Ebyte E19-868M20S User manual

E19-868M20S User Manual
SX1276 868MHz 100mW SMD Wireless Module

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 1
目录
1. Overview................................................................................................................................................................................................2
1.1 Brief introduction ......................................................................................................................................................................2
1.2 Features .......................................................................................................................................................................................2
1.3 Application .................................................................................................................................................................................2
2.Specification and parameter ................................................................................................................................................................3
2.1 Limit parameter .........................................................................................................................................................................3
2.2 Operating parameter .................................................................................................................................................................3
3.Size and pin definit ion ..........................................................................................................................................................................4
4. Basic operation .....................................................................................................................................................................................5
4.1 Hardware design ................................................................................................................................................................5
4.2 Software editing ........................................................................................................................................................................6
5.Basic application .........................................................................................................................................................................6
5.1 Basic circuit diagram................................................................................................................................................................6
6.FA Q..........................................................................................................................................................................................................7
6.1 Co mmunication range is too short .........................................................................................................................................7
6.2 Module is easy to damage........................................................................................................................................................7
6.3 BER(Bit Error Rate) is high ....................................................................................................................................................7
7.Production guidance..............................................................................................................................................................................7
7.1 Reflow soldering temperature .................................................................................................................................................7
7.2 Reflow soldering curve ............................................................................................................................................................8
8. E19 Series ..............................................................................................................................................................................................9
9. Antenna guidance .................................................................................................................................................................................9
9.1 Antenna recommendation ........................................................................................................................................................9
Revision history ..................................................................................................................................................................................... 10
About us .................................................................................................................................................................................................. 10

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 2
1. Overview
1.1 Brief introduction
E19-868M20S is a small-sized 868MHz LoRaTM SMD wireless
module, based on the original imported RF chip SX1276 from SEMTECH.
Due to the use of the imported SX1276 as the core of the module, with
its stable and reliable characteristics, it is favored by the majority of users.
Compared with the FSK、GFSK products, it has made great progress in
receiving current, receiving sensitivity, transmitting power, receiving rate
range and anti-interference ability. The module is aimed at smart home,
wireless meter reading, scientific research and medical, and medium and
long distance wireless communication equipment. Since RF performance
and component selection are in accordance with industrial standards, and the
product has obtained FCC, CE, RoHS and other international authoritative certification reports, users do not need to worry
about its performance. High precision 32MHz crystal is used.
Since the module is a pure RF transceiver module, you need to use the MCU driver or a dedicated SPI debug tool.
1.2 Features
Communication distance tested is up to 5km
Maximum transmission power of 100mW, software multi-level adjustable；
Support the global license-free ISM 868MH band；
Support air date rate of 0.018kbps~37.5kbp in LoRaTM；
The maximu m data transmission rate 300kpbs in FSK mode；
Support multiple modulation methods, LoRaTM/FSK/GFSK/MSK/GMSK/OOK；
Large capacity FIFO, supports 256Byte data buffer；
Support 2.5V~3.6V power supply, power supply over 3.3V can guarantee the best performance；
Industrial grade standard design, support -40 ~ 85 °C for working over a long time；
Stamp hole, good for secondary development and integration.
1.3 Application
Home security alarm and remote keyless entry；
Smart home and industrial sensors；
Wireless alarm security system；
Building automation solutions ；
Wireless industrial-grade remote control；
Health care products；
Advanced Meter Reading Architecture(AMI)；
Automotive industry applications.

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 3
2.Specification and parameter
2.1 Limit parameter
Main parameter
Performance
Remark
Min.
Max.
Power supply（V）
0
3.6
Voltage over 3.6V will cause permanent damage to module
Blocking power（dBm）
-
10
Chances of burn is slim when modules are used in short distance
Operatingtemperature（℃）
-40
85
-
2.2 Operating parameter
Main parameter
Performance
Remark
Min.
Typ.
Max.
Operatingvoltage（V）
1.8
3.3
3.6
≥3.3V ensures output power
Communication level（V）
-
3.3
-
For 5V TTL,it may be at risk of burning down
Operatingtemperature（℃）
-40
-
85
Industrial design
Operatingfrequency（MHz）
862
868
893
Support ISM band
Power
consumpti
on
TX current（mA）
-
630
-
Instant powerconsumption
RX current（mA）
-
14
-
-
Sleep current （μA）
-
1.0
-
Software is shut down
MaxTx power（dBm）
19
20
21
-
Receiving sensitivity（dBm）
-145
-147
-148
Sensitivity test conditions：
air data rate: 0.3 kbps, Coding rate4/5, Spread Spectrum
Factor 12.
Air data rate（bps）
1.2
-
300
Kbps
FSK
0.018
-
37.5
Kbps
LoraTM
Main parameter
Description
Remark
Distance for reference
5000m
Test condition：clear and open area, antenna gain: 5dBi，antenna
height: 2.5m，air data rate: 0.3kbps
FIFO
256Byte
Maxlength transmittedeach time
Crystalfrequency
32MHz
-
Modulation
LoRaTM (recommended)
FSK/GFSK/MSK/GM SK/OOK
Package
SMD
-
Connector
1.27mm
-
Communication interface
SPI
0-10Mbps
Size
17.6*25.2 mm
-
Antenna
Stamp hole
50 ohm impedance

