Sony HCD-ZX9 - Receiver Cd User manual

1
Ver. 1.2 2007.02
Model Name Using Similar Mechanism HCD-ZX6/ZX8
CD CD Mechanism Type CDM79B-F1BD81
Section Base Unit Name BU-F1BD81A
Optical Pick-up Name KSM-215DCP/C2NP
TAPE Model Name Using Similar Machanism HCD-ZX6/ZX8
Section Tape Mechanism Type CWM43RR35
SERVICE MANUAL
US Model
Mexican Model
HCD-ZX9
AUDIO POWER SPECIFICATION (US MODEL)
POWER OUTPUT AND TOTAL HARMONIC
DISTORTION:
With 6-ohm loads, both channels driven, from
120 Hz – 10 kHz; rates 140 watts per channel
minimum RMS power, with no more than 10% total
harmonic distortion from 250 milliwatts to rated
output.
Amplifier section
US models:
The following measured at AC 120 V, 60 Hz
Mexican models:
The following measured at AC 127 V, 60 Hz
DIN power output (rated):
140 ×2 + 140 ×2 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
180 ×2 + 180 ×2 watts
(6 ohms at 1 kHz, 10% THD)
Inputs
PHONO IN (phono jack):
sensitivity 3 mV,
impedance 47 kOhms
MIC (phone jack): sensitivity 1 mV,
impedance 10 kOhms
SPECIFICATIONS
GAME INPUT AUDIO L/R (phono jacks):
sensitivity 250 mV,
impedance 47 kOhms
GAME INPUT VIDEO (phono jack):
1 Vp-p, 75ohms
VIDEO/MD IN L/R (phono jacks):
sensitivity 250 mV/450 mV,
impedance 47 kOhms
Outputs
PHONES (stereo phone jack):
accepts headphones of
8 ohms or more
VIDEO/MD OUT L/R (phono jacks):
voltage 250 mV,
impedance 1 kOhm
VIDEO OUT (phono jack):
max. output level 1 Vp-p,
load impedance 75 ohms
SPEAKER:
FRONT L/R Use only the supplied
speaker SS-ZX9
SURROUND L/R Use only the supplied
speaker SS-ZX9
– Continued on next page –
COMPONENT Hi-Fi STEREO SYSTEM
•HCD-ZX9 is the tuner, deck,
CD and amplifier section in
FST-ZX9, LBT-ZX9.
9-887-372-03
2007B04-1
© 2007.02
Sony Corporation
Home Audio Division
Published by Sony Techno Create Corporation

2
HCD-ZX9
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
CD/MP3 player section
System Compact disc and digital
audio system
Laser Semiconductor laser
(λ=780 nm)
Emission duration:
continuous
Laser Output Max. 44.6 µW*
* This output is the value
measured at a distance of
200 mm from the objective
lens surface on the Optical
Pick-up Block with 7 mm
aperture.
Frequency response 2 Hz – 20 kHz (±0.5 dB)
Wave length 780 – 790 nm
Signal-to-noise-ratio More than 90 dB
Dynamic range More than 90 dB
OPTICAL CD DIGITAL OUT
(Square optical connector jack, rear panel)
Wave length 660 nm
Output level –18 dBm
Tape deck section
Recording system 4-track 2-channel, stereo
Frequency response 50 – 13,000 Hz (±3 dB),
using Sony TYPE I tapes
Wow and flutter ±0.15% W. Peak (IEC)
0.1% W. RMS (NAB)
±0.2% W. Peak (DIN)
Tuner section
FM stereo, FM/AM superheterodyne tuner
FM tuner section
Tuning range 87.5 – 108.0 MHz
Antenna FM lead antenna
Antenna terminals 75 ohms unbalanced
Intermediate frequency 10.7 MHz
AM tuner section
Tuning range 530 – 1,710 kHz
(with the tuning interval
set at 10 kHz)
531 – 1,710 kHz
(with the tuning interval
set at 9 kHz)
Antenna AM loop antenna
Antenna terminals External antenna terminal
Intermediate frequency 450 kHz
General
US models:
Power requirements 120 V, 60 Hz
Mexican models:
Power requirements 127 V, 60 Hz
Power consumption 330 watts
Dimensions (w/h/d) (Main Unit)
Approx. 362 ×437 ×465 mm
(14 1/4 ×17 1/4 ×18 1/4 inches)
Mass (Main Unit) Approx. 19.0 kg (14 lb 15 oz)
Supplied accessories: AM loop antenna (1)
FM lead antenna (1)
Remote Commander (1)
Batteries (2)
Speaker cords:
–grey (10m) (33 ft) (2)
–white (3m) (10 ft) (2)
Speaker pads (16)
Design and specifications are subject to change without
notice.
Ver. 1.1

