Telit Wireless Solutions LE910C1 Series Installation manual

LE910C1
Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14

LE910C1 Hardware User Guide
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Applicability Table
This documentation applies to the following products:
Table 1: Applicability Table
Module Name Description
LE910C1-NA North America – AT&T with global
roaming
LE910C1-NS North America - Sprint variant
LE910C1-AP APAC variant

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and reserves
the right to revise this document and to make changes from time to time in the content hereof with
no obligation to notify any person of revisions or changes. Telit does not assume any liability arising
out of the application or use of any product, software, or circuit described herein; neither does it
convey any license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country. Such
references or information must not be construed to mean that Telit intends to announce such Telit
products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be, include,
or describe copyrighted Telit material, such as computer programs stored in semiconductor
memories or other media. Laws in Italy and other countries preserve for Telit and its licensors
certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in
any form, distribute, and make derivative works of the copyrighted material. Accordingly, any
copyrighted material of Telit and its licensors contained herein or in the Telit products described in
this instruction manual may not be copied, reproduced, distributed, merged, or modified in any
manner without the express written permission of Telit. Furthermore, the purchase of Telit
products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit, as arises by operation of law
in the sale of a product.
Computer Software Copyrights
Telit and third-party software (SW) products described in this instruction manual may include
copyrighted Telit and other third-party computer programs stored in semiconductor memories or
other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain
exclusive rights for copyrighted computer programs, including the exclusive right to copy or
reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or
other third-party SW computer programs contained in the Telit products described in this
instruction manual may not be copied (reverse engineered) or reproduced in any manner without
the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other third-
party SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.

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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished by
an express license agreement only and may be used only in accordance with the terms of such an
agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is prohibited
by law. No part of the software or documentation may be reproduced, transmitted, transcribed,
stored in a retrieval system, or translated into any language or computer language, in any form or
by any means, without prior written permission of Telit.
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-
tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in
the following hazardous environments requiring fail-safe controls: the operation of nuclear
facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or
weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed
or implied warranty of fitness for such high-risk activities.
Trademarks
TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications
S.p.A. in the Unites States and/or other countries. All other product or service names are the
property of their respective owners.
Copyright © 2017 Telit Communications S.p.A.

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Contents
1. Introduction..................................................................................................... 13
1.1. Scope................................................................................................................13
1.2. Audience ..........................................................................................................13
1.3. Contact Information, Support..........................................................................13
1.4. Text Conventions .............................................................................................14
1.5. Related Documents..........................................................................................15
1.6. Abbreviations...................................................................................................16
2. General Product Description ............................................................................ 17
2.1. Overview ..........................................................................................................17
2.2. Applications .....................................................................................................17
2.3. General Functionality and Main Features .......................................................18
2.4. Block Diagram ..................................................................................................21
2.5. Environmental Requirements..........................................................................22
2.5.1. Temperature Range..............................................................................22
2.5.2. RoHS Compliance..................................................................................22
2.6. Frequency Bands..............................................................................................23
2.6.1. RF Bands per Regional Variant .............................................................23
2.6.2. Reference Table of RF Bands Characteristics .......................................24
2.7. RF parameters..................................................................................................27
2.7.1. Sensitivity..............................................................................................27
2.7.2. Output power .......................................................................................27
2.8. LE910C1 Mechanical Specifications.................................................................28
2.8.1. Dimensions ...........................................................................................28
2.8.2. Weight ..................................................................................................28
3. LE910C1 Module Connections .......................................................................... 29
3.1. Pin-out..............................................................................................................29
3.2. LE910C1 - Signals That Must Be Connected ....................................................40
3.3. LGA Pads Layout...............................................................................................42
3.4. Backward Compatibility to xE910 Family ........................................................43

