Texas Instruments ADC-PHI-PRU-EVM User manual

User’s Guide
ADC-PHI-PRU-EVM Evaluation Module
ABSTRACT
This user's guide contains information and support documentation for the ADC-PHI-PRU-EVM evaluation
module (EVM). Included are the circuit description, schematic, and bill of materials of the ADC-PHI-PRU-EVM.
Throughout this document, the terms evaluation board, evaluation module, and EVM are synonymous with the
ADC-PHI-PRU-EVM.
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Table of Contents
1 Introduction.............................................................................................................................................................................3
1.1 Features............................................................................................................................................................................. 3
2 ADC-PHI-PRU-EVM Overview................................................................................................................................................ 4
3 ADC-PHI-PRU-EVM Circuitry................................................................................................................................................. 5
3.1 Power Circuitry...................................................................................................................................................................5
3.2 MUX Circuitry..................................................................................................................................................................... 6
3.3 Board Mating Connections.................................................................................................................................................7
4 Schematics, PCB Layout, and Bill of Materials................................................................................................................... 9
4.1 Schematics.........................................................................................................................................................................9
4.2 ADC-PHI-PRU-EVM Layout.............................................................................................................................................13
4.3 Bill of Materials.................................................................................................................................................................17
List of Figures
Figure 2-1. ADC-PHI-PRU-EVM System Architecture.................................................................................................................4
Figure 3-1. J11 Selects Between the 3.3-V and 1.8-V DVDD Supplies for the ADC................................................................... 5
Figure 3-2. TPS61096 Boost Converter Circuitry........................................................................................................................ 5
Figure 3-3. D1 and D2 LEDS.......................................................................................................................................................6
Figure 3-4. J9 Selects Between Serial (S) and Parallel (P) Communication With the ADC........................................................ 6
Figure 4-1. ADC-PHI-PRU-EVM Power Schematic Page........................................................................................................... 9
Figure 4-2. ADC-PHI-PRU-EVM MUX Schematic Page............................................................................................................10
Figure 4-3. ADC-PHI-PRU-EVM Connectors Schematic Page..................................................................................................11
Figure 4-4. ADC-PHI-PRU-EVM Hardware Schematic Page.................................................................................................... 12
Figure 4-5. ADC-PHI-PRU-EVM Layout Layer 1....................................................................................................................... 13
Figure 4-6. ADC-PHI-PRU-EVM Layout Layer 2....................................................................................................................... 14
Figure 4-7. ADC-PHI-PRU-EVM Layout Layer 3....................................................................................................................... 15
Figure 4-8. ADC-PHI-PRU-EVM Layout Layer 4....................................................................................................................... 16
List of Tables
Table 1-1. ADC-PHI-PRU-EVM Compatible Precision ADC EVMs............................................................................................. 3
Table 3-1. ADC-PHI-PRU-EVM Serial Mode QSH Connector Signal Routing to the AM64x and AM24x................................... 7
Table 3-2. ADC-PHI-PRU-EVM Parallel Mode QSH Connector Signal Routing to the AM64x and AM24x................................ 8
Table 4-1. Bill of Materials..........................................................................................................................................................17
Trademarks
Sitara™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
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1 Introduction
The ADC-PHI-PRU-EVM evaluation adapter card interfaces the Sitara™ AM64x processor (TMDS64GPEVM)
or AM243x MCU (TMDS243GPEVM) development platforms to greater than 25 precision ADC EVMs for
communication, data capture, and software development. The adapter card routes the ICSSG-PRU signals
to the corresponding serial (SPI and eSPI) or parallel ADC data communication interfaces. The adapter card
offers configurability through two jumpers that select between serial or parallel connections, and also offers a
user-selectable digital power to match the required digital and analog supply voltage levels of the precision ADC
EVM. The programmability of the Sitara ICSSG-PRU peripheral allows for high-speed data capture along with
data preprocessing. Remove the extra microcontroller (MCU) or field-programmable gate array (FPGA) on your
current design and start your system precision analog-to-digital converter (ADC) and AM64x, AM243x software
development today with the ADC-PHI-PRU-EVM.