3
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
HCD-ZX9
NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK
OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•Keep the temperature of soldering iron around 270°C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to about
350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may also
be added to ordinary solder.
This appliance is
claassified as a CLASS 1
LASER product. This
label is located on the
rear exterior.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
1.5 k Ω 0.15 µ F
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
SAFETY CHECK-OUT (US MODEL)
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, screws,
and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microampers.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable. Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
Ver. 1.1

4
HCD-ZX9
MODEL IDENTIFICATION
– BACK PANEL –
PLAYABLE DISC
You can playback the following discs on this system. The other
discs cannot be played back.
List of playable discs
Format of Disc logo Contents
discs
Audio CDs Audio
CD-R/CD-RW Audio
(Audio CDs)
CD-R/CD-RW Audio
(Discs with
MP3 audio
tracks)
Part No.
MODEL PART No.
Mexican 2-649-004-2s
US 2-649-004-3s
Ver. 1.1

5
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. Service Position of CD BU Block....................................... 6
1-2. Service Position of TC Mechanism, Panel Board ............... 7
1-3. Service Position of Power Board ........................................ 8
1-4. Service Position of CD Changer ......................................... 8
2. GENERAL
List of Button Locations and Reference Pages........................ 9
3. DISASSEMBLY
3-1. Case ................................................................................... 13
3-2. Loading Panel.................................................................... 13
3-3. Front Panel Section ........................................................... 14
3-4. Tape Mechanism Deck ...................................................... 14
3-5. Game-in/hp Board, Mic Board.......................................... 15
3-6. Back Panel Section............................................................ 15
3-7. CD Mechanism Section..................................................... 16
3-8. Main Board ....................................................................... 17
3-9. Table Assy ......................................................................... 17
3-10. SE-130 Board ....................................................................18
3-11. TD Belt .............................................................................. 18
3-12. DC Motor (M901) .............................................................19
3-13. Optical Pick-up ................................................................. 19
3-14. BD81A Board ................................................................... 20
4. TEST MODE ..................................................................... 21
5. MECHANICAL ADJUSTMENTS ............................... 25
6. ELECTRICAL ADJUSTMENTS................................. 25
7. DIAGRAMS
7-1. Circuit Boards Location .................................................... 28
7-2. Block Diagram –CD Servo Section– ................................ 29
7-3. Block Diagram –Tuner/Tape Deck Section–..................... 30
7-4. Block Diagram –Main Section–........................................ 31
7-5. Block Diagram –Display/Power Section– ........................ 32
7-6. Printed Wiring Board –BD Section– ................................. 34
7-7. Schematic Diagram –BD Section–.................................... 35
7-8. Printed Wiring Boards –Loading Section– ....................... 36
7-9. Schematic Diagram –Loading Section–............................ 37
7-10. Schematic Diagram –Main Section (1/4)– ........................ 38
7-11. Schematic Diagram –Main Section (2/4)– ........................ 39
7-12. Schematic Diagram –Main Section (3/4)– ........................ 40
7-13. Schematic Diagram –Main Section (4/4)– ........................ 41
7-14. Printed Wiring Board –Main Section– ..............................42
7-15. Printed Wiring Boards –Power Section–........................... 43
7-16. Schematic Diagram –Power Section (1/2)– ...................... 44
7-17. Schematic Diagram –Power Section (2/2)– ...................... 45
7-18. Printed Wiring Board –Panel Section–.............................. 46
7-19. Schematic Diagram –Panel Section– ................................ 47
7-20. Printed Wiring Boards –Volume Section– ........................ 48
7-21. Printed Wiring Board –Mic Section– ................................ 49
7-22. Schematic Diagram –Volume, Mic Section– .................... 50
7-23. Schematic Diagram –Switch Section– ..............................51
7-24. Printed Wiring Boards –Switch Section (1/2)– ................. 52
7-25. Printed Wiring Boards –Switch Section (2/2)– ................. 53
7-26. Printed Wiring Boards –Jack Section–.............................. 54
7-27. Schematic Diagram –Jack Section– ..................................55
7-28. Printed Wiring Board –Lighting Section–......................... 56
7-29. Schematic Diagram –Lighting Section– ........................... 56
7-30. Printed Wiring Board –Surround Section– ....................... 57
7-31. Schematic Diagram –Surround Section– .......................... 58
7-32. Printed Wiring Boards –Transformer Section– ................. 59
7-33. Schematic Diagram –Transformer Section– ..................... 60
8. EXPLODED VIEWS
8-1. Back Panel Section............................................................ 71
8-2. Front Panel Section (1)...................................................... 72
8-3. Front Panel Section (2)...................................................... 73
8-4. Chassis Section ................................................................. 74
8-5. CD Mechanism Section (1) ............................................... 75
8-6. CD Mechanism Section (2) ............................................... 76
9. ELECTRICAL PARTS LIST ........................................ 77
HCD-ZX9