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4. Electrical Specifications .................................................................................... 44
4.1. Absolute Maximum Ratings – Not Operational...............................................44
4.2. Recommended Operating Conditions .............................................................44
4.3. Logic Level Specifications.................................................................................45
4.3.1. 1.8V Pads - Absolute Maximum Ratings...............................................45
4.3.2. 1.8V Standard GPIOs ............................................................................45
4.3.3. 1.8V SD Card Pads.................................................................................46
4.3.4. 1.8V SIM Card Pads...............................................................................46
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings .................................47
4.3.6. SD Card Pads @ 2.95V ..........................................................................47
4.3.7. SIM Card Pads @2.95V .........................................................................48
5. Hardware Commands....................................................................................... 49
5.1. Turning on the LE910C1 Module .....................................................................49
5.2. Initialization and Activation State....................................................................49
5.3. Turning OFF the LE910C1 Module ...................................................................52
5.3.1. Shutdown by Software Command .......................................................52
5.3.2. Hardware Shutdown.............................................................................53
5.3.4. Unconditional Hardware Shutdown.....................................................54
6. Power Supply................................................................................................... 55
6.1. Power Supply Requirements............................................................................55
6.2. General Design Rules .......................................................................................58
6.2.1. Electrical Design Guidelines..................................................................58
6.2.1.1. + 5V Input Source Power Supply – Design Guidelines .........58
6.2.1.2. + 12V Input Source Power Supply – Design Guidelines .......59
6.2.1.3. Battery Source Power Supply – Design Guidelines ..............61
6.2.2. Thermal Design Guidelines...................................................................62
6.2.3. Power Supply PCB Layout Guidelines...................................................63
7. Antenna(s)....................................................................................................... 64
7.1. GSM/WCDMA/LTE Antenna Requirements.....................................................64
7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines.........................................65

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7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines ....................................66
7.4. Antenna Diversity Requirements.....................................................................66
7.5. GNSS Antenna Requirements ..........................................................................67
7.5.1. Combined GNSS Antenna .....................................................................67
7.5.2. Linear and Patch GNSS Antenna...........................................................67
7.5.3. Front End Design Considerations .........................................................67
7.5.4. GNSS Antenna – PCB Line Guidelines...................................................68
7.5.5. GNSS Antenna – Installation Guidelines...............................................69
8. Hardware Interfaces......................................................................................... 70
8.1. USB Port ...........................................................................................................71
8.2. HSIC Interface ..................................................................................................72
8.3. SGMII Interface (optional) ...............................................................................72
8.3.1. Ethernet Control interface ...................................................................72
8.4. Serial Ports .......................................................................................................73
8.4.1. Modem Serial Port 1 Signals.................................................................74
8.4.2. Modem Serial Port 2.............................................................................75
8.4.3. RS232 Level Translation........................................................................76
8.5. Peripheral Ports ...............................................................................................78
8.5.1. SPI – Serial Peripheral Interface ...........................................................78
8.5.2. I2C - Inter-integrated Circuit ................................................................79
8.5.3. SD/MMC Card Interface .......................................................................79
8.5.4. WiFi SDIO Interface ..............................................................................81
8.6. Audio Interface ................................................................................................83
8.6.1. Digital Audio .........................................................................................83
8.6.1.1. Short Frame Timing Diagrams ..............................................84
8.6.1.2. Long Frame Timing Diagrams ...............................................86
8.7. General Purpose I/O ........................................................................................88
8.7.1. Using a GPIO Pad as Input ....................................................................90
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source.............................90
8.7.3. Using a GPIO Pad as Output .................................................................90

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9. Miscellaneous Functions .................................................................................. 92
9.1. Indication of Network Service Availability.......................................................92
9.2. Indication of Software Ready...........................................................................93
9.3. RTC – Real Time Clock......................................................................................93
9.4. VAUX Power Output ........................................................................................93
9.5. ADC Converter .................................................................................................94
9.5.1. Description............................................................................................94
9.5.2. Using the ADC Converter......................................................................94
9.6. Using the Temperature Monitor Function ......................................................94
9.7. GNSS Characteristics........................................................................................95
10.Mounting the Module on your Board ............................................................... 96
10.1. General.............................................................................................................96
10.2. Finishing & Dimensions....................................................................................96
10.3. Recommended Footprint for the Application .................................................99
10.4. Stencil.............................................................................................................100
10.5. PCB Pad Design ..............................................................................................100
10.6. Recommendations for PCB Pad Dimensions (mm)........................................101
10.7. Solder Paste ...................................................................................................102
10.7.1.Solder Reflow......................................................................................102
11. Application Guide ...........................................................................................104
11.1. Debug of the LE910C1 Module in Production ...............................................104
11.2. Bypass Capacitor on Power Supplies .............................................................105
11.3. SIM Interface..................................................................................................106
11.3.1.SIM Schematic Example......................................................................106
11.4. EMC Recommendations.................................................................................107
11.5. Download and Debug Port.............................................................................108
11.5.1.Fast Boot mode...................................................................................108
11.5.2.Recovery Boot Mode ..........................................................................108
12. Packing System ...............................................................................................109
12.1. Packing system – Tray....................................................................................109