Table 1-1 lists the precision EVMs compatible with the ADC-PHI-PRU-EVM.
Table 1-1. ADC-PHI-PRU-EVM Compatible Precision ADC EVMs
EVM CONVST Connection
(J2)
MUX Mode Selection
(J9)
DVDD Power Supply
Voltage (J11) Comments
AMC131M03EVM-PDK Serial 3.3 V
ADC128S102EVM Serial 3.3 V
ADS127L11EVM Serial 1.8 V
ADS1285EVM-PDK Serial 3.3 V
ADS131A04EVM Serial 3.3 V
ADS131B04-Q1EVM Serial 3.3 V
ADS131B26Q1EVM-PDK Serial 3.3 V
ADS131M04EVM Serial 3.3 V
ADS704x-5xEVM Serial 3.3 V
ADS8168EVM-PDK Serial 3.3 V
ADS8332V2EVM-PDK PRU1_GPIO17 Serial 3.3 V
ADS8353Q1EVM-PDK Serial 3.3 V
ADS8588SEVM-PDK PRU1_GPIO17 Parallel 3.3 V Short CONVST A/B together
ADS8681EVM-PDK PRU1_GPIO17 Serial 3.3 V
ADS8686SEVM-PDK PRU1_GPIO17 Parallel 3.3 V
ADS8688EVM-PDK Serial 3.3 V
ADS8860V2EVM-PDK PRU1_GPIO17 Serial 3.3 V
ADS8881V2EVM-PDK PRU1_GPIO17 Serial 3.3 V
ADS8900BV2EVM-PDK PRU1_GPIO17 Serial 3.3 V
ADS9110EVM-PDK PRU1_GPIO17 Serial 3.3 V
TLV2553EVM-PDK Parallel 3.3 V
1.1 Features
• Provides connection for the AM64x PRU and GPIO pins to the ADC interface for high-speed, flexible, data
acquisition, and device configuration
• 5.5-V boosted supply from the AM64x TMDS64GPEVM 5-V supply rail using the TPS61096A
• Jumper configurable support for serial (SPI) and parallel data types (J9)
• Precision ADC EVM DVDD voltages of 1.8 V and 3.3 V are available with jumper configuration (J11)
• No external MCU or processing chip required to interface the TMDS64GPEVM and precision ADC EVM
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2 ADC-PHI-PRU-EVM Overview
Figure 2-1 shows the two main connectors of the ADC-PHI-PRU-EVM adapter card. The 150-pin high-speed
expansion (HSE) connector is on the left and mates with the AM64x and AM243x general purpose (GP)
development platform HSE connectors. The 60-pin Q-strip (QSH) connector is on the right and mates with the
precision ADC EVMs listed in Table 3-1. Three jumpers (J2, J9, and J11) on the ADC-PHI-PRU-EVM select the
following settings:
• J2 shorts the CONVSTA and CONVSTB signals together for operation with a single CONVST signal
• J9 configures the MUX to select either serial or parallel mode to communicate with the precision ADC EVM
• J11 selects either 1.8 V or 3.3 V as the DVDD voltage for the precision ADC EVM
Figure 2-1. ADC-PHI-PRU-EVM System Architecture
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3 ADC-PHI-PRU-EVM Circuitry
This section provides an overview of the circuitry used for the jumpers, power circuitry, and MUXes on the
ADC-PHI-PRU-EVM.
3.1 Power Circuitry
Most precision ADC EVMs are powered directly from the USB-powered PA007 precision host adapter (PHI)
controller board. The PA007 board outputs 5.5 V, which is commonly used for the analog supplies, and either
3.3 V or 1.8 V for digital, I/O, and EEPROM supplies. To match the supply voltages, the ADC-PHI-PRU-EVM
converts and routes the 5-V, 3.3-V, and 1.8-V supplies that are featured on the HSE connector to the QSH
connector.
As shown in Figure 3-1, J11 selects the DVDD voltage routed to the QSH connector between the 3.3-V and
1.8-V supplies from the AM64x and AM24x HSE connector.
