Texas Instruments TPA6110A2 MSOP User manual

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  
 
2000 Mixed-Signal Products
User’s Guide
SLOU085

IMPORTANT NOTICE
TexasInstruments andits subsidiaries(TI) reservethe rightto makechanges totheir productsor todiscontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TIdeemsnecessarytosupport thiswarranty. Specifictestingofallparameters ofeachdevice isnotnecessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TIassumes noliabilityforapplicationsassistance orcustomer productdesign. TIdoes notwarrantorrepresent
thatanylicense,eitherexpressorimplied,isgrantedunderanypatentright,copyright,maskworkright,orother
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated

Information About Cautions and Warnings
iii
Read This First
Preface
Read This First
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Related Documentation From Texas Instruments
 TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
 TPA6110A2 150-mW Stereo Audio Power Amplifier (literature
number SLOS314) This is the data sheet for the TPA6110A2 audio
amplifier integrated circuit.

Running Title—Attribute Reference
iv
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
testedforcompliancewiththelimitsofcomputingdevicespursuanttosubpart
Jofpart 15ofFCCrules,which aredesignedtoprovidereasonableprotection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.

Running Title—Attribute Reference
v
Contents
Contents
1 Introduction 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 Features 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA6110A2 MSOP EVM Specifications 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Operation 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Precautions 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 References 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.1 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier 2-5. . . . .
2.4.2 TPA6110A2 MSOP EVM Schematic Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.3 TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List 2-6. . . .
2.4.4 TPA6110A2 EVM PCB Layers 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures
1–1 The TI TPA6110A2 Audio Amplifier Evaluation Module 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–1 Quick Start Platform Map 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Quick Start Module Map 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–3 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier 2-5. . . . . . . . . . . . . . .
2–4 TPA6110A2 MSOP EVM Schematic Diagram 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–5 TPA6110A2 EVM PCB Layers 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–6 TPA6110A2 EVM Silkscreen 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–7 TPA6110A2 EVM PCB Top Layer 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–8 TPA6110A2 EVM PCB Bottom Layer 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Tables
2–1 Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6110A2 MSOP EVM 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2–2 Platform Jumper and Switch Settings for the TPA6110A2 MSOP EVM 2-3. . . . . . . . . . . . . . .
2–3 TPA6110A2 MSOP EVM Parts List 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

vi

1-1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA6110A2
MSOPaudioamplifierevaluationmodule(SLOP338).ItincludesalistofEVM
features, a brief description of the module illustrated with a pictorial diagram,
and a list of EVM specifications.
Topic Page
1.1 Features 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 Description 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3 TPA6110A2 MSOP EVM Specifications 1–3. . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 1

Features
1-2
Introduction
1.1 Features
The TI TPA6110A2 MSOP audio amplifier evaluation module and the TI
plug-n-play audio amplifier evaluation platform include the following features:
TPA6110A2 MSOP Stereo Audio Power Amplifier Evaluation Module
Dual channel, single-ended operation
150-mW output power into 8 Ωat 5 V
2.5-V to 5.5-V operation
Very low distortion:
THD+N is less than 0.01% at 1 kHz and less than 0.03% from 20
Hz to 20 kHz into 10-kΩloads
Lessthan0.02%at1kHzandlessthan0.4%from20Hzto20kHz
into 32-Ωloads
Lessthan0.05%at1kHzandlessthan0.8%from20Hzto20kHz
into 8-Ωloads
Extremely low current consumption in shutdown mode
Internal thermal and short-circuit protection
Internal pop reduction circuitry
Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platformprovides quick andeasyaudioinput and outputconnections
Platform Power Options
Onboard 9-V battery
External 5-V–15-V (VCC) supply inputs
External regulated VDD supply input
Socket for on-board 5-V VDD voltage regulator EVM
Onboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output

Description
1-3
Introduction
1.2 Description
The TPA6110A2 MSOP audio power amplifier evaluation module is a
complete, low-power stereo audio power amplifier for high-fidelity line-level
output, headphone, and small speaker applications. It consists of the TI
TPA6110A2 150-mW stereo audio power amplifier IC in a very small MSOP
package, along with a small number of other parts mounted on a circuit board
that is approximately one and a quarter inches square (Figure 1–1).
Figure 1–1.The TI TPA6110A2 Audio Amplifier Evaluation Module
GND
Vo2
C3
IN2
GND
VDD GND
IN1
GND
U1
R1 R2
C2 R3
S1
Shutdown
C5
Vo1
GND
C1
TEXAS
INSTRUMENTS
SLOP338
TPA6110A2 MSOP EVM
C4
R4
R5
†Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is
replaced with the code TIAIZ.
Single in-line header pins are mounted to the underside of the module circuit
board; these pins allow the EVM to be plugged into the TI plug-n-play audio
amplifier evaluation platform, or to be wired directly into existing circuits and
equipment when used stand-alone.
The platform has room for a single TPA6110A2 evaluation module and is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which
automatically provides power to the modules, interconnects them correctly,
andconnectsthemtoaversatilearrayofstandardaudioinputandoutputjacks
and connectors. Easy-to-use configuration controls allow the platform and
EVMs to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3 TPA6110A2 MSOP EVM Specifications
Supply voltage range, VDD 2.5 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply current, IDD 160 mA, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output power, PO:8Ω, VDD=5 V 150 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio input voltage, VIVDD + 0.3 Vpp, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Minimum load impedance, RL8 Ω. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-4
Introduction