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12.2. Tape & Reel....................................................................................................111
12.3. Moisture Sensitivity .......................................................................................113
13. Safety Recommendations................................................................................114
14. Conformity assessment issues.........................................................................115
14.1. FCC/ISED Regulatory notices .........................................................................115
15. Document History...........................................................................................118

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List of Tables
Table 1: Applicability Table.................................................................................................................2
Table 2: Related Documents ............................................................................................................15
Table 3: RF Bands per Regional Variant............................................................................................23
Table 4: RF Bands Characteristics.....................................................................................................24
Table 5: LE910C1 Pin-out..................................................................................................................29
Table 6: Mandatory Signals ..............................................................................................................40
Table 7: Absolute Maximum Ratings – Not Operational..................................................................44
Table 8: Recommended Operating Conditions ................................................................................44
Table 9: Absolute Maximum Ratings - Not Functional.....................................................................45
Table 10: Operating Range – Interface Levels (1.8V CMOS) ............................................................45
Table 11: Operating Range – SD Card Pads Working at 1.8V ...........................................................46
Table 12: Operating Range – SIM Pads Working at 1.8V..................................................................46
Table 13: Absolute Maximum Ratings - Not Functional...................................................................47
Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................47
Table 15: Operating Range – For SIM Pads Operating at 2.95V.......................................................48
Table 16: Power Supply Requirements ............................................................................................55
Table 17: LE910C1 Current Consumption.........................................................................................55
Table 18: GSM / WCDMA/ LTE Antenna Requirements...................................................................64
Table 19: Antenna Line on PCB Requirements.................................................................................64
Table 20: Antenna Diversity Requirements......................................................................................66
Table 21: Antenna Line on PCB Requirements.................................................................................68
Table 22: LE910C1 Hardware Interfaces ..........................................................................................70
Table 23: USB Interface Signals ........................................................................................................71
Table 24: Ethernet Control Interface Signals....................................................................................72
Table 25: Modem Serial Port 1 Signals.............................................................................................74
Table 26 Modem Serial Port 2 Signals..............................................................................................75
Table 27: SPI Signals .........................................................................................................................78
Table 28: SD Card Signals..................................................................................................................80
Table 29: WiFi SDIO Interface Signals...............................................................................................81
Table 30: Digital Audio Interface (DVI) Signals.................................................................................83
Table 31: PCM_CODEC Timing Parameters......................................................................................85
Table 32: AUX_PCM_CODEC Timing Parameters .............................................................................87
Table 33: Primary GPIOs...................................................................................................................88
Table 34: Network Service Availability Indication ............................................................................92
Table 35: Operating Range – VAUX Power Supply ...........................................................................93
Table 36: ADC Parameters................................................................................................................94
The values are related to typical environment and conditions Table 37 GNSS Characteristics.......95
Table 38: Recommendations for PCB Pad Surfaces .......................................................................101
Table 39: Solder Profile Characteristics..........................................................................................103
Table 40: SIM Interface – C1 Range................................................................................................106

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Table 41: EMC Recommendations .................................................................................................107
Table 42: Document Revision History ............................................................................................118

