Telit Wireless Solutions E922-3GR Series Installation manual

xE922-3GR
Hardware User Guide
1VV0301272
Rev.0.8 - 2017-01-05

xE922-3GR Hardware User Guide
1VV0301272 Rev.0.8 2017-01-05
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APPLICABILITY TABLE
APPLICABILITY TABLE 1
PRODUCT
HE922-3GR
WE922-3GR

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and
is believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or
in the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer
programs contained in the Telit products described in this instruction manual may not be copied
(reverse engineered) or reproduced in any manner without the express written permission of
Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be
deemed to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit or other 3rd Party supplied SW, except for
the normal non-exclusive, royalty free license to use that arises by operation of law in the sale
of a product.

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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished
by express license agreement only and may be used only in accordance with the terms of such
an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-
tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment
in the following hazardous environments requiring fail-safe controls: the operation of Nuclear
Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life
Support, or Weapons Systems (“High Risk Activities"). Telit and its supplier(s) specifically
disclaim any expressed or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2016.

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Contents
1. Introduction ..................................................... 9
1.1. Scope ....................................................... 9
1.2. Audience ..................................................... 9
1.3. Contact Information, Support ....................................... 10
1.4. Text Conventions............................................... 10
1.5. Supporting documents ........................................... 11
1.6. Product Variants ............................................... 11
1.7. Abbreviations ................................................. 11
2. General Product Description ......................................... 13
2.1. Overview .................................................... 13
2.2. General Functionality and Main Features ............................... 15
2.3. Reference table of RF bands characteristics ............................. 19
2.3.1. Cellular network: ................................................. 19
2.3.2. WiFi/Bluetooth .................................................. 20
2.3.3. GNSS ........................................................ 20
2.4. Applications .................................................. 20
2.5. Sensitivity ................................................... 21
2.6. High level block Diagram ......................................... 22
2.7. Environmental requirements ....................................... 23
2.7.1. Temperature range ................................................ 23
2.8. xE922-3GR Mechanical Specifications ................................ 24
2.8.1. Dimensions..................................................... 24
2.8.2. Weight........................................................ 24
2.8.3. RoHS compliance ................................................ 24
3. xE922-3GR Module pin out .......................................... 25
3.1. PIN table .................................................... 25
3.2. LGA Pads Layout .............................................. 37
4. Electrical specifications............................................. 39
4.1. Absolute maximum ratings –not operational............................. 39

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4.2. Recommended operating conditions .................................. 39
4.3. Logic Level Specifications ........................................ 39
5. Power supply .................................................... 41
5.1. Input supply .................................................. 41
5.2. Output supply ................................................. 42
5.2.1. Linear voltage regulators .................................. 42
5.2.1.1. VAUX_1P8V ............................................... 42
5.2.1.2. VAUX_2P85V .............................................. 43
5.2.1.3. VAUX_3P0V ............................................... 43
5.2.1.4. VSIM1/2 ................................................. 44
5.2.2. DC/DC stepdown................................................. 44
5.2.2.1. 1V8_OUT ................................................. 44
5.3. Typical system power consumption................................... 45
5.4. RTC backup .................................................. 47
6. Power ON/OFF and reset control ...................................... 49
6.1. Power On.................................................... 49
6.1.1. ON_OFF key action ............................................... 49
6.1.2. Switching ON due to charging ........................................ 50
6.1.3. Switching on due to RTC alarm ....................................... 50
6.2. Power off .................................................... 50
6.2.1. Soft power off ................................................... 50
6.2.2. Emergency power off .............................................. 50
6.3. Reset....................................................... 50
7. Battery management .............................................. 51
7.1. Coulomb counter ............................................... 51
7.2. Battery charging ............................................... 52
7.2.1. Block diagram................................................... 52
7.2.2. Battery/charger-less operation ........................................ 54
8. USIM interface .................................................. 55
9. USB port....................................................... 57
10. Display interface ................................................ 60
10.1. MIPI-DSI .................................................. 60

