Contents
List of Abbreviations............................................................................................................................. 3
List of Tables ......................................................................................................................................... 4
List of Figures........................................................................................................................................ 5
Reference documents........................................................................................................................... 6
1Introduction .................................................................................................................................... 7
2Product Description....................................................................................................................... 8
2.1 Orderable parts ........................................................................................................................ 8
2.2 Technical Data ......................................................................................................................... 9
2.3 Block Diagram........................................................................................................................ 12
2.4 Module connector and pin assignment.................................................................................. 14
2.4.1 Connector type for the Carrier board................................................................................ 14
2.4.2 Pin assignment row A and row B...................................................................................... 14
2.5 Mechanical Dimensions and Heat spreader.......................................................................... 21
3Design-in Considerations............................................................................................................ 23
3.1 Power Supply Design considerations .................................................................................... 23
3.2 Power-on RESET and RESET Configurations ...................................................................... 23
3.3 Manual RESET (/MR) ............................................................................................................ 23
3.4 System Booting...................................................................................................................... 23
3.5 General interface design consideration ................................................................................. 23
3.6 PCI Express ........................................................................................................................... 25
3.7 SGMII..................................................................................................................................... 25
3.8 SGMII/SATA........................................................................................................................... 25
3.9 ETHERNET Interface considerations .................................................................................... 25
3.10 I2C Interface considerations .................................................................................................. 25
3.11 Temperature sensor............................................................................................................... 26
3.12 System Diagnostics Controller (SDC, optional)..................................................................... 26
3.12.1 Window-Watchdog timer................................................................................................... 26
3.12.2 Real Time Clock (RTC)..................................................................................................... 26
3.13 Deep sleep mode considerations........................................................................................... 26
3.14 Thermal Design considerations ............................................................................................. 27
4Application Carrier Board (optional).......................................................................................... 28
5Release and Comments............................................................................................................... 30
List of Tables
Table 1: Orderable parts............................................................................................................................... 8
Table 2: Technical data .............................................................................................................................. 11
Table 3: Overview to primary and alternative signal functions of LS1021A signal groups ........................ 13
Table 4: Carrier board plug-in connector.................................................................................................... 14
Table 5: Connector pin assignment (row A)............................................................................................... 17
Table 6: Connector pin assignment (row B)............................................................................................... 20
Table 7: Mechanical mounting material...................................................................................................... 22
Table 8: Overview of configured on-board power rails............................................................................... 23
Table 9: High-speed interface trace lengths............................................................................................... 24
Table 10: I2C line pull-up resistors............................................................................................................. 26
Table 11: I2C device addresses and bit rates............................................................................................ 26
