Tektronix P6450 User manual

P6450
Logic Analyzer Probe
with D-Max™ Probing Technology
ZZZ
Instruction Manual
xx
There are no current European directives that apply to this
product. This product provides cable and test lead connections
to a test object of electronic measuring and test equipment.
Warning
The servicing instructions are for use by qualified personnel
only. To avoid personal injury, do not perform any servicing
unless you are qualified to do so. Refer to all safety summaries
prior to performing service.
www.tektronix.com
*P071247801*
071-2478-01

Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries
or suppliers, and are protected by national copyright laws and international treaty provisions.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication
supersedes that in all previously published material. Specifications and price change privileges reserved.
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
D-Max is a registered trademark of Tektronix, Inc. MagniVu is a trademark of Tektronix, Inc.
cLGA is a registered trademark of Amphenol Intercon Systems, Inc.
Velcro is a registered trademark of Velcro Industries B.V.
Contacting Tektronix
Tektronix, Inc.
14150 SW Karl Braun Drive
P.O. B o x 50 0
Beaverton, OR 97077
USA
For product information, sales, service, and technical support:
In North America, call 1-800-833-9200.
Worldwide, visit www.tektronix.com to find contacts in your area.

Warranty
Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1)
year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its
option, either will repair the defective product without charge for parts and labor, or will provide a replacement
in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty
work may be new or reconditioned to like new performance. All replaced parts, modules and products become
the property of Tektronix.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of
the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible
for packaging and shipping the defective product to the service center designated by Tektronix, with shipping
charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within
the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping
charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage
or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or
integrated with other products when the effect of such modification or integration increases the time or difficulty
of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY
OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY
IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
TEKTRONIX' RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE
AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL,
OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS
ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
[W2 – 15AUG04]

Table of Contents
General safety summary .......................................................................................... iv
Service safety summary........................................................................................... vi
Compliance Information......................................................................................... vii
Environmental Considerations ............................................................................. vii
Preface ............................................................................................................. ix
Related Documentation ...................................................................................... ix
Commonly Used Terms....................................................................................... x
Operating Basics ................................................................................................... 1
Product Description ........................................................................................... 1
Attaching Probe Labels ....................................................................................... 2
Connecting the Probes to the Logic Analyzer ............................................................. 5
Connecting the Probes to the Target System ............................................................... 6
Dressing the Probe Cables .................................................................................. 11
Storing the Probe Head....................................................................................... 12
Reference .......................................................................................................... 13
Designing an Interface Between the Probes and a Target System....................................... 13
Board Design ................................................................................................. 16
Probe Footprint Dimensions................................................................................. 20
Other Design Considerations ............................................................................... 21
Probe Pinout Definition and Channel Assignment ......................................... .... .... .... .. 23
Specifications ...................................................................................................... 25
Mechanical and Electrical Specifications .................................................................. 25
Maintenance........................................................................................................ 27
Probe Calibration ............................................................................................. 27
Functional Check ............................................................................................. 27
Inspection and Cleaning...................................................................................... 27
Service Strategy............................................................................................... 27
Legacy Probe and Attachment Support .................................................................... 28
Repackaging Instructions .................................................................................... 29
Replaceable Parts ................................................................................................. 31
Parts Ordering Information ................................................................................. 31
Using the Replaceable Parts List ........................................................................... 31
Index
P6450 High-Density Logic Analyzer Probe Instruction Manual i

