Telit Wireless Solutions LE910C1 Series Installation manual

LE910C1
Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14

LE910C1 Hardware User Guide
1VV0301298 Rev. 1.08 - 2017-11-14
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Applicability Table
This documentation applies to the following products:
Table 1: Applicability Table
Module Name Description
LE910C1-NA North America – AT&T with global
roaming
LE910C1-NS North America - Sprint variant
LE910C1-AP APAC variant

LE910C1 Hardware User Guide
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
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no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and reserves
the right to revise this document and to make changes from time to time in the content hereof with
no obligation to notify any person of revisions or changes. Telit does not assume any liability arising
out of the application or use of any product, software, or circuit described herein; neither does it
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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished by
an express license agreement only and may be used only in accordance with the terms of such an
agreement.
Copyrighted Materials
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High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-
tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in
the following hazardous environments requiring fail-safe controls: the operation of nuclear
facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or
weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed
or implied warranty of fitness for such high-risk activities.
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TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications
S.p.A. in the Unites States and/or other countries. All other product or service names are the
property of their respective owners.
Copyright © 2017 Telit Communications S.p.A.

LE910C1 Hardware User Guide
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Contents
1. Introduction..................................................................................................... 13
1.1. Scope................................................................................................................13
1.2. Audience ..........................................................................................................13
1.3. Contact Information, Support..........................................................................13
1.4. Text Conventions .............................................................................................14
1.5. Related Documents..........................................................................................15
1.6. Abbreviations...................................................................................................16
2. General Product Description ............................................................................ 17
2.1. Overview ..........................................................................................................17
2.2. Applications .....................................................................................................17
2.3. General Functionality and Main Features .......................................................18
2.4. Block Diagram ..................................................................................................21
2.5. Environmental Requirements..........................................................................22
2.5.1. Temperature Range..............................................................................22
2.5.2. RoHS Compliance..................................................................................22
2.6. Frequency Bands..............................................................................................23
2.6.1. RF Bands per Regional Variant .............................................................23
2.6.2. Reference Table of RF Bands Characteristics .......................................24
2.7. RF parameters..................................................................................................27
2.7.1. Sensitivity..............................................................................................27
2.7.2. Output power .......................................................................................27
2.8. LE910C1 Mechanical Specifications.................................................................28
2.8.1. Dimensions ...........................................................................................28
2.8.2. Weight ..................................................................................................28
3. LE910C1 Module Connections .......................................................................... 29
3.1. Pin-out..............................................................................................................29
3.2. LE910C1 - Signals That Must Be Connected ....................................................40
3.3. LGA Pads Layout...............................................................................................42
3.4. Backward Compatibility to xE910 Family ........................................................43

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4. Electrical Specifications .................................................................................... 44
4.1. Absolute Maximum Ratings – Not Operational...............................................44
4.2. Recommended Operating Conditions .............................................................44
4.3. Logic Level Specifications.................................................................................45
4.3.1. 1.8V Pads - Absolute Maximum Ratings...............................................45
4.3.2. 1.8V Standard GPIOs ............................................................................45
4.3.3. 1.8V SD Card Pads.................................................................................46
4.3.4. 1.8V SIM Card Pads...............................................................................46
4.3.5. Dual Voltage Pads - Absolute Maximum Ratings .................................47
4.3.6. SD Card Pads @ 2.95V ..........................................................................47
4.3.7. SIM Card Pads @2.95V .........................................................................48
5. Hardware Commands....................................................................................... 49
5.1. Turning on the LE910C1 Module .....................................................................49
5.2. Initialization and Activation State....................................................................49
5.3. Turning OFF the LE910C1 Module ...................................................................52
5.3.1. Shutdown by Software Command .......................................................52
5.3.2. Hardware Shutdown.............................................................................53
5.3.4. Unconditional Hardware Shutdown.....................................................54
6. Power Supply................................................................................................... 55
6.1. Power Supply Requirements............................................................................55
6.2. General Design Rules .......................................................................................58
6.2.1. Electrical Design Guidelines..................................................................58
6.2.1.1. + 5V Input Source Power Supply – Design Guidelines .........58
6.2.1.2. + 12V Input Source Power Supply – Design Guidelines .......59
6.2.1.3. Battery Source Power Supply – Design Guidelines ..............61
6.2.2. Thermal Design Guidelines...................................................................62
6.2.3. Power Supply PCB Layout Guidelines...................................................63
7. Antenna(s)....................................................................................................... 64
7.1. GSM/WCDMA/LTE Antenna Requirements.....................................................64
7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines.........................................65

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7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines ....................................66
7.4. Antenna Diversity Requirements.....................................................................66
7.5. GNSS Antenna Requirements ..........................................................................67
7.5.1. Combined GNSS Antenna .....................................................................67
7.5.2. Linear and Patch GNSS Antenna...........................................................67
7.5.3. Front End Design Considerations .........................................................67
7.5.4. GNSS Antenna – PCB Line Guidelines...................................................68
7.5.5. GNSS Antenna – Installation Guidelines...............................................69
8. Hardware Interfaces......................................................................................... 70
8.1. USB Port ...........................................................................................................71
8.2. HSIC Interface ..................................................................................................72
8.3. SGMII Interface (optional) ...............................................................................72
8.3.1. Ethernet Control interface ...................................................................72
8.4. Serial Ports .......................................................................................................73
8.4.1. Modem Serial Port 1 Signals.................................................................74
8.4.2. Modem Serial Port 2.............................................................................75
8.4.3. RS232 Level Translation........................................................................76
8.5. Peripheral Ports ...............................................................................................78
8.5.1. SPI – Serial Peripheral Interface ...........................................................78
8.5.2. I2C - Inter-integrated Circuit ................................................................79
8.5.3. SD/MMC Card Interface .......................................................................79
8.5.4. WiFi SDIO Interface ..............................................................................81
8.6. Audio Interface ................................................................................................83
8.6.1. Digital Audio .........................................................................................83
8.6.1.1. Short Frame Timing Diagrams ..............................................84
8.6.1.2. Long Frame Timing Diagrams ...............................................86
8.7. General Purpose I/O ........................................................................................88
8.7.1. Using a GPIO Pad as Input ....................................................................90
8.7.2. Using a GPIO Pad as an interrupt / Wakeup source.............................90
8.7.3. Using a GPIO Pad as Output .................................................................90