2-1
Operation
Operation
Follow the steps in this chapter to quickly prepare the TPA6110A2 MSOP
audio amplifier EVM for use. The TPA6110A2 MSOP EVM and the TI
plug-n-play audio amplifier evaluation platform provide a quick and easy way
to connect power, signal and control inputs, and signal outputs to the EVM
using standard connectors. However, the audio amplifier evaluation module
can be used stand-alone by making connections directly to the module pins
and can be wired directly into existing circuits or equipment.
Theplatformswitchand jumper settings shown inTable2–1aretypicalforthe
TPA6110A2 MSOP EVM and will cause the TPA6110A2 IC to shutdown/mute
when a plug is removed from platform headphone jack J10.
Table 2–1. Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6110A2 MSOP EVM
EVM JP6 JP7 JP8 S2 S3
TPA6110A2 X Lo X See Note 2 U5
Notes: 1) X = Don’t care
2) SetS2to ON when signalconditioningboardis installed in U1;setS2
to OFF when no signal conditioning board is installed.
Topic Page
2.1 Precautions 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Quick Start List for Platform 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Quick Start List for Stand-Alone 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4 References 2–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 2

Precautions
2-2
Operation
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to VCC power input connector J1, J2, and/or VDD power
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied—damage
to the EVM board, the platform, or both may result.
Figure 2–1. Quick Start Platform Map
3
Signal Conditioning
****CAUTION****
Do not insert or remove
EVM boards with power
applied
ICC
JP4
F1
VR1
R1
JP3 JP2 JP1 AC/DC
(J2)
VCC(J1)
D1 D2 D3
D4 J2
J3 J4 J5
AC/DC
In
VCC
In
+
J1
DC
SOURCE
LED1 VCC
LED2 VDD
R2
JP5 IDD
B1
U6
POWER
SUPPLY
U3 U4
U5
U1
U2
Audio
Power
Amps
OnOff ConditioningS2
J7 J8 Right
Out Left
Out
+–+–
JP6
Mode
Mute
Spk(U2-U4)
JP8
J9 Left
Out
JP7
S3 HP Source
U2-U4
U5
Polarity
Lo
Hi
HP(U5)
C3 C2
++
R3
R4 R5
J10
Stereo
HP Out
TP1
GND
Plug-N-PlayAudio Amplifier
Evaluation Platform
SLOP097 Rev. C.1
Stereo
In
Right
In Left
In
J6 In/Out VDD
F2
VR2
+
DC
Power
In/Out
Speaker
Output
Headphone
Output
Audio
Input
Power
Input
Batt
C1+
Right
Out
On Off Pwr
S1
TEXAS INSTRUMENTS 1997
110
9
8
6b
6b
6a
6b
4
7b
25

Quick Start List for Platform
2-3
Operation
2.2 Quick Start List for Platform
Follow these steps when using the TPA6110A2 MSOP EVM with the TI
plug-n-playaudioamplifierevaluationplatform(seetheplatformuser’sguide,
SLOU011, for additional details). Numbered callouts for selected steps are
shown in Figure 2–1.
Platform preparations
1) Ensure that all external power sources are set to off and that the platform
power switch S1 is set to off
.
2) Install a TPA6110A2 MSOP module in platform socket U5, taking care to
align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1)
4) Set control signal polarity jumper JP7 to Lo.
5) SetHPsourceswitchS3toU5toroutetheoutputsignaltotheheadphone
jack (J10).
Table 2–2. Platform Jumper and Switch Settings for the TPA6110A2 MSOP EVM
EVM JP6 JP7 JP8 S2 S3
TPA6110A2 X Lo X See Note 2 U5
Notes: 1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when
no signal conditioning board is installed.
Power supply
6) Select and connect the power supply:
a) Connectanexternalregulatedpowersupplysettoavoltagebetween
2.5Vand 5.5VtoplatformVDD powerinputconnectorJ6,takingcare
to observe marked polarity, or
b) Install 3-V to 5-V voltage regulator EVM (SLVP097 or equiv.) in plat-
formsocketU6.Installa9-VbatteryinB1orconnecta7V–12Vpow-
er source to a platform VCC power input J1 or J2 and jumper the ap-
propriate power input (see platform user’s guide).
Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or
stereo miniature phone jack J4.
9) Connect 32-Ωheadphones to headphone jack J10.
Power-up
10) Verify correct voltage and input polarity and setthe external powersupply
toON.If VCC andanonboardregulatorEVMare usedtoprovideVDD,set
platform power switch S1 to ON.
Platform LED2 lights indicating the presence of VDD, and the evaluation
modules installed on the platform begin operation.
11) Adjust the signal source level as needed.

