Texas Instruments SimpleLink CC2640 User manual

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CC2640
SWRS176 –FEBRUARY 2015
CC2640 SimpleLink™ Bluetooth
®
Smart Wireless MCU
1 Device Overview
1.1 Features
1– Very Few External Components
• Microcontroller – Seamless Integration With the SimpleLink
– Powerful ARM®Cortex®-M3 CC2590 and CC2592 Range Extenders
– EEMBC CoreMark®score: 142 – Pin Compatible With the SimpleLink CC13xx in
– Up to 48-MHz Clock Speed 4-mm × 4-mm and 5-mm × 5-mm QFN
– 128KB of In-System Programmable Flash Packages
– 8-KB SRAM for Cache • Low Power
– 20-KB Ultra-Low Leakage SRAM – Wide Supply Voltage Range
– 2-Pin cJTAG and JTAG Debugging • Normal Operation: 1.8 to 3.8 V
– Supports Over-The-Air Upgrade (OTA) • External Regulator Mode: 1.7 to 1.95 V
• Ultra-Low Power Sensor Controller – Active-mode RX: 5.9 mA
– Can run autonomous from the rest of the – Active-mode TX at 0 dBm: 6.1 mA
system – Active-mode TX at +5 dBm: 9.1 mA
– 16-Bit Architecture – Active-mode MCU: 61 µA/MHz
– 2-KB Ultra-Low Leakage SRAM for Code and – Active-mode MCU: 48.5 CoreMark/mA
Data – Active-mode Sensor Controller: 8.2 µA/MHz
• Efficient Code Size Architecture, Placing Drivers, – Standby: 1 µA (RTC Running and RAM/CPU
Bluetooth®Low Energy Controller, and Bootloader Retention)
in ROM – Shutdown: 100 nA (Wake-up on External
• RoHS-Compliant Packages Events)
– 4-mm × 4-mm RSM QFN32 (10 GPIOs) • RF Section
– 5-mm × 5-mm RHB QFN32 (15 GPIOs) – 2.4 GHz RF Transceiver Compatible With
– 7-mm x 7-mm RGZ QFN48 (31 GPIOs) Bluetooth Low Energy (BLE) 4.1 specification
• Peripherals – Excellent Receiver Sensitivity (–97 dBm for
– All Digital Peripheral Pins can be Routed to any BLE), Selectivity, and Blocking Performance
GPIO – Programmable Output Power up to +5 dBm
– 4 General-Purpose Timer Modules (8 × 16-Bit or – Single-ended or Differential RF Interface
4 × 32-Bit Timer, PWM Each) – Suitable for Systems Targeting Compliance With
– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog Worldwide Radio Frequency Regulations
MUX • ETSI EN 300 328 (Europe)
– Continuous Time Comparator • EN 300 440 Class 2 (Europe)
– Ultra-Low Power Analog Comparator • FCC CFR47 Part 15 (US)
– Programmable Current Source • ARIB STD-T66 (Japan)
– UART • Tools and Development Environment
– 2x SSI (SPI, µW, TI) – Full-Feature and Low-Cost Development Kits
– I2C– Multiple Reference Designs for Different RF
– I2S Configurations
– Real-Time Clock (RTC) – Packet Sniffer PC Software
– AES-128 Security Module – Sensor Controller Studio
– True Random Number Generator (TRNG) – SmartRF™ Studio
– 10, 15, or 31 GPIOs, Depending on Package – SmartRF Flash Programmer 2
Option – IAR Embedded Workbench®for ARM
– Support for 8 Capacitive Sensing Buttons – Code Composer Studio™
– Integrated Temperature Sensor
• External System
– On-Chip internal DC-DC Converter
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC2640
SWRS176 –FEBRUARY 2015 www.ti.com
1.2 Applications
• Home and Building Automation • Health and Medical
– Connected Appliances – Thermometers
– Lighting – SpO2
– Locks – Blood Glucose and Pressure Meters
– Gateways – Weight-scales
– Security Systems – Vitals Monitoring
– Hearing Aids
• Industrial
– Logistics • Sports and Fitness
– Production and Manufacturing – Activity Monitors and Fitness Trackers
– Automation – Heart Rate Monitors
– Asset Tracking and Management – Running Sensors
– Remote Display – Biking Sensors
– Cable Replacement – Sports Watches
– HMI – Gym Equipment
– Access Control – Team Sports Equipment
• Retail • HID
– Beacons – Remote Controls
– Advertising – Keyboards and Mice
– ESL / Price Tags – Gaming
– Point of Sales / Payment Systems • Accessories
– Toys
– Trackers
– Luggage-tags
– Wearables
1.3 Description
The CC2640 is a wireless MCU targeting Bluetooth Smart applications.