Figure 3-1. J11 Selects Between the 3.3-V and 1.8-V DVDD Supplies for the ADC
Figure 3-2 shows that a TPS61096 boost converter on the ADC-PHI-PRU-EVM converts the 5.0-V HSE output
to the 5.5-V output to match the typical output of the PA007 motherboard. The feedback network formed from R8
and R11 sets the output voltage to approximately 5.5 V.
Figure 3-2. TPS61096 Boost Converter Circuitry
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Figure 3-3 shows the D1 and D2 indicator LEDs that confirm the presence of the 5-V and 3.3-V supplies from the
AM64x and AM24x EVM (TMDS64GPEVM and TMDS243GPEVM) HSE connectors.
Figure 3-3. D1 and D2 LEDS
3.2 MUX Circuitry
PA007-based precision ADC EVMs share several pins between the parallel and serial modes of operation
depending on how the controller card is configured by the EVM GUI. There are two SN74CBTLV16292VR
digital multiplexer (MUX) devices on the ADC-PHI-PRU-EVM that route the proper signals from the AM64x
and AM243x EVMs (TMDS64GPEVM and TMDS243GPEVM) to communicate with either the parallel or serial
precision ADC EVMs. Figure 3-4 shows how the J9 jumper sets the voltage level on the MUX device selection
pins that route the A side PRU signals from the HSE connector to either the B1 (parallel) or B2 (serial)
connections on the B side. The signal routing to the MUX devices for both parallel and serial communication
modes is provided in the full schematics of Section 4.1.
Figure 3-4. J9 Selects Between Serial (S) and Parallel (P) Communication With the ADC
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3.3 Board Mating Connections
Table 3-1 and Table 3-2 list the AM64x and AM24x signals that are routed to the ADC-PHI-PRU-EVM QSH
connector from the HSE connector.
Table 3-1. ADC-PHI-PRU-EVM Serial Mode QSH Connector Signal Routing to
the AM64x and AM24x
Signal Name Pin Number Pin Number Signal Name
5V 2 1 5.5V
5V 4 3 DGND
PRU1_GPIO7 6 5 —
PRU1_GPIO9 8 7 —
PRU0_GPIO13 10 9 —
PRU0_GPIO12 12 11 —
PRU0_GPIO11 14 13 —
PRU0_GPIO10 16 15 —
PRU0_GPIO9 18 17 —
PRU1_GPIO17_SYNC_OUT1 20 19 —
PRU0_GPIO8 22 21 —
PRU0_GPIO19_SYNC_OUT0 24 23 —
— 26 25 —
— 28 27 —
PRG0_PRU0_GPIO16 30 29 HSE_GPIO0_42
PRU0_GPIO17_SYNC_OUT1 32 31 PRU0_GPIO18_LATCH_IN0
PRU0_GPIO15 34 33 HSE_GPIO0_35
PRU0_GPIO14 36 35 —
PRU0_GPIO0 38 37 HSE_GPIO0_29