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 4
3.Size and pin definition
Pin No
Pin item
Pin direction
Pin application
1
GND
Input
Ground electrode, connected to the power reference ground
2
DIO5
Input/Output
Configurable IO port（Please find more on SX1278 datasheet）
3
DIO4
Input/Output
Configurable IO port（Please find more on SX1278 datasheet）
4
DIO3
Input/Output
Configurable IO port（Please find more on SX1278 datasheet）
5
DIO2
Input/Output
Configurable IO port（Please find more on SX1278 datasheet）
6
DIO1
Input/Output
Configurable IO port（Please find more on SX1278 datasheet）
7
DIO0
Input/Output
Configurable IO port（Please find more on SX1278 datasheet）
8
RST
Input
Reset
9
NC
--
Not connect
10
GND
Input
Ground electrode, connected to the power reference ground
11
VCC
Input
Power supply: 1.8~3.6V (3.3V Ceramic filter capacitor is advised to add)
12
SCK
Input
SPI clock
13
MISO
Output
SPI clock
14
MOSI
Input
SPI clock
15
NSS
Input
Chip select

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 5
16
TXEN
Input
Radio frequency switch control, make sure the TXEN pin is in high level, RXEN pin is
in low level when transmitting.
17
RXEN
Input
Radio frequency switch control, make sure the TXEN pin is in high level, RXEN pin is
in low level when transmitting
18
GND
Ground electrode, connected to the power reference ground
19
GND
Ground electrode, connected to the power reference ground
20
ANT
Output
Antenna
21
GND
Ground electrode, connected to the power reference ground
4. Basic operation
4.1Hardware design
It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded.；
Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module；
Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximu m value the module will be permanently damaged；
Please check the stability of the power supply, the voltage can not be fluctuated frequently；
When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation.；
The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other
parts with large electromagnetic interference.；
High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module.
If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is
spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module
and routed in the Bottom Layer；
Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer
or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees ；
It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect
the performance. It is recommended to keep them away from the module according to the strength of the interference.
If necessary, appropriate isolation and shielding can be done；
Assume that there are traces with large electromagnetic interference (high -frequency digital, high-frequency analog,
power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference.If necessary, appropriate isolation and shielding
can be done.
If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is
still a risk of damage)；
Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0；

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 6
The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure
that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside；
The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
4.2 Software editing
SX1278/SX1276+PA+LNA，same drive way as SX1278/SX1276，user can refer to SX1278/SX1276 datasheet.
DIO0、DIO1、DIO2、DIO3、DIO4、DIO5 are configurable I/O ports for various application，see more in SX1276
datasheet. It can be floated when not used.
RST、TXEN、RXEN must be connected,among which RST control chip reset，TXEN, RXEN are for controlling
RF switch.
Make it ground well with large space for grounding and small power ripple. Filter capacitor is necessary and make
sure it is close to pin VCC and GND.
SPI communication rate should not be set too high, usually around 1Mbps.
In transmitting，set TXEN as high communication level，RXEN pin is low level; In receiving, set RXEN as high
communication level,TXEN is low level; Before powering off, set TXEN、RXEN as low level.
Re-initialize register configuration when the chip is idle for higher stability.
5.Basic application
5.1 Basic circuit diagram

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 7
6.FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near groun d.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the
distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
Please check the stability of power source, the voltage cannot fluctuate too much.
Please make sure antistatic measure are taken when installing and us ing, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range, some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
Poor power supply may cause messy code. Make sure that the power supply is reliable.
The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Production guidance
7.1 Reflow soldering temperature

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 8
Profile Feature
Curve characteristics
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin）
Min preheating temp.
100℃
150℃
Preheat temperature max (Tsmax)
Mx preheating temp.
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average ramp-up rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temp.
183℃
217℃
Time（tL）Maintained Above（TL）
Time below liquid phaseline
60-90 sec
30-90 sec
Peak temperature（Tp）
Peak temp.
220-235℃
230-250℃
Aveage ramp-down rate（Tp to Tsmax）
Aveage ramp-down rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time to peak temperature
for 25℃
max 6 minutes
max 8 minutes
7.2 Reflow soldering curve

Chengdu Ebyte Electronic Technology Co., Ltd. E19 -868M20S User Manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd. 9
8. E19 Series
Model No.
IC
Frequency
(Hz)
Tx power
(dBm)
Test distance
km
Package
Antenna
Model No.
E19-433M20S2
SX1278
433M
20
5
SMD
15 * 15
Stamp hole
E19-915M30S
SX1276
915M
30
10
SMD
25 * 40
Stamp hole /IPEX
E19-868M30S
SX1276
868M
30
10
SMD
25 * 40
Stamp hole /IPEX
E19-868M20S
SX1276
868M
20
5
SMD
17.6*25.2
Stamp hole
E19-433M30S
SX1278
433M
30
10
SMD
25*37
Stamp hole
E19-915M20S
SX1276
915M
20
5
SMD
17.6*25.2
Stamp hole
E19-433M20SC
SX1278
433M
20
5
SMD
17.6*25.2
Stamp hole
9. Antenna guidance
9.1 Antenna recommendation
The antenna is an important role in the communication process. A good antenna can largely improve the
communication system. Therefore, we recommend some antennas for wireless modules with excellent performance and
reasonable price.
Model No.
Type
Frequency
Hz
Interface
Gain
dBi
Height
Cable
Function feature
TX868-XP-100
Sucker
868M
SMA-J
3.5
29cm
100cm
Sucker antenna, High gain
TX868-JK-20
Rubber
868M
SMA-J
3
200mm
-
Flexible &omnidirectional
TX868-JZ-5
Rubber
868M
SMA-J
2
50mm
-
Short straight &omnidirectional