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10.2. LVDS..................................................... 62
10.3. Backlight control ............................................. 64
10.4. LED_CURSINK ............................................. 65
10.5. Touch panel................................................. 66
11. Camera interface ............................................... 67
12. Peripheral interfaces ............................................. 71
12.1. I2C ...................................................... 71
12.2. USIF ..................................................... 72
12.3. SDMMC/SDIO .............................................. 74
12.4. ADC ..................................................... 77
13. General purpose I/O ............................................. 78
14. Debug / flash interfaces ........................................... 81
14.1. USB2.0 HS ................................................. 81
14.2. USIF2 .................................................... 81
14.3. JTAG ..................................................... 81
14.4. Test pads................................................... 81
15. Audio........................................................ 82
15.1. Analog .................................................... 82
15.1.1. Analog IN...................................................... 83
15.1.2. Analog OUT .................................................... 86
15.1.2.1. Earpiece ................................................. 87
15.1.2.2. Headset.................................................. 87
15.1.2.3. Loudspeaker .............................................. 88
15.2. Digital .................................................... 90
15.2.1. I2S .......................................................... 90
15.2.2. Digital microphone................................................ 90
16. Antenna(s) .................................................... 91
16.1. GSM/WCDMA Antenna Requirements ............................. 91
16.1.1. GSM/WCDMA Antenna –PCB line Guidelines............................. 92
16.1.2. GSM/WCDMA Antenna –Installation Guidelines ........................... 92

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16.2. WiFi/BT Antenna Requirements ................................... 93
16.3. GNSS Antenna Requirements.................................... 93
16.3.1. Combined GNSS Antenna .......................................... 94
16.3.2. Linear and Patch GNSS Antenna ..................................... 94
16.3.3. Front End Design Considerations ..................................... 94
16.3.4. GNSS Antenna - PCB Line Guidelines ................................. 95
16.3.5. GNSS Antenna –Installation Guidelines ................................ 95
17. Mounting the module on your board .................................. 96
17.1. General.................................................... 96
17.2. Finishing & Dimensions ........................................ 96
17.3. Recommended foot print for the application main board.................... 97
17.4. Stencil .................................................... 98
17.5. PCB Pad Design.............................................. 98
17.6. Recommendations for PCB Pad Dimensions (mm) ....................... 99
17.7. Solder Paste................................................ 100
17.7.1. Solder Reflow .................................................. 100
18. Packing system ................................................ 102
18.1. Tray Drawing .............................................. 104
18.2. Moisture Sensitivity .......................................... 105
19. Safety Recommendations ......................................... 106
20. Conformity assessment issues ...................................... 107
20.1. FCC/IC Regulatory notices...................................... 107
20.1.1. Modification statement ............................................ 107
20.1.2. Interference statement ............................................. 107
20.1.3. RF exposure ................................................... 107
20.1.4. FCC Class B digital device notice ..................................... 108
20.1.5. Labelling Requirements for the Host device .............................. 108
20.2. 1999/5/EC Directive .......................................... 109
21. Document History .............................................. 112

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1. Introduction
1.1. Scope
The aim of this document is to introduce Telit xE922-3GR modules as well as present possible
and recommended hardware solutions useful for developing a product based on the xE922-3GR
modules. All the features and solutions detailed are applicable to all xE922-3GR, where
“xE922-3GR” refers to the modules listed in the applicability table.
If a specific feature is applicable to a specific product, it will be clearly highlighted.
NOTICE:
The description text “xE922-3GR” refers to all modules listed in the APPLICABILITY TABLE 1.
In this document all the basic functions of a wireless module will be taken into account; for
each one of them a valid hardware solution will be suggested and usually incorrect solutions
and common errors to be avoided will be highlighted. Obviously this document cannot embrace
every hardware solution or every product that may be designed. Obviously avoiding invalid
solutions must be considered as mandatory. Whereas the suggested hardware configurations
need not be considered mandatory, the information given should be used as a guide and a
starting point for properly developing your product with the Telit xE922-3GR module.
NOTICE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/WiFi/BT/GNSS xE922-3GR
cellular module within user application must be done according to the design rules described in
this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communication S.p.A. for its use, such as any
infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent rights of Telit Communication
S.p.A. other than for circuitry embodied in Telit products. This document is subject to change
without notice.
1.2. Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit xE922-3GR module.