PRU0_GPIO1 40 39 HSE_GPIO0_24
PRU0_GPIO2 42 41 HSE_GPIO0_44
PRU0_GPIO3 44 43 PRU0_GPIO6
PRU0_GPIO4 46 45 PRU0_GPIO7_LATCH_IN1
PRU0_GPIO5 48 47 —
DVDD 50 49 HSE_GPIO0_32
PRU1_GPIO14 52 51 HSE_GPIO0_34
PRU1_GPIO16 54 53 HSE_GPIO0_37
SOC_I2C0_SDA 56 55 HSE_GPIO0_39
SOC_I2C0_SCL 58 57 HSE_GPIO0_41
DGND 60 59 ID PWR
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Table 3-2. ADC-PHI-PRU-EVM Parallel Mode QSH Connector Signal Routing to
the AM64x and AM24x
Signal Name Pin Number Pin Number Signal Name
5V 2 1 5.5V
5V 4 3 DGND
PRU0_GPIO15 6 5 —
PRU0_GPIO14 8 7 —
PRU0_GPIO13 10 9 —
PRU0_GPIO12 12 11 —
PRU0_GPIO11 14 13 —
PRU0_GPIO10 16 15 —
PRU0_GPIO9 18 17 —
PRU0_GPIO8 20 19 —
PRU0_GPIO7_LATCH_IN1 22 21 —
PRU0_GPIO6 24 23 PRU0_GPIO16
PRU0_GPIO5 26 25 —
PRU0_GPIO4 28 27 —
PRU0_GPIO3 30 29 HSE_GPIO0_42
PRU0_GPIO17_SYNC_OUT1 32 31 PRU0_GPIO18_LATCH_IN0
— 34 33 HSE_GPIO0_35
PRU0_GPIO19_SYNC_OUT0 36 35 —
PRU0_GPIO2 38 37 HSE_GPIO0_29
PRU0_GPIO1 40 39 HSE_GPIO0_24
PRU0_GPIO0 42 41 HSE_GPIO0_44
PRU1_GPIO17_SYNC_OUT1 44 43 PRU1_GPIO7
Jumper to 44/MCU GPIO 46 45 PRU1_GPIO9
PRU1_GPIO10 48 47 —
DVDD 50 49 HSE_GPIO0_32
PRU1_GPIO14 52 51 HSE_GPIO0_34
PRU1_GPIO16 54 53 HSE_GPIO0_37
SOC_I2C0_SDA 56 55 HSE_GPIO0_39
SOC_I2C0_SCL 58 57 HSE_GPIO0_41
DGND 60 59 ID PWR
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4 Schematics, PCB Layout, and Bill of Materials
The following sections contain images with the full schematics and layout prints, as well as a bill of materials
table, for the circuitry on the ADC-PHI-PRU-EVM.
4.1 Schematics
Figure 4-1 to Figure 4-4 illustrate the schematics for the ADC-PHI-PRU-EVM.
GND
DGND
VIN_3V3
EVM_DVDD
TP5
TP1 TP2
VIN_3V3 VIN_5V0
Green
2
1
D1
1.50k
R5
Green
2
1
D2
DGND DGND
TP3
EVM_DVDD
TP4
DCDC_5V5
TP6
DGND
TP7
DGND
TP8
DGND
TP9
DGND
VIN_5V0 VIN_3V3 VIN_1V8
VIN_5V0 VIN_3V3 VIN_1V8
1
2
3
J11
TSW-103-07-G-S
VIN_1V8
LVI1
1
LVI2
2
VIN
3SW 4
ILIM
5
EN
6
FB 7
VOSNS 8
VOUT 9
GND 10
HVO2 11
HVO1 12
PAD 13
TPS61096ADSSR
U1
2.00k
R6
2.7 Hµ
L1
45.3k
R8
10.0k
R11
VIN_5V0 DCDC_5V5
GND
10.0k
R7
10V
4.7 Fµ
C4
10 Fµ
25V
C5
1.50k
R4
HSE_GPIO0_30
EVM_ID_PWRVIN_3V3
0
R12
Figure 4-1. ADC-PHI-PRU-EVM Power Schematic Page
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1
2
3
J9
TSW-103-07-G-S
VIN_3V3
VIN_3V3
GND
100k
R13
100k
R14
1A
2
2A
4
3A
6
4A
