Texas Instruments bq20z60EVM-001 User manual

User's GuideSLUU354 – June 2009
bq20z60EVM-001 SBS 1.1 Impedance Track™ TechnologyEnabled Battery Management Solution Evaluation Module
This evaluation module (EVM) is a complete evaluation system for the bq20z60/bq29330/bq29412 batterymanagement system. The EVM includes one bq20z60/bq29330/bq29412 circuit module, a current senseresistor, two thermistors, and Windows™-based PC software. The circuit module includes one bq20z60integrated circuit (IC), one bq29330 IC, one bq29412 IC, and all other onboard components necessary tomonitor and predict capacity, perform cell balancing, monitor critical parameters, protect the cells fromovercharge, over discharge, short circuit, and overcurrent in 2-, 3- or 4-series cell Li-ion or Li-polymerbattery packs. The circuit module connects directly across the cells in a battery. With the EV2300 interfaceboard and software, the user can read the bq20z60 data registers, program the chipset for different packconfigurations, log cycling data for further evaluation, and evaluate the overall functionality of thebq20z60/bq29330/bq29412 solution under different charge and discharge conditions.
Contents1 Features ....................................................................................................................... 22 bq20z60/bq29330-Based Circuit Module ................................................................................. 23 bq20z60/bq29330 Circuit Module Schematic ............................................................................ 34 Circuit Module Physical Layouts and Bill of Materials .................................................................. 35 EVM Hardware and Software Setup ...................................................................................... 96 Troubleshooting Unexpected Dialog Boxes .............................................................................. 97 Hardware Connection ....................................................................................................... 98 Operation .................................................................................................................... 119 Calibration Screen.......................................................................................................... 1410 Pro (Advanced) Screen .................................................................................................... 1511 Related Documentation From Texas Instruments ..................................................................... 16
List of Figures
1 Layout (Silk Screen) ......................................................................................................... 42 Top Assembly ................................................................................................................ 43 Top Layer ..................................................................................................................... 44 Bottom Layer ................................................................................................................. 55 Bottom Assembly ............................................................................................................ 56 Schematic ..................................................................................................................... 87 bq20z60bq29330 Circuit Module Connection to Cells and System Load/Charger ................................ 108 SBS Data Screen........................................................................................................... 129 Data Flash Screen, 1st Level Safety Class ............................................................................. 1310 Calibration Screen.......................................................................................................... 1511 Pro (Advanced) Screen .................................................................................................... 16
List of Tables
1 Components and Flash-Memory Settings for Different Precharge Modes ........................................... 32 Bill of Materials ............................................................................................................... 63 Performance Specification Summary ..................................................................................... 94 Circuit Module to EV2300 Connections ................................................................................. 10
Impedance Track is a trademark of Texas Instruments.Windows is a trademark of Microsoft Corporation.
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1 Features
1.1 Kit Contents
1.2 Ordering Information
2 bq20z60/bq29330-Based Circuit Module
2.1 Circuit Module Connections
2.2 Pin Descriptions
Features www.ti.com
•Complete evaluation system for the bq20z60 SBS 1.1-compliant advanced gas gauge with ImpedanceTrack™ Technology, bq29330 analog front end (AFE) and protection IC, and bq29412 independentovervoltage protection IC•Populated circuit module for quick setup•Software that allows data logging for system analysis
•bq20z60/bq29330/bq29412 circuit module•Set of support documentation
EVM PART NUMBER CHEMISTRY CONFIGURATION CAPACITY
bq20z60EVM-001 Li-ion 2, 3, or 4 cell Any
The bq20z60/bq29330/bq29412-based circuit module is a complete and compact example solution of abq20z60 and bq29330 circuit for battery management and protection of Li-ion or Li-polymer packs. Thecircuit module incorporates a bq20z60 battery monitor IC, bq29330 AFE and protection IC, bq29412independent overvoltage protection IC, and all other components necessary to accurately predict thecapacity of 2-, 3-, or 4-series cells.
