM”.
3. Press the I/1button to turn the power off.
4. Press two buttons of [PLAY MODE/TUNING MODE] and I/1
simultaneously.
5. Themessage “AM 9K STEP” or “AM 10K STEP” is displayed
on the fluorescent indicator tube, and thus the channel step is
changed over.
CD SHIP (LOCK) MODE
This mode moves the optical pick-up to the position durable to
vibration. Use this mode when returning the set to the customer
after repair.
Procedure:
1. Press the I/1button to turn the power on.
2. Press the [CD] button to select “CD”.
3. Press two buttons of [CD] and I/1simultaneously.
4. Themessage “LOCK”is displayedon thefluorescent indicator
tube, and the CD ship mode is set.
CD SHIP (LOCK) MODE & COLD RESET
This mode is used to perform CD chip (lock) mode and cold reset
simultaneously.
Procedure:
1. Press the I/1button to turn the power on.
2. Press the [CD] button to select “CD”.
3. Press three buttons of x, [CD] and I/1simultaneously.
4. The message “COLD RESET” is displayed on the fluorescent
indicator tube momentarily, then becomes standby states.
CHANGE-OVER FUNCTION OF SAT/VIDEO
This mode is used to enable function of external input to change
over between SAT and VIDEO.
Procedure:
1. Press the I/1button to turn the power on.
2. Press two buttons of VIDEO/SAT and I/1simultaneously.
3. The message “SAT” or “VIDEO”is displayed on the
fluorescent indicator tube, and the function of external input
is changed over.
CD TRAY LOCK MODE
This mode is used to unable to take sample disc out of tray in the
shop.
Procedure:
1. Press the I/1button to turn the power on.
2. Press the [CD] button to select “CD”.
3. Set disc on the CD tray, press two buttons of xand Zfor 5
seconds.
4. The message “LOCKED” is displayed on the fluorescent
indicator tube and the CD tray is locked. (Even if pressing
the Zbutton, the message “LOCKED” is displayed on the
fluorescent indicator tube and the CD tray is locked)
5. To release from this mode, press two buttons of xand Zfor
5 seconds.
6. The message “UNLOCKED” is displayed on the fluorescent
indicator tube and the CD tray is unlocked.
AMP TEST MODE
This mode is used to display the parameter of amplifier IC and
display the VACS status.
Procedure:
1. Press the I/1button to turn the power on.
2. Press three buttons of x, [PRESET EQ] and [PLAY MODE/
TUNING MODE] simultaneously.
3. When the AMP test mode is activated, the message “AMP
TEST IN” is displayed on the fluorescent indicator tube
momentarily,then amplifier adjustment mode is displayed on
the fluorescent indicator tube.
4. Press the [DISPLAY] button to changed over between VACS
status display mode and the amplifier IC parameter display
mode.
5. In the amplifier IC parameter display mode, press the
[GROOVE] button to changed over DBFB on/off, and when it
ison, thecharacter “D” isdisplayed onthefluorescent indicator
tube.
6. In the amplifier IC parameter display mode, press the
[SURROUND] button to changed over surround on/off, and
when it is on, the character “S” is displayed on the fluorescent
indicator tube.
7. In the amplifier IC parameter display mode, turn each knob of
[ -- EQ + ] causes respective parameters to be changed,
as well as change-over of the display on the fluorescent
indicator tube.
CD SERVICE MODE
This mode can run the CD sled motor freely. Use this mode, for
instance, when cleaning the optical pick-up.
Procedure:
1. Press the I/1button to turn the power on.
2. Press the [CD] button to select “CD”.
3. Press three buttons of x, [PLAY MODE/TUNING MODE] and
Zsimultaneously.
4. When the CD service mode is activated, the message “MPEG
AV TEST” is displayed on the fluorescent indicator tube.
5. Press the Mbutton, optical pick-up move to outside track
and the message “SLED OUT” is displayed on the fluorescent
indicator tube.
6. Press the mbutton, optical pick-up move to inside track and
the message “SLED IN” is displayed on the fluorescent
indicator tube.
7. Press the [ENTER] button, traverse on/off is changed over.
8. Press the [EQ BAND] button when MPEG AV Test mode is
activated, the massage “SERVICE MODE” is displayed on
the fluorescent indicator tube and AV Test mode is activated.
. >

20
HCD-RV22/RV55
AGING MODE
This mode can be used for operation check of CD section and tape
deck section.
CD section and tape deck section work in parallel.
If an error occurred:
Theaging operationstops only anerror occurredsections and display
then status.
If no error occurs:
The aging operation continues repeatedly.
Procedure:
1. Press the I/1button to turn the power on.
2. Press the [CD] button to select “CD”.
3. Set disc on the CD tray and set tape into the deck.
4. Press three buttons of x, [PLAY MODE/TUNING MODE] and
[DISC SKIP/EX-CHANGE] simultaneously.
5. Aging operations of CD and tape are started at the same time.
6. To release from this mode, press the I/1button to turn the
power off and press the function buttons.
1. Display at the Aging Mode
Display operating state of CD section and tape deck section
alternately.
If an error occurred, stop display which that section.
2. CD Section
The sequence during the aging mode is following as below.
Display at the aging mode is the same as the normal operation.
Aging mode sequence (CD section) :
Start (from disc 1)
Disc chucking
TOC read
Play first track for 2 seconds
Play last track for 2 seconds
EX-change open/close
Open the disc tray
Disc skip
Close the tray
Change the next disc.
3. Tape Deck Section
The sequence during the aging mode is following as below.
If an error occurred, stop display that step.
Aging mode sequence (tape deck section) :
Rewind the tape A and B
“TAPE AAG-1 orTAPE BAG-2”
Shut off
FWD play the tape A
“TAPE AAG-3”
2 minutes
Rewind the tape A
“TAPE AAG-6”
Shut off
FWD play the tape B
“TAPE BAG-3”
2 minutes
Rewind the tape B
“TAPE BAG-6”
Shut off
Note: “TAPE *AG-*” is display of each step.
PANEL TEST MODE
This mode is used to check the fluorescent indicator tube, LEDs
and buttons.
Procedure:
1. Press the I/1button to turn the power on.
2. Press three buttons of x, [PLAY MODE/TUNING MODE] and
[ENTER] simultane-ously.
3. Fluorescent indicator tube and LEDs are all turned on.
4. Press two buttons of Xand [ENTER] simultaneously, mode
is changed over.
5. In the key check mode, press each key, the defined key number
of every each key list is displayed on the fluorescent indicator
tube.
6. In the key count check mode, “KEYCNT 0” is displayed on
the fluorescent indicator tube. Each time a key is pressed, “K”
value increases. However,once a key is pressed,it is no longer
taken into account.
7. In the headphone input check mode, connect the headphone,
the message “H_P ON” is displayed on the fluorescent
indicator tube, and disconnect the headphone, the message
“H_P OFF” is displayed on the fluorescent indicator tube.
8. In the volume check mode, “VOLUME FLAT” is displayed
on the fluorescent indicator tube. Turn the [VOLUME] knob
clockwise, the message “VOLUME UP” is displayed on the
fluorescentindicator tubemomentarily andturn the[VOLUME]
knob counterclockwise, the message “VOLUME DOWN” is
displayed on the fluorescent indicator tube momentarily.