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1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
[e-mail] if located in North America
For other regions, Collabnet Telit web portal can be used at https://teamforge.telit.com (account
can be asked at [email protected]
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users about the information provided.
1.4. Text Conventions
Danger –This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning –Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information –Provides advice and suggestions that may be useful when integrating
the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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1.5. Supporting documents
·1VV0301249_EVB USER GUIDE.pdf
·1VV0301285_IFBD HW User Guide xE922-3GR.pdf
·1VV0301324_MMI_EXT_CARD_xE922_3GR_HW USER GUIDE
·80504NT11473A Thermal Guidelines.pdf
For further detailed information, HW/SW user manuals and application notes related to the INTEL chipset
applied for this RF module, please consult Intel Business Link Support (IBL): https://businessportal.intel.com
1.6. Product Variants
xE922-3GR is available in the following hardware variants:
Type Number
Description
HE922-3GR
GSM/GPRS/EGPRS/WCDMA/HSPA+/WiFi/BT/GNSS
WE922-3GR
WiFi/BT/GNSS
1.7. Abbreviations
Term
Definition
ABB
Analog baseband
ADC
Analog-to-digital converter
AE
Application-Enabled
AES-NI
Advanced Encryption Standard New Instructions
AFE
Audio FrontEnd
CABC
Content Adaptive Backlight Control
CDP (USB)
Charging downstream port
CEU
Configurable Encryption Unit
CSI
Camera serial interface
DAC
Digital-to-analog converter
DBB
Digital baseband
DCP (USB)
Dedicated charging port
DBP
dead battery provision
DSI
Display serial interface
DSDS
Dual Sim Dual Standby
EOC
End of charge
EDID
Extended display identification data
FDD
Frequency division duplex

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GLONASS
Global orbiting navigation satellite system
GNSS
Global navigation satellite system
GPIO
General-purpose input/output
GPRS
General packet radio services
GPS
Global positioning system
GSM
Global system for mobile communications
HMI
Human machine interface
I2C
Inter-integrated circuit
ISP
Image Signal Processor
IDI
Inter die interface
LE
Low Energy
LVDS
Low Voltage Differential Signaling
MIPI
Mobile Industry Processor Interface
MS
Microstrip line
PMU
Power management unit
SD
Secure digital
SDP (USB)
Standard downstream port
SL
Strip line
SIM
Subscriber identity module
SOC
System-On-Chip
SOC
State of charge
SMEP
Supervisor Mode Execution Privilege
SPI
Serial peripheral interface
TE
Tearing effect
UART
Universal asynchronous receiver transmitter
UMTS
Universal mobile telecommunications system
USB
Universal serial bus
USIF
Universal serial interface
VMM
Virtual machine manager
VT-x
Intel Virtual Technology
WCDMA
Wideband code division multiple access

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2. General Product Description
2.1. Overview
Telit’s module family xE922-3GR is based on Intel’s IoTG Atom x3 Quad Core processor dual
chip platform.
DBB : SoC Atom x3
·CPU: Quad Core (Silvermont) 1.16 GHz
L1$ I/D 16KB/16KB ; L2$ 1MB
8-ch main application DMA / 4-ch secure DMA
Android 32bit, Linux Yocto 32bit
·GPU: GFX core modified Mali-450 MP4 600 MHz $128KB
·DSP : 2x TeakLite @277MHz
·Media Encode/Decode Engine: modified VeriSilicon Media Engine (dec G1/enc H1)
Video encoding:
• H.264 BP@level4.0, MP@level4.0, HP@level4.0
• Bit rate supported is from 10Kbps to 20Mbps
• JPEG Baseline
Video decoding:
• MPEG-1 Main Profile up to High Level
• MPEG-2 Main Profile up to High Level
• MPEG-4 Simple Profile up to Level 6, Advanced Profile up to Level 5
• H.264 up to HP Level 5.1, up to 1080p 30fps (yocto) /720p 50fps (android)
• HEVC Main Profile up to Level 4.1 High Tier, up to 1080p 30fps (yocto) /720p
50fps (android)
• VP6/VP8
• JPEG Baseline interleaved
·Security building blocks
ABB: AGOLD 620
·2G/3G RF transceiver
·WLAN
·Bluetooth

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·GNSS
·Audio
·Analog measurement
·Power management
The module incorporates the following key technologies:
·2G/3G cellular subsystem
·GNSS subsystem
·WiFi and Bluetooth subsystems
·Display subsystem
·Camera subsystem
·Audio subsystem
·Power management
xE922-3GR is designed for commercial (0C to70C) & industrial (extended temperature -40C to
+85C) markets quality needs.
In its most basic use case, xE922-3GR can be applied as a wireless communication front-end for
M2M products, offering GNSS and mobile communication features to an external host CPU
through its rich interfaces.
The module supports data only communication, voice call is not supported.
xE922-3GR can further support customer software applications and security features. xE922-
3GR provides software application environment with sufficient system resources for creating
rich on board applications. Thanks to a dedicated application processor and embedded security
resources, product developers and manufacturers can create products which guarantee fraud
prevention and tamper evidence without extra effort for additional security precautions.
xE922-3GR can be self-sufficient and serve as a fully integrated IoT solution. In such a case,
customer would simply complement the module with a power supply, speaker amplifier,
microphone, antennae and an HMI (if applicable).
xE922-3GR is offered with different variants per the list in Section 1.6:
·HE922-3GR: Cellular/WiFi/BT/GNSS
·WE922-3GR: WiFi/BT/GNSS