Contacts on the circuit module provide the following connections:•Direct connection to the cells: 1N (BAT–), 1P, 2P, 3P, 4P (BAT+)•To the serial communications port (SMBC, SMBD, VSS)•The system load and charger connect across PACK+ and PACK–•To the system-present pin (SYS PRES)
PIN NAME DESCRIPTION1N –ve connection of first (bottom) cell1P +ve connection of first (bottom) cell2P +ve connection of second cell3P +ve connection of third cell4P +ve connection of fourth (top) cellSMBC Serial communication port clockSMBD Serial communication data portSYS PRES System present pin (if low, system is present)PACK– Pack negative terminalVSS Pack negative terminalPACK+ Pack positive terminal
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3 bq20z60/bq29330 Circuit Module Schematic
3.1 Schematic
3.2 Modifications for Choosing Particular Precharge Mode
3.3 Testing Fuse-Blowing Circuit
4 Circuit Module Physical Layouts and Bill of Materials
www.ti.com bq20z60/bq29330 Circuit Module Schematic
This section contains information on the schematic for the bq20z60/bq29330/bq29412 implementation.
The schematic follows the bill of materials in this user's guide.
In order to charge, the charge FET (CHG-FET) must be turned on to create a current path. When theV
(BAT)
is 0 V and CHG-FET = ON, the V
(PACK)
is as low as the battery voltage. In this case, the supplyvoltage for the device is too low to operate. This function has three possible configurations, and thebq29330 can be easily configured according to the application needs. The three modes are 0-V ChargeFET mode, Common FET mode, and Precharge FET mode.1. 0-V Charge FET mode - Dedicates a precharge current path using an additional FET (ZVCHG-FET) tosustain the PACK+ voltage level.2. Common FET mode - Does not use a dedicated precharge FET. The charge FET (CHG-FET) is set toON state as default.3. Precharge FET mode - Dedicates a precharge current path using an additional open-drain (OD) pindrive FET (PCHG-FET) to sustain the PACK+ voltage level.
To use a particular mode of charging with the EVM, add or remove some elements shown in Table 1 , anduse the given settings of DF.Configuration, ZVCHG1, 0.
Table 1. Components and Flash-Memory Settings for Different PrechargeModes
MODE RESISTORS PRECHG FET ZVCHG1 ZVCHG0
1 0-V Chg R18, R23 Q3 0 0(default)
2 Common FET R20 Q2 0 13 Precharge R19, R23 Q3 1 0
For more details about precharge operation and mode choices, see the bq29330 data sheet at(SLUS673 ).
To prevent the loss of board functionality during the fuse-blowing test, the actual chemical fuse is notprovided in the circuit. FET Q1 drives TP3 low if a fuse-blow condition occurs; so, monitoring TP3 can beused to test this condition. Fuse placement on the application board is shown in the bq20z60 data sheetreference-board schematic.
This section contains the board layout, bill of materials, and assembly drawings for the bq20z60/ bq29330/bq29412 circuit module.
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4.1 Board Layout
Circuit Module Physical Layouts and Bill of Materials www.ti.com
This section shows the dimensions, PCB layers (Figure 1 through Figure 5 ), and assembly drawing for thebq20z60/bq29330 module.
Figure 1. Layout (Silk Screen)
Figure 2. Top Assembly
Figure 3. Top Layer
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www.ti.com Circuit Module Physical Layouts and Bill of Materials
Figure 4. Bottom Layer
Figure 5. Bottom Assembly
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4.2 Bill of Materials and Schematic