Quick Start List for Stand-Alone
2-4
Operation
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA6110A2 MSOP EVM stand-alone or when
connectingittoexistingcircuitsor equipment. Connections to theTPA6110A2
MSOP module header pins can be made via individual sockets,
wire-wrapping, or soldering to the pins, either on the top or the bottom of the
module circuit board. Numbered callouts for selected steps are shown in
Figure 2–2 and details appear in Chapter 3.
Figure 2–2. Quick Start Module Map
6
2
4
4
5
6
GND
Vo2
C3
IN2
GND
VDD GND
IN1
GND
U1
R1 R2
C2 R3
S1
Shutdown
C5
Vo1
GND
C1
TEXAS
INSTRUMENTS
SLOP338
TPA6110A2 MSOP EVM
C4
R4
R5
†Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is
replaced with the code TIAIZ.
Power supply
1) Ensure that all external power sources are set to off .
2) Connectanexternal regulated power supplysetto 5 V to themoduleVDD
and GND pins, taking care to observe marked polarity.
Inputs and outputs
3) Ensure that the signal source level is set to minimum.
4) Connect the audio source to the module IN1, IN2, and GND pins, taking
care to observe marked polarity.
5) Connect the shutdown (S1) pin to VDD through a normally open switch.
6) Connect 32-Ωheadphones to the module VO1, and VO2 pins through 33
µF to 1000 µF output-coupling capacitors (see Figure 2–3) and return to
the GND pin, or
7) For line output, connections to the VO1 and VO2 pins must be made
through 33 µF to 1000 µF output-coupling capacitors and returned to
GND.
Power-up
8) Verify correct voltage and input polarity and setthe external powersupply
to
ON.
The EVM should begin operation.
9) Adjust the signal source level as needed.

References
2-5
Operation
2.4 References
2.4.1 TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier
Figure 2–3.TPA6110A2 MSOP EVM Connected as a Stereo Headphone Amplifier
GND
Vo2
C3
IN2
GND
VDD GND
IN1
GND
U1
R1 R2
C2 R3
S1
Shutdown
C5
Vo1
GND
C1
TEXAS
INSTRUMENTS
SLOP338
TPA6110A2 MSOP EVM
C4
R4
R5
Audio Input
(Left)
Audio Input
(Right)
Shutdown NO
5 VDC
33 µF – 1000 µF
+
+
33 µF – 1000 µF
†Due to the very small size of the MSOP IC package, the standard part number TPA6110A2 is replaced with the code TIAIZ.
2.4.2 TPA6110A2 MSOP EVM Schematic Diagram
Figure 2–4.TPA6110A2 MSOP EVM Schematic Diagram
IN 1
Vo1
VDD
Vo2
Bypass
GND
Shutdown
IN 2
R1
82 kΩ
C1
1 µF
R3
20 kΩ
C2
1 µF
R2
20 kΩ
C3
1 µF
S1
R4, 82 kΩ
8
7
6
5
1
2
3
4
Vo1
Vo2
Audio Input 1
Audio Input 2
Shutdown
(VDD to
Shutdown)
R5
82 kΩ
TPA6110A2
MSOP
C5
10 µF+
VDD VDD
2 to 5.5 V
GND
C4
1 µF
SHUTDOWN

TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List
2-6
Operation
2.4.3 TPA6110A2 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 2–3.TPA6110A2 MSOP EVM Parts List
Ref. Description Size Qty. Manufacturer/
Part Number Vendor/Number
R2, R3 Resistor, 20 kΩ, 1/16
W, 5%, SMD 0603 3 Panasonic ERJ-3GSYJ203 Digi-Key P20PGCT–ND
R1, R4, R5 Resistor, 82 kΩ, 1/16
W, 5%, SMD 0603 2 Panasonic ERJ-3GSYJ823 Digi-Key P82KGCT–ND
C1–C4 Capacitor, 1 µF,
+20/–80%,
Non-polarized, SMD
0603 4 Murata
GRM39-Y5V105Z10 Newark
C5 Capacitor, 10 µF, 6.3 V,
SMD A 1 Panasonic ECS-TOJY106R Digi-Key PCS1106CT-ND
S1
(SHUTDOWN) Switch, momentary SMD 1 Panasonic P8048SCT-ND Digi-Key P8048SCT-ND
U1 IC, TPA6110A2, APA,
150 mW, 2 channel MSOP-8 1 TI TPA6110A2DGN
PNP Pins Terminal post headers 11 Sullins Digi-Key
S1022-36-ND
The following illustrations depict the TPA6110A2 EVM PCB layers and silks-
creen.Thesedrawingsarenottoscale.Gerberplotscanbeobtainedfromany
TI sales office.
2.4.4 TPA6110A2 EVM PCB Layers
Figure 2–5.TPA6110A2 EVM PCB Layers

TPA6110A2 EVM PCB Layers
2-7
Operation
Figure 2–6.TPA6110A2 EVM Silkscreen
Figure 2–7.TPA6110A2 EVM PCB Top Layer
Figure 2–8.TPA6110A2 EVM PCB Bottom Layer

2-8
Operation