Telit Wireless Solutions SE868SY-D Guide

[01.2017]
Mod. 0805 2017-01 Rev.6
SE868SY-D
Hardware Design Guide
#Preliminary#
1VV0301705 Rev. 1 –2021-02-17

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation tonotify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in theTelit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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APPLICABILITY TABLE
PRODUCTS
SE868SY-D

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Contents
NOTICE 2
COPYRIGHTS................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
I. License Agreements..................................................................... 3
II. Copyrighted Materials................................................................... 3
III. High Risk Materials....................................................................... 3
IV. Trademarks .................................................................................. 3
V. Third Party Rights......................................................................... 3
APPLICABILITY TABLE................................................................................ 4
CONTENTS.................................................................................................... 5
1. INTRODUCTION.......................................................................... 8
Scope........................................................................................... 8
Audience....................................................................................... 8
Contact Information, Support........................................................ 8
Text Conventions.......................................................................... 9
Related Documents...................................................................... 9
2. GENERAL PRODUCT DESCRIPTION ...................................... 10
Overview..................................................................................... 10
Product Variants and Frequency Bands...................................... 10
Target Market............................................................................. 10
Main features.............................................................................. 10
Mechanical Specifications........................................................... 12
2.5.1. Dimensions................................................................................. 12
2.5.2. Weight........................................................................................ 12
Temperature Range.................................................................... 12
3. PINS ALLOCATION................................................................... 13
Pin-out........................................................................................ 13
LGA Pads Layout........................................................................ 16
4. POWER SUPPLY....................................................................... 17
Power Supply Requirements....................................................... 17

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Power Consumption ................................................................... 17
General Design Rules................................................................. 18
4.3.1. Electrical Design Guidelines ....................................................... 18
4.3.2. Power Supply PCB layout Guidelines......................................... 19
5. DIGITAL SECTION .................................................................... 20
Logic Levels................................................................................ 20
Communication ports.................................................................. 21
5.2.1. Communication interfaces to the Host MCU (HIF) ...................... 21
5.2.2. Host interface selection............................................................... 22
Digital I/O.................................................................................... 22
5.3.1. nRESET ..................................................................................... 22
5.3.2. LNA enable................................................................................. 22
5.3.3. PPS............................................................................................ 23
6. PRODUCT PERFORMANCE ..................................................... 24
Horizontal Position Accuracy ...................................................... 24
Time to First Fix.......................................................................... 24
Sensitivity ................................................................................... 25
7. RF SECTION.............................................................................. 27
GNSS RF Signal Pin-out............................................................. 27
RF Front End Design.................................................................. 27
7.2.1. Reference design for passive Antenna ....................................... 27
7.2.2. Reference design for active Antenna.......................................... 28
7.2.3. Guidelines of PCB line for GNSS Antenna.................................. 28
GNSS Antenna Requirements.................................................... 29
7.3.2. GNSS Antenna –Installation Guidelines..................................... 29
7.3.3. Powering the External LNA (active antenna)............................... 29
Co-existance............................................................................... 30
8. MECHANICAL DESIGN............................................................. 31
Drawing ...................................................................................... 31
9. APPLICATION PCB DESIGN .................................................... 32
Footprint..................................................................................... 32
PCB pad design.......................................................................... 33
Stencil......................................................................................... 34
Solder paste ............................................................................... 34
Solder Reflow............................................................................. 34

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10. PACKAGING.............................................................................. 37
Modules shipped in Reel form..................................................... 37
Modules shipped in Tray form..................................................... 38
11. CONFORMITY ASSESSMENT ISSUES .................................... 40
EU RED Declaration of Conformity............................................. 40
12. SAFETY RECOMMENDATIONS................................................ 41
READ CAREFULLY.................................................................... 41
13. ACRONYMS............................................................................... 42
14. DOCUMENT HISTORY.............................................................. 46

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1. INTRODUCTION
Scope
This document introduces the SE868SY-D module and presents possible and
recommended hardware solutions for developing a product based on this module. All the
features and solutions detailed in this document are applicable to all the variants listed in
the applicability table.
Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should be used as a guide and a starting point for properly
developing your product with the Telit module.
Audience
This document is intendedfor Telit customers, who are integrators, about to implementtheir
applications using our SE868SY-D modules.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
•TS[email protected]
•[e-mail]
•[e-mail]
•[e-mail]
Alternatively, use:
http://www.telit.com/support
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.