Circuit Module Physical Layouts and Bill of Materials www.ti.com
Table 2. Bill of MaterialsCount RefDes Value Description Size Part Number MFR
21 C1–C12, C15, 0.1 µF Capacitor, Ceramic, 50V, X7R, 20% 0603 STD AnyC18–C22, C25,C26
1 C13 0.22 µF Capacitor, Ceramic, 50 V, X7R, 20% 0603 STD Any
3 C14, C16, C28 1.0 µF Capacitor, Ceramic, 25 V, X7R, 20% 0805 STD Any
1 C17 47 nF Capacitor, Ceramic, 50 V, X7R, 20% 0603 STD Any
2 C23, C27 0.47 µF Capacitor, Ceramic, 16 V, X7R, 20% 0603 STD Any
1 C24 4.7 µF Capacitor, Ceramic, 10 V, X5R, 10% 0603 STD Any
4 D1–D3, D11 BAS16 Diode, Switching, 150mA, 75V, 350mW SOT23 BAS16 Vishay-Liteon
2 D4, D10 Diode, Dual, Zener, 5.6V, 300mW SOT23 AZ23C5V6 Vishay-Telefunken
5 D5– D9 LN1361C Diode, LED, Green, Gullwing, GW Type, 0.120 ×0.087 inch LN1361C Panasonic20mA, 7.5 mcd typ.
1 J1 22-05-3041 Header, Friction Lock Assy, 4-pin right 0.400 ×0.500 inch 22-05-3041 Molexangle
1 Q1 NDS331N MOSFET, N-Ch, 20V, 1.3A, 210 m ΩSOT23 NDS331N Fairchild
2 Q2, Q4 FDS8817NZ MOSFET, N-Ch 30V, 15A , 7 m ΩSO8 FDS8817NZ Fairchild
1 Q3 FDS4435BZ MOSFET, P-Ch, -30V, -8.8A, 20 m ΩSO8 FDS4435BZ Fairchild
1 Q5 BSS138 MOSFET, N-Ch, 50V, 0.22A, 3.5 ΩSOT23 BSS138 Fairchild
12 R1–R5, R25, R26, 100 Resistor, Chip, 1/16W, 5% 0603 STD AnyR28, R32, R33,R37, R38
2 R13, R24 3.01M Resistor, Chip, 1/16W, 5% 0603 STD Any
1 R14 300 Resistor, Chip, 1W, 5% 2512 STD Any
3 R15, R18, R22 5.1K Resistor, Chip, 1/16W, 5% 0603 STD Any
4 R17, R35, R36, 1M Resistor, Chip, 1/16W, 5% 0603 STD AnyR41
0 R19 5.1K Resistor, Chip, 1/16W, 5% 0603 STD Any
0 R20 100K Resistor, Chip, 1/16W, 5% 0603 STD Any
1 R23 100K Resistor, Chip, 1/16W, 5% 0603 STD Any
1 R21 0.010 75 ppm Resistor, Chip, 1W, 1% 2512 WSL-2512-010 Vishay1% R86
2 R30, R40 8.45K Resistor, Chip, 1/16W, 1% 0603 STD Any
2 R31, R39 61.9K Resistor, Chip, 1/16W, 1% 0603 STD Any
4 R6, R11, R12, 220K Resistor, Chip, 1/16W, 5% 0603 STD AnyR34
7 R7– R10, R16, 1K Resistor, Chip, 1/16W, 5% 0603 STD AnyR27, R29
2 RT1**, RT2** 10K Thermistor, NTC, 3-A 0.095 ×0.150 inch 103AT-2 Semitec
1 SW1 Switch, Push button, Momentary, N.O. Low 5mm ×5mm EVQ-PLHA15 PanasonicProfile
2 TB1, TB4 ED555/3DS Terminal Block, 3-pin, 6-A, 3,5mm 0.41 ×0.25 inch ED555/3DS OST
2 TB2, TB3 ED555/2DS Terminal Block, 2-pin, 6-A, 3,5mm 0.27 ×0.25 inch ED555/2DS OST
1 TP1 GND Test Point, Black, Thru Hole Color Keyed 0.100 ×0.100 inch 5001 Keystone
1 TP2 2.5V Vcc Test Point, Red, Thru Hole Color Keyed 0.100 ×0.100 inch 5000 Keystone
1 TP3 Fuse Test Point, White, Thru Hole Color Keyed 0.100 ×0.100 inch 5002 Keystone
1 U1 bq29412DCT IC, Voltage Protection for 2, 3, 4 SSOP-08 BQ29412DCT TICell Lion , 2nd Protection, 4.45 v OVP
1 U2 bq29330DBT IC, 2-3 or 4 Cell Series Protection TSSOP30 bq29330DBT TIControl AFE
1 U3 bq20z60DBT IC, SBS 1.1-Compliant Gas Gauge TSSOP30 bq20z60DBT TIEnabled With Impedance Track
1 — PCB HPA435 Any
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www.ti.com Circuit Module Physical Layouts and Bill of Materials
Table 2. Bill of Materials (continued)Count RefDes Value Description Size Part Number MFR
Connector
2 J1 mate Connector, Female, 0.100 Centers Molex 22-01-3047
8 N/A Terminals, Crimp, Tin Molex 08-50-0114
N/A Wire, Insulated 24 AWG, Red, 18 Inches ( ±3 Alpha 1854-3inches)(USB_5V)
N/A Wire, Insulated 24 AWG, White, 18 Inches (+/- 3 Alpha 1854-1inches)(SCL)
N/A Wire, Insulated 24 AWG, Black, 18 Inches ( ±3 inches)(GND) Alpha 1854-2
N/A Wire, Insulated 24 AWG, Brown, 18 Inches (+/- 3 inches) Alpha 1854-7(SDA)
1 N/A Heatshrink 1 inch Any Any
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
4. Ref designators marked with an asterisk ('**') cannot be substituted.All other components can be substituted with equivalent MFG's components.