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2.2. General Functionality and Main Features
The xE922-3GR family of IoT modules features 2G/3G modem, GNSS and WiFi/BT
connectivity together with an on-chip powerful application processor and a rich set of
interfaces.
This overview sums all key interfaces offered by the module , consult the documentation on
INTEL’s IBL supporting website for actual implementation state.
A) Modem subsystem for data only communication (HE922-3GR variant only)
·2G technology 3GPP TS 45.005
oGSM/GPRS/EDGE (multislot class 10)
note : only EDGE RX mode supported
oQuad band support (GSM850/E-GSM900/DCS1800/PCS1900)
·3G technology 3GPP TS 25.101 rel 7
oWCDMA (HSDPA 21Mbps cat14 / HSUPA 5.76Mbps cat6)
oQuad band support ( band 1 / 2 / 5 / 8)
oClass3 power class
·Two (U)SIM ports –dual voltage 1.8/3V
ISO 7816-3 IC card standard
B) GNSS subsystem
§GPS/GLONASS receiver
§Assisted GNSS
§SBAS: WAAS, EGNOS
C) WiFi/Bluetooth subsystem
·WiFi 802.11 b/g/n 1x1 (1-14, max channel width 20MHz)
·BT 4.0 & BLE
·Single antenna shared for WiFi and BT
·Up to 72.2Mbps OTA throughput, 50Mbps actual throughput
D) Audio subsystem
·Embedded analog codec
o2x microphone inputs + bias supply
o1x stereo headset output

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o1x mono earpiece output
o1x mono speaker (classD 700mW/3.8V/8 ohm)
·Dual digital microphone
·I2S digital audio IO ( pinning multiplexed with USIF1 port)
E) Display subsystem
Up to 1080p, 24-bit color, 1080p 30fps (yocto) /720p 50fps (android)
·MIPI-DSI (one x4 lanes port, tearing effect timing control)
·LVDS (one x4 lanes port)
·4 display layer
·Support color space conversion :YUV2RGB and RGB2YUV
·Support replication and dithering
·2D Graphic Engine
·Backlight control (CABC input, BL feedback input, BL drive output)
·I2C port for touch panel control IC
F) Camera subsystem
Up to 13Mpix, 15 fps ( ISP throughput up to 221 Mpix/sec) (8Mpix, 25fps)
·4 lanes MIPI-CSI for primary camera (up to 13Mpix/1080p)
·One lane MIPI-CSI for secondary camera (up to 5Mpix/720p)
·1 camera at a time
·GPIO’s for camera control
·I2C port for camera subsystem control
·Camera auxiliary supply output
G) Power management
·External battery charger IC support
oI2C port dedicated to external charger IC control
oDedicated GPIO’s
oFuel gauge input, VBAT/DC sourcing sense ADC input
·Ability to supply the module from DC source without external battery charger
IC implementation
·Rich set of embedded power management functions are in place to permit
minimization of the powerconsumption of the system in all operating modes.

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oReduction of switching power consumption by clock gating.
oReduction of leakage power by switching off non active logic.
oDynamic Frequency Voltage Scaling reducing the supply voltage
depending on the perfomance requirements of the system
·The following system operating modes are defined :
oOFF : complete system switched off ( all context lost)
oWORKING : CPU executing scheduled tasks
oIDLE : CPU in power state HALT , waiting for interrupt
oDEEP SLEEP: CPU in power state DORMANT
H) Application processor
The Intel virtual machine manager (VMM) shares CPU resources of the quad core Atom
between the cellular DBB modem high level protocol implementation, the applied OS and
customer applications. Available BSP’s are 32bit Android and 32bit Linux (Yocto project).
The chipset external memory interface controller EMIC supports
·Low power LPDDR3 upto 2Gbyte
clock frequency up to 533MHz (data speed 1066 Mbps/pin)
·embedded MMC card interface eMMC4.51
clock frequency up to 52MHz ( data speed DDR 102 Mbps/pin)
(dataspeed DDR transfer)
Module embedded memory size implementation :
·FLASH eMMC: 8 Gbyte (x8 pin, data speed up to 833 Mbps)
·RAM LPDDR3: 1 Gbyte ( x32 pin, data speed up to 34112 Mbps)
I) Security capabilities of DBB:
Intergrated Trusted Executon Environment (TEE) based on Secure Virtual Machine and
HW Crypto Unit (CEU)
·Atom Quad Core:
VT-x2 / AES-NI / SMEP ( Supervisor Mode Execution Privilege)
·Extensible Secure Execution Environment:
HW crypto accelerator –CEU / 256K SRAM
·Configurable execution unit (CEU):
oDES/3DES
oAES(128,192,256)