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Text Conventions
Danger –This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning –Alerts the user to important points about
integrating the module, ifthese points are not followed, the module and
end user equipment may fail or malfunction.
Tip or Information –Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
Related Documents

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2. GENERAL PRODUCT DESCRIPTION
Overview
The SE868SY-D module is a multi-frequency and multi constellation GNSS receiver, latest
addition to the xE868 family.
The SE868SY-D product, exploiting the two GNSS bands L1 and L5, achieves sub-meter
accuracy and reduces multipath effects typical of urban canyons.
The SE868SY-D operates in the 1.8 V voltage domain, minimizing power consumption even
below L1-only products and making it ideally suited for battery powered and wearable
device applications.
Product Variants and Frequency Bands
Product
L1/E1 Bands
L5/E5 Bands
Region
SE868SY-D
GPS, QZSS, GAL,
GLO, BDS
GPS, QZSS, GAL,
NAVIC, BDS
Worldwide
Target Market
SE868SY-D, with its improved accuracy and ultra low power consumption, can ideally be
applied to all positioning verticals, like:
•Telemetry
•Fleet managements
•Insurance telematics / Dashcams
•Asset/personal tracking
•Sport equipment
•E-mobility
•Drones
Main features
Function
Features
GNSS
•Multi-constellation and Multi-bands
•Low power consumption
•High-Dynamics (25Hz update rate –in progress)
•Geofence (in progress)
•Real Time Clock

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Interfaces
•Main UART
•SPI / I2C (in progress)
•1PPS signal
•Single Antenna pin
•External Flash support (in progress)

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Mechanical Specifications
2.5.1. Dimensions
The overall dimensions of SE868SY-D are:
•Length: 11 mm
•Width: 11 mm
•Thickness: 2.6 mm
2.5.2. Weight
The nominal weight of the module is TBD grams.
Temperature Range
Note
Operating Temperature
Range
–40°C ÷ +85°C
Storage and non-operating
Temperature Range
–40°C ÷ +85°C

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3. PINS ALLOCATION
Pin-out
Pin
Signal
I/O
Function
Type
Comment
Host Interface (HIF) UART
10
UART_TX
I/O
1st function: UART-TX (HIF)
2nd function: I2C-SDA (HIF)
3rd function: SPI-MOSI (HIF)
DIGITAL 1.8V
11
UART_RX
I/O
1st function: UART-RX (HIF)
2nd function: I2C-SCL (HIF)
3rd function: SPI-SCLK (HIF)
DIGITAL 1.8V
23
UART_CTS
I/O
1st function: UART-CTS (HIF)
2nd function: SPI-CS (HIF)
3rd function: GPIO
DIGITAL 1.8V
24
UART_RTS
I/O
1st function: UART-RTS (HIF)
2nd function: SPI-MISO (HIF)
3rd function: GPIO
DIGITAL 1.8V
DIGITAL IO
12
nRESET
I
Reset –active LOW
DIGITAL 1.8V
19
HOST_SEL_0
I/O
Host Interface Protocol
Selector
DIGITAL 1.8V
20
HOST_SEL_1
I/O
Host Interface Protocol
Selector
DIGITAL 1.8V
26
LNA_EN
I/O
1st function: externalLNA
enabler (active HIGH)
2nd function: GPIO
DIGITAL 1.8V
28
PPS
I/O
1st function: PPS
2nd function: DRI (HIF)
DIGITAL 1.8V