Table of Contents
List of Figures
Figure i: Flying lead set............................................................................................ x
Figure ii: Probe example.......................................................................................... xi
Figure 1: P6450 High-Density probewith D-Max probing technology....................................... 1
Figure 2: Attaching labels to the P6450 probe .................................................................. 4
Figure 3: Connecting the logic analyzer probe.................................................................. 5
Figure 4: Installing the probe retention assembly.......................... .... ................................. 7
Figure 5: Proper handling of the interface clip.................................................................. 8
Figure 6: Connecting the probes to the target system .......................................................... 9
Figure 7: Proper dressing of the probe cables.................................................................. 11
Figure 8: Protecting the probe head ............................................................................. 12
Figure 9: P6450 probe dimensions .............................................................................. 16
Figure 10: Alternate retention assembly dimensions.......................................................... 17
Figure 11: Keepout area .......................................................................................... 17
Figure 12: Side-by-side layout................................................................................... 18
Figure 13: End-to-end layout .................................................................................... 18
Figure 14: Signal routing on the target system................................................................. 19
Figure 15: High-Density probe load model..................................................................... 20
Figure 16: Probe footprint dimensions on the PCB............................................................ 21
Figure 17: Optional Via-in-Pad placement recommendation................................................. 22
Figure 18: P6450 single-ended PCB footprint pinout detail.................................................. 23
Figure 19: Replacing the cLGA clip ............................................................................ 28
Figure 20: P6450 High-Density probe accessories ............................................................ 33
Figure 21: Optional accessories.................................................................................. 34
ii P6450 High-Density Logic Analyzer Probe Instruction Manual

Table of Contents
List of Tables
Table i: Product documentation.................................................................................. ix
Table 1: Probe section and label combinations.................................................................. 2
Table 2: Logic analyzer clock and qualifier availability .......... .............. .............................. 13
Table 3: 2X Demultiplexing source-to-destination channel assignments ... ................................ 14
Table 4: Channel assignment for a P6450 single-ended logic analyzer probe.............................. 23
Table 5: Mechanical and electrical specifications.............................................................. 25
Table 6: Environmental specifications .......................................................................... 25
Table 7: Parts list column descriptions.......................................................................... 31
Table 8: Manufacturers cross index ............................................................................. 32
Table 9: P6450 replaceable parts list............................................................................ 32
Table 10: P6450 Probe optional accessories.................................................................... 33
P6450 High-Density Logic Analyzer Probe Instruction Manual iii

General safety summary
General safetysummary
Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it.
To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of a larger system.
Read the safety sections of the other component manuals for warnings and
cautions related to operating the system.
To avoid fire or personal
injury
Connect and disconnect properly.Connect the probe output to the measurement
instrument before connecting the probe to the circuit under test. Connect the
probe reference lead to the circuit under test before connecting the probe input.
Disconnect the probe input and the probe reference lead from the circuit under test
before disconnecting the probe from the measurement instrument.
Ground the product.This product is indirectly grounded through the grounding
conductor of the mainframe power cord. To avoid electric shock, the grounding
conductor must be connected to earth ground. Before making connections to
the input or output terminals of the product, ensure that the product is properly
grounded.
Observe all terminal ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
The inputs are not rated for connection to mains or Category II, III, or IV circuits.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Power disconnect.The power cord disconnects the product from the power source.
Donotblockthepowercord;itmustremain accessible to the user at all times.
Do not operate without covers. Do not operate this product with covers or panels
removed.
Do not operate with suspected failures. If you suspect that there is damage to this
product, have it inspected by qualified service personnel.
Avoid exposed circuitry. Do not touch exposed connections and components when
power is present.
Use proper fuse.Use only the fuse type and rating specified for this product.
iv P6450 High-Density Logic Analyzer Probe Instruction Manual

General safety summary
Do not operate in wet/damp conditions.
Do not operate in an explosive atmosphere.
Keep product surfaces clean and dry.
Provide proper ventilation.Refer to the manual's installation instructions for details
on installing the product so it has proper ventilation.
Terms in this manual These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result
in injury or loss of life.
CAUTION.Caution statements identify conditions or practices that could result in
damage to this product or other property.
Symbols and terms on the
product
These terms may appear on the product:
DANGER indicates an injury hazard immediately accessible as you read
the marking.
WARNING indicates an injury hazard not immediately accessible as you
read the marking.
CAUTION indicates a hazard to property including the product.
The following symbol(s) may appear on the product:
P6450 High-Density Logic Analyzer Probe Instruction Manual v

