
Data Sheet: FReta iEB Series –Single Output Eighth Brick Bus Converter
©2004-2006 TDK Innoveta Inc.
1/24/2008
10/13
Wind Tunnel Test Setup Figure
Dimensions a e
in millimete s and (inches).
Thermal Management:
An impo tant pa t of the ove all system
design p ocess is the mal management;
the mal design must be conside ed at all
levels to ensu e good eliability and lifetime
of the final system. Supe io the mal design
and the ability to ope ate in seve e
application envi onments a e key elements
of a obust, eliable powe module.
A finite amount of heat must be dissipated
f om the powe module to the su ounding
envi onment. This heat is t ansfe ed by the
th ee modes of heat t ansfe : convection,
conduction and adiation. While all th ee
modes of heat t ansfe a e p esent in eve y
application, convection is the dominant mode
of heat t ansfe in most applications.
Howeve , to ensu e adequate cooling and
p ope ope ation, all th ee modes should be
conside ed in a final system configu ation.
The open f ame design of the powe module
p ovides an ai path to individual
components. This ai path imp oves
convection cooling to the su ounding
envi onment, which educes a eas of heat
concent ation and esulting hot spots.
Test Setup: The the mal pe fo mance data
of the powe module is based upon
measu ements obtained f om a wind tunnel
test with the setup shown in the wind tunnel
figu e. This the mal test setup eplicates the
typical the mal envi onments encounte ed in
most mode n elect onic systems with
dist ibuted powe a chitectu es. The
elect onic equipment in netwo king, telecom,
wi eless, and advanced compute systems
ope ates in simila envi onments and utilizes
ve tically mounted PCBs o ci cuit ca ds in
cabinet acks.
The powe module, as shown in the figu e, is
mounted on a p inted ci cuit boa d (PCB)
and is ve tically o iented within the wind
tunnel. The c oss section of the ai flow
passage is ectangula . The spacing
between the top of the module and a pa allel
facing PCB is kept at a constant (0.5 in).
The powe module’s o ientation with espect
to the ai flow di ection can have a significant
impact on the module’s the mal
pe fo mance.
Thermal Derating: Fo p ope application of
the powe module in a given the mal
envi onment, output cu ent de ating cu ves
a e p ovided as a design
guideline on the The mal Pe fo mance
section fo the powe module of inte est.
The module tempe atu e should be
measu ed in the final system configu ation to
ensu e p ope the mal management of the
powe module. Fo the mal pe fo mance
ve ification, the module tempe atu e should
be measu ed at the component indicated in
the the mal measu ement location figu e on
the the mal pe fo mance page fo the powe
module of inte est. In all conditions, the
powe module should be ope ated below the
maximum ope ating tempe atu e shown on
the de ating cu ve. Fo imp oved design
ma gins and enhanced system eliability, the
powe module may be ope ated at
tempe atu es below the maximum ated
ope ating tempe atu e.
AIRFLOW
Ai Velocity and Ambient
Tempe atu e
Measu ement Location
I
F
L
O
W
12.7
(0.50)
Module
Cente line
Ai Passage
Cente line
Adjacent PCB
76 (3.0)