9
5A
11
6A
13
7A
15
8A
18
9A
21
10A
23
11A
25
12A
27
GND 8
GND 19
NC
3
NC
5
NC
7
NC
10
NC
12
NC
14
NC
16
NC
20
NC
22
NC
24
NC
26
S
1
VCC
17 1B1 54
1B2 53
2B1 52
2B2 51
3B1 50
3B2 48
4B1 47
4B2 46
5B1 45
5B2 44
6B1 43
6B2 42
7B1 41
7B2 40
8B1 39
8B2 37
9B1 36
9B2 35
10B1 34
10B2 33
11B1 32
11B2 31
12B1 30
12B2 29
GND 38
GND 49 NC
28
NC
55
NC
56
SN74CBTLV16292VR
U2
1A
2
2A
4
3A
6
4A
9
5A
11
6A
13
7A
15
8A
18
9A
21
10A
23
11A
25
12A
27
GND 8
GND 19
NC
3
NC
5
NC
7
NC
10
NC
12
NC
14
NC
16
NC
20
NC
22
NC
24
NC
26
S
1
VCC
17 1B1 54
1B2 53
2B1 52
2B2 51
3B1 50
3B2 48
4B1 47
4B2 46
5B1 45
5B2 44
6B1 43
6B2 42
7B1 41
7B2 40
8B1 39
8B2 37
9B1 36
9B2 35
10B1 34
10B2 33
11B1 32
11B2 31
12B1 30
12B2 29
GND 38
GND 49 NC
28
NC
55
NC
56
SN74CBTLV16292VR
U3
VIN_3V3
PRG0_PRU0_GPIO0
PRG0_PRU0_GPIO4
PRG0_PRU0_GPIO19
PRG0_PRU0_GPIO15
PRG0_PRU0_GPIO16
PRG0_PRU1_GPIO17
MODE_SEL
MODE_SEL MODE_SEL
GND GND
PRG0_PRU0_GPIO5
PRG0_PRU0_GPIO2
PRG0_PRU0_GPIO6
PRG0_PRU0_GPIO7
PRG0_PRU0_GPIO8
PRG0_PRU0_GPIO14
PRG0_PRU0_GPIO3
VDD selects "S" mode
GND selects "P" mode
GPIO0p
GPIO2p
GPIO3p
GPIO4p GPIO5p
GPIO6p
GPIO7p
GPIO8p
GPIO14p
GPIO15p
GPIO16p
GPIO19p
PRU1_17p
PRU1_9p
PRU1_7p
PRU1_10p
PRU1_12p
GPIO2s
GPIO0s
GPIO16s
GPIO19s
GPIO8s
PRU1_17s
PRU1_7s
PRU1_9s
GPIO14s
GPIO3s
GPIO7s
GPIO6s
GPIO5sGPIO4s
GPIO15s
NC0p
NC0s
NC1s
NC2s
PRG0_PRU1_GPIO10
PRG0_PRU1_GPIO9
PRG0_PRU1_GPIO7
PRG0_PRU1_GPIO12
Figure 4-2. ADC-PHI-PRU-EVM MUX Schematic Page
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AM64x/HSE connector
HSE_DETECT DGND
0
R3
1 Fµ
10V
C1
GND
EVM_DVDD
1.50k
R1
1.50k
R2
EVM_ID_PWR
1 Fµ
10V
C2
GND
DCDC_5V5
1 Fµ
10V
C3
GND
VIN_5V0
A1
A1
A2
A2
A3
A3
A4
A4
A5
A5
A6
A6
A7
A7
A8
A8
A9
A9
A10
A10
A11
A11
A12
A12
A13
A13
A14
A14
A15
A15
A16
A16
A17
A17
A18
A18
A19
A19
A20
A20
A21
A21
A22
A22
A23
A23
A24
A24
A25
A25
A26
A26
A27
A27
A28
A28
A29
A29
A30
A30
J8A
SEAM-30-XX.X-XX-05-X-A
B1
B1
B2
B2
B3
B3
B4
B4
B5
B5
B6
B6
B7
B7
B8
B8
B9
B9
B10
B10
B11
B11
B12
B12
B13
B13
B14
B14
B15
B15
B16
B16
B17
B17
B18
B18
B19
B19
B20
B20
B21
B21
B22
B22
B23
B23
B24
B24
B25
B25
B26
B26
B27
B27
B28
B28
B29
B29
B30
B30
J8B
SEAM-30-XX.X-XX-05-X-A
C1
C1
C2
C2
C3
C3
C4
C4
C5
C5
C6
C6
C7
C7
C8
C8
C9
C9
C10
C10
C11
C11
C12
C12
C13
C13
C14
C14
C15
C15
C16
C16
C17
C17
C18
C18
C19
C19
C20
C20
C21
C21
C22
C22
C23
C23
C24
C24
C25
