Features
Very low capacitance values 0.6 up to 10 pF
ESD protection to IEC 61000-4-2, level 4
Bidirectional ESD protection in one component
No change in ESD protection performance at temperatures
up to 85 °C (temperature derating)
Low parasitic inductance
Low leakage current
Fast response time <0.5 ns
Lead-free nickel barrier terminations suitable for lead-free soldering
RoHS-compatible
Applications
Interfaces, data lines (USB, IEEE 1394, Ethernet, parallel port,
SATA, DisplayPort, etc.), audio lines (digital) and video lines
(analog), DVI, HDMI, ICs and I/O ports
Consumer electronic products (TV, DVD player/recorder, set-top
box, game consoles, MP3 player, digital still/video camera, etc.)
EDP products (desktop and notebook computer, monitor, PDA,
printer, memory card, control unit, head set, speaker, HDD, optical
drive, etc.)
Industrial applications
Mobile phone applications
Design
Multilayer technology
Nickel barrier termination (Ag/Ni/Sn) for lead-free soldering
Marking
Due to the symmetrical configuration no marking information is
needed.
Single chip
4-fold array
2/4 data + 1 supply
General technical data
Maximum DC operating voltage VDC,max 5.5 ... 30 V
Typical capacitance Ctyp 0.6 ... 10 pF
Air discharge ESD capability to IEC 61000-4-2 VESD,air 15 kV
Contact discharge ESD capability to IEC 61000-4-2 VESD,contact 8 kV
Leakage current (Vleak = 5.6 V) Ileak 1µA
Operating temperature Top 40/+85 °C
Storage temperature LCT/UCT 40/+125 °C
CeraDiodes
High-speed series
Page 4 of 25Please read Cautions and warnings and
Important notes at the end of this document.