6
HCD-ZX9
1-1. SERVICE POSITION OF CD BU BLOCK
SECTION 1
SERVICE NOTE
chassis
CD block

7
HCD-ZX9
1-2. SERVICE POSITION OF TC MECHANISM, PANEL BOARD
3 loading panel
1 Turn the gear (shaft) in the
direction of the arrow.
2
gear (shaft)
PANEL board
tape mechanism bloc
k

8
HCD-ZX9
1-4. SERVICE POSITION OF CD CHANGER
1-3. SERVICE POSITION OF POWER BOARD
POWER board
front panel assy CD mechanism bloc
k
CD mechanism block

9
HCD-ZX9
SECTION 2
GENERAL This section is extracted
from instruction manual.

10
HCD-ZX9

11
HCD-ZX9

12
HCD-ZX9 SECTION 3
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
3-1. CASE
(Page 13)
3-2. LOADING PANEL
(Page 13)
SET
3-7. CD MECHANISM SECTION
(Page 16)
3-10. SE-130 BOARD
(Page 18)
3-11. TD BELT
(Page 18)
3-9. TABLE ASSY
(Page 17)
3-3. FRONT PANEL SECTION
(Page 14)
3-4. TAPE MECHANISM DECK
(Page 14)
3-6. BACK PANEL SECTION
(Page 15)
3-13. OPTICAL PICK-UP
(Page 19)
3-14. BD81A BOARD
(Page 20)
3-5. GAME-IN/HP
BOARD,
MIC BOARD
(Page 15)
3-8. MAIN BOARD
(Page 17)
3-12. DC MOTOR (M901)
(Page 19)

13
HCD-ZX9
3-2. LOADING PANEL
Note : Follow the disassembly procedure in the numerical order given.
3-1. CASE
3 loading panel
1 Turn the gear (shaft) in the
direction of the arrow.
2
gear (shaft)
1 three screws
(+BVTP 3
× 8)
4 four screws
(+BVTP 3
× 8)
5 three screws
(case 3 TP2)
6 three screws
(case 3 TP2)
3 cover (top)
7 case
three claws
three claws
2

14
HCD-ZX9
3-3. FRONT PANEL SECTION
3-4. TAPE MECHANISM DECK
4 tape mechanism deck
lid (TC)
1
2 two screws
(+BVTP 2.6
× 8)
3 three screws
(+BVTP 2.6
× 8)
1 two holes
4 CN920 (3P)
qd front panel section
7 CN802 (2P)
9 CN801 (4P)
8 CN803 (3P)
5 connector (3P)
6 connector (6P)
dust sheet
two hooks
MAIN board
0 three screws
(+BVTP 3
× 8)
qs three screws
(+BVTP 3
× 8)
qa two screws
(+BVTP 3
× 8)
2 flexible flat cable (13 core)
(CN104)
3 flexible flat cable (21 core)
(CN507)