C25
C26
C26
C27
C27
C28
C28
C29
C29
C30
C30
J8C
SEAM-30-XX.X-XX-05-X-A
D1
D1
D2
D2
D3
D3
D4
D4
D5
D5
D6
D6
D7
D7
D8
D8
D9
D9
D10
D10
D11
D11
D12
D12
D13
D13
D14
D14
D15
D15
D16
D16
D17
D17
D18
D18
D19
D19
D20
D20
D21
D21
D22
D22
D23
D23
D24
D24
D25
D25
D26
D26
D27
D27
D28
D28
D29
D29
D30
D30
J8D
SEAM-30-XX.X-XX-05-X-A
E1
E1
E2
E2
E3
E3
E4
E4
E5
E5
E6
E6
E7
E7
E8
E8
E9
E9
E10
E10
E11
E11
E12
E12
E13
E13
E14
E14
E15
E15
E16
E16
E17
E17
E18
E18
E19
E19
E20
E20
E21
E21
E22
E22
E23
E23
E24
E24
E25
E25
E26
E26
E27
E27
E28
E28
E29
E29
E30
E30
J8E
SEAM-30-XX.X-XX-05-X-A
DGND
VIN_5V0
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
DGND
VIN_5V0
VIN_5V0
VIN_3V3
VIN_3V3
VIN_3V3
VIN_1V8
VIN_1V8
PRG0_PRU0_GPIO0
PRG0_PRU0_GPIO1PRG0_PRU0_GPIO2
PRG0_PRU0_GPIO3
PRG0_PRU0_GPIO4
PRG0_PRU0_GPIO5
PRG0_PRU0_GPIO6
PRG0_PRU0_GPIO8
PRG0_PRU0_GPIO9
PRG0_PRU0_GPIO10
PRG0_PRU0_GPIO11PRG0_PRU0_GPIO12
PRG0_PRU0_GPIO13
PRG0_PRU0_GPIO14
PRG0_PRU0_GPIO15
PRG0_PRU0_GPIO16
PRG0_PRU0_GPIO17
PRG0_PRU0_GPIO18
PRG0_PRU1_GPIO0
PRG0_PRU1_GPIO1
PRG0_PRU1_GPIO2
PRG0_PRU1_GPIO3
PRG0_PRU1_GPIO4
PRG0_PRU1_GPIO5
PRG0_PRU1_GPIO6
PRG0_PRU1_GPIO7
PRG0_PRU1_GPIO8
PRG0_PRU1_GPIO9
PRG0_PRU1_GPIO10
PRG0_PRU1_GPIO11
PRG0_PRU1_GPIO12
PRG0_PRU1_GPIO13
PRG0_PRU1_GPIO14
PRG0_PRU1_GPIO15
PRG0_PRU1_GPIO16
PRG0_PRU1_GPIO17
PRG1_PRU1_GPIO18
PRG1_PRU1_GPIO19
HSE_GPIO0_31 HSE_GPIO0_32 HSE_GPIO0_33
HSE_GPIO0_34
HSE_GPIO0_35
HSE_GPIO0_36
HSE_GPIO0_37
HSE_GPIO0_38HSE_GPIO0_39 HSE_GPIO0_41
SOC_I2C0_SCL
SOC_I2C0_SDA
HSE_DETECT
HSE_GPIO0_15HSE_GPIO0_16HSE_GPIO0_17
HSE_GPIO0_18HSE_GPIO0_82HSE_GPIO0_83
HSE_GPIO0_21HSE_GPIO0_22
HSE_GPIO0_23
HSE_GPIO0_24 HSE_GPIO0_25 HSE_GPIO0_26HSE_GPIO0_27 HSE_GPIO0_28
HSE_GPIO0_29
HSE_GPIO0_30 HSE_GPIO0_42
HSE_GPIO0_43
HSE_GPIO0_44
HSE_GPIO0_40
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
31 32
33 34
35 36
37 38
39 40
41 42
43 44
45 46
47 48
49 50
51 52
53 54
55 56
57 58
59 60
MP1
MP1
MP2
MP2
MP3
MP3
MP4
MP4
J1
QSH-030-01-L-D-A
DCDC_5V5
DGND
DGND
DGND
DGND
DGND
PADC/PHI connector
EVM_ID_PWR
VIN_5V0
VIN_5V0
EVM_DVDD
SOC_I2C0_SCL
SOC_I2C0_SDA
DGND
PRG0_PRU0_GPIO1
PRG0_PRU0_GPIO9
PRG0_PRU0_GPIO10
PRG0_PRU0_GPIO11
PRG0_PRU0_GPIO12
PRG0_PRU0_GPIO13
PRG0_PRU0_GPIO17PRG0_PRU0_GPIO18
PRG0_PRU0_GPIO19
PRG0_PRU0_GPIO7
GPIO0p
GPIO2p
GPIO3p
GPIO4p
GPIO5p
GPIO6p
GPIO7p
GPIO8p
GPIO14p
GPIO15p