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List of Figures
Figure 1: LE910C1 Block Diagram .....................................................................................................21
Figure 2: LGA Pads Layout ................................................................................................................42
Figure 3: LE910C1 vs. LE910 Pin-out Comparison (top view)...........................................................43
Figure 4: Power-on Circuit................................................................................................................49
Figure 5: LE910C1 Initialization and Activation ................................................................................50
Figure 6: Shutdown by Software Command.....................................................................................52
Figure 7: Hardware Shutdown..........................................................................................................53
Figure 8: Circuit for Unconditional Hardware Shutdown .................................................................54
Figure 9 Power down timing using HW_SHUTDOWN_N .................................................................54
Figure 10: Example of Linear Regulator with 5V Input.....................................................................59
Figure 11: Example of Switching Regulator with 12V Input – Part 1................................................60
Figure 12: Example of Switching Regulator with 12V Input – Part 2................................................60
Figure 13: RS232 Level Adaption Circuitry Example.........................................................................76
Figure 14: RS232 Serial Port Lines Connection Layout.....................................................................77
Figure 15: SPI Signal Connectivity.....................................................................................................78
Figure 16: SD/MMC Interface Connectivity......................................................................................80
Figure 17: Primary PCM Timing ........................................................................................................84
Figure 18: Auxiliary PCM Timing.......................................................................................................86
Figure 19: GPIO Output Pad Equivalent Circuit ................................................................................91
Figure 20: Status LED Reference Circuit ...........................................................................................92
Figure 21: LE910C1 Mechanical Dimensions (bottom view)............................................................96
Figure 22: LE910C1 Mechanical Dimensions (Top view) ..................................................................97
Figure 23: LE910C1 Mechanical Dimensions (Side view) .................................................................98
Figure 24: Recommended Footprint - Top View, 181 pads (dimensions are in mm, top view).......99
Figure 25: PCB Pad Design..............................................................................................................100
Figure 26: PCB Pad Dimensions......................................................................................................101
Figure 27: Solder Reflow Profile .....................................................................................................102
Figure 28: SIM Schematics..............................................................................................................106
Figure 29: Packing...........................................................................................................................109
Figure 30: Tray Drawing..................................................................................................................110
Figure 31: Module Positioning into the Carrier..............................................................................111
Figure 32: Carrier Tape Detail.........................................................................................................111
Figure 33: Reel Detail......................................................................................................................112
Figure 34: Reel Box Detail...............................................................................................................113

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1. Introduction
1.1. Scope
This document introduces the Telit LE910C1C1 module and presents possible and recommended
hardware solutions for developing a product based on the LE910C1C1 module. All the features
and solutions detailed in this document are applicable to all LE910C1C1 variants, where
“LE910C1C1” refers to the variants listed in the applicability table.
If a specific feature is applicable to a specific product only, it will be clearly marked.
NOTE:
LE910C1C1 refers to all modules listed in the Applicability Table.
This document takes into account all the basic functions of a wireless module; a valid hardware
solution is suggested for each function, and incorrect solutions and common errors to be avoided
are pointed out.
Obviously, this document cannot embrace every hardware solution or every product that can be
designed. Obviously, avoiding invalid solutions must be considered mandatory. Where the
suggested hardware configurations need not be considered mandatory, the information given
should be used as a guide and a starting point for properly developing your product with the Telit
LE910C1C1 module.
NOTE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE910C1C1 cellular module within
a user application must be done according to the design rules described in this manual.
1.2. Audience
This document is intended for Telit customers, especially system integrators, about to implement
their applications using the Telit LE910C1C1 module.
1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
•[e-mail]
•TS-[email protected]
•TS-[email protected]

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Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on
accessories and components, visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users about the information provided.
1.4. Text Conventions
The following conventions are used to emphasize specific types of information:
Danger:
This information MUST be followed or catastrophic equipment failure or bodily injury may
occur.
Caution or Warning:
Alerts the user to important points about integrating the module. If these points are not
followed, the module and end user equipment may fail or malfunction.
NOTE:
Tip or Information – Provides advice and suggestions that may be useful when integrating the
module.
All dates are in ISO 8601 format, that is, YYYY-MM-DD.

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1.5. Related Documents
Table 2: Related Documents
Document Title Document Number
Ref 1: LE9x0 AT Command User Guide 80407ST10116A
Ref 2: Telit EVB HW User Guide 1VV0301249
Ref 3: LE910C1 Interface Board HW User Guide 1VV0301323
Ref 4: LE910/LE920 Digital Voice Interface Application Note 80000NT11246A
Ref 5: Telit_LE920A4_LE910C1_Wi-Fi_Interface_Application_Note_r1 80490NT11511A
Ref 6: Antenna Detection Application Note 80000NT10002A
Ref 7: High-Speed Inter-Chip USB Electrical Specification, version 1.0
(a supplement to the USB 2.0 specification, Section 3.8.2)

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1.6. Abbreviations
Term Definition
ADC Analog-to-digital converter
AE Application-enabled
DAC Digital-to-analog converter
DTE Data Terminal Equipment
FDD Frequency division duplex
GLONASS Global orbiting navigation satellite system
GNSS Global navigation satellite system
GPIO General-purpose input/output
GPRS General packet radio services
GPS Global positioning system
GSM Global system for mobile communications
HSIC High-speed inter-chip
I2C Inter-integrated circuit
LTE Long term evolution
SD Secure digital
SGMII Serial Gigabit media-independent interface
SIM Subscriber identity module
SOC System-on-Chip
SPI Serial peripheral interface
UART Universal asynchronous receiver transmitter
UMTS Universal mobile telecommunications system
USB Universal serial bus
WCI Wireless Coexistence Interface
WCDMA Wideband code division multiple access