15
HCD-ZX9
3-5. GAME-IN/HP BOARD, MIC BOARD
3-6. BACK PANEL SECTION
2 CN1002 (2P)
5 CN01 (3P)
3 CN1004 (2P)
4 CN1000 (3P)
qf CN513 (3P)
qg back panel section
qd
6 two screws
(+BVTP 3
× 8)
7 two screws
(+BVTP 3
× 8)
8 two screws
(+BVTP 3
× 8)
9 two screws
(+BVTP 3
× 8)
0 five screws
(+BVTP 3
× 8)
qa four screws
(+BVTP 3
× 8
)
qs three screws
(+BVTP 3
× 8)
1 flexible flat cable (11 core)
(CN504)
qa two clips
5 clip
7 GAME-IN/HP board
4 bracket (game)
9 bracket (MIC)
2 bracket (center)
qd MIC board
0 knob (MIC)
two lugs
1 two screws
(+BVTP 3
× 8)
6 two screws
(+BVTP 2.6
× 8)
qs screw
(+BVTP 2.6
× 8)
3 four screws
(+BVTP 2.6
× 8
)
8 four screws
(+BVTP 2.6
× 8)

16
HCD-ZX9
3-7. CD MECHANISM SECTION
1 CN509 (11P)
7 chassis section
6
6
qa
CD mechanism section
9 two screws
(+BV 3 (3-CR))
0 two screws
(+BV 3 (3-CR))
3 two screws
(+BVTP 3
× 8)
8 two screws
(+BVTP 3
× 8)
4 two screws
(+BVTP 3
× 8)
5 three screws
(+BVTP 3
× 8)
2 flexible flat cable (27 core)
(CN501)

17
HCD-ZX9
3-8. MAIN BOARD
3-9. TABLE ASSY
qs table assy
2 tray
5
9
qa
4
bracket
0 plate (guide)
claw
7 screw
(+BTP 2.6
× 8)
8 screw
(+BTP 2.6
× 8)
3 two screws
(+BTP 2.6
× 8)
1 floating screw
(
+PTPWH M2.6 )
6 flexible flat cable (6 core
)
(CN002) (FMS-18)
3 CN509 (11P)
CN602
CN601
1 CN502 (4P)
6 MAIN board
5
4 two screws
(+BVTP 3
× 8
)
2 flexible flat cable (27 core)
(CN501)

18
HCD-ZX9
3-11. TD BELT
3-10. SE-130 BOARD
table ass
y
3 TD motor assy
4 TD belt
5 TD unit assy
2 two screws
(+P 3
× 3)
1 two screws
(+BTP 2.6
× 8)
6 SE-130 board
2 claw
3 claw
4 two screws
(+BTP 2.6
× 8)
1 CN102 (2P)
5 flexible flat cable (6 core
)
(CN101) (FMS-18)

19
HCD-ZX9
3-12. DC MOTOR (M901)
3-13. OPTICAL PICK-UP
8
holder (BU) assy
6 two stopper (BU)
4 two coil spring (insulating)
9 optical pick-up
7 two coil spring (insulating)
2 chassis plat
e
1 two screws
(+BVTP 3
× 8)
5 two screws
(+BVTP 2.6 (3CR))
3 two floating screws
(+
PTPWH M2.6 )
0 flexible flat cable (27 core)
(CN201)
5 CN004 (2P)
6 DC motor (M901)
2 gear (loading A)
3 belt (loading)
4 two screws
(+P 2.6
× 4)
1 screw
(+
PTPWH M2.6 )

20
HCD-ZX9
3-14. BD81A BOARD
5 BD81A board
3 gap tube
4 Remove the four solders.
1 optical pick-up (16 core
)
(CN101)
2 screw
(+BVTP 2.6 (3CR))