GPIO16p
GPIO19p
PRU1_17p
PRU1_9p
PRU1_7p
PRU1_10p
PRU1_12p
NC0p
HSE_GPIO0_42
HSE_GPIO0_35
HSE_GPIO0_29
HSE_GPIO0_24
HSE_GPIO0_44
HSE_GPIO0_32
HSE_GPIO0_34
HSE_GPIO0_37
HSE_GPIO0_39
HSE_GPIO0_41
SOC_I2C0_SDA
SOC_I2C0_SCL
PRG0_PRU1_GPIO16
GPIO2s
GPIO0s
GPIO16s
NC1s
NC0s
GPIO19s
GPIO8s
PRU1_17s
PRU1_9s
PRU1_7s
NC2s
GPIO14s
GPIO3s
GPIO7s
GPIO6s
GPIO5s
GPIO4s
GPIO15s 1
2
J2
TSW-102-07-G-S
PRU1_17p
PRU1_12p
PRG0_PRU1_GPIO14
Figure 4-3. ADC-PHI-PRU-EVM Connectors Schematic Page
www.ti.com Schematics, PCB Layout, and Bill of Materials
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ADC-PHI-PRU-EVM Evaluation Module 11
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LOGO
PCB
Logo2
Texas Instruments
FID2FID1 FID3
DC186
B
PCB Number:
PCB Rev:
Label Assembly Note
ZZ4
This Assembly Note is for PCB labels only
Assembly Note
ZZ2
These assemblies are ESD sensitive, ESD precautions shall be observed.
Assembly Note
ZZ3
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
Assembly Note
ZZ1
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
Variant/Label Table
Variant Label Text
001 MPU/PADC adapter card
Logo1
CE Mark
LOGO
PCB
Logo4
WEEE logo
1
H1
NY PMS 440 0025 PH
DNP 1
H2
NY PMS 440 0025 PH
DNP
LOGO
PCB
Logo3
FCC disclaimer
SH1
1
H3
NY PMS 440 0025 PH
DNP 1
H4
NY PMS 440 0025 PH
DNP
SH2
SH3
MP1
29300
MP2
29300
Standoff hardware
In addition to "29300" screws,
"970300151" standoffs, "4692" washers,
"728" rubber feet, and "29304" screws are also used.
Figure 4-4. ADC-PHI-PRU-EVM Hardware Schematic Page
Schematics, PCB Layout, and Bill of Materials www.ti.com
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4.2 ADC-PHI-PRU-EVM Layout
Figure 4-5 to Figure 4-8 illustrate the layout for the ADC-PHI-PRU-EVM.
Figure 4-5. ADC-PHI-PRU-EVM Layout Layer 1
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Figure 4-6. ADC-PHI-PRU-EVM Layout Layer 2
Schematics, PCB Layout, and Bill of Materials www.ti.com
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Figure 4-7. ADC-PHI-PRU-EVM Layout Layer 3
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Figure 4-8. ADC-PHI-PRU-EVM Layout Layer 4
Schematics, PCB Layout, and Bill of Materials www.ti.com
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4.3 Bill of Materials
Table 4-1 lists the bill of materials (BOM).