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3rd function: GPIO
RF Section
8
RF_IN
I
L1-L5 band RF signal input
ANALOG RF
Power Supply
25
VDD18
-
Power supply
Power 1.8V
27
VDD18
-
Power supply
Power 1.8V
(*)Alternative voltage level at 0V8 to
support low power configurations will
be supported on Enginering samples
32
VDD18
-
Power supply
Power 1.8V
1
GND
-
Ground
Power
4
GND
-
Ground
Power
7
GND
-
Ground
Power
9
GND
-
Ground
Power
21
GND
-
Ground
Power
31
GND
-
Ground
Power
RESERVED FOR FUTURE USE (RFU)
2
RFU
-
RFU
3
RFU
-
RFU
6
RFU
-
RFU
14
RFU
-
RFU
15
RFU
-
RFU

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WARNING:
Reserved pins must not be connected.
16
RFU
-
RFU
17
RFU
-
RFU
18
RFU
-
RFU
22
RFU
-
RFU
29
RFU
-
RFU
30
RFU
-
RFU
NOT CONNECTED
5
NC
-
NOT CONNECTED
13
NC
-
NOT CONNECTED

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LGA Pads Layout
TOP VIEW

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4. POWER SUPPLY
The power supply circuitry and board layout are a very important part in the full product
design, and they strongly reflect on the product overall performances. Please read carefully
the requirements and the guidelines that will follow for a proper design.
Power Supply Requirements
The external power supplymust beconnected to VDD18 pins, and itmust fullfill the following
requirements:
Power Supply
Value
Nominal Supply Voltage
1.8 V (*)
(*)0V8 to support low power
configurations will be supported on
Enginering samples
Operating Voltage Range
1.71 ÷ 1.89 V
NOTE:
The Operating Voltage Range MUST never be exceeded at any time.
This applies also to overshoots above the maximum allowed voltage,
and drops below the minimum.
Power Consumption
Operative mode
PW in L1 only
PW in L1+L5
Acquisition (max)
65 mW
75 mW
Tracking (max)
30 mW
40 mW
Sleep (max)
2.16 mW

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NOTE:
It is recommended to reach the Sleep state only from Idle. Setting the
device in Sleep mode directly from the Active mode could lead to
higher-than-normal power consumption.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:
•the electrical design
•the thermal design
•the PCB layout
4.3.1. Electrical Design Guidelines
The electrical design of the power supply depends strongly on the chosen power source.
An example of a suitable linear voltage regulator is shown in the following picture:
Aluminum electrolytic capacitors are not recommended at the input to the module due to
their high ESR. Whe Tantalum capacitors are chosen, a minimum value of 10uF is
recommended, in parallel with a 0.1uF ceramic capacitor. Ceramic capacitors alone, for
both input and output can be used, but ensure that the LDO is stable with such capacitors
tied to the output.

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4.3.2. Power Supply PCB layout Guidelines
As seen on the electrical design guidelines, the power supply shall have a low ESR
capacitor on the output in order to cut the current peaks on the input and protect the module
supply from spikes.
The placement of this component is crucial for the correct working of the circuitry. A
misplaced component can be useless or can even decrease the power supply performance.
•The low ESR bypass capacitor must be placed close to the Telit SE868SY-D power
input pads; in case the power supply is a switching type, the capacitor can be placed
close to the switching inductor to cut the ripple.
•In case a switching power regulator is used, it is important to keep very small the
involved current loop formed by the input capacitor, the output diode (if not
embodied in the IC) and the regulator in order to reduce the radiated EMI at the
switching frequency (100-500 kHz usually).
•A dedicated ground for the Switching regulator, separated from the common ground
plane, is suggested.

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5. DIGITAL SECTION
Logic Levels
Parameter
Min
Max
ABSOLUTE MAXIMUM RATINGS –NOT FUNCTIONAL
Input level on any digital pin (CMOS 1.8) with respect to
ground
-0.3V
2.2 V
Operating Range - Interface levels (1.8V CMOS)
Input high level
0.7*VDD
VDD
Input low level
0 V
0.3*VDD
Output high level
VDD-0.45 V
VDD
Output low level
0 V
0.45 V
Parameter
AVG
CURRENT CHARACTERISTICS FOR DIGITAL PINS
Output Current
TBD
Input Current
TBD