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oExponentiation accelerator –supports RSA(1024.2048)
oHashing engines : MD5, HMAC, SHA1/256
oTrue-RNG
·Secure memory : isolated memory region IMR for secure VM
·Secure boot : root of trust is SEC ROM
·Content protection : Widevine Level 1 DRM ( HW protected Video Path)
J) Rich set of module I/O interfaces, including:
·SDIO: SD 3.0, 1x 4bit, speed up to DDR50
only 1.8V supported
·SDMMC: 1x 4bit, default mode (26MHz)
including power supply (fixed 2.9V) and card detect
·USB2.0 (FS/HS DRD dual role device)
The USB port is typically used for:
oFlashing of firmware and module configuration
oProduction testing
oAccessing the Application Processor’s filesystem
oAT command access
oHigh speed WWAN access to external host
oDiagnostic monitoring and debugging
oCommunication between Java application environment and an
external host CPU
oNMEA data to an external host CPU
oConnect to USB peripherals or hubs (note: application note available
from chipset provider on USB hub connectivity)
·Peripheral Ports
These can be applied to support several sensors like : accelerometer , gyroscope,
magnetometer, proximity and ambient light sensors
Please consult Intel’s IBL Support website for AVL (approved vendor list), as well
for recommended implemenation and port assignment
·3x I2C port full speed:

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oI2C_AUX : auxiliary use
oI2C_CAM / I2C_TP : available when not applied for camera and/or
touchpad control
·USIF1 port: configurable as SPI or UART (up to 48MHz) (multiplexed with I2S)
·USIF2 port: configurable as SPI or UART (up to 26MHz)
·26 general purpose GPIOs with at least 8 interrupts ( more can be available
depending on final product configuration)
·Analog audio I/F
·Antenna RF ports (GNSS, CELLULAR,WIFI/BT)
K) Form factor (40x34mm), 441 pin LGA
L) Single supply module. The module generates all its internal supply voltages.
M) Built-in RTC / backup supply pin for supercap
N) Two Operating temperature range specified for the xE922-3GR family:
·Commercial: 0 °C to +70 °C
·Industrial extended temperature: -40 °C to +85 °C
O) Cellular transmitter can work simultaneously with the transmitter in the 2.4GHz band. Only
one of the 2.4 GHz modes works at a given moment and it can work simultaneously with any
of the cellular modes.
2.3. Reference table of RF bands characteristics
2.3.1. Cellular network:
Mode
Freq. TX
(MHz)
Freq. RX (MHz)
Channels
TX
-
RX offset
PCS 1900
1850.2 ~ 1909.8
1930.2 ~ 1989.8
512 ~ 810
80MHz
DCS 1800
1710 ~ 1785
1805 ~ 1880
512 ~ 885
95MHz

xE922-3GR Hardware User Guide
1VV0301272 Rev.0.8 2017-01-05
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights
Reserved. Page 20 of 112
Mode
Freq. TX
(MHz)
Freq. RX (MHz)
Channels
TX
-
RX offset
GSM 850
824.2 ~ 848.8
869.2 ~ 893.8
128 ~ 251
45MHz
EGSM 900
890 ~ 915
935 ~ 960
0 ~ 124
45 MHz
880 ~ 890
925 ~ 935
975 ~ 1023
45 MHz
WCDMA 2100
–
B1
1920 ~ 1980
2110 ~ 2170
Tx: 9612 ~ 9888
Rx: 10562 ~ 10838
190MHz
WCDMA 1900
–
B2
1850 ~ 1910
1930 ~ 1990
Tx: 9262 ~ 9538
Rx: 9662 ~ 9938
80MHz
WCDMA 850
–B5
824 ~ 849
869
~ 894
Tx: 4132 ~ 4233
Rx: 4357 ~ 4458
45MHz
WCDMA 900
–B8
880 ~ 915
925 ~ 960
Tx: 2712 ~ 2863
Rx: 2937 ~ 3088
45MHz
2.3.2. WiFi/Bluetooth
min typ max unit
Frequency range
2402
-
2482
MHz
2.3.3. GNSS
min
typ
max
unit
GPS
-
1575.5
-
MHz
Glonass
- 1602 - MHz
2.4. Applications
xE922-3GR modules can be used for all kind of IoT Gateways.
Example applications can be:
-Reduction of production overheads
-Smart management of productions
-Remote device monitoring