5. Make one SMBus connector wire assembly for each assembly produced, from J1 mate, 4–24 AWG wires and Crimp terminals. Wire colors for Pinnumbers are listed below. The wire assembly shall have a J1 mate on each end.Red – Pin # 4 (Signal USB_5V)Brown – Pin # 3 (Signal SDA)White - Pin # 2 (Signal SCL)Black – Pin # 1 (GND)
6. RT1 and RT2 should be assembled horizontally laying flat against the board Edge.
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Circuit Module Physical Layouts and Bill of Materials www.ti.com
Figure 6. Schematic
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4.3 bq20z60/bq29330/bq29412 Circuit Module Performance Specification Summary
5 EVM Hardware and Software Setup
5.1 System Requirements
5.2 Software Installation
6 Troubleshooting Unexpected Dialog Boxes
7 Hardware Connection
www.ti.com EVM Hardware and Software Setup
This section summarizes the performance specifications of the bq20z60/ bq29330/bq29412 circuit module.
Table 3. Performance Specification Summary
Specification Min Typ Max Units
Input voltage Pack+ to Pack– 6 15 25 VCharge and discharge current 0 2 7 A
This section describes how to install the bq20z60EVM-001 PC software, and how to connect the differentcomponents of the EVM.
The bq20z60EVSW software requires Windows 2000 or Windows XP.
Find the latest software version in the bq20z60 tool folder on power.ti.com . Use the following steps toinstall the bq20z60EVSW software:1. Copy the files from the web into a temporary directory you select, double-click onbqEV-EASYSetup00.09.xx.exe, where xx indicates the version, and follow the installer instructions tocomplete the bq20z60 EVSW installation.2. If the EV2300 was not previously installed, after bq20z60 EVSW installation, a TI USB DRIVERINSTALLER pops up. Click "Yes" for the agreement message and follow its instructions. Two driversare associated with the EV2300. Follow the instructions to install both. Do no reboot the computereven if asked to do so.3. Plug the EV2300 into a USB port. The Windows system may show a prompt that new hardware hasbeen found. When asked "Can Windows connect to Windows Update to search for software?", select"No, not this time" and click on "NEXT". In the next dialog window, it indicates "This wizard helps youinstall software for: TI USB Firmware Updater", select "Install the software automatically(Recommended)" and click "NEXT". It is common for the next screen to be the Confirm File Replacescreen. Click "No" to continue. If this screen does not appear, then go to the next step. After Windowsindicates that the installation was finished, a similar dialog window pops up to install the second driver;proceed with the same installation preference as the first one. The second driver is "TI USB bq80xxDriver".
Ensure that the files were extracted from the zip file using the Preserve Folder names option.
Ensure that all the files were extracted from the zip file.
The user that is downloading the files must be logged in as the administrator.
The driver is not signed, so the administrator must allow installation of unsigned drivers in the operatingsystem policy.
The bq20z60EVM-001 comprises two hardware components: the bq20z60/bq29330/bq29412 circuitmodule and the EV2300 PC interface board.
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7.1 Connecting the bq20z60/bq29330/bq29412 Circuit Module to a Battery Pack
7.2 PC Interface Connection
Hardware Connection www.ti.com
Figure 7 shows how to connect the bq20z60/bq29330/bq29412 circuit module to the cells and systemload/charger.
The cells must be connected in the following order:1. 4-Cell Pack: 1N (BAT-), 1P, 2P, 3P, and 4P (see Section 2.1 for definitions).2. 3-Cell Pack: 1N (BAT-), 1P, 2P, and then connect 4P and 3P together.3. 2-Cell Pack: 1N (BAT-), 1P, and then connect 4P, 3P, and 2P together
To start charge or discharge test, connect SYS PRES pin to PACK- pin to set SYS PRES state. To testsleep mode, disconnect the SYS PRES pin.
Figure 7. bq20z60bq29330 Circuit Module Connection to Cells and System Load/Charger
The following steps configure the hardware for interface to the PC:1. Connect the bq20z60/bq29330-based smart battery to the EV2300 using wire leads as shown inTable 4 .
Table 4. Circuit Module to EV2300 Connections
bq20z60/bq29330-Based Battery EV2300
SMBD SMBDSMBC SMBCVSS GND
2. Connect the PC USB cable to the EV2300 and the PC USB port.
The bq20z60EVM-001 is now set up for operation.
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