Table 4-1. Bill of Materials
Designator Quantity Value Description Package Reference Part Number Manufacturer
!PCB1 1 Printed Circuit Board DC186 Any
C1, C2, C3 3 1 µF CAP, CERM, 1 µF, 10 V, ±10%, X7R, 0805 0805 LMK212B7105KD-T Taiyo Yuden
C4 1 4.7 µF Chip Multilayer Ceramic Capacitors for General Purpose, 0805,
4.7 µF, X7R, 15%, 10%, 10 V 0805 GRM21BR71A475KE51L Murata
C5 1 10 µF CAP, CERM, 10 µF, 25 V, ±10%, X7R, AEC-Q200 Grade 1,
1206 1206 CGA5L1X7R1E106K160AE TDK
D1, D2 2 Green LED, Green, SMD LED_0603 150060GS75000 Wurth Elektronik
FID1, FID2, FID3 3 Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
J1 1 Receptacle, 0.5 mm, 30 x 2, Gold, TH Receptacle, 0.5 mm,
30 x 2, TH QSH-030-01-L-D-A Samtec
J2 1 Header, 100 mil, 2 x 1, Gold, TH 2 x 1 Header TSW-102-07-G-S Samtec
J8 1 Terminal Array Assembly, Surface Mount, 0.050" Pitch,
150 Pins SAMTEC
J9, J11 2 Header, 100 mil, 3 x 1, Gold, TH 3 x 1 Header TSW-103-07-G-S Samtec
L1 1 2.7 µH Inductor, Shielded, Ferrite, 2.7 µH, 4.6 A, 0.018 Ω, SMD 6 x 6 mm 1255AY-2R7N=P3 MuRata
MP1, MP2 2 M2.5 x 0.45 Pan Head Machine Screw Slotted Drive Steel SCREW_M2.5 29300 Keystone Electronics
R1, R2, R4, R5 4 1.50 kΩ RES, 1.50 kΩ, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW06031K50FKEA Vishay-Dale
R3 1 0 Ω RES, 0, 5%, 0.1 W, 0603 0603 MCR03EZPJ000 Rohm
R6 1 2.00 kΩ RES, 2.00 kΩ, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW04022K00FKED Vishay-Dale
R7, R11 2 10.0 kΩ RES, 10.0 kΩ, 1%, 0.05 W, 0201 0201 RC0201FR-0710KL Yageo America
R8 1 45.3 kΩ RES, 45.3 kΩ, 1%, 0.063 W, AEC-Q200 Grade 0, 0402 0402 CRCW040245K3FKED Vishay-Dale
R12 1 0 Ω RES, 0, 5%, 0.1 W, 0603 0603 CRCW06030000Z0EA Vishay-Dale
R13, R14 2 100 kΩ RES, 100 kΩ, 1%, 0.1 W, AEC-Q200 Grade 0, 0603 0603 CRCW0603100KFKEA Vishay-Dale
SH1, SH2, SH3 3 1 x 2 Shunt, 100 mil, Gold Plated, Black Shunt SNT-100-BK-G Samtec
TP1, TP2, TP3, TP4 4 Test Point, Miniature, Red, TH Red Miniature
Testpoint 5000 Keystone
TP5, TP6, TP7, TP8,
TP9 5 Test Point, Miniature, Black, TH Black Miniature Testpoint 5001 Keystone
U1 1 28-V Output Voltage Boost Converter with Ultra-Low Quiescent
Current, DSS0012A (WSON-12) DSS0012A TPS61096ADSSR Texas Instruments
U2, U3 2 Multiplexer / Demultiplexer Bus Switch 1-Element CMOS 24-IN
56-Pin TVSOP T/R TVSOP56 SN74CBTLV16292VR Texas Instruments
H1, H2, H3, H4 0 Machine Screw, Round, #4-40 × 1/4, Nylon, Philips Pan Head Screw NY PMS 440 0025 PH B&F Fastener Supply
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ADC-PHI-PRU-EVM Evaluation Module 17
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STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

www.ti.com
2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.

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3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.