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2. General Product Description
2.1. Overview
LE910C1 is Telit’s new LTE series for IoT applications.
In its most basic use case, LE910C1 can be applied as a wireless communication front-end for
telematics products, offering GNSS and mobile communication features to an external host CPU
through its rich interfaces.
LE910C1 is available in hardware variants as listed in Table 1: Applicability Table. For differences in
the designated RF band sets – refer to Section 2.6.1, RF Bands per Regional Variant.
2.2. Applications
LE910C1 can be used for telematics applications where tamper-resistance, confidentiality,
integrity, and authenticity of end-user information are required, for example:
•Emergency call
•Telematics services
•Road pricing
•Pay-as-you-drive insurance
•Stolen vehicles tracking
•Internet connectivity

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2.3. General Functionality and Main Features
The LE910C1 series of cellular modules features LTE and multi-RAT modem together with an on-
chip powerful application processor and a rich set of interfaces.
The major functions and features are listed below:
Function Features
Modem •Multi-RAT cellular modem for voice and data communication
oLTE FDD Cat1 (Other variants) (10/5Mbps DL/UL).
oCarrier aggregation is not supported
oGSM/GPRS/EDGE
oWCDMA up to DC HSPA+, Rel.9
•Support for SIM profile switching
•Regional variants with optimal choice of RF bands for worldwide
coverage of countries and MNOs
•State-of-the-art GNSS solution with
GPS/GLONASS/BeiDou/Galileo/QZSS receiver
Digital audio
subsystem
•PCM/I2S digital audio interface
•Up to 48 kHz sample rate, 16 bit words
Two USIM ports –
dual voltage
•Class B and Class C support
•Hot swap support
•Clock rates up to 4 MHz
Application
processor
Application processor to run customer application code
•32 bit ARM Cortex-A7 up to 1.3 GHz running the Linux operating
system
•Flash + DDR are large enough to allow for customer’s own
software applications

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Function Features
Interfaces Rich set of interfaces, including:
•SD/MMC Card Interface supporting SD3.0 standard
•SDIO for external WiFi transceiver supporting SDIO3.0 standard
•SGMII for external Ethernet transceiver (optional)
oCompliant with IEEE802.3
oFull duplex operation at 1 Gbps
oHalf/full duplex operation at 10/100 Mbps
oSupport for VLAN tagging
oSupport for IEEE1588, PTP (Precision Time Protocol)
•USB2.0 – USB port is typically used for:
oFlashing of firmware and module configuration
oProduction testing
oAccessing the Application Processor’s file system
oAT command access
oHigh-speed WWAN access to external host
oDiagnostic monitoring and debugging
oCommunication between Java application environment and an
external host CPU
oNMEA data to an external host CPU
•HSIC
oHigh-speed 480 Mbps (240 MHz DDR) USB transfers are 100% host
driver compatible with traditional USB cable connected topologies
oBidirectional data strobe signal (STROBE)
oBidirectional data signal (DATA)
oNo power consumption unless a transfer is in progress
oMaximum trace length 10 cm
oSignals driven at 1.2V standard LVCMOS levels
•Peripheral Ports – SPI, I2C, UART
•GPIOs
•Antenna ports

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Function Features
Form factor Form factor (28x28mm), accommodating the multiple RF bands in each
region variant
Environment and
quality
requirements
The entire module is designed and qualified by Telit for satisfying the
environment and quality requirements.
Single supply
module
The module generates all its internal supply voltages.
RTC No dedicated RTC supply, RTC is supplied by VBATT
Operating
temperature
Range -40 °C to +85 °C (conditions as defined in Section 2.5.1, Temperature
Range).
NOTE:
The following interfaces are unique for the LE910C1 and may not be supported on other (former
or future) xE910 family. Special care must be taken when designing the application board if
future compatibility is required:
-SGMII for Ethernet connectivity
-SDIO for WIFI connectivity
-SD/MMC for SD Card connectivity