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9. Miscellaneous Functions .................................................................................. 92
9.1. Indication of Network Service Availability.......................................................92
9.2. Indication of Software Ready...........................................................................93
9.3. RTC – Real Time Clock......................................................................................93
9.4. VAUX Power Output ........................................................................................93
9.5. ADC Converter .................................................................................................94
9.5.1. Description............................................................................................94
9.5.2. Using the ADC Converter......................................................................94
9.6. Using the Temperature Monitor Function ......................................................94
9.7. GNSS Characteristics........................................................................................95
10.Mounting the Module on your Board ............................................................... 96
10.1. General.............................................................................................................96
10.2. Finishing & Dimensions....................................................................................96
10.3. Recommended Footprint for the Application .................................................99
10.4. Stencil.............................................................................................................100
10.5. PCB Pad Design ..............................................................................................100
10.6. Recommendations for PCB Pad Dimensions (mm)........................................101
10.7. Solder Paste ...................................................................................................102
10.7.1.Solder Reflow......................................................................................102
11. Application Guide ...........................................................................................104
11.1. Debug of the LE910C1 Module in Production ...............................................104
11.2. Bypass Capacitor on Power Supplies .............................................................105
11.3. SIM Interface..................................................................................................106
11.3.1.SIM Schematic Example......................................................................106
11.4. EMC Recommendations.................................................................................107
11.5. Download and Debug Port.............................................................................108
11.5.1.Fast Boot mode...................................................................................108
11.5.2.Recovery Boot Mode ..........................................................................108
12. Packing System ...............................................................................................109
12.1. Packing system – Tray....................................................................................109

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12.2. Tape & Reel....................................................................................................111
12.3. Moisture Sensitivity .......................................................................................113
13. Safety Recommendations................................................................................114
14. Conformity assessment issues.........................................................................115
14.1. FCC/ISED Regulatory notices .........................................................................115
15. Document History...........................................................................................118

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List of Tables
Table 1: Applicability Table.................................................................................................................2
Table 2: Related Documents ............................................................................................................15
Table 3: RF Bands per Regional Variant............................................................................................23
Table 4: RF Bands Characteristics.....................................................................................................24
Table 5: LE910C1 Pin-out..................................................................................................................29
Table 6: Mandatory Signals ..............................................................................................................40
Table 7: Absolute Maximum Ratings – Not Operational..................................................................44
Table 8: Recommended Operating Conditions ................................................................................44
Table 9: Absolute Maximum Ratings - Not Functional.....................................................................45
Table 10: Operating Range – Interface Levels (1.8V CMOS) ............................................................45
Table 11: Operating Range – SD Card Pads Working at 1.8V ...........................................................46
Table 12: Operating Range – SIM Pads Working at 1.8V..................................................................46
Table 13: Absolute Maximum Ratings - Not Functional...................................................................47
Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................47
Table 15: Operating Range – For SIM Pads Operating at 2.95V.......................................................48
Table 16: Power Supply Requirements ............................................................................................55
Table 17: LE910C1 Current Consumption.........................................................................................55
Table 18: GSM / WCDMA/ LTE Antenna Requirements...................................................................64
Table 19: Antenna Line on PCB Requirements.................................................................................64
Table 20: Antenna Diversity Requirements......................................................................................66
Table 21: Antenna Line on PCB Requirements.................................................................................68
Table 22: LE910C1 Hardware Interfaces ..........................................................................................70
Table 23: USB Interface Signals ........................................................................................................71
Table 24: Ethernet Control Interface Signals....................................................................................72
Table 25: Modem Serial Port 1 Signals.............................................................................................74
Table 26 Modem Serial Port 2 Signals..............................................................................................75
Table 27: SPI Signals .........................................................................................................................78
Table 28: SD Card Signals..................................................................................................................80
Table 29: WiFi SDIO Interface Signals...............................................................................................81
Table 30: Digital Audio Interface (DVI) Signals.................................................................................83
Table 31: PCM_CODEC Timing Parameters......................................................................................85
Table 32: AUX_PCM_CODEC Timing Parameters .............................................................................87
Table 33: Primary GPIOs...................................................................................................................88
Table 34: Network Service Availability Indication ............................................................................92
Table 35: Operating Range – VAUX Power Supply ...........................................................................93
Table 36: ADC Parameters................................................................................................................94
The values are related to typical environment and conditions Table 37 GNSS Characteristics.......95
Table 38: Recommendations for PCB Pad Surfaces .......................................................................101
Table 39: Solder Profile Characteristics..........................................................................................103
Table 40: SIM Interface – C1 Range................................................................................................106