The device is a member of the CC26xx family of cost-effective, ultra-low power, 2.4-GHz RF devices. Very
low active RF and MCU current, and low-power mode current consumption provides excellent battery
lifetime and allows operation on small coin cell batteries and in energy-harvesting applications.
The CC2640 contains a 32-bit ARM Cortex-M3 running at 48-MHz as the main processor and a rich
peripheral feature set, including a unique ultra-low power sensor controller, ideal for interfacing external
sensors and/or collecting analog and digital data autonomously while the rest of the system is in sleep
mode.
This makes the CC2640 ideal for a wide range of applications where long battery lifetime, small form
factor, and ease of use is important.
The Bluetooth Low Energy controller is embedded into ROM and run partly on an ARM Cortex®-M0
processor. This architecture improves overall system performance and power consumption and frees up
flash memory for the application.
The Bluetooth Smart stack is available free of charge from www.ti.com.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE
CC2640F128RGZ RGZ (QFN48) 7.00 mm × 7.00 mm
CC2640F128RHB RHB (QFN32) 5.00 mm × 5.00 mm
(1) For more information, see Section 9,Mechanical Packaging and Orderable Information.
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Device Information(1) (continued)
PART NUMBER PACKAGE BODY SIZE
CC2640F128RSM RSM (QFN32) 4.00 mm × 4.00 mm
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1.4 Functional Block Diagram
Section 1.4 shows a block diagram for the CC2640.
Figure 1-1. Block Diagram
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Table of Contents
1 Device Overview ......................................... 15.16 Battery Monitor...................................... 19
1.1 Features .............................................. 15.17 Continuous Time Comparator....................... 20
1.2 Applications........................................... 25.18 Low-Power Clocked Comparator ................... 20
1.3 Description............................................ 25.19 Programmable Current Source ..................... 20
1.4 Functional Block Diagram ............................ 45.20 DC Characteristics .................................. 21
2 Revision History ......................................... 65.21 Control Input AC Characteristics.................... 21
3 Device Comparison ..................................... 75.22 Synchronous Serial Interface (SSI) Characteristics.21
4 Terminal Configuration and Functions.............. 85.23 Typical Characteristics .............................. 22
4.1 Pin Diagram – RSM Package ........................ 86 Detailed Description ................................... 25
4.2 Signal Descriptions – RSM Package................. 86.1 Overview ............................................ 25
4.3 Pin Diagram – RHB Package ........................ 96.2 Main CPU ........................................... 25
4.4 Signal Descriptions – RHB Package................ 10 6.3 RF Core ............................................. 25
4.5 Pin Diagram – RGZ Package....................... 11 6.4 Sensor Controller ................................... 26
4.6 Signal Descriptions – RGZ Package................ 11 6.5 Memory.............................................. 27
5 Specifications........................................... 13 6.6 Debug ............................................... 27
5.1 Absolute Maximum Ratings......................... 13 6.7 Power Management................................. 28
5.2 ESD Ratings ........................................ 13 6.8 Clock Systems ...................................... 29
5.3 Recommended Operating Conditions............... 13 6.9 General Peripherals and Modules .................. 29
5.4 Thermal Characteristics............................. 14 6.10 System Architecture................................. 30