Service safety summary
Service safetysummary
Only qualified personnel should perform service procedures. Read this Service
safety summary and the General safety summary before performing any service
procedures.
Do not service alone. Do not perform internal service or adjustments of this
product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use care when servicing with power on. Dangerous voltages or currents may exist
in this product. Disconnect power, remove battery (if applicable), and disconnect
test leads before removing protective panels, soldering, or replacing components.
To avoid electric shock, do not touch exposed connections.
vi P6450 High-Density Logic Analyzer Probe Instruction Manual

Compliance Information
This section lists the EMC (electromagnetic compliance), safety, and
environmental standards with which the instrument complies.
Environmental Considerations
This section provides information about the environmental impact of the product.
Product End-of-Life
Handling
Observe the following guidelines when recycling an instrument or component:
Equipment recycling. Production of this equipment required the extraction and
use of natural resources. The equipment may contain substances that could be
harmful to the environment or human health if improperly handled at the product’s
end of life. To avoid release of such substances into the environment and to
reduce the use of natural resources, we encourage you to recycle this product in
an appropriate system that will ensure that most of the materials are reused or
recycled appropriately.
This symbol indicates that this product complies with the applicable European
Union requirements according to Directives 2002/96/EC and 2006/66/EC
on waste electrical and electronic equipment (WEEE) and batteries. For
information about recycling options, check the Support/Service section of the
Tektronix Web site (www.tektronix.com).
Restriction of Hazardous
Substances
This product is classified as Monitoring and Control equipment, and is outside the
scope of the 2002/95/EC RoHS Directive.
P6450 High-Density Logic Analyzer Probe Instruction Manual vii

Compliance Information
viii P6450 High-Density Logic Analyzer Probe Instruction Manual

Preface
This document provides information on using and servicing the P6450 logic
analyzer probe.
Related Documentation
The following table lists related documentation that is available for your
instrument. The documentation is available on the TLA Documentation CD and
on the Tektronix Web site (www.Tektronix.com/manuals).
For documentation not specified in the table, contact your local Tektronix
representative.
Table i: Product documentation
Item Purpose Location
TLA Quick Start User Manual High-level operational overview
Online Help In depth operation and UI help
Installation Quick Reference
Cards
High-level installation information
Installation Manuals Detailed first-time installation
information
XYZs of Logic Analyzers Introduction to logic analyzer basics
Product Specifications TLA product specification
documents
TPI.NET Documentation Detailed information for controlling
the logic analyzer using .NET
Field upgrade kits Upgrade information for your logic
analyzer product
Optional Service Manuals Self-service documentation for
modules and mainframes
P6450 High-Density Logic Analyzer Probe Instruction Manual ix

Preface
Commonly Used Terms
Refer to the following list of commonly used terms throughout the manual.
cLGA An acronym for compression Land Grid Array, a connector that provides an
electrical connection between a PCB and the probe input circuitry.
Compression Footprint A connectorless, solderless contact between your PCB and the P6450 probes.
Connection is obtained by applying pressure between your PCB and the probe
through a cLGA c-spring.
D-Max probing technology The name that describes the technology used in the P6450 high-density logic
analyzer probe.
Flying Lead Set A lead set designed to attach to a P6450 probe to provide general-purpose probing
capability. (See Figure i.)
Figure i: Flying lead set
Functional Check
Procedure
Functional check procedures verify the basic functionality of the probes by
confirming that the probes recognize signal activity at the probe tips.
Keepout Area An area on a printed circuit board in which component, trace, and/or via placement
may be restricted.
Module The unit that plugs into a mainframe that provides instrument capabilities such
as logic analysis.
x P6450 High-Density Logic Analyzer Probe Instruction Manual

Preface
Module End The end of the probe that plugs into the module unit.
PCB An acronym for Printed Circuit Board; also known as Etched Circuit Board (ECB).
Probe The device that connects a module with a target system. (See Figure ii.)
Figure ii: Probe example
Probe Head The end of the probe that connects to the target system or probe adapter.
SUT An acronym for System Under Test; alsoreferredtoastargetsystem.
P6450 High-Density Logic Analyzer Probe Instruction Manual xi

