GE910 Hardware User Guide
1vv0300962 Rev.12 2013-10-22
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 6 of 83 Mod. 0805 2011-07 Rev.2
7.4.9.
Powering the External LNA (active antenna)................................................................................................46
7.4.10.
External LNA Enable.....................................................................................................................................47
8.
Logic Level Specifications............................................................................................................................................48
9.
USB Port........................................................................................................................................................................49
9.1.
USB 2.0 FS ............................................................................................................................................................49
10.
Serial Ports................................................................................................................................................................50
10.1.
Modem Serial Port .................................................................................................................................................50
10.2.
RS232 level translation ..........................................................................................................................................52
11.
Audio Section Overview...........................................................................................................................................54
11.1.
Digital Voice Interface (DVI) ................................................................................................................................54
11.1.1.
DVI Electrical Connections...........................................................................................................................54
11.2.
Analog Front-End...................................................................................................................................................54
11.2.1.
MIC connection.............................................................................................................................................54
11.2.2.
LINE-IN connection.......................................................................................................................................56
11.2.3.
EAR connection.............................................................................................................................................57
11.2.4.
Electrical Characteristics..............................................................................................................................59
12.
General Purpose I/O.................................................................................................................................................61
12.1.
Using a GPIO Pad as INPUT.................................................................................................................................62
12.2.
Using a GPIO Pad as OUTPUT.............................................................................................................................62
12.3.
Indication of network service availability..............................................................................................................63
12.4.
RTC Bypass out .....................................................................................................................................................64
12.5.
External SIM Holder Implementation....................................................................................................................64
12.6.
ADC Converter ......................................................................................................................................................64
12.6.1.
Description....................................................................................................................................................64
12.6.2.
Using ADC Converter ...................................................................................................................................64
13.
Mounting the GE910 on your Board.......................................................................................................................65
13.1.
General...................................................................................................................................................................65
13.2.
Module finishing & dimensions.............................................................................................................................65
13.3.
Recommended foot print for the application..........................................................................................................66
13.4.
Stencil.....................................................................................................................................................................67
13.5.
PCB pad design......................................................................................................................................................67
13.6.
Recommendations for PCB pad dimensions..........................................................................................................67
13.7.
Solder paste............................................................................................................................................................69
13.7.1.
GE910 Solder reflow.....................................................................................................................................69
14.
Packing system..........................................................................................................................................................71
14.1.
Packing on Reel......................................................................................................................................................71
14.1.1.
Carrier Tape Detail.......................................................................................................................................71
14.1.2.
Reel Detail.....................................................................................................................................................72
14.1.3.
Packaging Detail...........................................................................................................................................73
14.2.
Packing on tray.......................................................................................................................................................74
14.3.
Moisture sensibility................................................................................................................................................76
15.
Conformity Assessment Issues.................................................................................................................................77
16.
SAFETY RECOMMANDATIONS.........................................................................................................................82
17.
Document History.....................................................................................................................................................83