5.5 Electrical Characteristics............................ 15 7 Application Circuit ..................................... 31
5.6 General Characteristics ............................. 16 8 Device and Documentation Support ............... 33
5.7 1-Mbps GFSK (Bluetooth Low Energy) – RX....... 16 8.1 Device Support...................................... 33
5.8 1-Mbps GFSK (Bluetooth Low Energy) – TX ....... 17 8.2 Documentation Support ............................. 35
5.9 1-Mbps GFSK (Bluetooth Low Energy) – Common 8.3 Additional Information ............................... 35
RX/TX ............................................... 17 8.4 Trademarks.......................................... 36
5.10 24-MHz Crystal Oscillator (XOSC_HF) ............. 18 8.5 Electrostatic Discharge Caution..................... 36
5.11 32.768-kHz Crystal Oscillator (XOSC_LF).......... 18 8.6 Export Control Notice ............................... 36
5.12 48-MHz RC Oscillator (RCOSC_HF) ............... 18 8.7 Glossary............................................. 36
5.13 32-kHz RC Oscillator (RCOSC_LF)................. 18 9 Mechanical Packaging and Orderable
5.14 ADC Characteristics................................. 19 Information .............................................. 37
5.15 Temperature Sensor ................................ 19 9.1 Packaging Information .............................. 37
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2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
February 2015 * Initial Release
6Revision History Copyright © 2015, Texas Instruments Incorporated
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3 Device Comparison
Table 3-1. Device Family Overview
Device PHY Support Flash (KB) RAM (KB) GPIO Package(1)
CC2650F128xxx Multi-Protocol(2) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2640F128xxx Bluetooth low energy 128 20 31, 15, 10 RGZ, RHB, RSM
CC2630F128xxx IEEE 802.15.4 ( ZigBee®/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM
CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 15, 10 RGZ, RHB, RSM
(1) Package designator replaces the xxx in device name to form a complete device name, RGZ is 7-mm x 7-mm QFN48, RHB is 5-mm x 5-
mm QFN32, and RSM is 4-mm x 4-mm QFN32.
(2) The CC2650 supports all PHYs and can be reflashed to run all the supported standards.
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CC26xx
28
29
27
30 QFN32 4x4
RSM
21 20 22 19 18
13
12
14
11
4 5 3 6 7
26 15
25 16
31 10
32 9
232 241 178
DIO_6 VSS DIO_5 RESET_N VSS VDDS_DCDC DCDC_SW DIO_7
VDDR_RF
X24M_N
X24M_P
VSS
VDDR
DIO_9
VDDS
DIO_8
DIO_1
JTAG_TMSC
DIO_2
DCOUPL
VDDS2
JTAG_TCKC
DIO_3
DIO_4
RF_P
RF_N
VSS
X32K_Q2
VSS
DIO_0
RX_TX
X32K_Q1
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SWRS176 –FEBRUARY 2015 www.ti.com
4 Terminal Configuration and Functions
NOTE
I/O pins marked in bold have high drive capabilities. I/O pins marked in italics have analog
capabilities.
4.1 Pin Diagram – RSM Package
Figure 4-1. RSM (4 mm × 4 mm) Pinout, 0.4-mm Pitch
4.2 Signal Descriptions – RSM Package
Table 4-1. Signal Descriptions – RSM Package
Pin Name Pin Pin Type Description
RF_P 1 RF I/O Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RF_N 2 RF I/O Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
RX_TX 4 RF I/O Optional bias pin for the RF LNA
VDDS 27 Power 1.8 V to 3.8 V main chip supply(1)
VDDS2 11 Power 1.8 V to 3.8 V GPIO supply(1)
VDDS_DCDC 19 Power 1.8 V to 3.8 V DC/DC supply. Tie to ground for external
regulator mode (1.7 V to 1.95 V operation)
VDDR 28 Power 1.7 V to 1.95 V supply, typically connect to output of internal
DC/DC(2)(3)
VDDR_RF 32 Power 1.7 V to 1.95 V supply, typically connect to output of internal
DC/DC(4)(3)
DCOUPL 12 Power 1.27 V regulated digital-supply decoupling capacitor(3)
VSS 3, 7, 17, 20, 29 Power Ground
(1) See Section 8.2, technical reference manual for more details.
(2) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(3) Do not supply external circuitry from this pin.
(4) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.