Preface
xii P6450 High-Density Logic Analyzer Probe Instruction Manual

Operating Basics
This section provides a brief description of the Tektronix P6450 High-Density
Logic Analyzer Probe, information on attaching color-coded probe labels, and
probe and adapter connection instructions from the logic analyzer to the target
system.
Product Description
The P6450 probe is a 34-channel, high-density connectorless probe with D-Max
probing technology (See Figure 1.). The probe consists of one probe head that has
34 channels (32 data and 2 clock/qual).
Figure 1: P6450 High-Density probewith D-Max probing technology
The following list details the capabilities and qualities of the P6450 probe:
Single-ended data inputs
cLGA contact eliminates need for built-in connector
Footprint supports direct signal pass-through
Supports PCB thickness of 1.27 mm to 6.35 mm (0.050 in to 0.250 in)
Consists of one independent probe head of 34 channels (32 data and 2
clock/quals), and two 34-channel module end connectors.
Narrow 34-channel probe head makes for easier placement and layout
2X mode, (for example, 1:2 demultiplexing) uses one-half of the probe head
Color-coded keyed attachment
P6450 High-Density Logic Analyzer Probe Instruction Manual 1

Operating Basics
-3.5 V to +6.5 V input operating range
500 mV minimum single-ended signal amplitude
Minimal loading of 0.7 pF at 20 kΩto ground
Operation in normal or inverted polarity is acceptable (clock only)
Attaching Probe Labels
When you purchase the P6450 logic analyzer probe, you must apply the
color-coded labels as described in this section. The labels help you identify the
probe connections at the logic analyzer end and at the target system end.
The following table lists the probe section and label color combinations. (See
Table 1.) Refer to the table and to the following figure when you attach the probe
labels. (See Figure 2 on page 4.)
Table 1: Probe section and label combinations
Probe
section Channels
Label
color
Probe
section Channels
Label
color
A3-A2 CK0,
A3:7-0,
A2:7-0
Brown A1-A0 CK1,
A1:7-0,
A0:7-0
Orange
D3-D2 QUAL0,
D3:7-0,
D2:7-0
Blue D1-D0 CK2,
D1:7-0,
D0:7-0
Yellow
C3-C2 CK3,
C3:7-0,
C2:7-0
White C1-C0 QUAL1,
C1:7-0,
C0:7-0
Gray
E3-E2 QUAL3,
E3:7-0,
E2:7-0
Green E1-E0 QUAL2,
E1:7-0,
E0:7-0
Violet
P6450 Labels Use the following instructions to attach probe labels to your Tektronix P6450
Logic Analyzer Probe.
NOTE. Always use flat-nosed tweezers to remove the labels from the sheet of
labels. Never peel labels with your fingers. The labels are made of soft vinyl and
can stretch and distort easily. To avoid stretching the label, always grasp it from
the top right corner while removing it from the sheet of labels.
The adhesive on the vinyl labels is extremely strong. Carefully align each label to
the intended outline on the module end and probe head before attaching it to the
probe. Once labels are placed on the probe, they become very difficult to remove.
2 P6450 High-Density Logic Analyzer Probe Instruction Manual

Operating Basics
You will be attaching labels to the logic analyzer end and both sides of the probe
head. Use the following steps to attach the probe labels:
1. Identify the module end of the probe cable. (See Figure 2 on page 4.)
2. From the sheet of labels, locate the color-coded label for the logic analyzer
end of the probe cable.
3. Attach the matching colored labels to the probe head on the other end of the
probe cable. (See Figure 2 on page 4.)
P6450 High-Density Logic Analyzer Probe Instruction Manual 3

Operating Basics
Figure 2: Attaching labels to the P6450 probe
4 P6450 High-Density Logic Analyzer Probe Instruction Manual