8Terminal Configuration and Functions Copyright © 2015, Texas Instruments Incorporated
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CC26xx
28
29
27
30 QFN32 5x5
RHB
21 20 22 19 18
13
12
14
11
4 5 3 6 7
26 15
25 16
31 10
32 9
232 241 178
DIO_10 DIO_7 DIO_9 DIO_8 DCDC_SW RESET_N VDDS_DCDC DIO_11
VDDR_RF
X24M_N
X24M_P
VDDR
VDDS
DIO_13
DIO_14
DIO_12
DIO_3
JTAG_TMSC
DIO_4
DCOUPL
VDDS2
JTAG_TCKC
DIO_5
DIO_6
RF_P
RF_N
RX_TX
DIO_0 DIO_1 DIO_2
X32K_Q1 X32K_Q2
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Table 4-1. Signal Descriptions – RSM Package (continued)
Pin Name Pin Pin Type Description
DCDC_SW 18 Power Output from internal DC/DC(1). Tie to ground for external
regulator mode (1.7 V to 1.95 V operation)
EGP Power Ground – Exposed Ground Pad
RESET_N 21 Digital input Reset, active-low. No internal pullup
DIO_0 8 Digital I/O GPIO, Sensor Controller, High drive capability
DIO_1 9 Digital I/O GPIO, Sensor Controller, High drive capability
DIO_2 10 Digital I/O GPIO, Sensor Controller, High drive capability
DIO_3 15 Digital I/O GPIO, High drive capability, JTAG_TDO
DIO_4 16 Digital I/O GPIO, High drive capability, JTAG_TDI
DIO_5 22 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_6 23 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_7 24 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_8 25 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_9 26 Digital/Analog I/O GPIO, Sensor Controller, Analog
JTAG_TMSC 13 Digital I/O JTAG TMSC
JTAG_TCKC 14 Digital I/O JTAG TCKC
X32K_Q1 5 Analog I/O 32 kHz crystal oscillator pin 1
X32K_Q2 6 Analog I/O 32 kHz crystal oscillator pin 2
X24M_N 30 Analog I/O 24 MHz crystal oscillator pin 1
X24M_P 31 Analog I/O 24 MHz crystal oscillator pin 2
4.3 Pin Diagram – RHB Package
Figure 4-2. RHB (5 mm × 5 mm) Pinout, 0.5-mm Pitch
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4.4 Signal Descriptions – RHB Package
Table 4-2. Signal Descriptions – RHB Package
Pin Name Pin Pin Type Description
RF_P 1 RF I/O Positive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RF_N 2 RF I/O Negative RF input signal to LNA during RX
Negative RF output signal to PA during TX
RX_TX 3 RF I/O Optional bias pin for the RF LNA
VDDS 28 Power 1.8 V to 3.8 V main chip supply(1)
VDDS2 11 Power 1.8 V to 3.8 V GPIO supply(1)
VDDS_DCDC 18 Power 1.8 V to 3.8 V DC/DC supply
VDDR 29 Power 1.7 V to 1.95 V supply, typically connect to output of internal
DC/DC(2)(3)
VDDR_RF 32 Power 1.7 V to 1.95 V supply, typically connect to output of internal
DC/DC(4)(3)
DCOUPL 12 Power 1.27 V regulated digital-supply decoupling(3)
DCDC_SW 17 Power Output from internal DC/DC(1)
EGP Power Ground – Exposed Ground Pad
RESET_N 19 Digital input Reset, active-low. No internal pullup
DIO_0 6 Digital I/O GPIO, Sensor Controller
DIO_1 7 Digital I/O GPIO, Sensor Controller
DIO_2 8 Digital I/O GPIO, Sensor Controller, High drive capability
DIO_3 9 Digital I/O GPIO, Sensor Controller, High drive capability
DIO_4 10 Digital I/O GPIO, Sensor Controller, High drive capability
DIO_5 15 Digital I/O GPIO, High drive capability, JTAG_TDO
DIO_6 16 Digital I/O GPIO, High drive capability, JTAG_TDI
DIO_7 20 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_8 21 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_9 22 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_10 23 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_11 24 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_12 25 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_13 26 Digital/Analog I/O GPIO, Sensor Controller, Analog
DIO_14 27 Digital/Analog I/O GPIO, Sensor Controller, Analog
JTAG_TMSC 13 Digital I/O JTAG TMSC, High drive capability
JTAG_TCKC 14 Digital I/O JTAG TCKC
X32K_Q1 4 Analog I/O 32 kHz crystal oscillator pin 1
X32K_Q2 5 Analog I/O 32 kHz crystal oscillator pin 2
X24M_N 30 Analog I/O 24 MHz crystal oscillator pin 1
X24M_P 31 Analog I/O 24 MHz crystal oscillator pin 2
(1) See Section 8.2, technical reference manual for more details.
(2) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(3) Do not supply external circuitry from this pin.
(4) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.
10 Terminal Configuration and Functions Copyright © 2015, Texas Instruments Incorporated
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